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  • 型号: ISO7631FCDWR
  • 制造商: Texas Instruments
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ISO7631FCDWR产品简介:

ICGOO电子元器件商城为您提供ISO7631FCDWR由Texas Instruments设计生产,在icgoo商城现货销售,并且可以通过原厂、代理商等渠道进行代购。 ISO7631FCDWR价格参考。Texas InstrumentsISO7631FCDWR封装/规格:数字隔离器, 通用 数字隔离器 2500Vrms 3 通道 25Mbps 25kV/µs CMTI 16-SOIC(0.295",7.50mm 宽)。您可以下载ISO7631FCDWR参考资料、Datasheet数据手册功能说明书,资料中有ISO7631FCDWR 详细功能的应用电路图电压和使用方法及教程。

产品参数 图文手册 常见问题
参数 数值
产品目录

隔离器

ChannelType

单向

描述

DGTL ISO 2.5KV GEN PURP 16SOIC

产品分类

数字隔离器

IsolatedPower

品牌

Texas Instruments

数据手册

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产品图片

产品型号

ISO7631FCDWR

PCN设计/规格

点击此处下载产品Datasheet

PulseWidthDistortion(Max)

3ns

rohs

无铅 / 符合限制有害物质指令(RoHS)规范要求

产品系列

-

上升/下降时间(典型值)

2.8ns, 2.9ns

传播延迟

-

传播延迟tpLH/tpHL(最大值)

28ns, 28ns

供应商器件封装

16-SOIC

共模瞬态抗扰度(最小值)

25kV/µs

其它名称

296-35465-6

制造商产品页

http://www.ti.com/general/docs/suppproductinfo.tsp?distId=10&orderablePartNumber=ISO7631FCDWR

包装

Digi-Reel®

封装/外壳

16-SOIC(0.295",7.50mm 宽)

工作温度

-40°C ~ 125°C

技术

容性耦合

数据速率

25Mbps

标准包装

1

电压-电源

3 V ~ 5.5 V

电压-隔离

2500Vrms

类型

通用

脉宽失真(最大)

3ns

输入-输入侧1/输入侧2

2/1

输出类型

逻辑

通道数

3

通道类型

单向

隔离式电源

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PDF Datasheet 数据手册内容提取

Product Sample & Technical Tools & Support & Folder Buy Documents Software Community ISO7631FM,ISO7631FC,ISO7641FC SLLSEC3F–SEPTEMBER2012–REVISEDAPRIL2016 ISO76x1 Low-Power Triple and Quad-Channels Digital Isolators 1 Features 3 Description • SignalingRate:150Mbps(M-Grade),25Mbps The ISO7631F and ISO7641F devices provide 1 galvanic isolation up to 4242 V per VDE. The (C-Grade) PK ISO7631F device has three channels, two of which • RobustDesignwithIntegratedNoiseFilter operate in the forward direction and one which (C-Grade) operates in the reverse direction. The ISO7641F • LowPowerConsumption,TypicalI perChannel device has 4 channels, three of which operate in the CC (3.3-VSupplies): forward direction and one of which operates in the reverse direction. Suffix F indicates that output – ISO7631FM:2mAat10Mbps defaults to low-state in fail-safe conditions (see ). M- – ISO7631FC:1.5mAat10Mbps Grade devices are high-speed isolators capable of up – ISO7641FC:1.3mAat10Mbps to150-Mbps data rates with fast propagation delays, whereas C-Grade devices are capable of up to 25- • Extremely-LowI (C-Grade) CC_disable Mbps data rates with low power consumption and • LowPropagationDelay:7nsTypical(M-Grade) integrated filters for noise-prone applications. C- • OutputDefaultstoLow-StateinFail-SafeMode Grade devices are recommended for lower-speed • WideTemperatureRange:–40°Cto125°C applications where input noise pulses of less than 6 ns duration must be suppressed, or when low-power • 50KV/µsTransientImmunity,Typical consumptioniscritical. • LongLifeWithSiO IsolationBarrier 2 Each isolation channel has a logic input and output • OperatesFrom2.7-V(M-Grade),3.3-Vand5-V buffer separated by a silicon dioxide (SiO ) insulation SupplyandLogicLevels 2 barrier. Used in conjunction with isolated power • 2.7-V(M-Grade),3.3-Vand5-VLevelTranslation supplies, these devices prevent noise currents on a • WideBodySOIC-16Package data bus or other circuits from entering the local ground and interfering with or damaging sensitive • SafetyandRegulatoryApprovals circuitry. The devices have TTL input thresholds and – 2500VRMSIsolationfor1MinuteperUL1577 can operate from 2.7-V (M-Grade), 3.3-V and 5-V – 4242V BasicInsulationperDINVVDEV supplies. All inputs are 5-V tolerant when supplied PK 0884-10andDINEN61010-1 from3.3-Vor2.7-Vsupplies. – CSAComponentAcceptanceNotice5A,IEC DeviceInformation(1) 60950-1andIEC61010-1EndEquipment PARTNUMBER PACKAGE BODYSIZE(NOM) Standards ISO7631FM – CQCCertificationperGB4943.1-2011 ISO7631FC SOIC(16) 10.30mm×7.50mm – TUV3000V ReinforcedInsulation RMS ISO7641FC accordingtoEN/UL/CSA60950-1and EN/UL/CSA61010-1 (1) For all available packages, see the orderable addendum at theendofthedatasheet. 2 Applications SimplifiedSchematic • OptocouplerReplacementin: VCCI VCCO Isolation – IndustrialFieldbus Capacitor – Profibus INx OUTx – Modbus ENx – DeviceNet™DataBuses – ServoControlInterface GNDI GNDO – MotorControl Copyright © 2016, Texas Instruments Incorporated – PowerSupplies (1) VCCI and GNDI are supply and ground connections respectively for the input – BatteryPacks channels. (2) V and GNDO are supply and ground CCO connections respectively for the output channels. 1 An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications, intellectualpropertymattersandotherimportantdisclaimers.PRODUCTIONDATA.

ISO7631FM,ISO7631FC,ISO7641FC SLLSEC3F–SEPTEMBER2012–REVISEDAPRIL2016 www.ti.com Table of Contents 1 Features.................................................................. 1 7.17 SwitchingCharacteristics:VCC1at5V±10%and V at3.3V±10%................................................11 2 Applications........................................................... 1 CC2 7.18 SwitchingCharacteristics:V at3.3V±10%and 3 Description............................................................. 1 CC1 V at5V±10%...................................................12 CC2 4 RevisionHistory..................................................... 2 7.19 SwitchingCharacteristics:V andV at3.3V± CC1 CC2 5 AvailableOptions................................................... 4 10%.......................................................................... 12 6 PinConfigurationandFunctions......................... 4 7.20 SwitchingCharacteristics:VCC1andVCC2at2.7V ................................................................................. 13 7 Specifications......................................................... 5 7.21 TypicalCharacteristics..........................................14 7.1 AbsoluteMaximumRatings......................................5 8 ParameterMeasurementInformation................17 7.2 ESDRatings..............................................................5 9 DetailedDescription............................................ 19 7.3 RecommendedOperatingConditions.......................5 7.4 ThermalInformation .................................................6 9.1 Overview.................................................................19 7.5 ElectricalCharacteristics:V andV at5V± 9.2 FunctionalBlockDiagram.......................................19 CC1 CC2 10%............................................................................ 6 9.3 FeatureDescription.................................................20 7.6 ElectricalCharacteristics:V at5V±10%and 9.4 DeviceFunctionalModes........................................23 CC1 VCC2at3.3V±10%..................................................6 10 ApplicationandImplementation........................ 24 7.7 ElectricalCharacteristics:VCC1at3.3V±10%and 10.1 ApplicationInformation..........................................24 V at5V±10%.....................................................7 CC2 10.2 TypicalApplication ...............................................24 7.8 ElectricalCharacteristics:V andV at3.3V± CC1 CC2 11 PowerSupplyRecommendations..................... 27 10%............................................................................ 7 7.9 ElectricalCharacteristics:V andV at2.7V 12 Layout................................................................... 27 CC1 CC2 (ISO7631FMOnly).....................................................7 12.1 LayoutGuidelines.................................................27 7.10 PowerDissipationCharacteristics..........................7 12.2 LayoutExample....................................................27 7.11 SupplyCurrentCharacteristics:VCC1andVCC2at5 13 DeviceandDocumentationSupport................. 28 V±10%.....................................................................8 13.1 DocumentationSupport........................................28 7.12 SupplyCurrentCharacteristics:V at5V±10% CC1 13.2 RelatedLinks........................................................28 andV at3.3V±10%...........................................9 CC2 13.3 CommunityResources..........................................28 7.13 SupplyCurrentCharacteristics:V at3.3V±10% CC1 13.4 Trademarks...........................................................28 andV at5V±10%..............................................9 CC2 13.5 ElectrostaticDischargeCaution............................28 7.14 SupplyCurrentCharacteristics:V andV at CC1 CC2 3.3V±10%............................................................. 10 13.6 Glossary................................................................28 7.15 SupplyCurrentCharacteristics:V andV at 14 Mechanical,Packaging,andOrderable CC1 CC2 2.7V(ISO7631FMOnly) ........................................10 Information........................................................... 28 7.16 SwitchingCharacteristics:V andV at5V± CC1 CC2 10%.......................................................................... 11 4 Revision History NOTE:Pagenumbersforpreviousrevisionsmaydifferfrompagenumbersinthecurrentversion. ChangesfromRevisionE(August2015)toRevisionF Page • ChangedtheISO7631pinimageinthePinConfigurationandFunctionssection ............................................................... 4 ChangesfromRevisionD(September2013)toRevisionE Page • AddedPinConfigurationandFunctionssection,ESDRatingstable,FeatureDescriptionsection,DeviceFunctional Modes,ApplicationandImplementationsection,PowerSupplyRecommendationssection,Layoutsection,Device andDocumentationSupportsection,andMechanical,Packaging,andOrderableInformationsection. ............................. 1 • Added2.7-V(M-Grade),3.3-Vand5-VLevelTranslationtoFeaturessection..................................................................... 1 • DeletedmarkedascolumnfromAvailableOptionstable....................................................................................................... 4 • AddedFootnote3toAbsoluteMaximumRatingstable......................................................................................................... 5 • ChangedthermalmetricvaluesintheThermalInformationtable......................................................................................... 6 • ChangedV toV inElectricalCharacteristics:V andV at5V±10%table......................................................... 6 CCX CCO CC1 CC2 • Addedcross-referencetoVI=V intheElectricalCharacteristics:VCC1andVCC2at5V±10%table. .......................6 CCI • ChangedFootnote1oftheElectricalCharacteristics:VCC1andVCC2at5V±10%tableforclarification. .....................6 2 SubmitDocumentationFeedback Copyright©2012–2016,TexasInstrumentsIncorporated ProductFolderLinks:ISO7631FM ISO7631FC ISO7641FC

ISO7631FM,ISO7631FC,ISO7641FC www.ti.com SLLSEC3F–SEPTEMBER2012–REVISEDAPRIL2016 • Addedcross-referencetoVI=V intheElectricalCharacteristics:VCC1at5V±10%andVCC2at3.3V±10% CCI table........................................................................................................................................................................................ 6 • AddedfootnotetotheElectricalCharacteristics:VCC1at3.3V±10%andVCC2at5V±10%table............................... 7 • ChangedV toV intheElectricalCharacteristics:VCC1andVCC2at3.3V±10%table. ........................................ 7 CCX CCO • Changedfootnote1intheElectricalCharacteristics:VCC1andVCC2at3.3V±10%tableforclarification......................7 • ChangedV toV intheElectricalCharacteristics:VCC1andVCC2at2.7Vtable. ................................................... 7 CCX CCO • DeletedIECandforDW-16PackagefromIECPackageInsulationandSafety-RelatedSpecificationsforDW-16 Packagesection................................................................................................................................................................... 20 • ChangedL(I01)MINfrom8.3mmto8mm,L(IO2)MINfrom8.1mmto8mm,andDINIEC60112/VDE0303Part 1toDINEN60112(VDE0303-11);IEC60112inthePackageInsulationandSafety-RelatedSpecificationstable. .......20 • Deletedfootnote2fromPackageInsulationandSafety-RelatedSpecificationsIECandforDW-16Packagefrom IECPackageInsulationandSafety-RelatedSpecificationsforDW-16Packagesection.................................................... 20 • ChangedVDEStandardtoDINVVDEV0884-10(VDEV0084-10):2006-12. ................................................................ 21 • Changedthevalueforθ from72°C/Wto77.5°C/WfortheTestConditionsandthevaluesforSafetyinput, JA output,orsupplycurrentmaxfrom316,482,and643to293,448and597intheSafetyLimitingValuestable. .............22 • ChangedsafetytemperaturetocasetemperatureinSafetyLimitingValues...................................................................... 22 • ChangednameofDW-16θJCThermalDeratingCurveperIEC64747-5-2toThermalDeratingCurveforSafety LimitingCurrentperVDE...................................................................................................................................................... 22 • ChangedFigure22intheSafetyLimitingValuessection................................................................................................... 22 • ChangedI/OschematicsfigureinFeatureDescriptionsection. ......................................................................................... 23 ChangesfromRevisionC(August2013)toRevisionD Page • Deleted2500V fromRatedIsolationData....................................................................................................................... 4 RMS • ChangedtheTable3,TUVcolumnFrom:CertificateNumber:U8V130777311009To:CertificateNumber:U8V 130977311010................................................................................................................................................................... 21 ChangesfromRevisionB(April2013)toRevisionC Page • ChangedtheDescription........................................................................................................................................................ 1 • DeletedISO7640FCfromtheAvailableOptionstable........................................................................................................... 4 • ChangedTheISO7631FCRatedIsolationvaluesintheAvailableOptionstable................................................................. 4 • DeletedGraphISO7640FCSupplyCurrentPerChannelvsDataRate.............................................................................. 14 • DeletedGraphISO7640FCSupplyCurrentForAllChannelsvsDataRate....................................................................... 14 • AddedtheTUVcolumntoTable3....................................................................................................................................... 21 • DeletedISO7640FCfromtheTYPICALSUPPLYCURRENTEQUATIONSsection.......................................................... 25 • DeletedtheISO7640circuitfromtheAPPLICATIONINFORMATIONsection.................................................................... 27 ChangesfromRevisionA(September2012)toRevisionB Page • ChangedtheV SPECIFICATIONFrom:4000V to4242V ............................................................................... 21 IOTM PEAK PEAK • ChangedTable3:4242V To:4000V .......................................................................................................................... 21 PK PK ChangesfromOriginal(September2012)toRevisionA Page • ChangedDescriptiontextFrom:"applicationswhereinputnoisepulsesoflessthan10nsduration..." To:"applicationswhereinputnoisepulsesoflessthan6nsduration..."................................................................................ 1 • AddednoteProductPreviewtoISO7640FCintheAvailableOptionstable.......................................................................... 4 • ChangedInputPUintheFunctiontableFrom:ZTo:'Undetermined.................................................................................. 23 Copyright©2012–2016,TexasInstrumentsIncorporated SubmitDocumentationFeedback 3 ProductFolderLinks:ISO7631FM ISO7631FC ISO7641FC

ISO7631FM,ISO7631FC,ISO7641FC SLLSEC3F–SEPTEMBER2012–REVISEDAPRIL2016 www.ti.com 5 Available Options PRODUCT RATEDISOLATION(1) PACKAGE INPUT DATARATE INTEGRATEDNOISE CHANNEL THRESHOLD FILTER DIRECTION 2Forward, ISO631FM 4242VPK DW-16 ~1.5VTTL 150Mbps No 1Reverse 2Forward, ISO7631FC 4242VPK DW-16 ~1.5VTTL 25Mbps Yes 1Reverse 3Forward, ISO7641FC 4242VPK DW-16 ~1.5VTTL 25Mbps Yes 1Reverse (1) SeetheTable3tablefordetailedisolationratings. 6 Pin Configuration and Functions ISO7641DWPackage ISO7631DWPackage 16-PinSOIC 16-PinSOIC TopView TopView VCC1 1 16 VCC2 VCC1 1 16 VCC2 GND1 2 15 GND2 GND1 2 15 GND2 INA 3 14 OUTA INA 3 14 OUTA INB 4 13 OUTB INB 4 13 OUTB INC 5 12 OUTC OUTC 5 12 INC OUTD 6 11 IND NC 6 11 NC EN1 7 10 EN2 EN1 7 10 EN2 GND1 8 9 GND2 GND1 8 9 GND2 PinFunctions PIN I/O DESCRIPTION NAME ISO7641 ISO7631 Enables(wheninputisHighorOpen)orDisables(wheninputisLow)OUTDofISO7641and EN1 7 7 I OUTCofISO7631 Enables(wheninputisHighorOpen)orDisables(wheninputisLow)OUTA,OUTB,and OUTCofISO7641 EN2 10 10 I Enables(wheninputisHighorOpen)orDisables(wheninputisLow)OUTAandOUTBof ISO7631 GND1 2,8 2,8 – GroundconnectionforV CC1 GND2 9,15 9,15 – GroundconnectionforV CC2 INA 3 3 I Input,channelA INB 4 4 I Input,channelB INC 5 12 I Input,channelC IND 11 – I Input,channelD NC – 6,11 – NoConnectpinsarefloatingwithnointernalconnection OUTA 14 14 O Output,channelA OUTB 13 13 O Output,channelB OUTC 12 5 O Output,channelC OUTD 6 – O Output,channelD V 1 1 – Powersupply,V CC1 CC1 V 16 16 – Powersupply,V CC2 CC2 4 SubmitDocumentationFeedback Copyright©2012–2016,TexasInstrumentsIncorporated ProductFolderLinks:ISO7631FM ISO7631FC ISO7641FC

ISO7631FM,ISO7631FC,ISO7641FC www.ti.com SLLSEC3F–SEPTEMBER2012–REVISEDAPRIL2016 7 Specifications 7.1 Absolute Maximum Ratings See (1) MIN MAX UNIT V VCC1(2) Supplyvoltage –0.5 6 V CC2 Voltage INx,OUTx,ENx –0.5 6(3) V I Outputcurrent ±15 mA O T Maximumjunctiontemperature 150 °C J T Storagetemperature –65 150 °C STG (1) Stressesbeyondthoselistedunderabsolutemaximumratingsmaycausepermanentdamagetothedevice.Thesearestressratings onlyandfunctionaloperationofthedeviceattheseoranyotherconditionsbeyondthoseindicatedunderRecommendedOperating Conditionsisnotimplied.Exposuretoabsolute-maximum-ratedconditionsforextendedperiodsmayaffectdevicereliability. (2) AllvoltagevaluesexceptdifferentialI/Obusvoltagesarewithrespecttothelocalgroundterminal(GND1orGND2)andarepeak voltagevalues. (3) Maximumvoltagemustnotexceed6V. 7.2 ESD Ratings VALUE UNIT Humanbodymodel(HBM),perANSI/ESDA/JEDECJS-001(1) ±4000 Charged-devicemodel(CDM),perJEDECspecificationJESD22- ±1500 V(ESD) Electrostaticdischarge C101(2) V Machinemodel(MM),JEDECJESD22-A115-A ±200 (1) JEDECdocumentJEP155statesthat500-VHBMallowssafemanufacturingwithastandardESDcontrolprocess. (2) JEDECdocumentJEP157statesthat250-VCDMallowssafemanufacturingwithastandardESDcontrolprocess. 7.3 Recommended Operating Conditions MIN NOM MAX UNIT M-Grade 2.7 5.5 V ,V Supplyvoltage V CC1 CC2 C-Grade 3 5.5 I High-leveloutputcurrent –4 mA OH I Low-leveloutputcurrent 4 mA OL V High-levelinputvoltage 2 5.5 V IH V Low-levelinputvoltage 0 0.8 V IL M-Grade:≥3-VOperation 6.67 t Inputpulseduration M-Grade:<3-VOperation 10 ns ui C-Grade:≥3-VOperation 40 M-Grade:≥3-VOperation 0 150 1/t Signalingrate M-Grade:<3-VOperation 0 100 Mbps ui C-Grade:≥3-VOperation 0 25 T Junctiontemperature –40 136 °C J T Ambienttemperature –40 25 125 °C A Copyright©2012–2016,TexasInstrumentsIncorporated SubmitDocumentationFeedback 5 ProductFolderLinks:ISO7631FM ISO7631FC ISO7641FC

ISO7631FM,ISO7631FC,ISO7641FC SLLSEC3F–SEPTEMBER2012–REVISEDAPRIL2016 www.ti.com 7.4 Thermal Information ISO76x1Fx THERMALMETRIC(1) DW(SOIC) UNIT 16PINS R Junction-to-ambientthermalresistance 77.5 °C/W θJA R Junction-to-case(top)thermalresistance 40.4 °C/W θJC(top) R Junction-to-boardthermalresistance 42.2 °C/W θJB ψ Junction-to-topcharacterizationparameter 15 °C/W JT ψ Junction-to-boardcharacterizationparameter 41.6 °C/W JB (1) Formoreinformationabouttraditionalandnewthermalmetrics,seetheSemiconductorandICPackageThermalMetricsapplication report,SPRA953. 7.5 Electrical Characteristics: V and V at 5 V ± 10% CC1 CC2 V andV at5V±10%(overrecommendedoperatingconditionsunlessotherwisenoted) CC1 CC2 M-Grade C-Grade PARAMETER TESTCONDITIONS UNIT MIN TYP MAX MIN TYP MAX IOH=–4mA;seeFigure16 VCCO(1)–0.8 4.8 VCCO–0.8 4.7 VOH High-leveloutputvoltage V IOH=–20μA;seeFigure16 VCCO–0.1 5 VCCO–0.1 5 IOL=4mA;seeFigure16 0.2 0.4 0.3 0.5 VOL Low-leveloutputvoltage V IOL=20μA;seeFigure16 0 0.1 0 0.1 Inputthresholdvoltage VI(HYS) hysteresis 450 450 mV IIH High-levelinputcurrent VIH=VCCatINxorENx 10 10 μA IIL Low-levelinputcurrent VIL=0VatINxorENx –10 -10 μA CMTI Cimommumnoityn-modetransient VI=VCCI(1)or0V;seeFigure19 25 75 25 75 kV/μs (1) V =Input-sidesupplyvoltage;V =Output-sidesupplyvoltage CCI CCO 7.6 Electrical Characteristics: V at 5 V ± 10% and V at 3.3 V ± 10% CC1 CC2 V at5V±10%andV at3.3V±10%(overrecommendedoperatingconditionsunlessotherwisenoted) CC1 CC2 M-Grade C-Grade PARAMETER TESTCONDITIONS UNIT MIN TYP MAX MIN TYP MAX IOH=–4mA;see OUTxonVCC1(5V)side VCC1–0.8 4.8 VCC1–0.8 4.7 High-leveloutput Figure16 OUTxonVCC2(3.3V)side VCC2-0.4 3 VCC2-0.6 2.9 VOH voltage IOH=–20μA; OUTxonVCC1(5V)side VCC1–0.1 5 VCC1–0.1 5 V seeFigure16 OUTxonVCC2(3.3V)side VCC2–0.1 3.3 VCC2–0.1 3.3 Low-leveloutput IOL=4mA;seeFigure16 0.2 0.4 0.3 0.5 VOL voltage IOL=20μA;seeFigure16 0 0.1 0 0.1 V Inputthresholdvoltage VI(HYS) hysteresis 430 430 mV IIH High-levelinputcurrent VIH=VCCatINxorENx 10 10 μA IIL Low-levelinputcurrent VIL=0VatINxorENx -10 -10 μA CMTI Ctraonmsmieonnt-immmoduenity VI=VCCI(1)or0V;seeFigure19 25 50 25 50 kV/μs (1) V =Input-sidesupplyvoltage CCI 6 SubmitDocumentationFeedback Copyright©2012–2016,TexasInstrumentsIncorporated ProductFolderLinks:ISO7631FM ISO7631FC ISO7641FC

ISO7631FM,ISO7631FC,ISO7641FC www.ti.com SLLSEC3F–SEPTEMBER2012–REVISEDAPRIL2016 7.7 Electrical Characteristics: V at 3.3 V ± 10% and V at 5 V ± 10% CC1 CC2 V at3.3V±10%andV at5V±10%(overrecommendedoperatingconditionsunlessotherwisenoted) CC1 CC2 M-Grade C-Grade PARAMETER TESTCONDITIONS UNIT MIN TYP MAX MIN TYP MAX IOH=–4mA;see OUTxonVCC1(3.3V)side VCC1–0.4 3 VCC1-0.6 2.9 Figure16 OUTxonVCC2(5V)side VCC2–0.8 4.8 VCC2–0.8 4.7 VOH High-leveloutputvoltage V IOH=–20μA;see OUTxonVCC1(3.3V)side VCC1–0.1 3.3 VCC1–0.1 3.3 Figure16 OUTxonVCC2(5V)side VCC2–0.1 5 VCC2–0.1 5 IOL=4mA;seeFigure16 0.2 0.4 0.3 0.5 VOL Low-leveloutputvoltage V IOL=20μA;seeFigure16 0 0.1 0 0.1 Inputthresholdvoltage VI(HYS) hysteresis 430 430 mV IIH High-levelinputcurrent VIH=VCCatINxorENx 10 10 μA IIL Low-levelinputcurrent VIL=0VatINxorENx -10 -10 μA CMTI Cimommumnoityn-modetransient VI=VCCI(1)or0V;seeFigure19 25 50 25 50 kV/μs (1) V =Input-sidesupplyvoltage CCI 7.8 Electrical Characteristics: V and V at 3.3 V ± 10% CC1 CC2 V andV at3.3V±10%(overrecommendedoperatingconditionsunlessotherwisenoted) CC1 CC2 M-Grade C-Grade PARAMETER TESTCONDITIONS UNIT MIN TYP MAX MIN TYP MAX High-leveloutput IOH=–4mA;seeFigure16 VCCO(1)–0.4 3 VCCO–0.6 2.9 VOH voltage IOH=–20μA;seeFigure16 VCCO–0.1 3.3 VCCO–0.1 3.3 V IOL=4mA;seeFigure16 0.2 0.4 0.3 0.5 VOL Low-leveloutputvoltage V IOL=20μA;seeFigure16 0 0.1 0 0.1 Inputthresholdvoltage VI(HYS) hysteresis 425 425 mV IIH High-levelinputcurrent VIH=VCCatINxorENx 10 10 μA IIL Low-levelinputcurrent VIL=0VatINxorENx -10 -10 μA CMTI Cimommumnoityn-modetransient VI=VCCI(1)or0V;seeFigure19 25 50 25 50 kV/μs (1) V =Input-sidesupplyvoltage;V =Output-sidesupplyvoltage CCI CCO 7.9 Electrical Characteristics: V and V at 2.7 V (ISO7631FM Only) CC1 CC2 V andV at2.7V(1)(overrecommendedoperatingconditionsunlessotherwisenoted) CC1 CC2 PARAMETER TESTCONDITIONS MIN TYP MAX UNIT IOH=–4mA;seeFigure16 VCCO(2)–0.5 2.4 VOH High-leveloutputvoltage V IOH=–20μA;seeFigure16 VCCO–0.1 2.7 IOL=4mA;seeFigure16 0.2 0.4 VOL Low-leveloutputvoltage V IOL=20μA;seeFigure16 0 0.1 VI(HYS) Inputthresholdvoltagehysteresis 350 mV IIH High-levelinputcurrent VIH=VCCatINxorENx 10 μA IIL Low-levelinputcurrent VIL=0VatINxorENx -10 μA CMTI Common-modetransientimmunity VI=VCCI(2)or0V;seeFigure19 25 50 kV/μs (1) OnlyM-Gradedevicesarerecommendedforoperationdownto2.7Vsupplies.For2.7V-operation,maxdatarateis100Mbps. (2) V =Input-sidesupplyvoltage;V =Output-sidesupplyvoltage CCI CCO 7.10 Power Dissipation Characteristics PARAMETER TESTCONDITIONS MIN TYP MAX UNIT V =V =5.5V,T =150°C, CC1 CC2 J CL=15pF P MaximumDevicePowerDissipation 399 mW D Inputa75MHz50%dutycycle squarewave Copyright©2012–2016,TexasInstrumentsIncorporated SubmitDocumentationFeedback 7 ProductFolderLinks:ISO7631FM ISO7631FC ISO7641FC

ISO7631FM,ISO7631FC,ISO7641FC SLLSEC3F–SEPTEMBER2012–REVISEDAPRIL2016 www.ti.com 7.11 Supply Current Characteristics: V and V at 5 V ± 10% CC1 CC2 V andV at5V±10%(overrecommendedoperatingconditionsunlessotherwisenoted) CC1 CC2 M-Grade C-Grade PARAMETER TESTCONDITIONS UNIT MIN TYP MAX MIN TYP MAX ISO7631F I 2.5 4 1.1 1.9 mA CC1 Disable EN1=EN2=0V I 3.7 5.4 1.5 2.6 mA CC2 I 2.6 4.1 1.8 2.7 mA CC1 DCto1Mbps I 3.8 5.5 2.6 3.9 mA CC2 I 3.3 4.5 2.7 3.7 mA CC1 10Mbps ICC2 DCSignal:VI=VCCor0V 4.9 6.6 3.9 5.3 mA ACSignal:Allchannelsswitchingwithsquare ICC1 25Mbps waveclockinput;CL=15pF 4.5 6 4.1 5.4 mA I 6.8 9 5.9 7.8 mA CC2 I 15 19.5 NotApplicable mA CC1 150Mbps I 22 30 NotApplicable mA CC2 ISO7641F I 1.2 2.1 mA CC1 Disable EN1=EN2=0V I 1.6 2.6 mA CC2 I 1.8 2.8 mA CC1 DCto1Mbps I 3.1 4.2 mA CC2 ICC1 DCSignal:VI=VCCor0V, 3 4 mA 10Mbps ACSignal:Allchannelsswitchingwithsquare ICC2 waveclockinput;CL=15pF 4.9 6.1 mA I 4.8 6 mA CC1 25Mbps I 7.7 9.5 mA CC2 8 SubmitDocumentationFeedback Copyright©2012–2016,TexasInstrumentsIncorporated ProductFolderLinks:ISO7631FM ISO7631FC ISO7641FC

ISO7631FM,ISO7631FC,ISO7641FC www.ti.com SLLSEC3F–SEPTEMBER2012–REVISEDAPRIL2016 7.12 Supply Current Characteristics: V at 5 V ± 10% and V at 3.3 V ± 10% CC1 CC2 V at5V±10%andV at3.3V±10%(overrecommendedoperatingconditionsunlessotherwisenoted) CC1 CC2 M-Grade C-Grade PARAMETER TESTCONDITIONS UNIT MIN TYP MAX MIN TYP MAX ISO7631F I 2.5 4 1.1 1.9 mA CC1 Disable EN1=EN2=0V I 2.7 3.7 0.7 1.3 mA CC2 I 2.6 4.1 1.8 2.7 mA CC1 DCto1Mbps I 2.8 3.8 1.8 2.6 mA CC2 I 3.3 4.5 2.7 3.7 mA CC1 10Mbps ICC2 DCSignal:VI=VCCor0V 3.5 4.6 2.6 3.5 mA ACSignal:Allchannelsswitchingwithsquare ICC1 25Mbps waveclockinput;CL=15pF 4.5 6 4.1 5.4 mA I 4.7 5.9 3.8 5 mA CC2 I 15 19.5 NotApplicable mA CC1 150Mbps I 14.6 19 NotApplicable mA CC2 ISO7641F I 1.2 2.1 mA CC1 Disable EN1=EN2=0V I 0.8 1.3 mA CC2 I 1.8 2.8 mA CC1 DCto1Mbps I 2 2.9 mA CC2 ICC1 DCSignal:VI=VCCor0V, 3 4 mA 10Mbps ACSignal:Allchannelsswitchingwithsquare ICC2 waveclockinput;CL=15pF 3.2 4.1 mA I 4.8 6 mA CC1 25Mbps I 5.1 7 mA CC2 7.13 Supply Current Characteristics: V at 3.3 V ± 10% and V at 5 V ± 10% CC1 CC2 V at3.3V±10%andV at5V±10%(overrecommendedoperatingconditionsunlessotherwisenoted) CC1 CC2 M-Grade C-Grade PARAMETER TESTCONDITIONS UNIT MIN TYP MAX MIN TYP MAX ISO7631F I 1.8 2.8 0.6 1.1 mA CC1 Disable EN1=EN2=0V I 3.7 5.4 1.5 2.6 mA CC2 I 1.9 2.9 1.2 1.8 mA CC1 DCto1Mbps I 3.8 5.5 2.6 3.9 mA CC2 I 2.4 3.4 1.8 2.6 mA CC1 10Mbps ICC2 DCSignal:VI=VCCor0V 4.9 6.6 3.9 5.3 mA ACSignal:Allchannelsswitchingwithsquare ICC1 25Mbps waveclockinput;CL=15pF 3.2 4.2 2.7 3.6 mA I 6.8 9 5.9 7.8 mA CC2 I 9.3 12.5 NotApplicable mA CC1 150Mbps I 22 30 NotApplicable mA CC2 ISO7641F I 0.7 1.1 mA CC1 Disable EN1=EN2=0V I 1.6 2.6 mA CC2 I 1.2 1.9 mA CC1 DCto1Mbps I 3.1 4.2 mA CC2 ICC1 DCSignal:VI=VCCor0V, 2 2.8 mA 10Mbps ACSignal:Allchannelsswitchingwithsquare ICC2 waveclockinput;CL=15pF 4.9 6.1 mA I 3.1 4 mA CC1 25Mbps I 7.7 9.5 mA CC2 Copyright©2012–2016,TexasInstrumentsIncorporated SubmitDocumentationFeedback 9 ProductFolderLinks:ISO7631FM ISO7631FC ISO7641FC

ISO7631FM,ISO7631FC,ISO7641FC SLLSEC3F–SEPTEMBER2012–REVISEDAPRIL2016 www.ti.com 7.14 Supply Current Characteristics: V and V at 3.3 V ± 10% CC1 CC2 V andV at3.3V±10%(overrecommendedoperatingconditionsunlessotherwisenoted) CC1 CC2 M-Grade C-Grade PARAMETER TESTCONDITIONS UNIT MIN TYP MAX MIN TYP MAX ISO7631F I 1.8 2.8 0.6 1.1 mA CC1 Disable EN1=EN2=0V I 2.7 3.7 0.7 1.3 mA CC2 I 1.9 2.9 1.2 1.8 mA CC1 DCto1Mbps I 2.8 3.8 1.8 2.6 mA CC2 I 2.4 3.4 1.8 2.6 mA CC1 10Mbps ICC2 DCSignal:VI=VCCor0V 3.5 4.6 2.6 3.5 mA ACSignal:Allchannelsswitchingwithsquare ICC1 25Mbps waveclockinput;CL=15pF 3.2 4.2 2.7 3.6 mA I 4.7 5.9 3.8 5 mA CC2 I 9.3 12.5 NotApplicable mA CC1 150Mbps I 14.6 19 NotApplicable mA CC2 ISO7641F I 0.7 1.1 mA CC1 Disable EN1=EN2=0V I 0.8 1.3 mA CC2 I 1.2 1.9 mA CC1 DCto1Mbps I 2 2.9 mA CC2 ICC1 DCSignal:VI=VCCor0V, 2 2.8 mA 10Mbps ACSignal:Allchannelsswitchingwithsquare ICC2 waveclockinput;CL=15pF 3.2 4.1 mA I 3.1 4 mA CC1 25Mbps I 5.1 7 mA CC2 7.15 Supply Current Characteristics: V and V at 2.7 V (ISO7631FM Only) (1) CC1 CC2 V andV at2.7V(overrecommendedoperatingconditionsunlessotherwisenoted) CC1 CC2 M-Grade PARAMETER TESTCONDITIONS UNIT MIN TYP MAX ISO7631F ICC1 1.5 2.4 mA Disable EN1=EN2=0V ICC2 2.2 3.2 mA ICC1 1.6 2.5 mA DCto1Mbps ICC2 2.3 3.2 mA ICC1 2 2.9 mA 10Mbps ICC2 DCSignal:VI=VCCor0V 3 3.9 mA ICC1 ACSignal:Allchannelsswitchingwithsquarewaveclockinput;CL=15pF 2.7 3.7 mA 25Mbps ICC2 3.9 4.9 mA ICC1 5.7 6.8 mA 100Mbps ICC2 8.6 12 mA (1) OnlyM-Gradedevicesarerecommendedforoperationdownto2.7Vsupplies.For2.7V-operation,maxdatarateis100Mbps. 10 SubmitDocumentationFeedback Copyright©2012–2016,TexasInstrumentsIncorporated ProductFolderLinks:ISO7631FM ISO7631FC ISO7641FC

ISO7631FM,ISO7631FC,ISO7641FC www.ti.com SLLSEC3F–SEPTEMBER2012–REVISEDAPRIL2016 7.16 Switching Characteristics: V and V at 5 V ± 10% CC1 CC2 V andV at5V±10%(overrecommendedoperatingconditionsunlessotherwisenoted) CC1 CC2 M-Grade C-Grade PARAMETER TESTCONDITIONS UNIT MIN TYP MAX MIN TYP MAX ISO7631F,ISO7641F tPLH,tPHL Propagationdelaytime SeeFigure16 3.5 7 10.5 11 17 28 ns PWD(1) Pulsewidthdistortion|tPHL–tPLH| SeeFigure16 2 3 ns Same-directionChannels 2 3 tsk(o)(2) Channel-to-channeloutputskewtime ns Opposite-directionChannels 3 4 tsk(pp)(3) Part-to-partskewtime 4.5 13 ns tr Outputsignalrisetime SeeFigure16 1.6 2.8 ns tf Outputsignalfalltime SeeFigure16 1 2.9 ns DisablePropagationDelay,high-to-high tPHZ impedanceoutput SeeFigure17 5 16 8 20 ns DisablePropagationDelay,low-to-high tPLZ impedanceoutput SeeFigure17 5 16 7 20 ns tPZH EimnpaebdleanPcreo-ptoa-ghaigtiohnoDutepluaty,high SeeFigure17 4 16 11000 22000(4) ns EnablePropagationDelay,high tPZL impedance-to-lowoutput SeeFigure17 4 16 8 20 ns Fail-safeoutputdelaytimefrominput tfs dataorpowerloss SeeFigure18 9.5 9 μs (1) AlsoknownasPulseSkew. (2) t istheskewbetweenoutputsofasingledevicewithalldrivinginputsconnectedtogetherandtheoutputsswitchinginthesame sk(o) directionwhiledrivingidenticalloads. (3) t isthemagnitudeofthedifferenceinpropagationdelaytimesbetweenanyterminalsofdifferentdevicesswitchinginthesame sk(pp) directionwhileoperatingatidenticalsupplyvoltages,temperature,inputsignalsandloads. (4) TheenablesignalrateforC-gradedevicesshouldbe≤45Kbps. 7.17 Switching Characteristics: V at 5 V ± 10% and V at 3.3 V ± 10% CC1 CC2 V at5V±10%andV at3.3V±10%(overrecommendedoperatingconditionsunlessotherwisenoted) CC1 CC2 M-Grade C-Grade PARAMETER TESTCONDITIONS UNIT MIN TYP MAX MIN TYP MAX ISO7631F,ISO7641F tPLH,tPHL Propagationdelaytime SeeFigure16 4 8 13 11 18 32 ns PWD(1) Pulsewidthdistortion|tPHL–tPLH| SeeFigure16 2 3.5 ns Same-directionChannels 2.5 4.5 tsk(o)(2) Channel-to-channeloutputskewtime ns Opposite-directionChannels 3.5 5.5 tsk(pp)(3) Part-to-partskewtime 6 15 ns tr Outputsignalrisetime SeeFigure16 2 3.6 ns tf Outputsignalfalltime SeeFigure16 1.2 3.3 ns DisablePropagationDelay,high-to- tPHZ highimpedanceoutput SeeFigure17 6.5 17 9 20 ns DisablePropagationDelay,low-to- tPLZ highimpedanceoutput SeeFigure17 6.5 17 8 20 ns tPZH EimnpaebdleanPcreo-ptoa-ghaigtiohnoDutepluaty,high SeeFigure17 5.5 17 11000 22000(4) ns EnablePropagationDelay,high tPZL impedance-to-lowoutput SeeFigure17 5.5 17 10 30 ns Fail-safeoutputdelaytimefrominput tfs dataorpowerloss SeeFigure18 9.5 8.5 μs (1) AlsoknownasPulseSkew. (2) t istheskewbetweenoutputsofasingledevicewithalldrivinginputsconnectedtogetherandtheoutputsswitchinginthesame sk(o) directionwhiledrivingidenticalloads. (3) t isthemagnitudeofthedifferenceinpropagationdelaytimesbetweenanyterminalsofdifferentdevicesswitchinginthesame sk(pp) directionwhileoperatingatidenticalsupplyvoltages,temperature,inputsignalsandloads. (4) TheenablesignalrateforC-gradedevicesshouldbe≤45Kbps. Copyright©2012–2016,TexasInstrumentsIncorporated SubmitDocumentationFeedback 11 ProductFolderLinks:ISO7631FM ISO7631FC ISO7641FC

ISO7631FM,ISO7631FC,ISO7641FC SLLSEC3F–SEPTEMBER2012–REVISEDAPRIL2016 www.ti.com 7.18 Switching Characteristics: V at 3.3 V ± 10% and V at 5 V ± 10% CC1 CC2 V at3.3V±10%andV at5V±10%(overrecommendedoperatingconditionsunlessotherwisenoted) CC1 CC2 M-Grade C-Grade PARAMETER TESTCONDITIONS UNIT MIN TYP MAX MIN TYP MAX ISO7631F,ISO7641F tPLH,tPHL Propagationdelaytime SeeFigure16 4 7.5 12.5 11 18.5 32 ns PWD(1) Pulsewidthdistortion|tPHL–tPLH| SeeFigure16 2 2.5 ns Same-directionChannels 2.5 4.5 tsk(o)(2) Channel-to-channeloutputskewtime ns Opposite-directionChannels 3.5 5.5 tsk(pp)(3) Part-to-partskewtime 6 15 ns tr Outputsignalrisetime SeeFigure16 1.7 2.9 ns tf Outputsignalfalltime SeeFigure16 1.1 2.9 ns DisablePropagationDelay,high-to-high tPHZ impedanceoutput SeeFigure17 5.5 17 8 20 ns DisablePropagationDelay,low-to-high tPLZ impedanceoutput SeeFigure17 5.5 17 7 20 ns tPZH EimnpaebdleanPcreo-ptoa-ghaigtiohnoDutepluaty,high SeeFigure17 4.5 17 11000 22000(4) ns EnablePropagationDelay,high tPZL impedance-to-lowoutput SeeFigure17 4.5 17 8 30 ns Fail-safeoutputdelaytimefrominputdata tfs orpowerloss SeeFigure18 9.5 7.5 μs (1) AlsoknownasPulseSkew. (2) t istheskewbetweenoutputsofasingledevicewithalldrivinginputsconnectedtogetherandtheoutputsswitchinginthesame sk(o) directionwhiledrivingidenticalloads. (3) t isthemagnitudeofthedifferenceinpropagationdelaytimesbetweenanyterminalsofdifferentdevicesswitchinginthesame sk(pp) directionwhileoperatingatidenticalsupplyvoltages,temperature,inputsignalsandloads. (4) TheenablesignalrateforC-gradedevicesshouldbe≤45Kbps. 7.19 Switching Characteristics: V and V at 3.3 V ± 10% CC1 CC2 V andV at3.3V±10%(overrecommendedoperatingconditionsunlessotherwisenoted) CC1 CC2 M-Grade C-Grade PARAMETER TESTCONDITIONS UNIT MIN TYP MAX MIN TYP MAX ISO7631F,ISO7641F tPLH,tPHL Propagationdelaytime SeeFigure16 4 8.5 14 12 23 35 ns PWD(1) Pulsewidthdistortion|tPHL–tPLH| SeeFigure16 2 3 ns Same-directionChannels 3 5 tsk(o)(2) Channel-to-channeloutputskewtime ns Opposite-directionChannels 4 6 tsk(pp)(3) Part-to-partskewtime 6.5 16 ns tr Outputsignalrisetime SeeFigure16 2 3.7 ns tf Outputsignalfalltime SeeFigure16 1.3 3.4 ns DisablePropagationDelay,high-to-high tPHZ impedanceoutput SeeFigure17 6.5 17 9 20 ns DisablePropagationDelay,low-to-high tPLZ impedanceoutput SeeFigure17 6.5 17 8 20 ns tPZH EimnpaebdleanPcreo-ptoa-ghaigtiohnoDutepluaty,high SeeFigure17 5.5 17 11000 22000(4) ns EnablePropagationDelay,high tPZL impedance-to-lowoutput SeeFigure17 5.5 17 10 30 ns Fail-safeoutputdelaytimefrominput tfs dataorpowerloss SeeFigure18 9.2 7.5 μs (1) AlsoknownasPulseSkew. (2) t istheskewbetweenoutputsofasingledevicewithalldrivinginputsconnectedtogetherandtheoutputsswitchinginthesame sk(o) directionwhiledrivingidenticalloads. (3) t isthemagnitudeofthedifferenceinpropagationdelaytimesbetweenanyterminalsofdifferentdevicesswitchinginthesame sk(pp) directionwhileoperatingatidenticalsupplyvoltages,temperature,inputsignalsandloads. (4) TheenablesignalrateforC-gradedevicesshouldbe≤45Kbps. 12 SubmitDocumentationFeedback Copyright©2012–2016,TexasInstrumentsIncorporated ProductFolderLinks:ISO7631FM ISO7631FC ISO7641FC

ISO7631FM,ISO7631FC,ISO7641FC www.ti.com SLLSEC3F–SEPTEMBER2012–REVISEDAPRIL2016 7.20 Switching Characteristics: V and V at 2.7 V (1) CC1 CC2 V andV at2.7V(overrecommendedoperatingconditionsunlessotherwisenoted) CC1 CC2 M-Grade PARAMETER TESTCONDITIONS MIN TYP MAX UNIT ISO7631F,ISO7641F tPLH,tPHL Propagationdelaytime SeeFigure16 5 8 16 ns PWD(2) Pulsewidthdistortion|tPHL–tPLH| SeeFigure16 2.5 ns Same-directionChannels 4 tsk(o)(3) Channel-to-channeloutputskewtime ns Opposite-directionChannels 5 tsk(pp)(4) Part-to-partskewtime 8 ns tr Outputsignalrisetime SeeFigure16 2.3 ns tf Outputsignalfalltime SeeFigure16 1.8 ns DisablePropagationDelay,high-to-high tPHZ impedanceoutput SeeFigure17 8 18 ns DisablePropagationDelay,low-to-high tPLZ impedanceoutput SeeFigure17 8 18 ns EnablePropagationDelay,highimpedance-to- tPZH highoutput SeeFigure17 7 18 ns EnablePropagationDelay,highimpedance-to- tPZL lowoutput SeeFigure17 7 18 ns Fail-safeoutputdelaytimefrominputdataor tfs powerloss SeeFigure18 8.5 μs (1) OnlyM-Gradedevicesarerecommendedforoperationdownto2.7Vsupplies.For2.7V-operation,maxdatarateis100Mbps. (2) AlsoknownasPulseSkew. (3) t istheskewbetweenoutputsofasingledevicewithalldrivinginputsconnectedtogetherandtheoutputsswitchinginthesame sk(o) directionwhiledrivingidenticalloads. (4) t isthemagnitudeofthedifferenceinpropagationdelaytimesbetweenanyterminalsofdifferentdevicesswitchinginthesame sk(pp) directionwhileoperatingatidenticalsupplyvoltages,temperature,inputsignalsandloads. Copyright©2012–2016,TexasInstrumentsIncorporated SubmitDocumentationFeedback 13 ProductFolderLinks:ISO7631FM ISO7631FC ISO7641FC

ISO7631FM,ISO7631FC,ISO7641FC SLLSEC3F–SEPTEMBER2012–REVISEDAPRIL2016 www.ti.com 7.21 Typical Characteristics 8 24 ICC1 at 3.3 V ICC1 at 3.3 V 7 ICC1 at 5 V 20 ICC1 at 5 V ICC2 at 3.3 V ICC2 at 3.3 V A) 6 ICC2 at 5 V A) ICC2 at 5 V m m 16 nt ( 5 nt ( e e urr 4 urr 12 C C pply 3 pply 8 u u S 2 S 1 TCAL == 2155° pCF 4 TCAL == 2155° pCF 0 0 0 20 40 60 80 100 120 140 160 0 20 40 60 80 100 120 140 160 Data Rate (Mbps) Data Rate (Mbps) G200 G201 Figure1.ISO7631FMSupplyCurrentPerChannel Figure2.ISO7631FMSupplyCurrentForAllChannels vsDataRate vsDataRate 2.5 7 ICC1 at 3.3 V ICC1 at 3.3 V ICC1 at 5 V 6 ICC1 at 5 V 2 ICC2 at 3.3 V ICC2 at 3.3 V A) ICC2 at 5 V A) 5 ICC2 at 5 V m m nt ( 1.5 nt ( 4 e e urr urr y C 1 y C 3 pl pl p p u u 2 S S 0.5 TA = 25°C 1 TA = 25°C CL = 15 pF CL = 15 pF 0 0 0 5 10 15 20 25 0 5 10 15 20 25 Data Rate (Mbps) Data Rate (Mbps) G202 G203 Figure3.ISO7631FCSupplyCurrentPerChannel Figure4.ISO7631FCSupplyCurrentForAllChannels vsDataRate vsDataRate 2.5 8 ICC1 at 3.3 V TA = 25°C ICC1 at 3.3 V ICC1 at 5 V CL = 15 pF 7 ICC1 at 5 V 2 ICC2 at 3.3 V ICC2 at 3.3 V A) ICC2 at 5 V A) 6 ICC2 at 5 V m m nt ( 1.5 nt ( 5 e e urr urr 4 C C ply 1 ply 3 p p u u S S 2 0.5 1 TA = 25°C CL = 15 pF 0 0 0 5 10 15 20 25 0 5 10 15 20 25 Data Rate (Mbps) Data Rate (Mbps) G102 G103 Figure5. ISO7641FCSupplyCurrentPerChannel Figure6. ISO7641FCSupplyCurrentForAllChannels vsDataRate vsDataRate 14 SubmitDocumentationFeedback Copyright©2012–2016,TexasInstrumentsIncorporated ProductFolderLinks:ISO7631FM ISO7631FC ISO7641FC

ISO7631FM,ISO7631FC,ISO7641FC www.ti.com SLLSEC3F–SEPTEMBER2012–REVISEDAPRIL2016 Typical Characteristics (continued) 6 6 VCC = 5 V TA = 25°C VCC = 3.3 V TA = 25°C V) 5 VCC = 3.3 V V) 5 VCC = 5 V e ( e ( g g a a olt 4 olt 4 V V ut ut utp 3 utp 3 O O el el ev 2 ev 2 L L − − h w Hig 1 Lo 1 0 0 −70 −60 −50 −40 −30 −20 −10 0 0 10 20 30 40 50 60 70 High−Level Output Current (mA) Low−Level Output Current (mA) G005 G006 Figure7.M-GradeHigh-LevelOutputVoltage Figure8.M-GradeLow-LevelOutputVoltage vsHigh-LevelOutputCurrent vsLow-LevelOutputCurrent 6 6 VCC = 3.3 V TA = 25°C VCC = 3.3 V TA = 25°C V) 5 VCC = 5 V V) 5 VCC = 5 V e ( e ( g g a a olt 4 olt 4 V V ut ut utp 3 utp 3 O O el el ev 2 ev 2 L L − − h w Hig 1 Lo 1 0 0 −30 −25 −20 −15 −10 −5 0 0 5 10 15 20 25 30 35 40 45 High−Level Output Current (mA) Low−Level Output Current (mA) G104 G105 Figure9.C-GradeHigh-LevelOutputVoltage Figure10.C-GradeLow-LevelOutputVoltage vsHigh-LevelOutputCurrent vsLow-LevelOutputCurrent 2.52 11 tPLH at 3.3 V Power Supply Voltage Threshold (V) 2222....24444.24685 VVCCCC RFaislliinngg ation Delay Time (ns) 1890 tttPPPHHLHLL aaattt 355. 3VV V Under 2.4 Propag 7 2.38 CL = 15 pF 2.36 6 −40 −20 0 20 40 60 80 100 120 −40 −15 10 35 60 85 110 135150 Free−Air Temperature (°C) Free−Air Temperature (°C) G007 G008 Figure11.V UndervoltageThreshold Figure12.M-GradePropagationDelayTime CC vsFreeAirTemperature vsFreeAirTemperature Copyright©2012–2016,TexasInstrumentsIncorporated SubmitDocumentationFeedback 15 ProductFolderLinks:ISO7631FM ISO7631FC ISO7641FC

ISO7631FM,ISO7631FC,ISO7641FC SLLSEC3F–SEPTEMBER2012–REVISEDAPRIL2016 www.ti.com Typical Characteristics (continued) 28 1 Time (ns) 2246 ttttPPPPLHLHHHLL aaaatttt 3355.. 33VV VV er (ns) 000...789 ay Jitt 0.6 Del 22 put 0.5 n ut o O 0.4 ati 20 k Propag 18 Pk-P 00..23 TCAL== 2155° pCF CL = 15 pF 0.1 VVCCCC== 53 .V3 V ATyllp C Jhitatenrn oenls oSuwtpitucth pining shown 16 0 −40 −20 0 20 40 60 80 100 120 140 0 20 40 60 80 100 120 140 160 180 Free−Air Temperature (°C) Data Rate (Mbps) G106 G009 Figure13.C-GradePropagationDelayTime Figure14.M-GradeOutputJittervsDataRate vsFreeAirTemperature 1.4 1.2 s) n 1 er ( Jitt 0.8 ut p ut 0.6 O k Pk-P 0.4 TCAL == 2155° pCF 0.2 VCC = 3.3 V All Channels Switching VCC = 5 V Typ Jitter on output pin shown 0 0 5 10 15 20 25 Data Rate (Mbps) G107 Figure15.C-GradeOutputJittervsDataRate 16 SubmitDocumentationFeedback Copyright©2012–2016,TexasInstrumentsIncorporated ProductFolderLinks:ISO7631FM ISO7631FC ISO7641FC

ISO7631FM,ISO7631FC,ISO7641FC www.ti.com SLLSEC3F–SEPTEMBER2012–REVISEDAPRIL2016 8 Parameter Measurement Information R E V RI CCI IN BAR OUT VI VCC/2 VCC/2 N 0 V O Input ATI VO tPLH tPHL Generator VI 50W OL CL 90% VOH NOTEA IS NOTE VO 50% 50% B 10% V tr tf OL Copyright © 2016,Texas Instruments Incorporated A. Theinputpulseissuppliedbyageneratorhavingthefollowingcharacteristics:PRR≤50kHz,50%dutycycle,t ≤3 r ns,t ≤3ns,Z =50Ω.Attheinput,50ΩresistorisrequiredtoterminateInputGeneratorsignal.Itisnotneededin f O actualapplication. B. C =15pFandincludesinstrumentationandfixturecapacitancewithin±20%. L Figure16. SwitchingCharacteristicsTestCircuitandVoltageWaveforms V CCO V CC RIER RL=1kW ±1% VI VCC/2 VCC/2 0V IN ATIONBAR OUT VO tPZL tPLZ V0CVCO L 0.5V ISO EN CL VO 50% V Input NOTE OL B Generator VI 50W NOTEA R V E CC RI IN BAR OUT VO V VCC/2 VCC/2 3V N I ATIO 0V ISOL EN CL R =1kW ±1% tPZH VOH L GeInnepruattor VI 50W NOBTE VO 50% 0.5V 0V t NOTEA PHZ Copyright © 2016,Texas Instruments Incorporated A. The input pulse is supplied by a generator having the following characteristics: PRR ≤ 10 kHz, 50% duty cycle, t ≤3ns,t ≤3ns,Z =50Ω. r f O B. C =15pFandincludesinstrumentationandfixturecapacitancewithin±20%. L Figure17. Enable/DisablePropagationDelayTimeTestCircuitandWaveform Copyright©2012–2016,TexasInstrumentsIncorporated SubmitDocumentationFeedback 17 ProductFolderLinks:ISO7631FM ISO7631FC ISO7641FC

ISO7631FM,ISO7631FC,ISO7641FC SLLSEC3F–SEPTEMBER2012–REVISEDAPRIL2016 www.ti.com Parameter Measurement Information (continued) VI VCCI VCCI ER VI 2.7V RRI 0V IN = VCCI ATIONBA OUT VO tfs VOH OL VO 50% IS CL fs low V OL NOTEA Copyright © 2016,Texas Instruments Incorporated A. C =15pFandincludesinstrumentationandfixturecapacitancewithin±20%. L Figure18. FailsafeDelayTimeTestCircuitandVoltageWaveforms V V CCI CCO C = 0.1μF ±1% C = 0.1μF ±1% Pass-fail criteria– output must remain er stable. arri IN B OUT S1 n atio + ol s C V or V I L OH OL NoteA – GNDI GNDO + V – CM Copyright © 2016,Texas Instruments Incorporated A. C =15pFandincludesinstrumentationandfixturecapacitancewithin±20%. L Figure19. Common-ModeTransientImmunityTestCircuit 18 SubmitDocumentationFeedback Copyright©2012–2016,TexasInstrumentsIncorporated ProductFolderLinks:ISO7631FM ISO7631FC ISO7641FC

ISO7631FM,ISO7631FC,ISO7641FC www.ti.com SLLSEC3F–SEPTEMBER2012–REVISEDAPRIL2016 9 Detailed Description 9.1 Overview The isolator in Figure 20 is based on a capacitive, isolation-barrier technique. The I/O channel of the device consists of two internal data channels, a high-frequency channel (HF) with a bandwidth from 100 kbps up to 150 Mbps, and a low-frequency channel (LF) covering the range from 100 kbps down to DC. In principle, a single-ended input signal entering the HF-channel is split into a differential signal via the inverter gate at the input. The following capacitor-resistor networks differentiate the signal into transients, which then are converted into differential pulses by two comparators. The comparator outputs drive a NOR-gate flip-flop whose output feeds an output multiplexer. A decision logic (DCL) at the driving output of the flip-flop measures the durations between signal transients. If the duration between two consecutive transients exceeds a certain time limit, (as in the case of a low-frequency signal), the DCL forces the output-multiplexer to switch from the high- to the low- frequencychannel. Because low-frequency input signals require the internal capacitors to assume prohibitively large values, these signals are pulse-width modulated (PWM) with the carrier frequency of an internal oscillator, thus creating a sufficientlyhighfrequencysignal,capableofpassingthecapacitivebarrier.Astheinputismodulated,alow-pass filter (LPF) is needed to remove the high-frequency carrier from the actual data before passing it on to the output multiplexer. 9.2 Functional Block Diagram Isolation Barrier OSC LPF Low t Frequency Channel PWM VREF (DC...100 kbps) 0 OUT 1 S IN DCL High t Frequency Channel VREF (100 kbps...150 Mbps) Copyright © 2016, Texas Instruments Incorporated Figure20. ISO7631FMConceptualBlockDiagram Copyright©2012–2016,TexasInstrumentsIncorporated SubmitDocumentationFeedback 19 ProductFolderLinks:ISO7631FM ISO7631FC ISO7641FC

ISO7631FM,ISO7631FC,ISO7641FC SLLSEC3F–SEPTEMBER2012–REVISEDAPRIL2016 www.ti.com Functional Block Diagram (continued) Isolation Barrier OSC Low t Frequency Channel PWM VREF LPF (DC...100 kbps) 0 Polarity and IN Threshold Selection OUT 1 S High t Frequency Channel VREF DCL (100 kbps...25 Mbps) Polarity and Threshold Selection Copyright © 2016, Texas Instruments Incorporated Figure21. ISO7631FCandISO7641FCConceptualBlockDiagram 9.3 Feature Description 9.3.1 PackageInsulationandSafety-RelatedSpecifications PARAMETER TESTCONDITIONS MIN TYP MAX UNIT L(I01) Minimumairgap(Clearance) Shortestterminaltoterminaldistancethroughair 8 mm L(I02)(1) Minimumexternaltracking Shortestterminaltoterminaldistanceacrossthe 8 mm (Creepage) packagesurface Trackingresistance(Comparative CTI DINEN60112(VDE0303-11);IEC60112 ≥400 V TrackingIndex) MinimumInternalGap(Internal DTI Distancethroughtheinsulation 0.014 mm Clearance) C(2) Inputcapacitance V =V /2+0.4sin(2πft),f=1MHz,V =5V 2 pF I I CC CC (1) PerJEDECpackagedimensions. (2) Measuredfrominputpintoground. spacer NOTE Creepage and clearance requirements should be applied according to the specific equipment isolation standards of an application. Care should be taken to maintain the creepage and clearance distance of a board design to ensure that the mounting pads of theisolatorontheprintedcircuitboarddonotreducethisdistance. Creepage and clearance on a printed circuit board become equal according to the measurement techniques shown in the Isolation Glossary. Techniques such as inserting grooves and/or ribs on a printed circuit board are used to help increase these specifications. 20 SubmitDocumentationFeedback Copyright©2012–2016,TexasInstrumentsIncorporated ProductFolderLinks:ISO7631FM ISO7631FC ISO7641FC

ISO7631FM,ISO7631FC,ISO7641FC www.ti.com SLLSEC3F–SEPTEMBER2012–REVISEDAPRIL2016 Table1.DINVVDEV0884-10(VDEV0884-10):2006-12InsulationCharacteristics(1) PARAMETER TESTCONDITIONS SPECIFICATION UNIT V Maximumworkinginsulationvoltage 1414 V IORM PEAK AfterInput/Outputsafetytestsubgroup2/3, V =V x1.2,t=10s, 1697 PR IORM Partialdischarge<5pC Methoda,Afterenvironmentaltestssubgroup1, V Input-to-outputtestvoltage V =V x1.6,t=10s, 2262 V PR PR IORM PEAK PartialDischarge<5pC Methodb1,100%Productiontest V =V x1.875,t=1s 2652 PR IORM Partialdischarge<5pC V =V TEST IOTM V Maximumtransientovervoltage t=60sec(Qualification) 4242 V IOTM PEAK t=1sec(100%Production) V =500V,T =25°C >1012 IO A R (2) Isolationresistance,InputtoOutput V =500V,100°C≤T ≤125°C >1011 Ω IO IO A V =500VatT =150°C >109 IO S C (2) Barriercapacitance,InputtoOutput V =0.4sin(2πft),f=1MHz 2 pF IO I Pollutiondegree 2 (1) ClimaticClassification40/125/21 (2) Allpinsoneachsideofthebarriertiedtogethercreatingatwo-terminaldevice. Table2.IEC60664-1RatingsTable PARAMETER TESTCONDITIONS SPECIFICATION MaterialGroup II Ratedmainsvoltage≤300V I–IV RMS Installationclassification/Overvoltage Ratedmainsvoltage≤600V I–III categoryforbasicinsulation RMS Ratedmainsvoltage≤1000V I–II RMS Table3.RegulatoryInformation VDE TUV CSA UL CQC Certifiedaccordingto Certifiedaccordingto ApprovedunderCSA Recognizedunder1577 Certifiedaccordingto DINVVDEV0884-10 EN/UL/CSA60950-1and61010- ComponentAcceptanceNotice ComponentRecognition GB4943.1-2011 (VDEV0884-10):2006- 1 5A,IEC60950-1andIEC Program 12andDINEN61010- 61010-1 1(VDE0411-1):2011- 07 BasicInsulation 3000VRMSReinforcedInsulation, ReinforcedInsulation,Altitude≤ MaximumTransient 400VRMSmaximumworking SingleProtection,2500 5000m,TropicalClimate,250 OMvaexrimvoultmagWe,o4rk2i4n2gVPK v3o0l0ta0gVeRMSBasicInsulation,600 3000VRMSIsolationRating VRMS(1) VVRoMltaSgMeaximumWorking Voltage,1414VPK VRMSmaximumworkingvoltage Certificatenumber: Certificatenumber: Mastercontractnumber: Filenumber:E181974 Certificatenumber: 40016131 U8V130977311010 220991 CQC14001109542 (1) Productiontested≥3000V for1secondinaccordancewithUL1577. RMS Copyright©2012–2016,TexasInstrumentsIncorporated SubmitDocumentationFeedback 21 ProductFolderLinks:ISO7631FM ISO7631FC ISO7641FC

ISO7631FM,ISO7631FC,ISO7641FC SLLSEC3F–SEPTEMBER2012–REVISEDAPRIL2016 www.ti.com 9.3.1.1 SafetyLimitingValues Safety limiting intends to prevent potential damage to the isolation barrier upon failure of input or output circuitry. A failure of the IO can allow low resistance to ground or the supply and, without current limiting, dissipate sufficient power to overheat the die and damage the isolation barrier potentially leading to secondary system failures. PARAMETER TESTCONDITIONS MIN TYP MAX UNIT θ =77.5°C/W,V =5.5V,T =150°C,T =25°C 293 JA I J A Safetyinput,output,orsupply I DW-16 θ =77.5°C/W,V =3.6V,T =150°C,T =25°C 448 mA S current JA I J A θ =77.5°C/W,V =2.7V,T =150°C,T =25°C 597 JA I J A T Maximumsafetytemperature 150 °C S The safety-limiting constraint is the absolute maximum junction temperature specified in the absolute maximum ratings table. The power dissipation and junction-to-air thermal impedance of the device installed in the application hardware determines the junction temperature. The assumed junction-to-air thermal resistance in the Thermal Information table is that of a device installed on a High-K Test Board for Leaded Surface Mount Packages.Thepoweristherecommendedmaximuminputvoltagetimesthecurrent.Thejunctiontemperatureis thentheambienttemperatureplusthepowertimesthejunction-to-airthermalresistance. 700 VCC1 = VCC2 = 2.7 V VCC1 = VCC2 = 3.6 V 600 VCC1 = VCC2 = 5.5 V A 500 m nt - e urr 400 C g n miti 300 Li y et Saf 200 100 0 0 50 100 150 200 Ambient Temperature - (qC) DD000101 Figure22.ThermalDeratingCurveforSafetyLimitingCurrentperVDE 22 SubmitDocumentationFeedback Copyright©2012–2016,TexasInstrumentsIncorporated ProductFolderLinks:ISO7631FM ISO7631FC ISO7641FC

ISO7631FM,ISO7631FC,ISO7641FC www.ti.com SLLSEC3F–SEPTEMBER2012–REVISEDAPRIL2016 9.4 Device Functional Modes Table4.FunctionTable(1) INPUT OUTPUT INPUT OUTPUTENABLE OUTPUT V V (INx) (ENx) (OUTx) CC CC H HorOpen H L HorOpen L PU PU X L Z Open HorOpen L PD PU X HorOpen L PD PU X L Z PU PD X X Undetermined (1) PU=PoweredUp(V ≥2.7V);PD=PoweredDown(V ≤2.1V);X=Irrelevant;H=HighLevel;L CC CC =LowLevel;Z=HighImpedance IInnppuutt OOuuttppuutt EEnnaabbllee VV VV VV CCCCOO VV VV VV CCCCII CCCCII CCCCOO CCCCOO CCCCOO 11 MMWW 550000WW 88WW 550000WW IINN OOUUTT EENN 1133WW 77..55 µµAA Copyright © 2016,Texas Instruments Incorporated Figure23. DeviceI/OSchematics Copyright©2012–2016,TexasInstrumentsIncorporated SubmitDocumentationFeedback 23 ProductFolderLinks:ISO7631FM ISO7631FC ISO7641FC

ISO7631FM,ISO7631FC,ISO7641FC SLLSEC3F–SEPTEMBER2012–REVISEDAPRIL2016 www.ti.com 10 Application and Implementation NOTE Information in the following applications sections is not part of the TI component specification, and TI does not warrant its accuracy or completeness. TI’s customers are responsible for determining suitability of components for their purposes. Customers should validateandtesttheirdesignimplementationtoconfirmsystemfunctionality. 10.1 Application Information ISO7641FC uses single-ended TTL-logic switching technology. It has a supply voltage range from 3 V to 5.5 V for both supplies, V and V . When designing with digital isolators, it is important to note that due to CC1 CC2 the single-ended design structure, digital isolators do not conform to any specific interface standard and are only intended for isolating single-ended CMOS or TTL digital signal lines. The isolator is typically placed between the data controller (that is, μC or UART), and a data converter or a line transceiver, regardless of theinterfacetypeorstandard. 10.2 Typical Application ISO-BARRIER 5VISO 5VISO 5VISO 3.3V 3.3V 0.1F 0.1F 16 1 0.1F 22 1 VCC2 VCC1 AVDD DVDD 0.1F 10 7 0.1F 2 11 EN2 EN1 AIN1+ 8 14 3 11 DVcc 5 A0 OUTA INA P3.0 XOUT RTD 12 7 13 ISO7641 4 12 AIN1- A1 OUTB INB P3.1 27 12 5 14 MSP430 6 SCLK OUTC INC CLK XIN F2132 18 28 11 6 13 18 Bridge AIN2+ DOUT IND OUTD SOMI P3.7 17AIN2-ADS1234 5VISO 5VISO 9,15GND2 GND12,8 3.3V 15 P3.61176 20 P3.4 P3.5 Thermo 13AIN3+ RREEFF+-19 0.1F0.1F 1106VCC2 VCC117 0.1F D4Vss couple 14 EN NC AIN3- 23 14 3 GAIN0 OUTA INA 24 13 ISO7640 4 GAIN1 OUTB INB 16 AIN4+ 25 12 5 Current SPEED OUTC INC shunt 15 26 11 6 AIN4- PWDN OUTD IND 9,15 2,8 AGND DGND GND2 GND1 21 2 Copyright © 2016,Texas Instruments Incorporated Figure24. IsolatedDataAcquisitionSystemforProcessControl 10.2.1 DesignRequirements Unlike optocouplers, which require external components to improve performance, provide bias, or limit current, theISO76xxdeviceonlyrequirestwoexternalbypasscapacitorstooperate. 24 SubmitDocumentationFeedback Copyright©2012–2016,TexasInstrumentsIncorporated ProductFolderLinks:ISO7631FM ISO7631FC ISO7641FC

ISO7631FM,ISO7631FC,ISO7641FC www.ti.com SLLSEC3F–SEPTEMBER2012–REVISEDAPRIL2016 Typical Application (continued) 10.2.2 DetailedDesignProcedure ISO7641 0.1 µF 0.1 µF V V CC1 1 16 CC2 GND1 GND2 2 15 INA 3 14 OUTA INB 4 13 OUTB INC 5 12 OUTC OUTD 6 11 IND 7 10 EN1 EN2 8 9 GND1 GND2 Copyright © 2016, Texas Instruments Incorporated Figure25. TypicalISO7641FCCircuitHookup 10.2.2.1 TypicalSupplyCurrentEquations (CalculatedbasedonroomtemperatureandtypicalSiliconprocess) ISO7631FM: AtV =V =3.3V CC1 CC2 I =1.8072+0.0244×f+0.0016×f×C (1) CC1 L I =2.4625+0.0252×f+0.0033×f×C (2) CC2 L AtV =V =5V CC1 CC2 I =2.3183+0.04×f+0.0025×f×C (3) CC1 L I =3.2582+0.0403×f+0.0049×f×C (4) CC2 L ISO7631FC: AtV =V =3.3V CC1 CC2 I =1.1762+0.0325×f+0.0017×f×C (5) CC1 L I =1.5285+0.0299×f+0.0033×f×C (6) CC2 L AtV =V =5V CC1 CC2 I =1.6001+0.0528×f+0.0025×f×C (7) CC1 L I =2.2032+0.0475×f+0.005×f×C (8) CC2 L ISO7641FC: AtV =V =3.3V CC1 CC2 I =1.2162+0.0462×f+0.0017×f×C (9) CC1 L Copyright©2012–2016,TexasInstrumentsIncorporated SubmitDocumentationFeedback 25 ProductFolderLinks:ISO7631FM ISO7631FC ISO7641FC

ISO7631FM,ISO7631FC,ISO7641FC SLLSEC3F–SEPTEMBER2012–REVISEDAPRIL2016 www.ti.com Typical Application (continued) (CalculatedbasedonroomtemperatureandtypicalSiliconprocess) I =1.8054+0.0411×f+0.005×f×C (10) CC2 L AtV =V =5V CC1 CC2 I =1.6583+0.0757×f+0.0025×f×C (11) CC1 L I =2.5008+0.0655×f+0.0076×f×C (12) CC2 L I and I are typical supply currents measured in mA; f is data rate measured in Mbps; C is the capacitive CC1 CC2 L loadoneachchannelmeasuredinpF. 10.2.3 ApplicationCurves TA= 25oC, CL= 15 pF VCC1= VCC2= 5 V TA= 25oC, CL= 15 pF Pattern: NRZ 216-1 VCC1= VCC2= 3.3 V Pattern: NRZ 216-1 Figure26.M-GradeTypicalEyeDiagramat150Mbps, Figure27.M-GradeTypicalEyeDiagramat150Mbps, 5VOperation 3.3VOperation TA= 25oC, CL= 15 pF VCC1= VCC2= 5 V Pattern: NRZ 216-1 TA= 25oC, CL= 15 pF VCC1= VCC2= 3.3 V Pattern: NRZ 216-1 Figure28. C-GradeTypicalEyeDiagramat25Mbps,5V Figure29.C-GradeTypicalEyeDiagramat25Mbps,3.3V Operation Operation 26 SubmitDocumentationFeedback Copyright©2012–2016,TexasInstrumentsIncorporated ProductFolderLinks:ISO7631FM ISO7631FC ISO7641FC

ISO7631FM,ISO7631FC,ISO7641FC www.ti.com SLLSEC3F–SEPTEMBER2012–REVISEDAPRIL2016 11 Power Supply Recommendations To ensure reliable operation at all data rates and supply voltages, a 0.1-μF bypass capacitor is recommended at input and output supply pins (V and V ). The capacitors should be placed as close to the supply pins as CC1 CC2 possible. If only a single primary-side power supply is available in an application, isolated power can be generated for the secondary-side with the help of a transformer driver such as Texas Instruments' SN6501. For such applications, detailed power supply design and transformer selection recommendations are available in SN6501datasheet(SLLSEA0). 12 Layout 12.1 Layout Guidelines AminimumoffourlayersisrequiredtoaccomplishalowEMIPCBdesign(seeFigure30).Layerstackingshould be in the following order (top-to-bottom): high-speed signal layer, ground plane, power plane and low-frequency signallayer. • Routing the high-speed traces on the top layer avoids the use of vias (and the introduction of their inductances) and allows for clean interconnects between the isolator and the transmitter and receiver circuits ofthedatalink. • Placing a solid ground plane next to the high-speed signal layer establishes controlled impedance for transmissionlineinterconnectsandprovidesanexcellentlow-inductancepathforthereturncurrentflow. • Placing the power plane next to the ground plane creates additional high-frequency bypass capacitance of approximately100pF/in2. • Routing the slower speed control signals on the bottom layer allows for greater flexibility as these signal links usuallyhavemargintotoleratediscontinuitiessuchasvias. If an additional supply voltage plane or signal layer is needed, add a second power and ground plane system to thestacktokeepitsymmetrical.Thismakesthestackmechanicallystableandpreventsitfromwarping.Alsothe powerandgroundplaneofeachpowersystemcanbeplacedclosertogether,thusincreasingthehigh-frequency bypasscapacitancesignificantly. NOTE Fordetailedlayoutrecommendations,seeDigitalIsolatorDesignGuide,SLLA284. 12.2 Layout Example High-speed traces 10 mils Ground plane Keep this space free FR-4 40 mils from planes, 0 ~ 4.5 r traces, pads, and vias Power plane 10 mils Low-speed traces Figure30. RecommendedLayerStack Copyright©2012–2016,TexasInstrumentsIncorporated SubmitDocumentationFeedback 27 ProductFolderLinks:ISO7631FM ISO7631FC ISO7641FC

ISO7631FM,ISO7631FC,ISO7641FC SLLSEC3F–SEPTEMBER2012–REVISEDAPRIL2016 www.ti.com 13 Device and Documentation Support 13.1 Documentation Support 13.1.1 RelatedDocumentation Forrelateddocumentation,seethefollowing: • DigitalIsolatorDesignGuide,SLLA284 • TransformerDriverforIsolatedPowerSupplies,SLLSEA0 • IsolationGlossary,SLLA353 13.2 Related Links The table below lists quick access links. Categories include technical documents, support and community resources,toolsandsoftware,andquickaccesstosampleorbuy. Table5.RelatedLinks TECHNICAL TOOLS& SUPPORT& PARTS PRODUCTFOLDER SAMPLE&BUY DOCUMENTS SOFTWARE COMMUNITY ISO7631FM Clickhere Clickhere Clickhere Clickhere Clickhere ISO7631FC Clickhere Clickhere Clickhere Clickhere Clickhere ISO7641FC Clickhere Clickhere Clickhere Clickhere Clickhere 13.3 Community Resources The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use. TIE2E™OnlineCommunity TI'sEngineer-to-Engineer(E2E)Community.Createdtofostercollaboration amongengineers.Ate2e.ti.com,youcanaskquestions,shareknowledge,exploreideasandhelp solveproblemswithfellowengineers. DesignSupport TI'sDesignSupport QuicklyfindhelpfulE2Eforumsalongwithdesignsupporttoolsand contactinformationfortechnicalsupport. 13.4 Trademarks DeviceNet,E2EaretrademarksofTexasInstruments. Allothertrademarksarethepropertyoftheirrespectiveowners. 13.5 Electrostatic Discharge Caution Thesedeviceshavelimitedbuilt-inESDprotection.Theleadsshouldbeshortedtogetherorthedeviceplacedinconductivefoam duringstorageorhandlingtopreventelectrostaticdamagetotheMOSgates. 13.6 Glossary SLYZ022—TIGlossary. Thisglossarylistsandexplainsterms,acronyms,anddefinitions. 14 Mechanical, Packaging, and Orderable Information The following pages include mechanical, packaging, and orderable information. This information is the most current data available for the designated devices. This data is subject to change without notice and revision of thisdocument.Forbrowser-basedversionsofthisdatasheet,refertotheleft-handnavigation. 28 SubmitDocumentationFeedback Copyright©2012–2016,TexasInstrumentsIncorporated ProductFolderLinks:ISO7631FM ISO7631FC ISO7641FC

ISO7631FM,ISO7631FC,ISO7641FC www.ti.com SLLSEC3F–SEPTEMBER2012–REVISEDAPRIL2016 PACKAGE OUTLINE DW0016B SOIC - 2.65 mm max height SCALE 1.500 SOIC C 10.63 SEATING PLANE TYP 9.97 A PIN 1 ID 0.1 C AREA 14X 1.27 16 1 10.5 2X 10.1 8.89 NOTE 3 8 9 0.51 16X 0.31 7.6 B 7.4 0.25 C A B 2.65 MAX NOTE 4 0.38 TYP 0.25 SEE DETAILA 0.25 GAGE PLANE 0.3 0 - 8 0.1 1.27 0.40 DETAILA (1.4) TYPICAL 4221009/A 08/2013 NOTES: 1.All linear dimensions are in millimeters. Dimensions in parenthesis are for reference only. Dimensioning and tolerancing perASMEY14.5M. 2.This drawing is subject to change without notice. 3.This dimension does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not exceed 0.15 mm, per side. 4.This dimension does not include interlead flash. Interlead flash shall not exceed 0.25 mm, per side. 5. Reference JEDEC registration MO-013, variationAA. www.ti.com Copyright©2012–2016,TexasInstrumentsIncorporated SubmitDocumentationFeedback 29 ProductFolderLinks:ISO7631FM ISO7631FC ISO7641FC

ISO7631FM,ISO7631FC,ISO7641FC SLLSEC3F–SEPTEMBER2012–REVISEDAPRIL2016 www.ti.com EXAMPLE BOARD LAYOUT DW0016B SOIC - 2.65 mm max height SOIC SYMM SYMM 16X (2) 16X (1.65) SEE SEE DETAILS DETAILS 1 1 16 16 16X (0.6) 16X (0.6) SYMM SYMM 14X (1.27) 14X (1.27) 8 9 8 9 (9.3) (9.75) IPC-7351 NOMINAL HV / ISOLATION OPTION 7.3 mm CLEARANCE/CREEPAGE 8.1 mm CLEARANCE/CREEPAGE LAND PATTERN EXAMPLE SCALE:4X METAL SOOPLEDNEINRG MASK SOLDOEPRE MNAINSGK METAL 0.07 MAX 0.07 MIN ALLAROUND ALLAROUND NON SOLDER MASK SOLDER MASK DEFINED DEFINED SOLDER MASK DETAILS 4221009/A 08/2013 NOTES: (continued) 6. Publication IPC-7351 may have alternate designs. 7. Solder mask tolerances between and around signal pads can vary based on board fabrication site. www.ti.com 30 SubmitDocumentationFeedback Copyright©2012–2016,TexasInstrumentsIncorporated ProductFolderLinks:ISO7631FM ISO7631FC ISO7641FC

ISO7631FM,ISO7631FC,ISO7641FC www.ti.com SLLSEC3F–SEPTEMBER2012–REVISEDAPRIL2016 EXAMPLE STENCIL DESIGN DW0016B SOIC - 2.65 mm max height SOIC SYMM SYMM 16X (2) 16X (1.65) 1 1 16 16 16X (0.6) 16X (0.6) SYMM SYMM 14X (1.27) 14X (1.27) 8 9 8 9 (9.3) (9.75) IPC-7351 NOMINAL HV / ISOLATION OPTION 7.3 mm CLEARANCE/CREEPAGE 8.1 mm CLEARANCE/CREEPAGE SOLDER PASTE EXAMPLE BASED ON 0.125 mmTHICK STENCIL SCALE:4X 4221009/A 08/2013 NOTES: (continued) 8. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate design recommendations. 9. Board assembly site may have different recommendations for stencil design. www.ti.com Copyright©2012–2016,TexasInstrumentsIncorporated SubmitDocumentationFeedback 31 ProductFolderLinks:ISO7631FM ISO7631FC ISO7641FC

PACKAGE OPTION ADDENDUM www.ti.com 6-Feb-2020 PACKAGING INFORMATION Orderable Device Status Package Type Package Pins Package Eco Plan Lead/Ball Finish MSL Peak Temp Op Temp (°C) Device Marking Samples (1) Drawing Qty (2) (6) (3) (4/5) ISO7631FCDW ACTIVE SOIC DW 16 40 Green (RoHS NIPDAU Level-3-260C-168 HR -40 to 125 ISO7631FC & no Sb/Br) ISO7631FCDWR ACTIVE SOIC DW 16 2000 Green (RoHS NIPDAU Level-3-260C-168 HR -40 to 125 ISO7631FC & no Sb/Br) ISO7631FMDW ACTIVE SOIC DW 16 40 Green (RoHS NIPDAU Level-3-260C-168 HR -40 to 125 ISO7631FM & no Sb/Br) ISO7631FMDWR ACTIVE SOIC DW 16 2000 Green (RoHS NIPDAU Level-3-260C-168 HR -40 to 125 ISO7631FM & no Sb/Br) ISO7641FCDW ACTIVE SOIC DW 16 40 Green (RoHS NIPDAU Level-3-260C-168 HR -40 to 125 ISO7641FC & no Sb/Br) ISO7641FCDWR ACTIVE SOIC DW 16 2000 Green (RoHS NIPDAU Level-3-260C-168 HR -40 to 125 ISO7641FC & no Sb/Br) (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may reference these types of products as "Pb-Free". RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption. Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based flame retardants must also meet the <=1000ppm threshold requirement. (3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. (5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device. Addendum-Page 1

PACKAGE OPTION ADDENDUM www.ti.com 6-Feb-2020 (6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish value exceeds the maximum column width. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 2

PACKAGE MATERIALS INFORMATION www.ti.com 26-Feb-2019 TAPE AND REEL INFORMATION *Alldimensionsarenominal Device Package Package Pins SPQ Reel Reel A0 B0 K0 P1 W Pin1 Type Drawing Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant (mm) W1(mm) ISO7631FCDWR SOIC DW 16 2000 330.0 16.4 10.75 10.7 2.7 12.0 16.0 Q1 ISO7631FMDWR SOIC DW 16 2000 330.0 16.4 10.75 10.7 2.7 12.0 16.0 Q1 ISO7641FCDWR SOIC DW 16 2000 330.0 16.4 10.75 10.7 2.7 12.0 16.0 Q1 PackMaterials-Page1

PACKAGE MATERIALS INFORMATION www.ti.com 26-Feb-2019 *Alldimensionsarenominal Device PackageType PackageDrawing Pins SPQ Length(mm) Width(mm) Height(mm) ISO7631FCDWR SOIC DW 16 2000 350.0 350.0 43.0 ISO7631FMDWR SOIC DW 16 2000 350.0 350.0 43.0 ISO7641FCDWR SOIC DW 16 2000 350.0 350.0 43.0 PackMaterials-Page2

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