High-Speed(10+Gbps) BGA Mezzanine Connectors IT3 Series ■Flexibility Hirose’s IT3 mezzanine connector system is as comfortable in today’s data rates of PCIe and XAUI as it is in tomorrow’s 10+Gbps systems. With the ability to transmit differential, single- ended, and power through one package and d. ve being stackable from 14 – 40mm, IT3 can solve r e s your interface needs for both current and future e R generations. s ht g Ri All ■Mechanical features D. ● Unique 3-piece structure for flexibility T L ● Stacking heights from 14 to 40mm O., ● Staggered 1.5mm ∞ 1.75mm ball grid array C C Interposer ● Number of Contacts: 100, 200, &300 signals RI Signal Ground + 90% additional grounds T EC ● Differential, single-ended, and power L E ● Low mating/extracting forces E S ● Wide misalignment tolerances for multiple O R connector use 8 HI Signal / Ground Configuration ● Both of SnPb and Pb-free are available 01 ● Excellent reflow solderability 2 ht ● IT3 is inter-mateable with IT5 Series g ri ■Signal integrity features y p o ● Insertion loss to Crosstalk Ratio (ICR) C 8 The ICR performance meets the 60 0 1 0 extrapolated IEEE 802.3ap ICR 1.2 specification for 6.25Gbps with 50 IEEE spec -10 ec. fully-populated pin assignment, 40 D -20 aasnsdig 1nm0+eGnbt.ps with skipped pin CR (dB)30 RL (dB)-30 I 20 ● Return Loss -40 10 RL The differential return loss meets IEEE Spec the extrapolated IEEE 802.3ap 0 -50 0 5 10 15 20 0 5 10 15 20 specification up to 12GHz. Frequency (GHz) Frequency (GHz) ■Stacking height variations 2piece 3piece Stacking Height 14 15 17 18 20 22 25 26 28 30 32 35 38 40 Contact Position mm mm mm mm mm mm mm mm mm mm mm mm mm mm 100 * 200 * 300 * : Under planning Ipnl ecaassee sc ownhtaecret ath ceo ampppalincya trieopnr ewsielln dteamtivaen fdo ar fhuirgthh eler vineflo orfm raetliiaobni.lity, such as automotive, 2017.10⑤ 1

IT3 Series●High-Speed(10+Gbps) BGA Mezzanine Connectors ■Product Specifications Current Rating : 1.0A / pin (note 1) Operating Temperature Range: -55˚C to +85˚C Rating Voltage Rating : 50Vrms Operating Humidity Range: For relative humidity, Storage Temperature Range : -10˚C to +60˚C 90% max (no condensation is permitted) Item Specification Conditions 1. Insulation Resistance 1000Mø min. 100V DC 2. Withstanding Voltage No fl ashover or insulation breakdown 150V duty for 60 seconds (2mA max leak) 40mø max. (height 14-15mm) 50mø max. (height 17-24mm) (note 2) 3. Contact Resistance 100mA 55mø max. (height 25-32mm) (note 2) 60mø max. (height 33-40mm) (note 2) 1) No electrical discontinuity of 1μs or more Frequency : 50 to 2000Hz; power spectrum density : 4. Vibration d. 2) No damage, crack, or loose part 0.1G2/Hz for 90 minutes in three directions e v 5. Cyclic Temperature 1) Contact resistance change: 20mø or less 25˚C, 80% RH : 60 min dwell time, 30 min ramp time r e and Humidity 2) No damage, crack or loose part 65˚C, 50% RH : 60 min dwell time under 24 cycles s e R 6. Durability 1) Contact resistance change: 20mø or less 100 cycles s (Mating/Un-mating) 2) No damage, crack or loose part ht g Note1 : Refer to IT3 derating curves on test report TR636E-20041 for power application. Ri Note2 : The value of contact resistance includes 2 contact points and the bulk resistance. All ■Materials / Finish TD. ●Receptacle L O., Component Material Finish & Remarks C Housing(Mounting Side) LCP Black , UL 94V-0 C Housing(Detachable / Mating Side) LCP Gray , UL 94V-0 RI Locator LCP Black , UL 94V-0 T C Contact Area : Gold (0.76 μm) over Nickel (1.5 μm) E Contact Copper Alloy Mounting Area : Gold (0.05 μm) over Nickel (1.5 μm) L E Other : Nickel (1.5 μm) E S Solder Ball Tin-Lead (SnPb) Sn(63)-Pb(37) O Tin (Pb-Free) Sn(96.5)-Ag(3)-Cu(0.5) R HI Tray Polystyrene Black 8 Pick Up Cap Stainless steel 300pos 1 Pick Up Tape Paper (Nomex) 100pos and 200pos 0 ht 2 ●Interposer g ri Component Material Finish & Remarks y p Guide (Mounting Side) PBT Black , UL 94V-0 o C LCP Gray , UL 94V-0 8 Guide (Detachable/Mating Side) PBT Gray , UL 94V-0 01 Blade LCP Black , UL 94V-0 2 1. Contact Copper Alloy Contact Area : Gold (0.76 μm) over Nickel (1.5 μm) c. Ground Shield Copper Alloy Other : Nickel (1.5 μm) e D Tray Polypropylene ---------- ●Plug Component Material Finish & Remarks Housing LCP Black , UL 94V-0 Locator LCP Black , UL 94V-0 Contact Area : Gold (0.76 μm) over Nickel (1.5 μm) Contact Copper Alloy Mounting Area : Gold (0.05 μm) over Nickel (1.5 μm) Other : Nickel (1.5 μm) Tin-Lead (SnPb) Sn(63)-Pb(37) Solder Ball Tin (Pb-Free) Sn(96.5)-Ag(3)-Cu(0.5) Tray Polystyrene Blue Pick Up Cap Stainless steel 100pos, 200pos and 300pos 2

IT3 Series●High-Speed(10+Gbps) BGA Mezzanine Connectors ■Product Number Structure Refer to the chart below when determining the product specifications from the product number. Please select from the product numbers listed in this catalog when placing orders. ●Receptacle IT 3 ** - *** S - BGA ** (**) ❶ ❷ ❸ ❹ ❺ ❻ ❼ ●Interposer IT 3 ** - *** P - ** H ** (**) d. ❶ ❷ ❸ ❹ ❽ ❻ ❾ e rv ●Plug e s e IT 3 ** - *** P - ** BGA ** (**) R s ht ❶ ❷ ❸ ❹ ❽ ❻ ❼ g Ri All ❶ Series name : IT3 ❼ Material and Plating Specification of Mounting Receptacle, plug D. ❷ Receptacle Type Housing : Black T L D : Mating Receptacle (37) : Pb-free Solder Sn(96.5)-Ag(3.0)-Cu(0.5) O., D* : Mating Receptacle ( Customized ) Contact Area : Au(0.76μm)+Ni(1.5μm) C M : Mounting Receptacle (57) : Eutectic Solder Sn(63)-Pb(37) C M* : Mounting Receptacle ( Customized ) Contact Area : Au(0.76μm)+Ni(1.5μm) RI Interposer Type Material and Plating Specification of Mating Receptacle T C Blank : Standard Housing : Glay E L ** : Customized (39) : Pb-free Solder Sn(96.5)-Ag(3.0)-Cu(0.5) E Plug Type Contact Area : Au(0.76μm)+Ni(1.5μm) E S M : Plug (59) : Eutectic Solder Sn(63)-Pb(37) O M* : Plug ( Customized ) Contact Area : Au(0.76μm)+Ni(1.5μm) R HI ❸ Contact Positions : 100, 200, 300 ❽ Stacking Height (mm) 8 ❹ Connector type 14, 15, 17, 18, 20, 22, 25, 26, 28, 30, 32, 35, 38, 40 1 0 S : Receptacle Plug : 14, 15 2 ht P : Interposer , Plug Interposer : 17, 40 g ❺ BGA : Ball Grid Array ❾ Plating Specification of Interposer yri ❻ Package Specification (03), (04) : Contact Area : Au(0.76μm)+Ni(1.5μm) p o Blank : Standard C 8 ** : Customized 1 0 2 1. ■Signal Integrity c. De ●Pin assignment For the fully-populated pin assignment, adjacent pins are grouped into differential pairs as shown in the figures below. In the following data, one victim pair and eight aggressor pairs are included. 7 8 9 16 17 18 4 5 6 13 14 15 1 2 3 10 11 12 Mating receptacle side Mounting receptacle side Signal Ground Victim pair Aggressor pair 3

IT3 Series●High-Speed(10+Gbps) BGA Mezzanine Connectors ●Impedance profile at 60ps rise time (20-80%) The impedance profiles (of connector only) for the center pair are shown below. The IT3 receptacles are designed with higher impedance to offset the via’s low impedance. 115 115 115 110 110 110 m) m) m) Oh105 Oh105 Oh105 Z ( Z ( Z ( 100 100 100 d. e v S11 S11 S11 r 95 95 95 e 0 200 400 600 800 1000 0 200 400 600 800 1000 0 200 400 600 800 1000 es Time (ps) Time (ps) Time (ps) R 17mm Height 25mm Height 32mm Height s ht g Ri All ●Differential propagation delay D. Stacking Height (mm) 17 25 32 T L Delay (ps) 101.05 146.69 188.48 O., C C ●Differential Insertion Loss RI T C The differential insertion loss is less than -2dB up to 12GHz. E L E E 0 0 0 S O -1 -1 -1 R -2 -2 -2 HI -3 -3 -3 8 -4 -4 -4 1 20 S (dB) -5 S (dB) -5 S (dB) -5 ht -6 -6 -6 g -7 -7 -7 ri y -8 -8 -8 p o -9 -9 -9 C S514 S514 S514 8 -100 5 10 15 20 -100 5 10 15 20 -100 5 10 15 20 1 17mm Height 25mm Height 32mm Height 0 2 1. c. e D ●Differential Return Loss The connector-only differential return loss for the center pair meets the extrapolated IEEE 802.3ap spec up to 12GHz. (The attenuation of PCB traces in the channel will give an even larger margin.) 0 0 0 -10 -10 -10 -20 -20 -20 B) B) B) RL (d-30 RL (d-30 RL (d-30 -40 -40 -40 RL RL RL IEEE Spec IEEE Spec IEEE Spec -50 -50 -50 0 5 10 15 20 0 5 10 15 20 0 5 10 15 20 Frequency (GHz) Frequency (GHz) Frequency (GHz) 17mm Height 25mm Height 32mm Height 4

IT3 Series●High-Speed(10+Gbps) BGA Mezzanine Connectors ●Differential Near-End Crosstalk (NEXT) The near-end crosstalk at the center pair from surrounding 8 aggressors is shown below. The NEXT is not as critical because TX and RX can be grouped into separate wafers. 0 0 0 -10 -10 -10 -20 S51 -20 S51 -20 S51 S52 S52 S52 S (dB)-30 SS5534 S (dB)-30 SS5534 S (dB)-30 SS5534 S56 S56 S56 -40 -40 -40 S57 S57 S57 S58 S58 S58 d. -50 S59 -50 S59 -50 S59 e Sum Sum Sum rv -60 -60 -60 e 0 5 10 15 20 0 5 10 15 20 0 5 10 15 20 es Frequency (GHz) Frequency (GHz) Frequency (GHz) R s 17mm Height 25mm Height 32mm Height ht g Ri All D. ●Differential Far-End Crosstalk (FEXT) T L Low far-end crosstalk at the center pair from surrounding 8 aggressors is observed. Even lower O., crosstalk can be achieved by skipping pins. C C RI 0 0 0 T C -10 -10 -10 E L E -20 S141 -20 S141 -20 S141 E S142 S142 S142 OS S (dB)-30 SS114434 S (dB)-30 SS114434 S (dB)-30 SS114434 R -40 S146 -40 S146 -40 S146 HI SS114478 SS114478 SS114478 8 -50 S149 -50 S149 -50 S149 1 Sum Sum Sum 0 2 -60 -60 -60 ht 0 5 Frequenc1y0 (GHz) 15 20 0 5 Frequenc1y0 (GHz) 15 20 0 5 Frequenc1y0 (GHz) 15 20 g ri 17mm Height 25mm Height 32mm Height y p o C 8 1 0 2 1. ●Insertion-Loss-to-Crosstalk-Ratio (ICR) for FEXT c. e D The insertion-loss-to-crosstalk-ratio (ICR) for 8-aggressor FEXT meets the extrapolated IEEE 802.3ap specification up to 12GHz. 60 60 60 ICR ICR ICR 50 IEEE spec 50 IEEE spec 50 IEEE spec 40 40 40 B) B) B) R (d30 R (d30 R (d30 C C C I I I 20 20 20 10 10 10 0 0 0 0 5 10 15 20 0 5 10 15 20 0 5 10 15 20 Frequency (GHz) Frequency (GHz) Frequency (GHz) 17mm Height 25mm Height 32mm Height 5

IT3 Series●High-Speed(10+Gbps) BGA Mezzanine Connectors ■Receptacle A±0.5 5 0. ± 2 9. 1 d. e v r e s e R s ht g Ri 3 All ±0. D. 6.0 T L O., Shown: 200 position mounting receptacle, IT3M-200S-BGA C C RI T C E L E *Unit : mm E Contact Positions Type Solder Ball Material Part No. HRS No. A S O R Mating Pb-free (SAC305) solder IT3D-100S-BGA(39) 636-0013-1 39 HI 100 Receptacle SnPb solder IT3D-100S-BGA(59) 636-0013-1 59 21.0 8 (100 signals/90 grounds) Mounting Pb-free (SAC305) solder IT3M-100S-BGA(37) 636-0014-4 37 1 0 Receptacle SnPb solder IT3M-100S-BGA(57) 636-0014-4 57 2 ht Mating Pb-free (SAC305) solder IT3D-200S-BGA(39) 636-0003-8 39 g 200 Receptacle SnPb solder IT3D-200S-BGA(59) 636-0003-8 59 ri 38.5 py (200 signals/180 grounds) Mounting Pb-free (SAC305) solder IT3M-200S-BGA(37) 636-0004-0 37 Co Receptacle SnPb solder IT3M-200S-BGA(57) 636-0004-0 57 8 Mating Pb-free (SAC305) solder IT3D-300S-BGA(39) 636-0007-9 39 01 300 Receptacle SnPb solder IT3D-300S-BGA(59) 636-0007-9 59 2 56.0 1. (300 signals/270 grounds) Mounting Pb-free (SAC305) solder IT3M-300S-BGA(37) 636-0008-1 37 c. Receptacle SnPb solder IT3M-300S-BGA(57) 636-0008-1 57 e D 6

IT3 Series●High-Speed(10+Gbps) BGA Mezzanine Connectors ■Interposer A±0.5 5 0. ± 1 2 Mating Side ed. ±0.5 v B r e s e Mounting Side R s ht g Ri D. All wipe) LT act ers) O., Cont spac TRIC C IT3D-***S-BGA(**) Daughter card ±0.25 1.4±0.3 ( (1.0 with C C 8 HIROSE ELE Spacer height : D±0.127 IT3-S*p*a*cPe-r**H(**) IT3M-***S-BGA(**) MotheSr pbaocaerrd Mated connector height : MMoautinntign gS Sididee 0.9±0.3Contact wipe 1 0 Mating Cross Section 2 ht Mating condition with spacers Mating condition without spacers g ri y p o C 8 *Unit : mm 1 Height Height 0 Part No. HRS No. A B C D Part No. HRS No. A B C D 2 (mm) (mm) 1. IT3-100P-17H(04) 636-0265-4 04 24.0 IT3-100P-28H(04) 636-0170-0 04 24.0 ec. 17 IT3-200P-17H(04) 636-0100-4 04 41.5 15.8 16.6 17.0 28 IT3-200P-28H(04) 636-0105-8 04 41.5 26.827.628.0 D IT3-300P-17H(04) 636-0130-5 04 59.0 IT3-300P-28H(04) 636-0140-9 04 59.0 IT3-100P-18H(03) 636-0250-7 03 24.0 IT3-200P-30H(04) 636-0180-3 04 41.5 30 28.8 29.6 30.0 18 IT3-200P-18H(03) 636-0252-2 03 41.5 16.817.618.0 IT3-300P-30H(04) 636-0185-7 04 59.0 IT3-300P-18H(03) 636-0254-8 03 59.0 IT3-100P-32H(04) 636-0266-7 04 24.0 IT3-100P-20H(03) 636-0223-4 03 24.0 32 IT3-200P-32H(04) 636-0115-1 04 41.5 30.831.632.0 20 IT3-200P-20H(03) 636-0224-7 03 41.5 18.8 19.620.0 IT3-300P-32H(04) 636-0145-2 04 59.0 IT3-300P-20H(03) 636-0225-0 03 59.0 IT3-100P-35H(03) 636-0239-4 03 24.0 IT3-100P-22H(03) 636-0264-1 03 24.0 35 IT3-200P-35H(03) 636-0240-3 03 41.5 33.834.635.0 22 IT3-200P-22H(03) 636-0209-3 03 41.5 20.8 21.6 22.0 IT3-300P-35H(03) 636-0241-6 03 59.0 IT3-300P-22H(03) 636-0210-2 03 59.0 IT3-100P-38H(03) 636-0200-9 03 24.0 IT3-100P-25H(04) 636-0150-2 04 24.0 38 IT3-200P-38H(03) 636-0195-0 03 41.5 36.8 37.638.0 25 IT3-200P-25H(04) 636-0155-6 04 41.5 23.824.625.0 IT3-300P-38H(03) 636-0190-7 03 59.0 IT3-300P-25H(04) 636-0160-6 04 59.0 IT3-100P-40H(03) 636-0230-0 03 24.0 40 38.839.640.0 IT3-100P-26H(04) 636-0165-0 04 24.0 IT3-300P-40H(03) 636-0175-3 03 59.0 26 IT3-200P-26H(04) 636-0110-8 04 41.5 24.825.6 26.0 IT3-300P-26H(04) 636-0135-9 04 59.0 7

IT3 Series●High-Speed(10+Gbps) BGA Mezzanine Connectors ■Plug A±0.5 5 5 0. 0. ± ± 4 1 2 2 d. e v r e s e R s ht g Ri All TD. ±0.5 L B O., C C RI Shown : 200 position mounting plug, IT3M-200P-15BGA T C E *Unit : mm L E Height E (mm) Solder Ball Material Part No. HRS No. A B S IT3M-100P-14BGA(37) 636-0511-9 37 24.0 O R 14 Pb-Free(SAC305) solder IT3M-200P-14BGA(37) 636-0508-4 37 41.5 13.15 HI IT3M-300P-14BGA(37) 636-0507-1 37 59.0 8 Pb-Free(SAC305) solder IT3M-100P-15BGA(37) 636-0504-3 37 1 24.0 0 Sn-Pb solder IT3M-100P-15BGA(57) 636-0504-3 57 2 right 15 PSbn--FPrbe eso(SldAeCr305) solder IITT33MM--220000PP--1155BBGGAA((3577)) 663366--00550055--66 3577 41.5 14.15 y p Pb-Free(SAC305) solder IT3M-300P-15BGA(37) 636-0506-9 37 o 59.0 C Sn-Pb solder IT3M-300P-15BGA(57) 636-0506-9 57 8 1 0 2 1. c. e D 8

IT3 Series●High-Speed(10+Gbps) BGA Mezzanine Connectors BPCB footprint (mounting foot pattern) Ø0.6±0.03 Signal Ø0.1XY 1 2 Ground Column No.n No.1 5) 5) 8 8 Row Y 6. 7. ( ( A B C D E 1 2 F G MHKP NRLJ 0.75 1.5 13.5 (27.2) (29.2) d. T U ve V W r e s e X R s ht 0.875 g Ri 1.75 All 0.875 A 1 (5.73) D. 1 (B) 2 (6.73) T L 2 (C) O., Mounting Receptacle - IT3M C C Plug RI T C Ø0.6±0.03 E L Signal Ø0.1XY E E Ground S Column O No.n No.1 R Row HI 8 VWU 01 PT R 1 2 2 N pyright MHDKF GELJ 0.75 1.5 13.5 (27.2) (29.2) o C C B A 18 Y 85) 85) 0 X 6. 7. 2 ( ( 1. c. 0.875 e 1 2 D 1.75 0.875 A 1 (5.73) 1 (B) 2 (6.73) 2 (C) Mating Receptacle - IT3D 1 Minimum clearance for all devices 2 Minimum clearance for sensitive devices *Unit : mm Dimension 100 200 300 A 15.75 33.25 50.75 B 28.10 45.60 63.10 C 30.10 47.60 65.10 9

IT3 Series●High-Speed(10+Gbps) BGA Mezzanine Connectors BSpacers Spacers are required to support the PWB’s and protect the BGA solder joints. Stacking Height d. e v r e s e Spacers R s ht g Ri All Suggested spacer style is shown below : D. T L O., C C RI T Spacer, male-male, M3 thread C E The recommended spacer height corresponds to the interposer stacking height as shown in the L E chart below : E S Stacking Height Recommended Spacer Height O R 14 mm 14 +/-0.127 mm HI 15 mm 15 +/-0.127 mm 18 17 mm 17 +/-0.127 mm 20 18 mm 18 +/-0.127 mm ht 20 mm 20 +/-0.127 mm g ri 22 mm 22 +/-0.127 mm y p 25 mm 25 +/-0.127 mm o C 26 mm 26 +/-0.127 mm 8 28 mm 28 +/-0.127 mm 01 30 mm 30 +/-0.127 mm 2 1. 32 mm 32 +/-0.127 mm c. 35 mm 35 +/-0.127 mm e D 38 mm 38 +/-0.127 mm 40 mm 40 +/-0.127 mm 10- 50mm 10- Two spacers located diagonally are minimally 50mm required. Some applications may require 4 spacers. Spacers should be located 10 – 50 mm from the corners of the receptacles to prevent excessive mechanical loading on the interconnections. If assembly will be subjected to vibration, spacers should be located to prevent resonance, and additional spacers may be required. (cid:162)(cid:40)(cid:35)(cid:42) Recommended Spacer Location (cid:67)(cid:100)(cid:99)(cid:21)(cid:101)(cid:97)(cid:86)(cid:105)(cid:90)(cid:89)(cid:21)(cid:105)(cid:93)(cid:103)(cid:100)(cid:106)(cid:92)(cid:93)(cid:21)(cid:93)(cid:100)(cid:97)(cid:90) 10

IT3 Series●High-Speed(10+Gbps) BGA Mezzanine Connectors BInterposer installation Position interposer directly over mounting receptacle, aligning the polarity chamfers. If positioned properly, the interposer should slide easily onto the mounting receptacle. Place installation cap onto interposer and push straight down to engage the locking latches. Manual Installation *Installation caps are available upon Press firmly on installation cap only, request for manual operation not on wafers or interposer body d. e v r e s e R s ht g Ri Locking All Latch D. T L O., uAnldwearyssid seu tpop porret vPeWntB fl efrxoimng C C BDaughter card installation RI T After the interposer is mounted, install spacers onto motherboard. To install mating receptacle, align C E the spacer holes in the daughter card with the threads on the spacers. L E E S O R HI 8 1 0 2 ht g ri y p o C 8 1 0 2 1. The spacers help align the mating receptacle with c. e the interposer. If positioned correctly, the mating D receptacle will slip down into the interposer. Push directly down on the assembly to lock the mating receptacle in place. Install nuts onto the spacer threads. Tighten nuts to specified torque. BDaughter card removal To remove a daughter card, first remove the nuts from the reinforcing spacers, then lift the daughter card straight off the interposers, as shown right. 11

IT3 Series●High-Speed(10+Gbps) BGA Mezzanine Connectors BInterposer removal Interposer Removal by Hand 1) Hold the Interposer Assembly on the walls 2) Gently rotate one side of the Interposer without locking latches Assembly laterally 10° maximum d. Locking e Latch 10(cid:100)MAX v r e s e Caution: do not rotate more than 10 degrees R s ht 3) While gently rotating, pull up on other side of the 4) The Interposer Assembly is removed, and the g Interposer Assembly Mounting Receptacle is ready to accept another Ri Interposer Assembly. All D. T L O., C C RI T C E L E E S An interposer removal tool is also available. This tool is not an interposer installation cap, so please do not O use it to install an interposer. Doing so may damage an interposer. R HI Interposer Removal with Tool 8 1 0 2 1) Cover the interposer Assembly with the 2) Gently rotate one side of the Interposer ht interposer removal tool Assembly laterally 10° maximum using the tool g ri y p o C 8 1 0 2 1. Locking c. e Latch D 10°MAX Caution: do not rotate more than 10 degrees 3) While gently rotating, pull up on other side of the 4) The Interposer Assembly is removed, as it is tool inside the tool Precaution Visually inspect the interposer before reinstalling it. Discard if it shows any sign of damage or wear. Do not subject the interposer assembly to more than five removal-reinstallation cycles, even if it appears unaffected. 12

IT3 Series●High-Speed(10+Gbps) BGA Mezzanine Connectors BAssembly reflow soldering profile Parameters Eutectic (SnPb) Pb-Free Comment Preheat Ramp Rate 2 - 3ç/sec 2 - 3ç/sec Other components may limit ramp rate to 2ç/sec Soak requirements determined by board design, Soak Time 0 - 120 sec 0 - 120 sec oven capability, and paste activation requirements Caution - "oversoaking" may exhaust fl ux and Soak Temperature 140 - 180ç 160 - 215ç affect soldering Cooler peak temperatures may require longer Peak Refl ow Temperature 205 - 225ç 230 - 250ç TAL's Shorter TAL's may require higher peak Time Above Liquidus (TAL) 30 - 90 sec 45 - 120 sec temperatures d. e Faster cooling rates produce fi ner grain v Cooling Rate >6ç/sec >6ç/sec er structures and smoother joint appearances es Open body design allows for low delta T between R Maximum Package Body Temperature (T) 240ç 260ç package and solder joint s ght Maximum Delta T between Body and 10ç 10ç Standard practice is easy to achieve with open Ri PWB at Liquidus body design All Package Body Exposure Limit 5 sec 5 sec Adjust profi le if maximum exposure limit is at Maximum Temperature approached or exceeded D. T L O., Reflow Profile C C RI Different solder pastes have T C different thermal performance E characteristics. Consult with L E paste manufacturer for optimum E S profile settings. O Check thermal exposure limits of R HI PWB laminate if processing with 8 Pb-free solder. 1 0 2 ht g ri y p o C 8 1 0 2 1. c. De BMating self alignment BMating tolerance *Unit : mm Due to its 3-piece design, the IT3 connector system can accept mating tolerances of up to ±0.3mm tolerance in the X-axis and up to ±0.2mm in the Y-axis. +/-0.8 +/-0.6 +/-0.3 +/-0.2 X-direction Y-direction X-direction Y-direction 13

IT3 Series●High-Speed(10+Gbps) BGA Mezzanine Connectors BPackaging information Please order per box with its Minimum Order Quantity (MOQ) of connectors contained. The number for each configuration is shown below. ●Receptacles Unit : pcs IT 3* - ***S - BGA(**) (2) 100 200 300 (1) (1) (2) M 120 72 48 ●Plug D 120 72 48 IT 3* - ***P - BGA(**) d. (1) (2) e v er This is also a packaging quantity, s e therefore please multiply integrally R s based on this MOQ quantity when Right you place more. Dry package and deoxidizer Box All Ex.) 240pcs of IT3M-300S-BGA(57) TD. (= 5 of vacuum packed boxes) Cushion L materials O., C C RI Three trays Bundle T + One empty tray as lid C E L BPackaging information E E S ●Interposers O R IT 3 - ***P - **H(**) HI Unit : pcs 8 (3) (4) (3) 01 100 200 300 2 (4) ht 17 100 80 60 g ri 18 100 80 60 y p 20 100 80 60 o C 22 100 80 60 8 25 100 80 60 1 0 26 100 80 60 2 1. 28 50 40 30 c. 30 ---------- 40 30 e D 32 50 40 30 35 50 40 30 38 50 40 30 40 50 ---------- 30 This is also a packaging quantity, therefore please multiply integrally based on this MOQ quantity when you place more. Box Cushion materials Bundle One or two trays (depending on height) +One empty tray as lid 14

IT3 Series●High-Speed(10+Gbps) BGA Mezzanine Connectors BTray information BTray information (con’t) (cid:77)(cid:40)(cid:21) (cid:56)(cid:93)(cid:86)(cid:98)(cid:91)(cid:90)(cid:103)(cid:21)(cid:29)(cid:56)(cid:100)(cid:99)(cid:99)(cid:90)(cid:88)(cid:105)(cid:100)(cid:103)(cid:21)(cid:56)(cid:100)(cid:97)(cid:106)(cid:98)(cid:99)(cid:38)(cid:30) (cid:77)(cid:40) (cid:56)(cid:93)(cid:86)(cid:98)(cid:91)(cid:90)(cid:103)(cid:21)(cid:29)(cid:56)(cid:100)(cid:99)(cid:99)(cid:90)(cid:88)(cid:105)(cid:100)(cid:103)(cid:21)(cid:56)(cid:100)(cid:97)(cid:106)(cid:98)(cid:99)(cid:38)(cid:30) (cid:40)(cid:38) (cid:40)(cid:38) (cid:40)(cid:38) (cid:40)(cid:38) (cid:40)(cid:38) (cid:40)(cid:38) (cid:40)(cid:38) (cid:40)(cid:38) (cid:40)(cid:38) (cid:38)(cid:45) (cid:78)(cid:40)(cid:21) (cid:40)(cid:38) (cid:40)(cid:38) (cid:40)(cid:38) (cid:40)(cid:38) (cid:40)(cid:38) (cid:40)(cid:38) (cid:40)(cid:38) (cid:40)(cid:38) (cid:40)(cid:38) (cid:38)(cid:45) (cid:78)(cid:40) (cid:38)(cid:45)(cid:35)(cid:44)(cid:42) (cid:38)(cid:45)(cid:35)(cid:44)(cid:42) (cid:38)(cid:40)(cid:42)(cid:35)(cid:46)(cid:164)(cid:37)(cid:35)(cid:42) (cid:40)(cid:39)(cid:35)(cid:45)(cid:40)(cid:39)(cid:35)(cid:45)(cid:40)(cid:39)(cid:35)(cid:45) (cid:38)(cid:40)(cid:42)(cid:35)(cid:46)(cid:164)(cid:37)(cid:35)(cid:42) (cid:40)(cid:39)(cid:35)(cid:45)(cid:40)(cid:39)(cid:35)(cid:45)(cid:40)(cid:39)(cid:35)(cid:45) (cid:73)(cid:86)(cid:101)(cid:90) (cid:29)(cid:40)(cid:35)(cid:45)(cid:30) (cid:40)(cid:38)(cid:42)(cid:164)(cid:37)(cid:35)(cid:42) (cid:73)(cid:86)(cid:101)(cid:90) d. (cid:29)(cid:40)(cid:35)(cid:45)(cid:30) (cid:40)(cid:38)(cid:42)(cid:164)(cid:37)(cid:35)(cid:42) e v r JEDEC Tray for IT3M 100 Position Receptacles and plug JEDEC Tray for IT3D 100 Position Receptacles e s e R s ht (cid:56)(cid:93)(cid:86)(cid:98)(cid:91)(cid:90)(cid:103)(cid:21)(cid:29)(cid:56)(cid:100)(cid:99)(cid:99)(cid:90)(cid:88)(cid:105)(cid:100)(cid:103)(cid:21)(cid:56)(cid:100)(cid:97)(cid:106)(cid:98)(cid:99)(cid:38)(cid:30) g (cid:77)(cid:40)(cid:21) (cid:56)(cid:93)(cid:86)(cid:98)(cid:91)(cid:90)(cid:103)(cid:21)(cid:29)(cid:56)(cid:100)(cid:99)(cid:99)(cid:90)(cid:88)(cid:105)(cid:100)(cid:103)(cid:21)(cid:56)(cid:100)(cid:97)(cid:106)(cid:98)(cid:99)(cid:38)(cid:30) Ri (cid:77)(cid:40)(cid:21) (cid:42)(cid:38)(cid:35)(cid:44) (cid:42)(cid:38)(cid:35)(cid:44) (cid:42)(cid:38)(cid:35)(cid:44) (cid:42)(cid:38)(cid:35)(cid:44) (cid:42)(cid:38)(cid:35)(cid:44) (cid:39)(cid:45)(cid:35)(cid:39)(cid:42) C CO., LTD. All (cid:38)(cid:40)(cid:42)(cid:35)(cid:46)(cid:164)(cid:37)(cid:35)(cid:42) (cid:42)(cid:38)(cid:35)(cid:44) (cid:42)(cid:38)(cid:35)(cid:44) (cid:42)(cid:38)(cid:35)(cid:44) (cid:42)(cid:38)(cid:35)(cid:44) (cid:42)(cid:38)(cid:35)(cid:44) (cid:39)(cid:45)(cid:35)(cid:39)(cid:42) (cid:38)(cid:45)(cid:35)(cid:44)(cid:42)(cid:40)(cid:39)(cid:35)(cid:45)(cid:40)(cid:39)(cid:35)(cid:45)(cid:40)(cid:39)(cid:35)(cid:45) (cid:78)(cid:21)(cid:40)(cid:21) (cid:38)(cid:40)(cid:42)(cid:35)(cid:46)(cid:164)(cid:37)(cid:35)(cid:42) (cid:38)(cid:45)(cid:35)(cid:44)(cid:42)(cid:40)(cid:39)(cid:35)(cid:45)(cid:40)(cid:39)(cid:35)(cid:45)(cid:40)(cid:39)(cid:35)(cid:45) (cid:78)(cid:40) RI (cid:73)(cid:86)(cid:101)(cid:90) (cid:29)(cid:40)(cid:35)(cid:45)(cid:30) (cid:40)(cid:38)(cid:42)(cid:164)(cid:37)(cid:35)(cid:42) (cid:73)(cid:86)(cid:101)(cid:90) T (cid:29)(cid:40)(cid:35)(cid:45)(cid:30) (cid:40)(cid:38)(cid:42)(cid:164)(cid:37)(cid:35)(cid:42) C E L JEDEC Tray for IT3M 200 Position Receptacles and plug JEDEC Tray for IT3D 200 Position Receptacles E E S O R HI (cid:77)(cid:40)(cid:21) (cid:56)(cid:93)(cid:86)(cid:98)(cid:91)(cid:90)(cid:103)(cid:21)(cid:29)(cid:56)(cid:100)(cid:99)(cid:99)(cid:90)(cid:88)(cid:105)(cid:100)(cid:103)(cid:21)(cid:56)(cid:100)(cid:97)(cid:106)(cid:98)(cid:99)(cid:38)(cid:30) (cid:21)(cid:77)(cid:40)(cid:21) (cid:56)(cid:93)(cid:86)(cid:98)(cid:91)(cid:90)(cid:103)(cid:21)(cid:29)(cid:56)(cid:100)(cid:99)(cid:99)(cid:90)(cid:88)(cid:105)(cid:100)(cid:103)(cid:21)(cid:56)(cid:100)(cid:97)(cid:106)(cid:98)(cid:99)(cid:38)(cid:30) 8 (cid:44)(cid:44)(cid:35)(cid:43) (cid:44)(cid:44)(cid:35)(cid:43) (cid:44)(cid:44)(cid:35)(cid:43) (cid:41)(cid:38)(cid:35)(cid:38) (cid:78)(cid:40)(cid:21) (cid:44)(cid:44)(cid:35)(cid:43) (cid:44)(cid:44)(cid:35)(cid:43) (cid:44)(cid:44)(cid:35)(cid:43) (cid:41)(cid:38)(cid:35)(cid:38) (cid:21)(cid:78)(cid:40)(cid:21) 1 8 Copyright 20 (cid:38)(cid:40)(cid:42)(cid:35)(cid:46)(cid:164)(cid:37)(cid:35)(cid:42) (cid:38)(cid:45)(cid:35)(cid:44)(cid:42)(cid:40)(cid:39)(cid:35)(cid:45)(cid:40)(cid:39)(cid:35)(cid:45)(cid:40)(cid:39)(cid:35)(cid:45) (cid:38)(cid:40)(cid:42)(cid:35)(cid:46)(cid:164)(cid:37)(cid:35)(cid:42) (cid:38)(cid:45)(cid:35)(cid:44)(cid:42)(cid:40)(cid:39)(cid:35)(cid:45)(cid:40)(cid:39)(cid:35)(cid:45)(cid:40)(cid:39)(cid:35)(cid:45) 01 (cid:29)(cid:40)(cid:35)(cid:45)(cid:30) (cid:40)(cid:38)(cid:42)(cid:164)(cid:37)(cid:35)(cid:42) (cid:56)(cid:86)(cid:101) (cid:29)(cid:40)(cid:35)(cid:45)(cid:30) (cid:40)(cid:38)(cid:42)(cid:164)(cid:37)(cid:35)(cid:42) (cid:56)(cid:86)(cid:101) 2 1. c. JEDEC Tray for IT3M 300 Position Receptacles and plug JEDEC Tray for IT3D 300 Position Receptacles e D 15

IT3 Series●High-Speed(10+Gbps) BGA Mezzanine Connectors USA: USA: USA: HIROSE ELECTRIC (U.S.A.), INC. HEADQUARTERS CHICAGO OFFICE HIROSE ELECTRIC (U.S.A.), INC. SAN JOSE OFFICE HIROSE ELECTRIC (U.S.A.), INC. DETROIT OFFICE (AUTOMOTIVE) 2300 Warrenville Road, Suite 150, 2841 Junction Ave, Suite 200 17197 N. Laurel Park Drive, Suite 253, Downers Grove, IL 60515 San Jose, CA. 95134 Livonia, MI 48152 Phone : +1-630-282-6700 Phone : +1-408-253-9640 Phone : +1-734-542-9963 http://www.hirose.com/us/ Fax : +1-408-253-9641 Fax : +1-734-542-9964 http://www.hirose.com/us/ http://www.hirose.com/us/ USA: THE NETHERLANDS: GERMANY: HIROSE ELECTRIC (U.S.A.), INC. BOSTON OFFICE HIROSE ELECTRIC EUROPE B.V. HIROSE ELECTRIC EUROPE B.V. GERMAN BRANCH 300 Brickstone Square Suite 201, Hogehillweg #8 1101 CC Amsterdam Z-O Schoenbergstr. 20, 73760 ostfildern Andover, MA 01810 Phone : +31-20-6557460 Phone : +49-711-456002-1 Phone : +1-978-662-5255 Fax : +31-20-6557469 Fax : +49-711-456002-299 http://www.hirose.com/eu/ http://www.hirose.com/eu/ d. e v r e s e GERMANY: GERMANY: FRANCE: R s HIROSE ELECTRIC EUROPE B.V. NUREMBERG OFFICE HIROSE ELECTRIC EUROPE B.V. HANOVER OFFICE HIROSE ELECTRIC EUROPE B.V. PARIS OFFICE ht Neumeyerstrasse 22-26, 90411 Nurnberg Bayernstr. 3, Haus C 30855 Langenhagen, Germany 130 Avenue Joseph Kessel, Bat E, 78960 g Ri Phone : +49-911 32 68 89 63 Phone : +49-511 97 82 61 30 Voisins le Bretonneux, France All Fax : +49-911 32 68 89 69 Fax : +49-511 97 82 61 35 Phone : +33-1-85764886 http://www.hirose.com/eu/ http://www.hirose.com/eu/ Fax : +33-1-85764823 D. http://www.hirose.com/eu/ T L O., UNITED KINGDOM: CHINA: CHINA: C HIROSE ELECTRIC EUROPE BV (UK BRANCH) HIROSE ELECTRIC (SHANGHAI) CO., LTD. HIROSE ELECTRIC (SHANGHAI) CO.,LTD. BEIJING BRANCH C 4 Newton Court, Kelvin Drive, Knowlhill, 18, Enterprise Center Tower 2, 209# Gong He A1001, Ocean International Center, Building 56# East 4th RI T Milton Keynes, MK5 8NH Road, Jing’an District, Shanghai, CHINA 200070 Ring Middle Road, ChaoYang District, Beijing, 100025 C Phone : +44-1908 202050 Phone : +86-21-6391-3355 Phone : +86-10-5165-9332 E L Fax : +44-1908 202058 Fax : +86-21-6391-3335 Fax : +86-10-5908-1381 E E http://www.hirose.com/eu/ http://www.hirose.com/cn/ http://www.hirose.com/cn/ S O R CHINA: HONG KONG: TAIWAN: HI HIROSE ELECTRIC TECHNOLOGIES (SHENZHEN) CO., LTD. HIROSE ELECTRIC HONGKONG TRADING CO., LTD. HIROSE ELECTRIC TAIWAN CO., LTD. 8 Room 09-13, 19/F, Office Tower Shun Hing Square, Di Wang Commercial Centre, Room 1001, West Wing, Tsim Sha Tsui Centre, 66 103 8F, No.87, Zhengzhou Rd., Taipei 1 0 5002 Shen Nan Dong Road, Shenzhen City, Guangdong Province, 518008 Mody Road, Tsim Sha Tsui East, Kowloon, Hong Kong Phone : +886-2-2555-7377 2 ht Phone : +86-755-8207-0851 Phone : +852-2803-5338 Fax : +886-2-2555-7355 g Fax : +86-755-8207-0873 Fax : +852-2591-6560 http://www.hirose.com/tw/ ri y http://www.hirose.com/cn/ http://www.hirose.com/hk/ p o C 8 KOREA: SINGAPORE: INDIA: 1 HIROSE KOREA CO.,LTD. HIROSE ELECTRIC SINGAPORE PTE. LTD. HIROSE ELECTRIC SINGAPORE PTE. LTD. DELHI LIAISON OFFICE 0 2 143, Gongdan 1-daero, Siheung-si, 03, Anson Road, #20-01, Springleaf Tower, Office NO.552, Regus-Green Boulevard, Level5, Tower C, 1. c. Gyeonggi-do, 15084, Korea Singapore 079909 Sec62, Plot B-9A, Block B, Noida, 201301, Uttar Pradesh, India e Phone : +82-31-496-7000 Phone : +65-6324-6113 Phone : +91-12-660-8018 D Fax : +82-31-496-7100 Fax : +65-6324-6123 Fax : +91-120-4804949 http://www.hirose.co.kr/ http://www.hirose.com/sg/ http://www.hirose.com/sg/ INDIA: MALAYSIA: THAILAND: HIROSE ELECTRIC SINGAPORE PTE. LTD. BANGALORE LIAISON OFFICE PENANG REPRESENTATIVE OFFICE BANGKOK OFFICE (REPRESENTATIVE OFFICE) Unit No-403, 4th Floor, No-84, Barton Centre, Mahatma 73-3-1, Ideal@The One, Jalan Mahsuri, Bayan Unit 4703, 47th FL., 1 Empire Tower, South Sathorn Gandhi (MG) Road, Bangalore 560 001, Karnataka, India Lepas Penang, 11950, Malaysia Road, Yannawa, Sathorn, Bangkok 10120 Thailand Phone : +91-80-4120 1907 Phone : +604-648-5536 Phone : +66-2-686-1255 Fax : +91-80-4120 9908 http://www.hirose.com/sg/ Fax : +66-2-686-3433 http://www.hirose.com/sg/ http://www.hirose.com/sg/ ® 2-6-3,Nakagawa Chuoh,Tsuzuki-Ku,Yokohama-Shi 224-8540,JAPAN TEL: +81-45-620-3526 Fax: +81-45-591-3726 http://www.hirose.com http://www.hirose-connectors.com The characteristics and the specifications contained herein are for reference purpose. Please refer to the latest customer drawings prior to use. 16 The contents of this catalog are current as of date of 10/2017. Contents are subject to change without notice for the purpose of improvements. Powered by TCPDF (www.tcpdf.org)

Mouser Electronics Authorized Distributor Click to View Pricing, Inventory, Delivery & Lifecycle Information: H irose Electric: IT3-100P-25H(03) IT3-100P-26H(03) IT3-100P-28H(03) IT3-200P-17H(03) IT3-200P-25H(03) IT3-200P-26H(03) IT3-200P-28H(03) IT3-200P-30H(03) IT3-200P-32H(03) IT3-300P-17H(03) IT3-300P-25H(03) IT3-300P-26H(03) IT3-300P-28H(03) IT3-300P-30H(03) IT3-300P-32H(03) IT3D-100S-BGA(37) IT3D-100S-BGA(57) IT3D-200S- BGA(57) IT3D-300S-BGA(57) IT3M-100S-BGA(57) IT3M-200S-BGA(57) IT3M-300S-BGA(57) IT3-200P/REMOVAL- CAP IT3-300P/REMOVAL-CAP IT3M2-180P-25H(04) IT3M2-180P-28H(04) IT3M-200P-15BGA(37)