L272 ® DUAL POWER OPERATIONAL AMPLIFIERS . . .OUTPUT CURRENT TO 1 A .OPERATES AT LOW VOLTAGES SINGLE OR SPLIT SUPPLY .LARGE COMMON-MODE AND DIFFEREN- .TIAL MODE RANGE .GROUND COMPATIBLE INPUTS LOW SATURATION VOLTAGE THERMAL SHUTDOWN Powerdip (8 + 8) DESCRIPTION The L272 is a monolithic integrated circuits in Pow- Minidip SO16 (Narrow) erdip, Minidip and SO packages intended for use as power operational amplifiers in a wide range of ap- plications including servo amplifiers and power sup- ORDERING NUMBERS : L272 (Powerdip) plies, compacts disc, VCR, etc. L272M (Minidip) The high gain and high output power capability pro- L272D (SO16 Narrow) vide superior performance whatever an operational amplifier/power booster combination is required. PIN CONNECTIONS (top view) L272M L272D 1/10 July 2003

L272 BLOCK DIAGRAMS L272 L272D L272M SCHEMATIC DIAGRAM (one only) 2/10

L272 ABSOLUTE MAXIMUM RATINGS Symbol Parameter Value Unit V Supply Voltage 28 V s V Input Voltage V i s Vi Differential Input Voltage – Vs I DC Output Current 1 A o I Peak Output Current (non repetitive) 1.5 A p Ptot Power Dissipation at: Tamb = 80(cid:176) C (L272), Tamb = 50(cid:176) C (L272M), Tcase = 90 (cid:176) C (L272D) 1.2 W Tcase = 75 (cid:176) C (L272) 5 W Top Operating Temperature Range (L272D) – 40 to 85 (cid:176) C Tstg, Tj Storage and Junction Temperature – 40 to 150 (cid:176) C THERMAL DATA Symbol Parameter Powerdip SO16 Minidip Unit R Thermal Resistance Junction-pins Max. 15 – * 70 oC/W th j-case R Thermal Resistance Junction-ambient Max. 70 – 100 oC/W th j-amb R Thermal Resistance Junction-alumina Max. – ** 50 – oC/W th j-alumina * Thermal resistance junction-pin 4 ** Thermal resistance junctions-pins with the chip soldered on the middle of an alumina supporting substrate measuring 15x 20mm; 0.65mm thickness and infinite heatsink. ELECTRICAL CHARACTERISTICS (V = 24V, T = 25oC unless otherwise specified) S amb Symbol Parameter Test Conditions Min. Typ. Max. Unit V Supply Voltage 4 28 V s V I Quiescent Drain Current V = S V = 24V 8 12 mA s O 2 Vs = 12V 7.5 11 mA s Ib Input Bias Current 0.3 2.5 m A Vos Input Offset Voltage 15 60 mV I Input Offset Current 50 250 nA os SR Slew Rate 1 V/m s B Gain-bandwidth Product 350 kHz Ri Input Resistance 500 kW Gv O. L. Voltage Gain f = 100Hz 60 70 dB f = 1kHz 50 dB eN Input Noise Voltage B = 20kHz 10 m V I Input Noise Current B = 20kHz 200 pA N CRR Common Mode Rejection f = 1kHz 60 75 dB SVR Supply Voltage Rejection f = 100Hz, RG = 10kW , VR = 0.5V dB Vs = 24V 70 V = – 12V 54 62 s V = – 6V 56 s V Output Voltage Swing I = 0.1A 23 V o p I = 0.5A 21 22.5 V p C Channel Separation f = 1 kHz; R =10W , G = 30dB dB s L v V = 24V 60 s Vs = – 6V 60 d Distortion f = 1kHz, G = 3 dB, V = 24V, R = ¥ 0.5 % v s L Tsd Thermal Shutdown Junction 145 (cid:176) C Temperature 3/10

L272 Figure 1 : Quiescent Current versus Figure 2 : Quiescent Drain Current versus Supply Voltage Temperature Figure 3 : Open Loop Voltage Gain Figure 4 : Output Voltage Swing versus Load Current Figure 5 : Output Voltage Swing versus Figure 6 : Supply Voltage Rejection versus Load Current Frequency 4/10

L272 Figure 7 : Channel Separation versus Figure 8 : Common Mode Rejection versus Frequency Frequency APPLICATION SUGGESTION - layout accuracy ; NOTE - a 100nF capacitor corrected between supply pins In order to avoid possible instability occuring into fi- and ground ; nal stage the usual suggestions for the linear power - boucherot cell (0.1 to 0.2 m F + 1 W series) between stages are useful, as for instance : Figure 9 : Bidirectional DC Motor Control with m P Compatible Inputs Figure 10 : Servocontrol for Compact-disc Figure 11 : Capstan Motor Control in Video Recorders 5/10

L272 Figure 12 : Motor Current Control Circuit. Note : The input voltage level is compatible with L291 (5-BIT D/A converter). Figure 13 : Bidirectional Speed Control of DC Motors. 2R3 (cid:176) R1 For circuit stability ensure that R > where R = internal resistance of motor. X M R M The voltage available at the terminals of the motor is V = 2 (V (cid:215) Vs ) + ‰ R ‰ (cid:215) I where ‰ R ‰ =2R (cid:176) R1 M i o M o 2 RX and IM is the motor current. 6/10

L272 mm inch DIM. OUTLINE AND MECHANICAL DATA MIN. TYP. MAX. MIN. TYP. MAX. a1 0.51 0.020 B 0.85 1.40 0.033 0.055 b 0.50 0.020 b1 0.38 0.50 0.015 0.020 D 20.0 0.787 E 8.80 0.346 e 2.54 0.100 e3 17.78 0.700 F 7.10 0.280 I 5.10 0.201 L 3.30 0.130 Powerdip 16 Z 1.27 0.050 7/10

L272 mm inch DIM. OUTLINE AND MIN. TYP. MAX. MIN. TYP. MAX. MECHANICAL DATA A 3.32 0.131 a1 0.51 0.020 B 1.15 1.65 0.045 0.065 b 0.356 0.55 0.014 0.022 b1 0.204 0.304 0.008 0.012 D 10.92 0.430 E 7.95 9.75 0.313 0.384 e 2.54 0.100 e3 7.62 0.300 e4 7.62 0.300 F 6.6 0.260 I 5.08 0.200 L 3.18 3.81 0.125 0.150 Minidip Z 1.52 0.060 8/10

L272 mm inch DIM. OUTLINE AND MIN. TYP. MAX. MIN. TYP. MAX. MECHANICAL DATA A 1.75 0.069 a1 0.1 0.25 0.004 0.009 a2 1.6 0.063 Weight: 0.20gr b 0.35 0.46 0.014 0.018 b1 0.19 0.25 0.007 0.010 C 0.5 0.020 c1 45˚ (typ.) D (1) 9.8 10 0.386 0.394 E 5.8 6.2 0.228 0.244 e 1.27 0.050 e3 8.89 0.350 F (1) 3.8 4 0.150 0.157 G 4.6 5.3 0.181 0.209 L 0.4 1.27 0.016 0.050 M 0.62 0.024 SO16 Narrow S 8˚(max.) (1) D and F do not include mold flash or protrusions. Mold flash or potrusions shall not exceed 0.15mm (.006inch). 0016020 9/10

L272 Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the conse- quences of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of STMicroelectronics. Specification mentioned in this publication are subject to change without notice. This publication supersedes and replaces all information previously supplied. STMi- croelectronics products are not authorized for use as critical components in life support devices or systems without express written approval of STMicroelectronics. The ST logo is a registered trademark of STMicroelectronics © 2003 STMicroelectronics – Printed in Italy – All Rights Reserved STMicroelectronics GROUP OF COMPANIES Australia - Brazil - Canada - China - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan - Malaysia - Malta - Morocco - Singapore - Spain - Sweden - Switzerland - United Kingdom - United States. http://www.st.com 10/10

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