DATASHEET ISL29029 FN7682 Low Power Ambient Light and Proximity Sensor with Intelligent Interrupt and Rev 0.00 Sleep Modes November 23, 2010 The ISL29029 is an integrated ambient and infrared light-to- Features digital converter with a built-in IR LED driver and I2C Interface (SMBus Compatible). This device uses two independent ADCs • Works Under All Light Sources Including Sunlight for concurrently measuring ambient light and proximity in • Dual ADCs Measure ALS/Prox Concurrently parallel. The flexible interrupt scheme is designed for minimal • Intelligent Interrupt Scheme Simplifies μC Code microcontroller utilization. • 0.5% Typical Nonlinearity For ambient light sensor (ALS) data conversions, an ADC Ambient Light Sensing converts photodiode current (with a light sensitivity range up to 2000 Lux) in 100ms per sample. The ADC rejects 50Hz/60Hz • Simple Output Code Directly Proportional to lux flicker noise caused by artificial light sources. • 50Hz/60Hz Flicker Noise and IR Rejection • Light Sensor Close to Human Eye Response For proximity sensor (PROX) data conversions, the built-in driver turns on an external infrared LED and the proximity • Selectable 125/2000 Lux Range sensor ADC converts the reflected IR intensity to digital. This Proximity Sensing ADC rejects ambient IR noise (such as sunlight) and has a • Proximity Sensor with Broad IR Spectrum 540μs conversion time. - Can Use 850nm and 950nm External IR LEDs The ISL29029 provides low power operation of ALS and PROX • IR LED Driver with I2C Programmable Sink Currents sensing with a typical 138μA normal operation current (110μA for - Net 100μs Pulse with 110mA or 220mA Amplitudes sensors and internal circuitry, ~28μA for external LED) with - Periodic Sleep Time up to 800ms Between Pulses 220mA current pulses for a net 100μs, repeating every 800ms • Ambient IR Noise Cancellation (Including Sunlight) (or under). Intelligent and Flexible Interrupts The ISL29029 uses both a hardware pin and software bits to • Independent ALS/PROX Interrupt Thresholds indicate an interrupt event has occurred. An ALS or PROX • Adjustable Interrupt Persistency interrupt is defined as a measurement which is outside a set - 1/4/8/16 Consecutive Triggers Required Before Interrupt window. The user may also require that both ALS/PROX interrupts occur at once, up to 16 times in a row before Ultra Low Power activating the interrupt pin. • 138μA DC Typical Supply Current for ALS/Prox Sensing - 110μA for Sensors and Internal Circuitry The ISL29029 is designed to operate from 2.25V to 3.63V over - 28μA Typical Current for External IR LED (Assuming the -40°C to +85°C ambient temperature range. It is packaged in 220mA for 100μs Every 800ms) a clear, lead-free 8lead ODFN package. • <1.0μA Supply Current When Powered Down Applications Easy to Use • Display and Keypad Dimming Adjustment and Proximity • Set Registers; Wait for Interrupt Sensing for: • I2C (SMBus Compatible) Output - Mobile Devices: Smart Phone, PDA, GPS • Temperature Compensated - Computing Devices: Laptop PC, Netbook • Tiny ODFN8 2.0x2.1x0.7 (mm) Package - Consumer Devices: LCD-TV, Digital Picture Frame, Digital Additional Features Camera • 1.7V to 3.63V Supply for I2C Interface • Industrial and Medical Light and Proximity Sensing • 2.25V to 3.63V Sensor Power Supply • Pb-Free (RoHS compliant) • I2C Address Selection Pin FN7682 Rev 0.00 Page 1 of 16 November 23, 2010

ISL29029 Block Diagram VDD 2 ALS PHOTODIODE ARRAY COMMAND REGISTER LIGHT DATA DUAL CHANNEL PROCESS DATA ALS AND IR ADCs REGISTER 1 ADDR0 IR PHOTODIODE I2C 5 SCL ARRAY 6 SDA IREF INTERRUPT 7 INT FOSC IR DRIVER 8 IRDR 4 3 REXT GND Pin Configuration Pin Descriptions ISL29029 8 LD ODFN (2.0x2.1x0.7mm) PIN PIN TOP VIEW NUMBER NAME DESCRIPTION ADDR0 1 8 IRDR 0 T.PAD Thermal Pad (connect to GND or float) 1 ADDR0 I2C address pin - pull high or low (do not float) VDD 2 7 INT THERMAL PAD 2 VDD Positive supply: 2.25V to 3.63V GND 3 6 SDA 3 GND Ground REXT 4 5 SCL 4 REXT External resistor (499k; 1%) connects this pin to ground *THERMAL PAD CAN BE CONNECTED TO GND OR ELECTRICALLY ISOLATED 5 SCL I2C clock The I2C bus lines can be pulled line from 1.7V to above VDD, 3.63V max 6 SDA I2C data line 7 INT Interrupt pin; Logic output (open-drain) for interrupt 8 IRDR IR LED driver pin - current flows into ISL29029 from LED cathode Ordering Information PACKAGE PART NUMBER TEMP. RANGE Tape & Reel PKG. (Notes 1, 2, 3) (°C) (Pb-free) DWG. # ISL29029IROZ-T7 -40 to +85 8 Ld ODFN L8.2.1x2.0 NOTES: 1. Please refer to TB347 for details on reel specifications. 2. These Intersil Pb-free plastic packaged products employ special Pb-free material sets; molding compounds/die attach materials and NiPdAu plate - e4 termination finish, which is RoHS compliant and compatible with both SnPb and Pb-free soldering operations. Intersil Pb-free products are MSL classified at Pb-free peak reflow temperatures that meet or exceed the Pb-free requirements of IPC/JEDEC J STD-020. 3. For Moisture Sensitivity Level (MSL), please see device information page for ISL29029. For more information on MSL please see techbrief TB363. FN7682 Rev 0.00 Page 2 of 16 November 23, 2010

ISL29029 Absolute Maximum Ratings (TA = +25°C) Thermal Information VDD Supply Voltage between VDD and GND . . . . . . . . . . . . . . . . . . . . . .4.0V Thermal Resistance (Typical) JA (°C/W) JC (°C/W) I2C Bus Pin Voltage (SCL, SDA). . . . . . . . . . . . . . . . . . . . . . . . . -0.5V to 4.0V 8 Ld ODFN Package (Notes 4, 5) . . . . . . . . 88 10 I2C Bus Pin Current (SCL, SDA). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . <10mA Maximum Die Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .+90°C REXT Pin Voltage. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .-0.5V to VDD+0.5V Storage Temperature. . . . . . . . . . . . . . . . . . . . . . . . . . . . . .-40°C to +100°C IRDR Pin Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .5.5V Operating Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . .-40°C to +85°C ADDR0 Pin Voltage. . . . . . . . . . . . . . . . . . . . . . . . . . . . . .-0.5V to VDD+0.5V Pb-Free Reflow Profile . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . see link below INT Pin Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.5V to 4.0V http://www.intersil.com/pbfree/Pb-FreeReflow.asp INT Pin Current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . <10mA ESD Rating Human Body Model (Note 6). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2kV CAUTION: Do not operate at or near the maximum ratings listed for extended periods of time. Exposure to such conditions may adversely impact product reliability and result in failures not covered by warranty. NOTES: 4. JA is measured in free air with the component mounted on a high effective thermal conductivity test board with “direct attach” features. See Tech Brief TB379. 5. For JC, the “case temp” location is the center of the exposed metal pad on the package underside. 6. ESD on all pins is 2kV except for IRDR, which is 1.5kV. IMPORTANT NOTE: All parameters having Min/Max specifications are guaranteed. Typical values are for information purposes only. Unless otherwise noted, all tests are at the specified temperature and are pulsed tests, therefore: TJ = TC = TA Electrical Specifications VDD = 3.0V, TA = +25°C, REXT = 499k1% tolerance. PARAMETER DESCRIPTION CONDITION MIN TYP MAX UNIT VDD Power Supply Range 2.25 3.0 3.63 V SR_VDD Input Power-up Slew Rate VDD Rising Edge between 0.4V and 2.25V 0.5 V/ms IDD_OFF Supply Current when Powered Down ALS_EN = 0; PROX_EN = 0 0.1 0.8 µA IDD_NORM Supply Current for ALS+Prox in Sleep Time ALS_EN = 1; PROX_EN = 1 110 125 µA IDD_PRX_SLP Supply Current for Prox in Sleep Time ALS_EN = 0; PROX_EN = 1 80 µA IDD_ALS Supply Current for ALS ALS_EN = 1; PROX_EN = 0 96 µA fOSC Internal Oscillator Frequency 5.25 MHz tINTGR_ALS 12-bit ALS Integration/Conversion Time 88 100 112 ms tINTGR_PROX 8-bit Prox Integration/Conversion Time 0.54 ms Linearity ALS_1Nonlinearity EAMBIENT = 0, 53, 90 Lux; ALS_RANGE =0 (Notes -6 0.5 +6 % 7, 11) DATAALS_0 ALS Result when Dark EAMBIENT = 0 lux, 2k Range 1 3 Counts DATAALS_F Full Scale ALS ADC Code EAMBIENT > Selected Range Maximum Lux (Note 4095 Counts 11) ΔDATA Count Output Variation Over Three Light Sources: Ambient Light Sensing ±10 % DATA Fluorescent, Incandescent and Sunlight DATAALS_1 Light Count Output with LSB of 0.0326Lux/Count E = 53 lux, Fluorescent (Note 8), 1638 Counts ALS_RANGE = 0 DATAALS_2 Light Count Output With LSB of 0.522Lux/Count E = 320 lux, Fluorescent (Notes 8, 11), 503 614 725 Counts ALS_RANGE = 1 DATAPROX_0 Prox Measurement w/o Object in Path 1 2 Counts DATAPROX_F Full Scale Prox ADC Code 255 Counts DATAPROX_1 Prox Measurement Result (Note 9) 34 46 58 Counts tr Rise Time for IRDR Sink Current RLOAD = 15 at IRDR pin, 20% to 80% 500 ns tf Fall time for IRDR Sink Current RLOAD = 15 at IRDR pin, 80% to 20% 500 ns FN7682 Rev 0.00 Page 3 of 16 November 23, 2010

ISL29029 Electrical Specifications VDD = 3.0V, TA = +25°C, REXT = 499k1% tolerance. (Continued) PARAMETER DESCRIPTION CONDITION MIN TYP MAX UNIT IIRDR_0 IRDR Sink Current PROX_DR = 0; VIRDR = 0.5V 90 110 130 mA IIRDR_1 IRDR Sink Current PROX_DR = 1; VIRDR = 0.5V 220 mA IIRDR_LEAK IRDR Leakage Current PROX_EN = 0; VDD = 3.63V (Note 10) 0.001 1 µA VIRDR Acceptable Voltage Range on IRDR Pin Register bit PROX_DR = 0 0.5 4.3 V tPULSE Net IIRDR On Time Per PROX Reading 100 µs VREF Voltage of REXT Pin 0.51 V FI2C I2C Clock Rate Range 400 kHz VI2C Supply Voltage Range for I2C Interface 1.7 3.63 V VIL SCL and SDA Input Low Voltage 0.55 V VIH SCL and SDA Input High Voltage 1.25 V ISDA SDA Current Sinking Capability VOL = 0.4V 3 5 mA IINT INT Current Sinking Capability VOL = 0.4V 3 5 mA PSRRIRDR (IIRDR)/(VIRDR) PROX_DR = 0; VIRDR = 0.5V to 4.3V 4 mA/V NOTES: 7. Nonlinearity is defined as: [(Measured Counts at 53 lux)-(Expected Counts at 53 lux)]/4095. Expected counts are calculated using an endpoint linear- fit trendline from measurements at 0 lux and 90 lux. 8. An LED is used in production test. The LED irradiance is calibrated to produce the same DATA count against a fluorescent light source of the same lux level. 9. An 850nm infrared LED is used to test PROX/IR sensitivity in an internal test mode. 10. Ability to guarantee IIRDR leakage of ~1nA is limited by test hardware. 11. For ALS applications under light-distorting glass, please see the section titled ALS Range 1 Considerations. I2C Electrical Specifications For SCL and SDA unless otherwise noted, VDD = 3V, TA = +25°C, REXT = 499k 1% tolerance (Note12). PARAMETER DESCRIPTION CONDITION MIN TYP MAX UNIT VI2C Supply Voltage Range for I2C Interface 1.7 3.63 V fSCL SCL Clock Frequency 400 kHz VIL SCL and SDA Input Low Voltage 0.55 V VIH SCL and SDA Input High Voltage 1.25 V Vhys Hysteresis of Schmitt Trigger Input 0.05VDD V VOL Low-level output voltage (open-drain) at 4mA sink 0.4 V current Ii Input Leakage for each SDA, SCL pin -10 10 µA tSP Pulse width of spikes that must be suppressed by 50 ns the input filter tAA SCL Falling Edge to SDA Output Data Valid 900 ns Ci Capacitance for each SDA and SCL pin 10 pF tHD:STA Hold Time (Repeated) START Condition After this period, the first clock pulse is 600 ns generated tLOW LOW Period of the SCL clock Measured at the 30% of VDD crossing 1300 ns tHIGH HIGH period of the SCL Clock 600 ns tSU:STA Set-up Time for a Repeated START Condition 600 ns tHD:DAT Data Hold Time 30 ns FN7682 Rev 0.00 Page 4 of 16 November 23, 2010

ISL29029 I2C Electrical Specifications For SCL and SDA unless otherwise noted, VDD = 3V, TA = +25°C, REXT = 499k 1% tolerance (Note12). (Continued) PARAMETER DESCRIPTION CONDITION MIN TYP MAX UNIT tSU:DAT Data Set-up Time 100 ns tR Rise Time of both SDA and SCL Signals (Note 13) 20 + 0.1xCb ns tF Fall Time of both SDA and SCL Signals (Note 13) 20 + 0.1xCb ns tSU:STO Set-up Time for STOP Condition 600 ns tBUF Bus Free Time Between a STOP and START 1300 ns Condition Cb Capacitive Load for Each Bus Line 400 pF Rpull-up SDA and SCL system bus pull-up resistor Maximum is determined by tR and tF 1 k tVD;DAT Data Valid Time 0.9 µs tVD:ACK Data Valid Acknowledge Time 0.9 µs VnL Noise Margin at the LOW Level 0.1VDD V VnH Noise Margin at the HIGH Level 0.2VDD V NOTES: 12. All parameters in I2C Electrical Specifications table are guaranteed by design and simulation. 13. Cb is the capacitance of the bus in pF. FIGURE 1. I2C TIMING DIAGRAM FN7682 Rev 0.00 Page 5 of 16 November 23, 2010

ISL29029 Register Map There are ten 8-bit registers accessible via I2C. Registers 0x1 and 0x2 define the operation mode of the device. Registers 0x3 through 0x7 store the various ALS/IR/Prox thresholds which trigger interrupt events. Registers 0x8 through 0xA store the results of ALS/IR/Prox ADC conversions. TABLE 1. ISL29029 REGISTERS AND REGISTER BITS BIT ADDR REG NAME 7 6 5 4 3 2 1 0 DEFAULT 0x00 (n/a) (Reserved) (n/a) 0x01 CONFIGURE PROX EN PROX_SLP[2:0] PROX_DR ALS_EN ALS_RANGE ALSIR_MODE 0x00 0x02 INTERRUPT PROX_FLAG PROX_PRST[1:0] (Write 0) ALS_FLAG ALS_PRST[1:0] INT_CTRL 0x00 0x03 PROX_LT PROX_LT[7:0] 0x00 0x04 PROX_HT PROX_HT[7:0] 0xFF 0x05 ALSIR_TH1 ALSIR_LT[7:0] 0x00 0x06 ALSIR_TH2 ALSIR_HT[3:0] ALSIR_LT[11:8] 0xF0 0x07 ALSIR_TH3 ALSIR_HT[11:4] 0xFF 0x08 PROX_DATA PROX_DATA[7:0] 0x00 0x09 ALSIR_DT1 ALSIR_DATA[7:0] 0x00 0x0A ALSIR_DT2 (Unused) ALSIR_DATA[11:8] 0x00 0x0E TEST1 (Write as 0x00) 0x00 0x0F TEST2 (Write as 0x00) 0x00 Register Descriptions TABLE 2. REGISTER 0x00 (RESERVED) BIT # ACCESS DEFAULT NAME FUNCTION/OPERATION 7:0 RO (n/a) (n/a) Reserved - no need to read or write TABLE 3. REGISTER 0x01 (CONFIGURE) - PROX/ALS CONFIGURATION BIT # ACCESS DEFAULT NAME FUNCTION/OPERATION When = 0, proximity sensing is disabled PROX_EN 7 RW 0x00 When = 1, continuous proximity sensing is enabled. Prox data will be ready 0.54ms after this (Prox Enable) bit is set high For bits 6:4 = (see the following) 111; sleep time between prox IR LED pulses is 0.0ms (run continuously) 110; sleep time between prox IR LED pulses is 12.5ms 101; sleep time between prox IR LED pulses is 50ms PROX_SLP 6:4 RW 0x00 100; sleep time between prox IR LED pulses is 75ms (Prox Sleep) 011; sleep time between prox IR LED pulses is 100ms 010; sleep time between prox IR LED pulses is 200ms 001; sleep time between prox IR LED pulses is 400ms 000; sleep time between prox IR LED pulses is 800ms PROX_DR When = 0, IRDR behaves as a pulsed 110mA current sink 3 RW 0x00 (Prox Drive) When = 1, IRDR behaves as a pulsed 220mA current sink ALS_EN When = 0, ALS/IR sensing is disabled 2 RW 0x00 (ALS Enable) When = 1, continuous ALS/IR sensing is enabled with new data ready every 100ms ALS_RANGE When = 0, ALS is in low-lux range 1 RW 0x00 (ALS Range) When = 1, ALS is in high-lux range ALSIR_MODE When = 0, ALS/IR data register contains visible ALS sensing data 0 RW 0x00 (ALSIR Mode) When = 1, ALS/IR data register contains IR spectrum sensing data FN7682 Rev 0.00 Page 6 of 16 November 23, 2010

ISL29029 TABLE 4. REGISTER 0x02 (INTERRUPT) - PROX/ALS INTERRUPT CONTROL BIT # ACCESS DEFAULT BIT NAME FUNCTION/OPERATION When = 0, no Prox interrupt event has occurred since power-on or last “clear” PROX_FLAG 7 FLAG 0x00 When = 1, a Prox interrupt event occurred. Clearable by writing “0” (Prox Flag) Writing “1” leaves previous state unchanged For bits 6:5 = (see the following) 00; set PROX_FLAG if 1 conversion result trips the threshold value PROX_PRST 6:5 RW 0x00 01; set PROX_FLAG if 4 conversion results trip the threshold value (Prox Persist) 10; set PROX_FLAG if 8 conversion results trip the threshold value 11; set PROX_FLAG if 16 conversion results trip the threshold value Unused Unused register bit - write 0 4 RW 0x00 (Write 0) When = 0, no ALS interrupt event has occurred since power-on or last “clear” ALS_FLAG 3 FLAG 0x00 When = 1, an ALS interrupt event occurred. Clearable by writing “0” (ALS FLAG) Writing “1” leaves previous state unchanged For bits 2:1 = (see the following) 00; set ALS_FLAG if 1 conversion is outside the set window ALS_PRST 2:1 RW 0x00 01; set ALS_FLAG if 4 conversions are outside the set window (ALS Persist) 10; set ALS_FLAG if 8 conversions are outside the set window 11; set ALS_FLAG if 16 conversions are outside the set window INT_CTRL When = 0, set INT pin low if PROX_FLAG or ALS_FLAG high (logical OR) 0 RW 0x00 (Interrupt Control) When = 1, set INT pin low if PROX_FLAG and ALS_FLAG high (logical AND) TABLE 5. REGISTER 0x03 (PROX_LT) - INTERRUPT LOW THRESHOLD FOR PROXIMITY SENSOR BIT # ACCESS DEFAULT BIT NAME FUNCTION/OPERATION PROX_LT 8-bit interrupt low threshold for 7:0 RW 0x00 (Prox Threshold) proximity sensing TABLE 6. REGISTER 0x04 (PROX_HT) - INTERRUPT HIGH THRESHOLD FOR PROXIMITY SENSOR BIT # ACCESS DEFAULT BIT NAME FUNCTION/OPERATION PROX_HT 7:0 RW 0xFF 8-bit interrupt high threshold for proximity sensing (Prox Threshold) TABLE 7. REGISTER 0x05 (ALSIR_TH1) - INTERRUPT LOW THRESHOLD FOR ALS/IR BIT # ACCESS DEFAULT BIT NAME FUNCTION/OPERATION ALSIR_LT[7:0] 7:0 RW 0x00 Lower 8 bits (of 12 bits) for ALS/IR low interrupt threshold (ALS/IR Low Thr.) TABLE 8. REGISTER 0x06 (ALSIR_TH2) - INTERRUPT LOW/HIGH THRESHOLDS FOR ALS/IR BIT # ACCESS DEFAULT BIT NAME FUNCTION/OPERATION ALSIR_HT[3:0] 7:4 RW 0x0F Lower 4 bits (of 12 bits) for ALS/IR high interrupt threshold (ALS/IR High Thr.) ALSIR_LT[11:8] 3:0 RW 0x00 Upper 4 bits (of 12 bits) for ALS/IR low interrupt threshold (ALS/IR Low Thr.) TABLE 9. REGISTER 0x07 (ALSIR_TH3) - INTERRUPT HIGH THRESHOLD FOR ALS/IR BIT # ACCESS DEFAULT BIT NAME FUNCTION/OPERATION ALSIR_HT[11:4] 7:0 RW 0xFF Upper 8 bits (of 12 bits) for ALS/IR high interrupt threshold (ALS/IR High Thr.) FN7682 Rev 0.00 Page 7 of 16 November 23, 2010

ISL29029 TABLE 10. REGISTER 0x08 (PROX_DATA) - PROXIMITY SENSOR DATA BIT # ACCESS DEFAULT BIT NAME FUNCTION/OPERATION PROX_DATA 7:0 RO 0x00 Results of 8-bit proximity sensor ADC conversion (Proximity Data) TABLE 11. REGISTER 0x09 (ALSIR_DT1) - ALS/IR SENSOR DATA (LOWER 8 BITS) BIT # ACCESS DEFAULT BIT NAME FUNCTION/OPERATION ALSIR_DATA 7:0 RO 0x00 Lower 8 bits (of 12 bits) from result of ALS/IR sensor conversion (ALS/IR Data) TABLE 12. REGISTER 0x0A (ALSIR_DT2) - ALS/IR SENSOR DATA (UPPER 4 BITS) BIT # ACCESS DEFAULT BIT NAME FUNCTION/OPERATION 7:4 RO 0x00 (Unused) Unused bits ALSIR_DATA 3:0 RO 0x00 Upper 4 bits (of 12 bits) from result of ALS/IR sensor conversion (ALS/IR Data) TABLE 13. REGISTER 0x0E (TEST1) - TEST MODE BIT # ACCESS DEFAULT BIT NAME FUNCTION/OPERATION 7:0 RW 0x00 (Write as 0x00) Test mode register. When 0x00, in normal operation TABLE 14. REGISTER 0x0F (TEST2) - TEST MODE 2 BIT # ACCESS DEFAULT BIT NAME FUNCTION/OPERATION 7:0 RW 0x00 (Write as 0x00) Test mode register. When 0x00, in normal operation I2C DATA START DEVICE ADDRESS W A REGISTER ADDRESS STOPSTART DEVICE ADDRESS A DATA BYTE0 I2C SDA A6 A5 A4 A3 A2 A1 A0 W A R7 R6 R5 R4 R3 R2 R1 R0 A A6 A5 A4 A3 A2 A1 A0 W A SDA DRIVEN BY ISL29029 MASTER I2C SDA SLAVE(ISL29029) SDA DRIVEN BY MASTER A SDA DRIVEN BY MASTER A SDA DRIVEN BY MASTER A D7 D6 D5 D4 D3 D2 D1 D0 I2C CLK 1 2 3 4 5 6 7 8 9 1 2 3 4 5 6 7 8 9 1 2 3 4 5 6 7 8 9 1 2 3 4 5 6 7 8 9 FIGURE 2. I2C DRIVER TIMING DIAGRAM FOR MASTER AND SLAVE CONNECTED TO COMMON BUS Principles of Operation For more information about the I2C standard, please consult the 2 Philips™ I2C specification documents. I C Interface Photodiodes and ADCs The ISL29029’s I2C interface slave address is internally hardwired as 0b100010<x>, where “0b” signifies binary notation and x The ISL29029 contains two photodiode arrays which convert represents the logic level on pin ADDR0. photons (light) into current. The ALS photodiodes are constructed to mimic the human eye’s wavelength response curve to visible light Figure 2 shows a sample one-byte read. The I2C bus master (see Figure 6). The ALS photodiodes’ current output is digitized by a always drives the SCL (clock) line, while either the master or the 12-bit ADC in 100ms. These 12 bits can be accessed by reading slave can drive the SDA (data) line. Every I2C transaction begins from I2C registers 0x9 and 0xA when the ADC conversion is with the master asserting a start condition (SDA falling while SCL completed. remains high). The first transmitted byte is initiated by the master and includes 7 address bits and a R/W bit. The slave is The ALS converter is a charge-balancing integrating 12-bit ADC. responsible for pulling SDA low during the ACK bit after every Charge-balancing is best for converting small current signals in the transmitted byte. presence of periodic AC noise. Integrating over 100ms highly rejects both 50Hz and 60Hz light flicker by picking the lowest integer Each I2C transaction ends with the master asserting a stop number of cycles for both 50Hz/60Hz frequencies. condition (SDA rising while SCL remains high). FN7682 Rev 0.00 Page 8 of 16 November 23, 2010

ISL29029 ALS CONVERSION TIME = SEVERAL µs BETWEEN 100ms (FIXED) CONVERSIONS ALS ACTIVE 100ms 100ms 100ms 100ms 100ms TIME 0.54ms FOR PROX CONVERSION PROX SENSOR ACTIVE TIME SERIES OF IRDR CURRENT PULSES (CURRENT TOTALING 0.1ms DRIVER) TIME SLEEP TIME (PROX_SLP) FIGURE 3. TIMING DIAGRAM FOR PROX/ALS EVENTS - NOT TO SCALE The proximity sensor is an 8-bit ADC which operates in a similar Proximity Sensing fashion. When proximity sensing is enabled, the IRDR pin will When proximity sensing is enabled (PROX_EN = 1), the external drive a user-supplied infrared LED, the emitted IR reflects off an IR LED is driven for 0.1ms by the built-in IR LED driver through object (i.e., a human head) back into the ISL29029, and a sensor the IRDR pin. The amplitude of the IR LED current depends on converts the reflected IR wave to a current signal in 0.54ms. The Register 1 bit 3: PROX_DR. If this bit is low, the load will see a ADC subtracts the IR reading before and after the LED is driven fixed 110mA current pulse. If this bit is high, the load on IRDR (to remove ambient IR such as sunlight), and converts this value will see a fixed 220mA current pulse as seen in Figure 4. to a digital count stored in Register0x8. 220mA The ISL29029 is designed to run two conversions concurrently: a (PROX_DR = 1) proximity conversion and an ALS (or IR) conversion. Please note that because of the conversion times, the user must let the ADCs perform one full conversion first before reading from I2C Registers 110mA PROX_DATA (wait 0.54ms) or ALSIR_DT1/2 (wait 100ms). The timing (PROX_DR = 0) PIN 8 - IRDR between ALS and Prox conversions is arbitrary (as shown in Figure 3). The ALS runs continuously with new data available every 100ms. The proximity sensor runs continuously with a time between conversions (IRDR IS HI-Z WHEN decided by PROX_SLP (Register 1 Bits [6:4]). NOT DRIVING) Changes from ISL29028 FIGURE 4. CURRENT DRIVE MODE OPTIONS The ISL29029 is identical to the ISL29028 with a few small changes: the x29 photodiode structure has been improved for better When the IR from the LED reaches an object and gets reflected ALS linearity in high-IR conditions, and the x29’s PROX interrupt back into the ISL29029, the reflected IR light is converted into scheme behaves as an out-of-window comparator (compared to the current as per the IR spectral response shown in Figure 7. One x28’s PROX level-comparator with hysteresis). If the internal entire proximity measurement takes 0.54ms for one conversion registers are of concern to the customer, please contact Intersil for a (which includes 0.1ms spent driving the LED), and the period list of changes (internal register changes are independent of part between proximity measurements is decided by PROX_SLP performance). (sleep time) in Register 1 Bits 6:4. Ambient Light and IR Sensing Average LED driving current consumption is given by Equation 1. I 100s The ISL29029 is set for ambient light sensing when Register bit I = --l--R----D----R---;--P---E----A---K-------------------------- (EQ. 1) lRDR;AVE T ALSIR_MODE = 0 and ALR_EN = 1. The light-wavelength response of SLEEP the ALS appears as shown in Figure 6. ALS measuring mode (as A typical IRDR scheme is 220mA amplitude pulses every 800ms, opposed to IR measuring mode) is set by default. which yields 28μA DC. When the part is programmed for infrared (IR) sensing Total Current Consumption (ALSIR_MODE = 1; ALS_EN = 1), infrared light is converted into a current and digitized by the same ALS ADC. The result of an IR Total current consumption is the sum of IDD and IIRDR. The IRDR conversion is strongly related to the amount of IR energy incident pin sinks current (as shown in Figure 4) and the average IRDR on our sensor, but is unitless and is referred to in digital counts. FN7682 Rev 0.00 Page 9 of 16 November 23, 2010

ISL29029 current can be calculated using Equation 1. IDD depends on method instead of writing to test registers: set VDD = 0V for 1 second voltage and the mode-of-operation as seen in Figure 11. or more, power back up at the required slew rate, and write registers to the desired values. Interrupt Function Power-Down The ISL29029 has an intelligent interrupt scheme designed to shift some logic processing away from intensive microcontroller To put the ISL29029 into a power-down state, the user can set both I2C polling routines (which consume power) and towards a more PROX_EN and ALS_EN bits to 0 in Register1. Or more simply, set all independent light sensor which can instruct a system to “wake of Register 1 to 0x00. up” or “go to sleep”. Calculating Lux An ALS interrupt event (ALS_FLAG) is governed by Registers 5 through The ISL29029’s ADC output codes are directly proportional to lux 7 (ALSTH1, ALSTH2, ALSTH3). The user writes high and low threshold when in ALS mode (see ALSIR_MODE bit). values to these registers and the ISL29029 will issue an ALS interrupt flag if the measured ALS data from registers 0x9 and 0xA are outside E =  OUT (EQ. 2) calc RANGE ADC the user’s programmed threshold window X-times-in-a-row (X is set by user; see “persistency” option below). The user must write 0 to clear In Equation 2, Ecalc is the calculated lux reading and OUT the ALS_FLAG. represents the ADC code. The constant  to plug in is determined by the range bit ALS_RANGE (register 0x1 bit 1) and is A PROX interrupt event (PROX_FLAG) is governed by the high and independent of the light source type. low thresholds in registers 3 and 4 (PROX_LT and PROX_HT). The user writes high and low threshold values to these registers and the TABLE 15. ALS SENSITIVITY AT DIFFERENT RANGES ISL29029 will issue a PROX interrupt flag if the measured PROX data αRANGE from register 0x8 is outside the user’s programmed threshold window ALS_RANGE (Lux/Count) X-times-in-a-row (X is set by user; see “persistency” option below). The user must write 0 to clear the PROX_FLAG. 0 0.0326 1 0.522 Writing “1” to either ALS_FLAG or PROX_FLAG bits does not change the previous logic state of the bit. Table 15 shows two different scale factors: one for the low range Interrupt persistency is another useful option available for both (ALS_RANGE = 0) and the other for the high range (ALS_RANGE ALS and proximity measurements. Persistency requires X-in-a- = 1). row interrupt flags before the INT pin is driven low. Both ALS and Prox have their own independent interrupt persistency options. Noise Rejection See ALS_PRST and PROX_PRST bits in Register 2. Charge balancing ADC’s have excellent noise-rejection The final interrupt option is the ability to AND or OR the two characteristics for periodic noise sources whose frequency is an interrupt flags using Register 2 Bit 0 (INT_CTRL). If the user integer multiple of the conversion rate. For instance, a 60Hz AC wants both ALS/Prox interrupts to happen at the same time unwanted signal’s sum from 0ms to k*16.66ms (k = 1,2...ki) is zero. before changing the state of the interrupt pin, set this bit high. If Similarly, setting the device’s integration time to be an integer the user wants the interrupt pin to change state when either the multiple of the periodic noise signal greatly improves the light ALS or the Proximity interrupt flag goes high, leave this bit to its sensor output signal in the presence of noise. Since wall sockets default of 0. may output at 60Hz or 50Hz, our integration time is 100ms: the lowest common integer number of cycles for both frequencies. ALS Range 1 Considerations Proximity Detection of Various Objects When measuring ALS counts higher than 1800 on range 1 Proximity sensing relies on the amount of IR reflected back from (ALSIR_MODE=0, ALS_RANGE=0, ALS_DATA > 1800), switch to objects. A perfectly black object would absorb all light and reflect range 2 (change the ALS_RANGE bit from “0” to “1”) and no photons. The ISL29029 is sensitive enough to detect black ESD remeasure ALS counts. This recommendation pertains only to foam which reflects only 1% of IR. For biological objects, blonde applications where the light incident upon the sensor is IR-heavy hair reflects more than brown hair and customers may notice that and is distorted by tinted glass that increases the ratio of infrared skin tissue is much more reflective than hair. IR penetrates into to visible light. For more information, see the separate ALS the skin and is reflected or scattered back from within. As a result, Range 1 Considerations document. the proximity count peaks at contact and monotonically decreases V Power-up and Power Supply as skin moves away. The reflective characteristics of skin are very DD different from that of paper. Considerations Typical Circuit Upon power-up, please ensure a VDD slew rate of 0.5V/ms or greater. After power-up, or if the user’s power supply temporarily deviates A typical application for the ISL29029 is shown in Figure5. The from our specification (2.25V to 3.63V), Intersil recommends the ISL29029’s I2C address is internally hardwired as 0b100010<x>, user write the following: write 0x00 to register 0x01, write 0x29 to with x representing the logic state of input I2C address pin register 0x0F, write 0x00 to register 0x0E, and write 0x00 to register ADDR0. The device can be tied onto a system’s I2C bus together 0x0F. The user should then wait ~1ms or more and then rewrite all with other I2C compliant devices. registers to the desired values. If the user prefers a hardware reset FN7682 Rev 0.00 Page 10 of 16 November 23, 2010

ISL29029 Soldering Considerations Layout Considerations Convection heating is recommended for reflow soldering; direct- The ISL29029 is relatively insensitive to layout. Like other I2C infrared heating is not recommended. The plastic ODFN package devices, it is intended to provide excellent performance even in does not require a custom reflow soldering profile, and is qualified to significantly noisy environments. There are only a few +260°C. A standard reflow soldering profile with a +260°C considerations that will ensure best performance. maximum is recommended. Route the supply and I2C traces as far as possible from all sources of Suggested PCB Footprint noise. A 0.1µF and 1µF power supply decoupling capacitors need to be placed close to the device. It is important that users check the “Surface Mount Assembly Guidelines for Optical Dual FlatPack No Lead (ODFN) Package” before starting ODFN product board mounting. (http://www.intersil.com/data/tb/TB477.pdf) VI2C_PULL-UP R1 R2 R3 I2C MASTER 10k 10k 10k MICROCONTROLLER INT SDA VDD SCL VIR-LED SLAVE_0 SLAVE_1 I2C SLAVE_n 1 8 ADDR0 IRDR SDA SDA 2 VDD INT 7 SCL SCL C1 C2 1µF 0.1µF 3 6 GND SDA 4 5 REXT SCL REXT ISL29029 499k FIGURE 5. ISL29029 TYPICAL CIRCUIT FN7682 Rev 0.00 Page 11 of 16 November 23, 2010

ISL29029 Typical Performance Curves VDD = 3.0V, REXT = 499k 1.0 1.0 HUMAN EYE 0.9 FLUORESCENT 0.9 IR/PROX NSITY 00..78 ONSE 00..78 ALS E P NT 0.6 ES 0.6 D I 0.5 HALOGEN INCAND. D R 0.5 ALIZE 0.4 SUN ALIZE 0.4 M 0.3 M 0.3 R R NO 0.2 NO 0.2 0.1 0.1 0 0.0 350 550 750 950 300 400 500 600 700 800 900 1000 1100 WAVELENGTH (nm) WAVELENGTH (nm) FIGURE 6. SPECTRUM OF FOUR LIGHT SOURCES NORMALIZED FIGURE 7. ISL29029 SENSITIVITY TO DIFFERENT WAVELENGTHS BY LUMINOUS INTENSITY (LUX) 1.0 2500 0.9 HALOGEN TIVITY 00..78 G (LX) 2000 SI N EN 0.6 ADI 1500 S E D 0.5 R FLUORESCENT E R LIZ 0.4 TE 1000 INCANDESCENT A E M 0.3 M R X O 0.2 U 500 N L 0.1 0 0 -90 -60 -30 0 30 60 90 0 1000 2000 3000 4000 5000 ANGULAR OFFSET (°) ALS CODE (12-BIT) FIGURE 8. ANGULAR SENSITIVITY FIGURE 9. ALS LINEARITY OVER 3 LIGHT SOURCES (2000 LUX RANGE) 300 160 ALS+PROX (DURING PROX SLEEP) 18% GREY CARD 250 140 COUNTS (8-BIT) 112050000 220mA11 M0mWODAHE IMTEO DCEOPY PAPER ASURED I (µA)DD 11028000 ALS-ONLY X E O M R P 50 60 PROX (DURING PROX SLEEP) 0 40 0 20 40 60 80 100 120 140 160 180 200 2.25 2.40 2.55 2.70 2.85 3.00 3.15 3.30 3.45 3.60 DISTANCE (mm) INPUT VDD (V) FIGURE 10. PROX COUNTS vs DISTANCE WITH 10CM x 10CM FIGURE 11. VDD vs IDD FOR VARIOUS MODES OF OPERATION REFLECTOR (USING ISL29028 EVALUATION BOARD) FN7682 Rev 0.00 Page 12 of 16 November 23, 2010

ISL29029 Typical Performance Curves VDD = 3.0V, REXT = 499k (Continued) 50 240 220mA-MODE (PROX_DR = 1) 40 220 OM %) 30 I (mA)IRDR 112680000 T CHANGE FRASUREMENT ( -1210000 NE UM 112400 LS CO+25°C --3200 110mA-MODE (PROX_DR = 0) A -40 100 0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 -50 -40 -15 10 35 60 85 VIRDR (V) TEMPERATURE (°C) FIGURE 12. IRDR PULSE AMPLITUDE vs VIRDR FIGURE 13. STABILITY OF ALS COUNT OVER TEMP (AT300 LUX) 10 9 8 T) 7 BI 2- 6 1 E ( 5 D O C 4 S L 3 A 2 1 0 -40 10 60 TEMPERATURE (°C) FIGURE 14. STABILITY OF ALS COUNT OVER-TEMPERATURE (AT 0.00 LUX) FN7682 Rev 0.00 Page 13 of 16 November 23, 2010

ISL29029 2.10 1 8 2 7 2.00 T E S F F O R 0.43 3 6 O S N E 0.50 S 4 5 0.42 FIGURE 15. 8 LD ODFN SENSOR LOCATION OUTLINE - DIMENSIONS IN mm FN7682 Rev 0.00 Page 14 of 16 November 23, 2010

ISL29029 Revision History The revision history provided is for informational purposes only and is believed to be accurate, but not warranted. Please go to web to make sure you have the latest Rev. DATE REVISION CHANGE 11/23/10 FN7682.0 Initial Release. About Intersil Intersil Corporation is a leader in the design and manufacture of high-performance analog, mixed-signal and power management semiconductors. The company's products address some of the largest markets within the industrial and infrastructure, personal computing and high-end consumer markets. For more information about Intersil, visit our website at www.intersil.com. For the most updated datasheet, application notes, related documentation and related parts, please see the respective product information page found at www.intersil.com. You may report errors or suggestions for improving this datasheet by visiting www.intersil.com/en/support/ask-an-expert.html. Reliability reports are also available from our website at http://www.intersil.com/en/support/qualandreliability.html#reliability © Copyright Intersil Americas LLC 2010. All Rights Reserved. All trademarks and registered trademarks are the property of their respective owners. For additional products, see www.intersil.com/en/products.html Intersil products are manufactured, assembled and tested utilizing ISO9001 quality systems as noted in the quality certifications found at www.intersil.com/en/support/qualandreliability.html Intersil products are sold by description only. Intersil may modify the circuit design and/or specifications of products at any time without notice, provided that such modification does not, in Intersil's sole judgment, affect the form, fit or function of the product. Accordingly, the reader is cautioned to verify that datasheets are current before placing orders. Information furnished by Intersil is believed to be accurate and reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries. For information regarding Intersil Corporation and its products, see www.intersil.com FN7682 Rev 0.00 Page 15 of 16 November 23, 2010

ISL29029 Package Outline Drawing L8.2.1x2.0 8 LEAD OPTICAL DUAL FLAT NO-LEAD PLASTIC PACKAGE (ODFN) Rev 1, 12/09 2.10 A B 6 6 PIN 1 0.50 INDEX AREA PIN 1 INDEX AREA 2.00 1.50 1.50 0.20±0.05 (2X) 0.10 0.10M CAB 8X 0 . 35 ± 0 . 05 TOP VIEW 0.75 BOTTOM VIEW SEE DETAIL "X" 2.50 0.10C 2.10 0.70±0.05 C BASE PLANE SEATING PLANE SIDE VIEW 0.08C (6x0.50) (1.50) (8x0.20) C 0 . 2 REF 5 (8x0.20) 0 . 00 MIN. 0 . 05 MAX. (8x0.55) DETAIL "X" (0.75) NOTES: TYPICAL RECOMMENDED LAND PATTERN 1. Dimensions are in millimeters. Dimensions in ( ) for Reference Only. 2. Dimensioning and tolerancing conform to ASME Y14.5m-1994. 3. Unless otherwise specified, tolerance : Decimal ± 0.05 4. Dimension b applies to the metallized terminal and is measured between 0.25mm and 0.35mm from the terminal tip. 5. Tiebar shown (if present) is a non-functional feature. 6. The configuration of the pin #1 identifier is optional, but must be located within the zone indicated. The pin #1 identifier may be either a mold or mark feature. FN7682 Rev 0.00 Page 16 of 16 November 23, 2010