SM2 D-Sub connectors - Stamped and Formed Contacts SURFACE MOUNT CONNECTORS S Specifications N Amphenol SMT D-Sub is offered in C O I I right angle, receptacle with brackets, T • Connectors according to MIL C24308 - NFC 93425-HE5 T S P as an industry standard for I / O I I R R connections. E Materials and Platings C T S C Shells Steel with tin plating E A D Boardlock features: R Insulator High temperature (peak at 260°C) glass-filled A -LIF (Low Insertion Force) boardlock H thermoplastic, UL 94V-0 C especially designed to be fully Socket contact Stamped and formed brass, selected gold in mating area; compatible with pick and place 2.54µm (100µ”) min. tin on termination area, with entire machine. contact under-plated 1.27µm (50µ”) min. nickel -ZeFo (Zero Force Insertion) boardlock Rear insert Brass, 3µm up to 5µm (118µ” up to 197µ”) tinned over has been designed so that once placed nickel 2µm up to 3 µm (78µ” to 118µ”) and expanded, secures a safe locking. Boardlock Tin plating 4µm up to 6µm (157µ” up to 236µ”) over nickel 2µm up to 3µm (78µ” up to 118µ”), insertion force: Low Insertion Force = LIF (bronze) Zero Insertion Force = ZeFo (bronze) DDeessiiggnneedd ffoorr Screwlock Brass, 6µm up to 10µm (236µ” up to 394µ”) tinned over nickel 2µm up to 3µm (78µ” up to 118µ”) PPiicckk aanndd PPllaaccee Grounding Grounding strap: brass, 4µm up to 6µm tin plating over nickel 2µm up to 3µm (78µ” up to 118µ”) SSMMTT pprroocceessss Electrical Data Current rating 3A Voltage rating 300V AC/rms 50Hz Withstanding voltage 1000V AC/rms 50Hz for one minute Insulation resistance 5000MΩ Contact resistance 10mΩ max S • Industrial N Climatic Data IO • Telecom T Operating temperature 85°C, peak at 105°C A • Any industry standard C Damp heat 56 days (40°C - 95% HR) I I / O connections L P P 2 Mechanical Data A E Single contact insertion force 1.2N < F < 2.5N / Single contact withdrawal force 0.4N min 2 LIF boardlock 8N max per connector M Coplanarity of contacts 0.2mm (.008”) max S Mating and unmating force Unit: N No. of Cts Mate (max) Unmate (min) 9 (size E) 30 3.5 15 (size A) 50 4.5 25 (size B) 83 8.0

S Shell Size Dimensions N O I S N E M I D L L A R E V O PCB LAYOUT SHELL mm (inch) SIZE A B C D PITCH F K +0.05 (.002) 0 ±0.1 (.004) 0 -0.1 (.004) -0.2 (.008) -0.25 (.01) E 31.15 (1.226) 16.4 (.645) 25 (.984) 8.03 (.316) 2.74 (.1078) 10.97 (.432) 16.3 (.642) A 39.4 (1.551) 24.8 (.976) 33.3 (1.311) 8.03 (.316) 2.74 (.1078) 19.2 (.756) 24.6 (.968) B 53.3 (2.098) 38.5 (1.515) 47 (1.850) 8.03 (.316) 2.76 (.1086) 33.12 (1.304) 38.3 (1.508)

Panel mounting option A T A D GROUNDING TABS: L A C I N H C E T BOARDLOCKS: FLANGES ACCESSORIES: 2 E / 2 M S

S How to order E T O N L 17 SM2 ... S ... ... ... ... RoHS Compliant packaging: R = reel (100 / reel, 9 Pos only) T = tube configuration: 09 15 contact plating: 25 1 = 0.2µm Au (7.9µ”) 2 = 0.4µm Au (15.7µ”) 3 = 0.5µm Au (19.7µ”) 4 = 0.8µm Au (31.5µ”) board locks / grounding tab: 6 = 1.27µm Au (50µ”) 1 = V1 grounding tab +ZeFo boardlocks (PCB = 1.6) 4 = ZeFo boardlocks only mounting options: (PCB = 1.6) 1 = rear insert 4-40 7 = V1 grounding tab only 2 = rear insert M3 8 = no grounding tab and no 5 = installed front screwlock boardlocks 4-40 B = V2 grounding tab + LIF 6 = fixed front screwlock 4-40 boardlocks (PCB = 1.6) g. n : Standard options n writi d i e For special request, please consult factory ov pr p a Memo nless u d, e bit hi o pr n is o ati plic u d ny A ary. ess ec n m e e d e w ay w ny a n ucts i d o pr ur o dify o m o ht t g e ri h e t erv es We r nly. o e n eli d ui g a as e ar nt e m Do not hesitate to contact us for further information u oc d Amphenol IT & Communication Products n this Block A3/A4, The 4th Industrial District of en i Industrial Headquarters, Dong Keng Road n giv Gong Ming Town, Shen Zhen China atio m Fax:+86(0)755 2754 9955 or nf Technical Support e i h Tel:+86(0)755 2717 7945 T Info-dsub@amphenol.com.cn B http://www.dsubconnector.com 13/ E