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  • 型号: IXTH12N100L
  • 制造商: IXYS
  • 库位|库存: xxxx|xxxx
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IXTH12N100L产品简介:

ICGOO电子元器件商城为您提供IXTH12N100L由IXYS设计生产,在icgoo商城现货销售,并且可以通过原厂、代理商等渠道进行代购。 IXTH12N100L价格参考。IXYSIXTH12N100L封装/规格:晶体管 - FET,MOSFET - 单, 通孔 N 沟道 1000V 12A(Tc) 400W(Tc) TO-247(IXTH)。您可以下载IXTH12N100L参考资料、Datasheet数据手册功能说明书,资料中有IXTH12N100L 详细功能的应用电路图电压和使用方法及教程。

产品参数 图文手册 常见问题
参数 数值
产品目录

分立半导体产品

ChannelMode

Enhancement

描述

MOSFET N-CH 1000V 12A TO-247MOSFET 12 Amps 1000V 1.3 Ohms Rds

产品分类

FET - 单分离式半导体

FET功能

标准

FET类型

MOSFET N 通道,金属氧化物

Id-ContinuousDrainCurrent

12 A

Id-连续漏极电流

12 A

品牌

IXYS

产品手册

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产品图片

rohs

符合RoHS无铅 / 符合限制有害物质指令(RoHS)规范要求

产品系列

晶体管,MOSFET,IXYS IXTH12N100L-

数据手册

点击此处下载产品Datasheet

产品型号

IXTH12N100L

Pd-PowerDissipation

400 W

Pd-功率耗散

400 W

RdsOn-Drain-SourceResistance

1.3 Ohms

RdsOn-漏源导通电阻

1.3 Ohms

Vds-Drain-SourceBreakdownVoltage

1 kV

Vds-漏源极击穿电压

1 kV

Vgs-Gate-SourceBreakdownVoltage

+/- 30 V

Vgs-栅源极击穿电压

30 V

上升时间

55 ns

下降时间

65 ns

不同Id时的Vgs(th)(最大值)

5V @ 250µA

不同Vds时的输入电容(Ciss)

2500pF @ 25V

不同Vgs时的栅极电荷(Qg)

155nC @ 20V

不同 Id、Vgs时的 RdsOn(最大值)

1.3 欧姆 @ 500mA,20V

产品种类

MOSFET

供应商器件封装

TO-247 (IXTH)

典型关闭延迟时间

110 ns

功率-最大值

400W

包装

管件

单位重量

6.500 g

商标

IXYS

安装类型

通孔

安装风格

Through Hole

封装

Tube

封装/外壳

TO-247-3

封装/箱体

TO-247-3

工厂包装数量

30

晶体管极性

N-Channel

最大工作温度

+ 150 C

最小工作温度

- 55 C

标准包装

30

漏源极电压(Vdss)

1000V(1kV)

电流-连续漏极(Id)(25°C时)

12A (Tc)

系列

IXTH12N100

通道模式

Enhancement

配置

Single

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PDF Datasheet 数据手册内容提取

LinearTM Power IXTH12N100L V = 1000V DSS MOSFET w/ Extended I = 12A D25 FBSOA R ≤≤≤≤≤ 1.3ΩΩΩΩΩ DS(on) N-Channel Enhancement Mode Avalanche Rated TO-247 Symbol Test Conditions Maximum Ratings V T = 25°C to 150°C 1000 V DSS J V T = 25°C to 150°C, R = 1MΩ 1000 V DGR J GS VGSS Continuous ±30 V G V Transient ±40 V D S Tab GSM I T = 25°C 12 A D25 C I T = 25°C, Pulse Width Limited by T 25 A G = Gate D = Drain DM C JM S = Source Tab = Drain I T = 25°C 12 A A C E T = 25°C 1.5 J AS C P T = 25°C 400 W D C T -55...+150 °C J T 150 °C JM Features T -55...+150 °C stg T 1.6mm (0.063 in.) from Case for 10s 300 °C • International Standard Package L • Designed for Linear Operation T Plastic Body for 10s 260 °C SOLD • Avalanche Rated M Mounting Torque 1.13/10 Nm/lb.in. • Molding Epoxy Meets UL94 V-0 d Weight 6 g Flammability Classification Advantages • Easy to Mount • Space Savings • High Power Density Symbol Test Conditions Characteristic Values (T = 25°C, Unless Otherwise Specified) Min. Typ. Max. J Applications BV V = 0V, I = 250μA 1000 V DSS GS D • Programmable Loads V V = V , I = 250μA 3.5 5.5 V GS(th) DS GS D • Current Regulators I V = ±30V, V = 0V ±100 nA • DC-DC Converters GSS GS DS • Battery Chargers I V = V ,V = 0V 50 μA DSS DS DSS GS • DC Choppers T = 125°C 500 μA J • Temperature and Lighting Controls R V = 20V, I = 0.5 • I , Note 1 1.3 Ω DS(on) GS D DSS © 2010 IXYS CORPORATION, All Rights Reserved DS99126B(04/10)

IXTH12N100L Symbol Test Conditions Characteristic Values TO-247 (IXTH) Outline (T = 25°C, Unless Otherwise Specified) Min. Typ. Max. J g V = 20V, I = 0.5 • I , Note 1 3.0 5.0 S fs DS D DSS C 2500 pF iss C V = 0V, V = 25V, f = 1MHz 300 pF ∅ P oss GS DS 1 2 3 C 95 pF rss t 30 ns d(on) Resistive Switching Times t 55 ns r V = 15V, V = 0.5 • V , I = 0.5 • I t GS DS DSS D DSS 110 ns d(off) R = 4.7Ω (External) t G 65 ns e f Terminals: 1 - Gate 2 - Drain Q 155 nC g(on) 3 - Source Q V = 20V, V = 0.5 • V , I = 0.5 • I 35 nC gs GS DS DSS D DSS Dim. Millimeter Inches Q 55 nC Min. Max. Min. Max. gd A 4.7 5.3 .185 .209 R 0.31 °C/W A 2.2 2.54 .087 .102 thJC 1 A 2.2 2.6 .059 .098 R 0.21 °C/W 2 thCS b 1.0 1.4 .040 .055 b 1.65 2.13 .065 .084 1 b 2.87 3.12 .113 .123 2 C .4 .8 .016 .031 D 20.80 21.46 .819 .845 Safe-Operating-Area Specification E 15.75 16.26 .610 .640 e 5.20 5.72 0.205 0.225 Symbol Test Conditions Characteristic Values L 19.81 20.32 .780 .800 Min. Typ. Max. L1 4.50 .177 ∅P 3.55 3.65 .140 .144 SOA V = 800V, I = 0.25A, T = 60°C 200 W Q 5.89 6.40 0.232 0.252 DS D C R 4.32 5.49 .170 .216 S 6.15 BSC 242 BSC Source-Drain Diode Symbol Test Conditions Characteristic Values (T = 25°C, Unless Otherwise Specified) Min. Typ. Max. J I V = 0V 12 A S GS I Repetitive, Pulse Width Limited by T 48 A SM JM V I = I , V = 0V, Note 1 1.5 V SD F S GS t 1000 ns rr I = I , -di/dt = 100A/μs, V =100V, V = 0V F S R GS Note 1. Pulse test, t ≤ 300μs, duty cycle, d ≤ 2%. IXYS Reserves the Right to Change Limits, Test Conditions, and Dimensions. IXYS MOSFETs and IGBTs are covered 4,835,592 4,931,844 5,049,961 5,237,481 6,162,665 6,404,065 B1 6,683,344 6,727,585 7,005,734 B2 7,157,338B2 by one or more of the following U.S. patents: 4,850,072 5,017,508 5,063,307 5,381,025 6,259,123 B1 6,534,343 6,710,405 B2 6,759,692 7,063,975 B2 4,881,106 5,034,796 5,187,117 5,486,715 6,306,728 B1 6,583,505 6,710,463 6,771,478 B2 7,071,537

IXTH12N100L Fig. 1. Output Characteristics @ T = 25ºC Fig. 2. Extended Output Characteristics @ T = 25ºC J J 12 20 VGS = 20V VGS = 20V 12V 18 12V 10 10V 16 14 s 8 9V 10V pere eres 12 Am 6 mp 10 I - D 8V - AD 8 9V I 4 6 8V 4 2 7V 2 7V 6V 6V 0 0 0 2 4 6 8 10 12 14 16 0 5 10 15 20 25 30 VDS - Volts VDS - Volts Fig. 4. R Normalized to I = 6A Value vs. DS(on) D Fig. 3. Output Characteristics @ TJ = 125ºC Junction Temperature 12 3.0 V G S = 1200VV VGS = 20V 10 2.6 9V 8 ed 2.2 I D = 12A z es ali mper 6 8V Norm 1.8 I D = 6A I - AD 4 - DS(on) 1.4 7V R 1.0 2 0.6 6V 5V 0 0.2 0 5 10 15 20 25 30 35 -50 -25 0 25 50 75 100 125 150 VDS - Volts TJ - Degrees Centigrade Fig. 5. R Normalized to I = 6A Value vs. Fig. 6. Maximum Drain Current vs. DS(on) D Drain Current Case Temperature 2.6 12 2.4 VGS = 20V TJ = 125ºC 2.2 10 d ormalize 12..80 mperes 8 - Nn) 1.6 - AD 6 o I RDS( 1.4 TJ = 25ºC 4 1.2 2 1.0 0.8 0 0 2 4 6 8 10 12 14 16 18 20 -50 -25 0 25 50 75 100 125 150 ID - Amperes TC - Degrees Centigrade © 2010 IXYS CORPORATION, All Rights Reserved

IXTH12N100L Fig. 7. Input Admittance Fig. 8. Transconductance 16 10 14 9 TJ = - 40ºC 8 12 7 25ºC eres 10 TJ = 125ºC mens 6 125ºC I - AmpD 68 - 2450ººCC g - Sief s 45 3 4 2 2 1 0 0 3.5 4.5 5.5 6.5 7.5 8.5 9.5 10.5 0 2 4 6 8 10 12 14 16 VGS - Volts ID - Amperes Fig. 9. Forward Voltage Drop of Intrinsic Diode Fig. 10. Gate Charge 36 20 32 18 VDS = 500V I D = 6A 28 16 I G = 10mA 14 24 eres 20 olts12 p V - AmS 16 V - GS108 I 12 TJ = 125ºC 6 8 TJ = 25ºC 4 4 2 0 0 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 1.1 1.2 0 20 40 60 80 100 120 140 160 VSD - Volts QG - NanoCoulombs Fig. 11. Capacitance Fig. 12. Maximum Transient Thermal Impedance 1 10,000 f = 1 MHz s ad Ciss ar 1,000 F o Pic W e - C / 0.1 apacitanc 100 Coss Z - º(th)JC C Crss 10 0.01 0 5 10 15 20 25 30 35 40 0.0001 0.001 0.01 0.1 1 VDS - Volts Pulse Width - Seconds IXYS Reserves the Right to Change Limits, Test Conditions, and Dimensions.

IXTH12N100L Fig. 13. Forward-Bias Safe Operating Area Fig. 14. Forward-Bias Safe Operating Area @ T = 25ºC @ T = 60ºC C C 100 100 RDS(on) Limit RDS(on) Limit 25µs 25µs 10 100µs 10 100µs s s e e er er p p m m A 1ms A - D - D 1ms I I 1 1 10ms 10ms DC TJ = 150ºC TJ = 150ºC TC = 25ºC TC = 60ºC DC Single Pulse Single Pulse 0.1 0.1 10 100 1,000 10,000 10 100 1,000 10,000 VDS - Volts VDS - Volts © 2010 IXYS CORPORATION, All Rights Reserved IXYS REF: T_12N100L(7N)4-19-10-A

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