DATASHEET ISL4485E FN6049 ±15kV ESD Protected, 20Mbps, 5V, Low Power, RS-485/RS-422 Transceiver Rev 4.00 Oct 8, 2018 The ISL4485E is a high speed, BiCMOS 5V powered, single Features transceiver that meets both the RS-485 and RS-422 • Pb-free available (RoHS compliant) standards for balanced communication. Each driver output/receiver input is protected against ±15kV ESD strikes • High data rates. . . . . . . . . . . . . . . . . . . . . . up to 20Mbps without latch-up. Unlike competitive devices, this device is • RS-485 I/O pin ESD protection . . . . . . . . . . . 15kV HBM specified for 10% tolerance supplies (4.5V to 5.5V). - Class 3 ESD level on all other pins . . . . . . . >7kV HBM The excellent differential output voltage coupled with high • Operates from a single +5V supply (10% tolerance) drive-current output stages allow 20Mbps operation over twisted pair networks up to 450ft in length. The 25kΩ • 1 unit load allows up to 32 devices on the bus receiver input resistance presents a single unit load to the • Low quiescent current . . . . . . . . . . . . . . . . . . . . . . 700µA RS-485 bus, allowing up to 32 transceivers on the network. • -7V to +12V common-mode input voltage range The receiver (Rx) inputs feature a “fail-safe if open” design, • Three state Rx and Tx outputs which ensures a logic high Rx output if the Rx inputs are floating. • 30ns propagation delays, 2ns skew The driver (Tx) outputs are short-circuit protected, even for • Current limiting and thermal shutdown for driver overload voltages exceeding the power supply voltage. Additionally, protection on-chip thermal shutdown circuitry disables the Tx outputs to Applications prevent damage if power dissipation becomes excessive. The half duplex configuration multiplexes the Rx inputs and • SCSI “fast 20” drivers and receivers Tx outputs to allow transceivers with Rx and Tx disable • Data loggers functions in 8 Ld packages. • Security networks Related Literature • Building environmental control systems For a full list of related documents, visit our website: • Industrial/process control networks • ISL4485E product page • Level translators Typical Operating Circuit ISL4485E 5V 5V 8 100nF 100nF 8 R R PU VCC VCC PU RB 1 RO RO 1 A/Y 6 6 A/Y 2 RE RE 2 3 DE B/Z 7 RT2 VFS RT1 7 B/Z DE 3 4 DI DI 4 RB GND GND 5 5 To calculate the resistor values, refer to TB509. FN6049 Rev 4.00 Page 1 of 13 Oct 8, 2018

ISL4485E Ordering Information PART NUMBER TAPE AND REEL PACKAGE (Notes2, 3) PART MARKING TEMP. RANGE (°C) (UNITS) (Note1) (RoHS COMPLIANT) PKG. DWG. # ISL4485EIBZ 4485EIBZ -40 to +85 - 8 Ld SOIC (Pb-free) M8.15 ISL4485EIBZ-T 4485EIBZ -40 to +85 2.5k 8 Ld SOIC Tape & Reel M8.15 (Pb-free) NOTE: 1. Refer to TB347 for details about reel specifications. 2. These Pb-free products employ special Pb-free material sets; molding compounds/die attach materials and 100% matte tin plate termination finish, which are RoHS compliant and compatible with both SnPb and Pb-free soldering operations. Pb-free products are MSL classified at Pb-free peak reflow temperatures that meet or exceed the Pb-free requirements of IPC/JEDEC J STD-020. 3. For Moisture Sensitivity Level (MSL), refer to the ISL4485E product information page. For more information, refer to TB363. Truth Tables TRANSMITTING RECEIVING INPUTS OUTPUTS INPUTS OUTPUT RE DE DI B/Z A/Y RE DE A-B RO X 1 1 0 1 0 0 ≥ +0.2V 1 X 1 0 1 0 0 0 ≤ -0.2V 0 X 0 X High-Z High-Z 0 0 Inputs Open 1 1 X X High-Z Pinout TOP VIEW RO 1 8 VCC R RE 2 7 B / Z DE 3 6 A / Y DI 4 D 5 GND Pin Descriptions PIN FUNCTION RO Receiver output: RO is high if A > B by at least 0.2V; RO is low if A < B by 0.2V or more; RO = high if A and B are unconnected (floating). RE Receiver output enable. RO is enabled when RE is low; RO is high impedance when RE is high. DE Driver output enable. The driver outputs, Y and Z, are enabled by bringing DE high. They are high impedance when DE is low. DI Driver input. A low on DI forces output Y low and output Z high. Similarly, a high on DI forces output Y high and output Z low. GND Ground connection. A/Y ±15kV HBM ESD protected, noninverting receiver input and noninverting driver output. Pin is an input (A) if DE = 0; pin is an output(Y) if DE = 1. B/Z ±15kV HBM ESD protected, inverting receiver input and inverting driver output. Pin is an input (B) if DE = 0; pin is an output (Z) if DE= 1. VCC System power supply input (4.5V to 5.5V). FN6049 Rev 4.00 Page 2 of 13 Oct 8, 2018

ISL4485E Absolute Maximum Ratings Thermal Information VCC to Ground. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7V Thermal Resistance (Typical, Note4) JA (°C/W) Input Voltages 8 Ld SOIC Package. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .170 DI, DE, RE . . . . . . . . . . . . . . . . . . . . . . . . . . -0.5V to (VCC +0.5V) Maximum Junction Temperature (Plastic Package) . . . . . . . . . 150 Input / Output Voltages Maximum Storage Temperature Range. . . . . . . . . . . .-65°C to +150 A / Y, B / Z . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -8V to +12.5V Maximum Lead Temperature (Soldering 10s) . . . . . . . . . . . . . . 300 RO . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.5V to (VCC +0.5V) (Lead Tips Only) Short-Circuit Duration Y, Z. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Continuous ESD Rating . . . . . . . . . . . . . . . . . . . . See “Electrical Specifications” Operating Conditions Temperature Range ISL4485EIBZ . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .-40°C to 85°C CAUTION: Stresses above those listed in “Absolute Maximum Ratings” can permanently damage the device. This is a stress only rating and operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. NOTE: 4. JA is measured with the component mounted on a low-effective thermal conductivity test board in free air. See TB379 for details. Electrical Specifications Test Conditions: VCC = 4.5V to 5.5V; unless otherwise specified. Typicals are at VCC = 5V, TA=+25°C, Note5 TEMP PARAMETER SYMBOL TEST CONDITIONS (oC) MIN TYP MAX UNIT DC CHARACTERISTICS Driver Differential VOUT (no load) VOD1 Full - - VCC V Driver Differential VOUT (with load) VOD2 R = 50Ω (RS-422), (Figure1) Full 2 3 - V R = 27Ω (RS-485), (Figure1) Full 1.5 2.3 5 V Change in Magnitude of Driver VOD R = 27Ω or 50Ω, (Figure1) Full - 0.01 0.2 V Differential VOUT for Complementary Output States Driver Common-Mode VOUT VOC R = 27Ω or 50Ω, (Figure1) Full - - 3 V Change in Magnitude of Driver VOC R = 27Ω or 50Ω, (Figure1) Full - 0.01 0.2 V Common-Mode VOUT for Complementary Output States Logic Input High Voltage VIH DE, DI, RE Full 2 - - V Logic Input Low Voltage VIL DE, DI, RE Full - - 0.8 V Logic Input Current IIN1 DE, DI, RE Full -25 - 25 µA Input Current (A, B), (Note8) IIN2 DE = 0V, VCC = 0V or VIN = 12V Full - - 1 mA 4.5V to 5.5V VIN = -7V Full - - -0.8 mA Receiver Differential Threshold VTH -7V ≤ VCM ≤ 12V Full -0.2 - 0.2 V Voltage Receiver Input Hysteresis VTH VCM = 0V 25 - 70 - mV Receiver Output High Voltage VOH IO = -4mA, VID = 200mV Full 3.5 4 - V Receiver Output Low Voltage VOL IO = -4mA, VID = 200mV Full - 0.1 0.4 V Three-State (High Impedance) IOZR 0.4V ≤ VO ≤ 2.4V Full - - 1 µA Receiver Output Current Receiver Input Resistance RIN -7V ≤ VCM ≤ 12V Full 12 25 - kΩ No-Load Supply Current, (Note6) ICC DI, RE = 0V or VCC DE = VCC Full - 700 900 µA DE = 0V Full - 500 565 µA Driver Short-Circuit Current, IOSD1 DE = VCC, -7V ≤ VY or VZ ≤ 12V, (Note7) Full 35 - 250 mA VO = High or Low FN6049 Rev 4.00 Page 3 of 13 Oct 8, 2018

ISL4485E Electrical Specifications Test Conditions: VCC = 4.5V to 5.5V; unless otherwise specified. Typicals are at VCC = 5V, TA=+25°C, Note5 (Continued) TEMP PARAMETER SYMBOL TEST CONDITIONS (oC) MIN TYP MAX UNIT Receiver Short-Circuit Current IOSR 0V ≤ VO ≤ VCC Full 7 - 85 mA SWITCHING CHARACTERISTICS Driver Input to Output Delay tPLH, tPHL RDIFF = 54Ω, CL = 100pF, (Figure2) Full 15 30 50 ns Driver Output Skew tSKEW RDIFF = 54Ω, CL = 100pF, (Figure2) Full - 1.3 5 ns Driver Differential Rise or Fall Time tR, tF RDIFF = 54Ω, CL = 100pF, (Figure2) Full 3 11 25 ns Driver Enable to Output High tZH CL = 100pF, SW = GND, (Figure3) Full - 17 30 ns Driver Enable to Output Low tZL CL = 100pF, SW = VCC, (Figure3) Full - 14 30 ns Driver Disable from Output High tHZ CL = 15pF, SW = GND, (Figure3) Full - 19 30 ns Driver Disable from Output Low tLZ CL = 15pF, SW = VCC, (Figure3) Full - 13 30 ns Driver Maximum Data Rate fMAXD VOD ≥ 1.5V, (Figure4, Note9) Full 20 - - Mbps Receiver Input to Output Delay tPLH, tPHL Figure 5 Full 20 40 70 ns Receiver Skew | tPLH - tPHL | tSKD Figure 5 Full - 3 10 ns Receiver Enable to Output High tZH CL = 15pF, SW = GND, (Figure6) Full - 9 25 ns Receiver Enable to Output Low tZL CL = 15pF, SW = VCC, (Figure6) Full - 9 25 ns Receiver Disable from Output High tHZ CL = 15pF, SW = GND, (Figure6) Full - 9 25 ns Receiver Disable from Output Low tLZ CL = 15pF, SW = VCC, (Figure6) Full - 9 25 ns Receiver Maximum Data Rate fMAXR CL = 15pF, VID ≥ 1.5V (Note9) Full 20 - - Mbps ESD PERFORMANCE RS-485 Pins (A/Y, B/Z) Human Body Model 25 - ±15 - kV All Other Pins 25 - >±7 - kV NOTE: 5. All currents into device pins are positive; all currents out of device pins are negative. All voltages are referenced to device ground unless otherwise specified. 6. Supply current specification is valid for loaded drivers when DE = 0V. 7. Applies to peak current. See “Typical Performance Curves” for more information. 8. Devices meeting these limits are denoted as “single unit load (1 UL)” transceivers. The RS-485 standard allows up to 32 unit loads on the bus. 9. Guaranteed by characterization, but not tested. Test Circuits and Waveforms R DE VCC Z DI D VOD Y R VOC FIGURE 1. DRIVER VOD AND VOC FN6049 Rev 4.00 Page 4 of 13 Oct 8, 2018

ISL4485E Test Circuits and Waveforms (Continued) 3V DI 1.5V 1.5V 0V tPLH tPHL VOH CL = 100pF OUT (Y) 50% 50% DE VCC VOL DI Z D RDIFF tPHL tPLH Y CL = 100pF VOH OUT (Z) 50% 50% SIGNAL GENERATOR VOL 90% 90% +VOD DIFF OUT (Y - Z) 10% 10% -VOD tR tF SKEW = |CROSSING PT. OF Y & Z - CROSSING PT. OF Y & Z FIGURE 2A. TEST CIRCUIT FIGURE 2B. MEASUREMENT POINTS FIGURE 2. DRIVER PROPAGATION DELAY AND DIFFERENTIAL TRANSITION TIMES DE 3V DE 1.5V 1.5V DI Z 500Ω VCC D 0V SGIEGNNEARLATOR Y CL SW GND tZH OUTPUT HIGH tHZ VOH - 0.5V VOH OUT (Y, Z) 2.3V 0V PARAMETER OUTPUT RE DI SW CL (pF) tHZ Y/Z X 1/0 GND 15 tZL tLZ tLZ Y/Z X 0/1 VCC 15 VCC tZH Y/Z X 1/0 GND 100 OUT (Y, Z) 2.3V tZL Y/Z X 0/1 VCC 100 VOL + 0.5V VOL OUTPUT LOW FIGURE 3A. TEST CIRCUIT FIGURE 3B. MEASUREMENT POINTS FIGURE 3. DRIVER ENABLE AND DISABLE TIMES FN6049 Rev 4.00 Page 5 of 13 Oct 8, 2018

ISL4485E Test Circuits and Waveforms (Continued) 3V DI DE 0V VCC + DI Z D 60Ω CD = 200pF VOD Y - DIFF OUT (Y - Z) -VOD +VOD 0V SIGNAL GENERATOR FIGURE 4A. TEST CIRCUIT FIGURE 4B. MEASUREMENT POINTS FIGURE 4. DRIVER DATA RATE RE 3V B 15pF A 1.5V 1.5V +1.5V RO A R 0V tPLH tPHL SIGNAL VCC GENERATOR RO 50% 50% 0V FIGURE 5A. TEST CIRCUIT FIGURE 5B. MEASUREMENT POINTS FIGURE 5. RECEIVER PROPAGATION DELAY RE 3V B R RO 1kΩ VCC RE 1.5V 1.5V SIGNAL SW GND 0V A GENERATOR 15pF tZH tHZ OUTPUT HIGH VOH - 0.5V VOH RO 1.5V 0V PARAMETER DE A SW tHZ 0 +1.5V GND tZL tLZ tLZ 0 -1.5V VCC VCC tZH 0 +1.5V GND RO 1.5V tZL 0 -1.5V VCC VOL + 0.5V VOL OUTPUT LOW FIGURE 6A. TEST CIRCUIT FIGURE 6B. MEASUREMENT POINTS FIGURE 6. RECEIVER ENABLE AND DISABLE TIMES FN6049 Rev 4.00 Page 6 of 13 Oct 8, 2018

ISL4485E Application Information RS-485/422 are intended for network lengths up to 4000ft, but the maximum transmission length decreases as the data rate RS-485 and RS-422 are differential (balanced) data increases. According to guidelines in the RS-422 specification, transmission standards for use in long haul or noisy a 20Mbps network should be limited to less than 50ft of environments. RS-422 is a subset of RS-485, so RS-485 24AWG twisted pair. However, the ISL4485E's large transceivers are also RS-422 compliant. RS-422 is a differential voltage swing, fast transition times, and high point-to-multipoint (multidrop) standard that allows only one drive-current output stages allow operation at 20Mbps in driver and up to 10 receivers on each bus (assuming one unit RS-485/422 networks as long as 450ft. Figure7 on page8 load devices). RS-485 is a true multipoint standard that allows details ISL4485E operation at 20Mbps driving 300ft of CAT 5 up to 32 one unit load devices (any combination of drivers and cable terminated in 120Ω at the driver and the receiver (that is, receivers) on each bus. To allow for multipoint operation, the double terminated). The acceptance criteria for this test was RS-485 specification requires that drivers must handle bus the ability of the driver to deliver a 1.5V differential signal to the contention without sustaining any damage. receiver at the end of the cable (|A-B| ≥ 1.5V). If a more liberal An important advantage of RS-485 is the extended acceptance criteria is used, the distance can be further Common-Mode Range (CMR). The CMR specifies that the extended. For example, Figure8 on page8 illustrates the driver outputs and receiver inputs withstand signals that range performance in the same configuration but with a cable length from +12V to -7V. RS-422 and RS-485 are intended for runs as of 450ft and an acceptance criteria of no more than 6dB long as 4000ft, so the wide CMR is necessary to handle attenuation across the cable (|A-B| = |Y-Z|/2). ground potential differences and voltages induced in the cable Driver differential output voltage decreases with increasing by external fields. differential load capacitance, so maintaining a 1.5V differential Receiver Features output requires a data rate reduction as shown in Figure9 on The ISL4485E uses a differential input receiver for maximum page8. noise immunity and common-mode rejection. Input sensitivity is To minimize reflections, proper termination is imperative when 200mV, as required by the RS-422 and RS-485 specifications. using this 20Mbps device. In point-to-point or Receiver input impedance surpasses the RS-422 specification point-to-multipoint (single driver on bus) networks, terminate of 4kΩ and meets the RS-485 unit load requirement of 12kΩ the main cable in its characteristic impedance (typically 120Ω) minimum. at the end farthest from the driver. In multi-receiver applications, keep stubs connecting receivers to the main Receiver inputs function with common-mode voltages as great cable as short as possible (preferably less than 12in). as 7V outside the power supplies (+12V and -7V), making Multipoint (multi-driver) systems require that the main cable be them ideal for long networks in which induced voltages are a terminated in its characteristic impedance at both ends. Keep realistic concern. stubs connecting a transceiver to the main cable as short as The receiver includes a “fail-safe if open” function that possible. guarantees a high level receiver output if the receiver inputs Built-In Driver Overload Protection are unconnected (floating). The output is three-statable using The RS-485 specification requires that drivers survive worst the active low RE input, and the receiver meets the 20Mbps case bus contentions undamaged. The ISL4485E device data rate. meets this requirement with driver output short-circuit current Driver Features limits and on-chip thermal shutdown circuitry. The RS-485/422 driver is a differential output device that The driver output stages incorporate short-circuit current delivers at least 1.5V across a 54Ω load (RS-485) and at least limiting circuitry, ensuring that the output current never 2V across a 100Ω load (RS-422). The ISL4485E driver exceeds the RS-485 specification even at the common-mode features low propagation delay skew to maximize bit width and voltage range extremes. These devices also use a foldback to minimize EMI, and the outputs are three-statable using the circuit that reduces the short-circuit current (and the power active high DE input. dissipation) when the contending voltage exceeds either The ISL4485E driver outputs are not slew rate limited, so faster supply. output transition times allow data rates up to 20Mbps. In the event of a major short-circuit condition, this device’s Data Rate, Cables, and Terminations thermal shutdown feature disables the drivers whenever the die temperature becomes excessive. This eliminates the power Twisted pair cable is the cable of choice for RS-485/422 dissipation, allowing the die to cool. The drivers automatically networks. Twisted pair cables pick up noise and other reenable after the die temperature drops about 15°C. If the electromagnetically induced voltages as common-mode condition persists, the thermal shutdown/reenable cycle signals that are effectively rejected by the differential receivers repeats until the fault is cleared. Receivers stay operational in these ICs. during thermal shutdown. FN6049 Rev 4.00 Page 7 of 13 Oct 8, 2018

ISL4485E ESD Protection protection structures (for example, transient suppression diodes) and the associated undesirable capacitive load that All pins on these interface devices include class 3 Human they cause. Body Model (HBM) ESD protection structures, but the RS-485 pins (driver outputs and receiver inputs) incorporate advanced Human Body Model Testing structures allowing them to survive ESD events in excess of This test method emulates the ESD event delivered to an IC 15kV HBM. The RS-485 pins are particularly vulnerable to during human handling. The tester delivers the charge stored ESD damage because they typically connect to an exposed on a 100pF capacitor through a 1.5kΩ current limiting resistor port on the exterior of the finished product. Simply touching the into the pin under test. The HBM method determines an IC’s port pins or connecting a cable can cause an ESD event that ability to withstand the ESD events typically present during destroys unprotected ICs. The ISL4485E ESD structures handling and manufacturing. protect the device whether or not it is powered up, protect without allowing any latchup mechanism to activate, and The RS-485 pin survivability on this high ESD device has been without degrading the RS-485 CMR of -7V to +12V. This characterized to be in excess of 15kV, for discharges to GND. built-in ESD protection eliminates the need for board level Typical Performance Curves VCC = 5V, TA = 25oC, Unless Otherwise Specified T (V) DI 5UT (V) T (V) DI 5UT (V) U P U P UTP 0R IN UTP 0R IN O E O E ER 5 RIV ER 5 RIV V RO D V RO D EI 0 EI 0 C C E E R R DRIVER+CABLE DELAY (~450ns) DRIVER+CABLE DELAY (~650ns) V) 3 V) 3 T ( T ( U 1.5 U 1.5 P P N N R I 0 R I 0 VE A - B VE A - B EI-1.5 EI-1.5 C C E E R -3 R -3 TIME (20ns/DIV) TIME (20ns/DIV) FIGURE 7. DRIVER AND RECEIVER WAVEFORMS DRIVING FIGURE 8. DRIVER AND RECEIVER WAVEFORMS DRIVING 300FT OF CABLE (DOUBLE TERMINATED) 450FT OF CABLE (DOUBLE TERMINATED) 30 750 RDIFF = 54Ω 700 25 DE = VCC, RE = X 650 s) 20 p b M 600 A RATE ( 15 I (A)CC550 T A 10 D 500 DE = GND, RE = X 5 450 0 400 5001000 2000 3000 4000 5000 6000 7000 8000 9000 10000 -40 -25 0 25 50 75 85 DIFFERENTIAL CAPACITANCE (pF) TEMPERATURE (°C) FIGURE 9. DATA RATE vs DIFFERENTIAL CAPACITANCE FIGURE 10. SUPPLY CURRENT vs TEMPERATURE FN6049 Rev 4.00 Page 8 of 13 Oct 8, 2018

ISL4485E Typical Performance Curves (Continued) VCC = 5V, TA = 25oC, Unless Otherwise Specified 90 3.6 80 3.4 V) mA) 70 GE ( 3.2 RDIFF = 100Ω NT ( 60 LTA E O 3 R V CUR 50 PUT 2.8 UT 40 UT UTP 30 AL O 2.6 ER O 20 ENTI 2.4 RDIFF = 54Ω V R RI E D 10 F 2.2 F DI 0 2 0 1 2 3 4 5 -40 -25 0 25 50 75 85 DIFFERENTIAL OUTPUT VOLTAGE (V) TEMPERATURE (°C) FIGURE 11. DRIVER OUTPUT CURRENT vs DIFFERENTIAL FIGURE 12. DRIVER DIFFERENTIAL OUTPUT VOLTAGE vs OUTPUT VOLTAGE TEMPERATURE 40 3 ns) 35 2.5 Y ( tPHLY - tPLHZ LA tPHLY E D TION 30 tPHLZ tPLHZ ns) 2 tPLHY - tPHLZ GA W ( PA tPLHY KE O S R 25 1.5 P CROSSING PT. OF Y & Z - CROSSING PT. OF Y & Z 25 1 -40 -25 0 25 50 75 85 -40 -25 0 25 50 75 85 TEMPERATURE (°C) TEMPERATURE (°C) FIGURE 13. DRIVER PROPAGATION DELAY vs FIGURE 14. DRIVER SKEW vs TEMPERATURE TEMPERATURE FN6049 Rev 4.00 Page 9 of 13 Oct 8, 2018

ISL4485E Typical Performance Curves (Continued) VCC = 5V, TA = 25oC, Unless Otherwise Specified OUTPUT (V) DI RDIFF = 54Ω, CL = 100pF 05 ER INPUT (V) OUTPUT (V) DI RDIFF = 54Ω, CL = 100pF 05 ER INPUT (V) VER 5 RO DRIV VER 5 RO DRIV EI 0 EI 0 C C E E R R V) 4 V) 4 T ( B/Z T ( A/Y U 3 U 3 P P T T OU 2 A/Y OU 2 B/Z R R E 1 E 1 V V RI RI D 0 D 0 TIME (10ns/DIV) TIME (10ns/DIV) FIGURE 15. DRIVER AND RECEIVER WAVEFORMS, FIGURE 16. DRIVER AND RECEIVER WAVEFORMS, LOW TO HIGH HIGH TO LOW 160 140 120 Y OR Z = LOW 100 A) 80 m 60 T ( N 40 E R 20 R U 0 C T -20 PU Y OR Z = HIGH T -40 U O -60 -80 -100 -120 -7 -6 -4 -2 0 2 4 6 8 10 12 OUTPUT VOLTAGE (V) FIGURE 17. DRIVER OUTPUT CURRENT vs SHORT-CIRCUIT VOLTAGE Die Characteristics SUBSTRATE POTENTIAL (POWERED UP): GND TRANSISTOR COUNT: 518 PROCESS: Si Gate CMOS FN6049 Rev 4.00 Page 10 of 13 Oct 8, 2018

ISL4485E Revision History The revision history provided is for informational purposes only and is believed to be accurate, but not warranted. Please visit our website to make sure you have the latest revision. DATE REVISION CHANGE Oct 8, 2018 FN6049.4 Updated typical operating circuit on page 1. Added Related Literature section to page 1. Removed ISL4485EIB and ISL4485EIB-T from ordering information table on page 2. Added Tape and Reel column and Notes 1, 2, and 3 to ordering information table on page 2. Removed Intersil copyright information and added Renesas disclaimer. Added Revision History to page 11. Updated package outline drawing from revision 0 to revision 4. Changes between revisions: -Revision 1: Initial revision -Revision 1 to revision 2: Updated to new package outline drawing format by removing table, moving dimensions onto drawing, and adding land pattern -Revision 2 to revision 3: Changed the following values in Typical Recommended Landing Pattern: 2.41(0.095) to 2.20 (0.087) 0.76(0.030) to 0.60(0.023) 0.200 to 5.20(0.205) -Revision 3 to revision 4: Changed text in Note 1 from “1982” to “1994” FN6049 Rev 4.00 Page 11 of 13 Oct 8, 2018

ISL4485E Package Outline Drawing For the most recent package outline drawing, see M8.15. M8.15 8 LEAD NARROW BODY SMALL OUTLINE PLASTIC PACKAGE Rev 4, 1/12 DETAIL "A" 1.27 (0.050) 0.40 (0.016) INDEX 6.20 (0.244) AREA 5.80 (0.228) 0.50 (0.20) x 45° 4.00 (0.157) 0.25 (0.01) 3.80 (0.150) 8° 1 2 3 0° 0.25 (0.010) 0.19 (0.008) TOP VIEW SIDE VIEW “B” 2.20 (0.087) 1 8 SEATING PLANE 0.60 (0.023) 5.00 (0.197) 1.75 (0.069) 2 7 4.80 (0.189) 1.35 (0.053) 1.27 (0.050) 3 6 -C- 4 5 1.27 (0.050) 0.25(0.010) 0.10(0.004) 0.51(0.020) 5.20(0.205) 0.33(0.013) SIDE VIEW “A TYPICAL RECOMMENDED LAND PATTERN NOTES: 10. Dimensioning and tolerancing per ANSI Y14.5M-1994. 11. Package length does not include mold flash, protrusions or gate burrs. Mold flash, protrusion and gate burrs shall not exceed 0.15mm (0.006 inch) per side. 12. Package width does not include interlead flash or protrusions. Interlead flash and protrusions shall not exceed 0.25mm (0.010 inch) per side. 13. The chamfer on the body is optional. If it is not present, a visual index feature must be located within the crosshatched area. 14. Terminal numbers are shown for reference only. 15. The lead width as measured 0.36mm (0.014 inch) or greater above the seating plane, shall not exceed a maximum value of 0.61mm (0.024 inch). 16. Controlling dimension: MILLIMETER. Converted inch dimensions are not necessarily exact. 17. This outline conforms to JEDEC publication MS-012-AA ISSUE C. FN6049 Rev 4.00 Page 12 of 13 Oct 8, 2018

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"Standard": Computers; office equipment; communications equipment; test and measurement equipment; audio and visual equipment; home electronic appliances; machine tools; personal electronic equipment; industrial robots; etc. "High Quality": Transportation equipment (automobiles, trains, ships, etc.); traffic control (traffic lights); large-scale communication equipment; key financial terminal systems; safety control equipment; etc. Unless expressly designated as a high reliability product or a product for harsh environments in a Renesas Electronics data sheet or other Renesas Electronics document, Renesas Electronics products are not intended or authorized for use in products or systems that may pose a direct threat to human life or bodily injury (artificial life support devices or systems; surgical implantations; etc.), or may cause serious property damage (space system; undersea repeaters; nuclear power control systems; aircraft control systems; key plant systems; military equipment; etc.). Renesas Electronics disclaims any and all liability for any damages or losses incurred by you or any third parties arising from the use of any Renesas Electronics product that is inconsistent with any Renesas Electronics data sheet, user’s manual or other Renesas Electronics document. 6. When using Renesas Electronics products, refer to the latest product information (data sheets, user’s manuals, application notes, “General Notes for Handling and Using Semiconductor Devices” in the reliability handbook, etc.), and ensure that usage conditions are within the ranges specified by Renesas Electronics with respect to maximum ratings, operating power supply voltage range, heat dissipation characteristics, installation, etc. Renesas Electronics disclaims any and all liability for any malfunctions, failure or accident arising out of the use of Renesas Electronics products outside of such specified ranges. 7. Although Renesas Electronics endeavors to improve the quality and reliability of Renesas Electronics products, semiconductor products have specific characteristics, such as the occurrence of failure at a certain rate and malfunctions under certain use conditions. Unless designated as a high reliability product or a product for harsh environments in a Renesas Electronics data sheet or other Renesas Electronics document, Renesas Electronics products are not subject to radiation resistance design. You are responsible for implementing safety measures to guard against the possibility of bodily injury, injury or damage caused by fire, and/or danger to the public in the event of a failure or malfunction of Renesas Electronics products, such as safety design for hardware and software, including but not limited to redundancy, fire control and malfunction prevention, appropriate treatment for aging degradation or any other appropriate measures. Because the evaluation of microcomputer software alone is very difficult and impractical, you are responsible for evaluating the safety of the final products or systems manufactured by you. 8. Please contact a Renesas Electronics sales office for details as to environmental matters such as the environmental compatibility of each Renesas Electronics product. You are responsible for carefully and sufficiently investigating applicable laws and regulations that regulate the inclusion or use of controlled substances, including without limitation, the EU RoHS Directive, and using Renesas Electronics products in compliance with all these applicable laws and regulations. Renesas Electronics disclaims any and all liability for damages or losses occurring as a result of your noncompliance with applicable laws and regulations. 9. Renesas Electronics products and technologies shall not be used for or incorporated into any products or systems whose manufacture, use, or sale is prohibited under any applicable domestic or foreign laws or regulations. You shall comply with any applicable export control laws and regulations promulgated and administered by the governments of any countries asserting jurisdiction over the parties or transactions. 10. It is the responsibility of the buyer or distributor of Renesas Electronics products, or any other party who distributes, disposes of, or otherwise sells or transfers the product to a third party, to notify such third party in advance of the contents and conditions set forth in this document. 11. This document shall not be reprinted, reproduced or duplicated in any form, in whole or in part, without prior written consent of Renesas Electronics. 12. Please contact a Renesas Electronics sales office if you have any questions regarding the information contained in this document or Renesas Electronics products. (Note 1) “Renesas Electronics” as used in this document means Renesas Electronics Corporation and also includes its directly or indirectly controlled subsidiaries. (Note 2) “Renesas Electronics product(s)” means any product developed or manufactured by or for Renesas Electronics. (Rev.4.0-1 November 2017) SALES OFFICES http://www.renesas.com Refer to "http://www.renesas.com/" for the latest and detailed information. Renesas Electronics Corporation TOYOSU FORESIA, 3-2-24 Toyosu, Koto-ku, Tokyo 135-0061, Japan Renesas Electronics America Inc. 1001 Murphy Ranch Road, Milpitas, CA 95035, U.S.A. Tel: +1-408-432-8888, Fax: +1-408-434-5351 Renesas Electronics Canada Limited 9251 Yonge Street, Suite 8309 Richmond Hill, Ontario Canada L4C 9T3 Tel: +1-905-237-2004 Renesas Electronics Europe Limited Dukes Meadow, Millboard Road, Bourne End, Buckinghamshire, SL8 5FH, U.K Tel: +44-1628-651-700 Renesas Electronics Europe GmbH Arcadiastrasse 10, 40472 Düsseldorf, Germany Tel: +49-211-6503-0, Fax: +49-211-6503-1327 Renesas Electronics (China) Co., Ltd. Room 1709 Quantum Plaza, No.27 ZhichunLu, Haidian District, Beijing, 100191 P. R. China Tel: +86-10-8235-1155, Fax: +86-10-8235-7679 Renesas Electronics (Shanghai) Co., Ltd. Unit 301, Tower A, Central Towers, 555 Langao Road, Putuo District, Shanghai, 200333 P. R. China Tel: +86-21-2226-0888, Fax: +86-21-2226-0999 Renesas Electronics Hong Kong Limited Unit 1601-1611, 16/F., Tower 2, Grand Century Place, 193 Prince Edward Road West, Mongkok, Kowloon, Hong Kong Tel: +852-2265-6688, Fax: +852 2886-9022 Renesas Electronics Taiwan Co., Ltd. 13F, No. 363, Fu Shing North Road, Taipei 10543, Taiwan Tel: +886-2-8175-9600, Fax: +886 2-8175-9670 Renesas Electronics Singapore Pte. Ltd. 80 Bendemeer Road, Unit #06-02 Hyflux Innovation Centre, Singapore 339949 Tel: +65-6213-0200, Fax: +65-6213-0300 Renesas Electronics Malaysia Sdn.Bhd. Unit 1207, Block B, Menara Amcorp, Amcorp Trade Centre, No. 18, Jln Persiaran Barat, 46050 Petaling Jaya, Selangor Darul Ehsan, Malaysia Tel: +60-3-7955-9390, Fax: +60-3-7955-9510 Renesas Electronics India Pvt. Ltd. No.777C, 100 Feet Road, HAL 2nd Stage, Indiranagar, Bangalore 560 038, India Tel: +91-80-67208700, Fax: +91-80-67208777 Renesas Electronics Korea Co., Ltd. 17F, KAMCO Yangjae Tower, 262, Gangnam-daero, Gangnam-gu, Seoul, 06265 Korea Tel: +82-2-558-3737, Fax: +82-2-558-5338 © 2018 Renesas Electronics Corporation. All rights reserved. Colophon 7.2