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IRFU320PBF产品简介:
ICGOO电子元器件商城为您提供IRFU320PBF由Vishay设计生产,在icgoo商城现货销售,并且可以通过原厂、代理商等渠道进行代购。 IRFU320PBF价格参考。VishayIRFU320PBF封装/规格:晶体管 - FET,MOSFET - 单, 通孔 N 沟道 400V 3.1A(Tc) 2.5W(Ta),42W(Tc) TO-251AA。您可以下载IRFU320PBF参考资料、Datasheet数据手册功能说明书,资料中有IRFU320PBF 详细功能的应用电路图电压和使用方法及教程。
参数 | 数值 |
产品目录 | |
ChannelMode | Enhancement |
描述 | MOSFET N-CH 400V 3.1A I-PAKMOSFET N-Chan 400V 3.1 Amp |
产品分类 | FET - 单分离式半导体 |
FET功能 | 标准 |
FET类型 | MOSFET N 通道,金属氧化物 |
Id-ContinuousDrainCurrent | 3.1 A |
Id-连续漏极电流 | 3.1 A |
品牌 | Vishay SiliconixVishay / Siliconix |
产品手册 | |
产品图片 | |
rohs | RoHS 合规性豁免无铅 / 符合限制有害物质指令(RoHS)规范要求 |
产品系列 | 晶体管,MOSFET,Vishay / Siliconix IRFU320PBF- |
数据手册 | |
产品型号 | IRFU320PBFIRFU320PBF |
Pd-PowerDissipation | 2.5 W |
Pd-功率耗散 | 2.5 W |
RdsOn-Drain-SourceResistance | 1.8 Ohms |
RdsOn-漏源导通电阻 | 1.8 Ohms |
Vds-Drain-SourceBreakdownVoltage | 400 V |
Vds-漏源极击穿电压 | 400 V |
Vgs-Gate-SourceBreakdownVoltage | +/- 20 V |
Vgs-栅源极击穿电压 | 20 V |
上升时间 | 14 ns |
下降时间 | 13 ns |
不同Id时的Vgs(th)(最大值) | 4V @ 250µA |
不同Vds时的输入电容(Ciss) | 350pF @ 25V |
不同Vgs时的栅极电荷(Qg) | 20nC @ 10V |
不同 Id、Vgs时的 RdsOn(最大值) | 1.8 欧姆 @ 1.9A,10V |
产品目录绘图 | |
产品目录页面 | |
产品种类 | MOSFET |
供应商器件封装 | TO-251AA |
其它名称 | *IRFU320PBF |
典型关闭延迟时间 | 30 ns |
功率-最大值 | 2.5W |
功率耗散 | 2.5 W |
包装 | 管件 |
商标 | Vishay / Siliconix |
安装类型 | 通孔 |
安装风格 | Through Hole |
导通电阻 | 1.8 Ohms |
封装 | Tube |
封装/外壳 | TO-251-3 短引线,IPak,TO-251AA |
封装/箱体 | IPAK-3 |
工厂包装数量 | 3000 |
晶体管极性 | N-Channel |
最大工作温度 | + 150 C |
最小工作温度 | - 55 C |
标准包装 | 75 |
汲极/源极击穿电压 | 400 V |
漏极连续电流 | 3.1 A |
漏源极电压(Vdss) | 400V |
电流-连续漏极(Id)(25°C时) | 3.1A (Tc) |
通道模式 | Enhancement |
配置 | Single |
闸/源击穿电压 | +/- 20 V |
IRFR320, IRFU320, SiHFR320, SiHFU320 www.vishay.com Vishay Siliconix Power MOSFET FEATURES PRODUCT SUMMARY • Dynamic dV/dt rating V (V) 400 DS • Repetitive avalanche rated R (Ω) V = 10 V 1.8 DS(on) GS • Surface mount (IRFR320,SiHFR320) Q (Max.) (nC) 20 g • Straight lead (IRFU320,SiHFU320) Q (nC) 3.3 gs • Available in tape and reel Available Q (nC) 11 gd • Fast switching Configuration Single • Ease of paralleling D • Material categorization: for definitions of compliance please see www.vishay.com/doc?99912 DPAK IPAK (TO-252) (TO-251) DESCRIPTION D D G Third generation power MOSFETs from Vishay provide the designer with the best combination of fast switching, ruggedized device design, low on-resistance and S G D S cost-effectiveness. G S The DPAK is designed for surface mounting using vapor phase, infrared, or wave soldering techniques. The straight N-Channel MOSFET lead version (IRFU, SiHFU series) is for through-hole mounting applications. Power dissipation levels up to 1.5 W are possible in typical surface mount applications. ORDERING INFORMATION Package DPAK (TO-252) DPAK (TO-252) DPAK (TO-252) DPAK (TO-252) IPAK (TO-251) Lead (Pb)-free and Halogen-free SiHFR320-GE3 SiHFR320TRL-GE3a SiHFR320TR-GE3 a - SiHFU320-GE3 IRFR320PbF IRFR320TRLPbFa IRFR320TRPbF a IRFR320TRRPbF a IRFU320PbF Lead (Pb)-free SiHFR320-E3 SiHFR320TL-E3a SiHFR320T-E3 a SiHFR320TR-E3 a SiHFU320-E3 Note a. See device orientation. ABSOLUTE MAXIMUM RATINGS (T = 25 °C, unless otherwise noted) C PARAMETER SYMBOL LIMIT UNIT Drain-Source Voltage V 400 DS V Gate-Source Voltage V ± 20 GS T = 25 °C 3.1 C Continuous Drain Current V at 10 V I GS D T = 100 °C 2.0 A C Pulsed Drain Current a I 12 DM Linear Derating Factor 0.33 W/°C Linear Derating Factor (PCB Mount) e 0.020 Single Pulse Avalanche Energy b E 160 mJ AS Repetitive Avalanche Current a I 3.1 A AR Repetitive Avalanche Energy a E 4.2 mJ AR Maximum Power Dissipation T = 25 °C 42 C P W Maximum Power Dissipation (PCB Mount)e T = 25 °C D 2.5 A Peak Diode Recovery dV/dt c dV/dt 4.0 V/ns Operating Junction and Storage Temperature Range T , T -55 to +150 J stg °C Soldering Recommendations (Peak Temperature) d for 10 s 260 Notes a. Repetitive rating; pulse width limited by maximum junction temperature (see fig. 11). b. V = 50 V, starting T = 25 °C, L = 29 mH, R = 25 Ω, I = 3.1 A (see fig. 12). DD J g AS c. I ≤ 3.1 A, dI/dt ≤ 65 A/μs, V ≤ V , T ≤ 150 °C. SD DD DS J d. 1.6 mm from case. S14-2355-Rev. E, 08-Dec-14 1 Document Number: 91273 For technical questions, contact: hvm@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
IRFR320, IRFU320, SiHFR320, SiHFU320 www.vishay.com Vishay Siliconix e. When mounted on 1" square PCB (FR-4 or G-10 material). THERMAL RESISTANCE RATINGS PARAMETER SYMBOL MIN. TYP. MAX. UNIT Maximum Junction-to-Ambient R - - 110 thJA Maximum Junction-to-Ambient R - - 50 °C/W (PCB Mount) a thJA Maximum Junction-to-Case (Drain) R - - 3.0 thJC Note a. When mounted on 1" square PCB (FR-4 or G-10 material). SPECIFICATIONS (T = 25 °C, unless otherwise noted) J PARAMETER SYMBOL TEST CONDITIONS MIN. TYP. MAX. UNIT Static Drain-Source Breakdown Voltage V V = 0 V, I = 250 μA 400 - - V DS GS D V Temperature Coefficient ΔV /T Reference to 25 °C, I = 1 mA - 0.51 - V/°C DS DS J D Gate-Source Threshold Voltage V V = V , I = 250 μA 2.0 - 4.0 V GS(th) DS GS D Gate-Source Leakage I V = ± 20 V - - ± 100 nA GSS GS V = 400 V, V = 0 V - - 25 DS GS Zero Gate Voltage Drain Current I μA DSS V = 320 V, V = 0 V, T = 125 °C - - 250 DS GS J Drain-Source On-State Resistance R V = 10 V I = 1.9 A b - - 1.8 Ω DS(on) GS D Forward Transconductance g V = 50 V, I = 1.9 A 1.7 - - S fs DS D Dynamic Input Capacitance C - 350 - iss V = 0 V, GS Output Capacitance C V = - 25 V, - 120 - pF oss DS f = 1.0 MHz, see fig. 5 Reverse Transfer Capacitance C - 47 - rss Total Gate Charge Q - - 20 g I = 3.3 A, V = 320 V, Gate-Source Charge Q V = 10 V D DS - - 3.3 nC gs GS see fig. 6 and 13 b Gate-Drain Charge Q - - 11 gd Turn-On Delay Time t - 10 - d(on) RTuisren -TOimff eDelay Time tdt(or ff) Rg = 1V8D DΩ =, R2D0 0= V5,6 I DΩ =, s3e.e3 fAig, . 10 b -- 3104 -- ns Fall Time t - 13 - f Internal Drain Inductance L Between lead, D - 4.5 - D 6 mm (0.25") from nH package and center of G Internal Source Inductance LS die contact - 7.5 - S Drain-Source Body Diode Characteristics Continuous Source-Drain Diode Current I MOSFET symbol D - - 3.1 S showing the A integral reverse G Pulsed Diode Forward Current a ISM p - n junction diode S - - 12 Body Diode Voltage V T = 25 °C, I = 3.1 A, V = 0 V b - - 1.6 V SD J S GS Body Diode Reverse Recovery Time t - 270 600 ns rr T = 25 °C, I = 3.3 A, dI/dt = 100 A/μs b J F Body Diode Reverse Recovery Charge Q - 1.4 3.0 μC rr Forward Turn-On Time t Intrinsic turn-on time is negligible (turn-on is dominated by L and L ) on S D Notes a. Repetitive rating; pulse width limited by maximum junction temperature (see fig. 11). b. Pulse width ≤ 300 μs; duty cycle ≤ 2 %. S14-2355-Rev. E, 08-Dec-14 2 Document Number: 91273 For technical questions, contact: hvm@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
IRFR320, IRFU320, SiHFR320, SiHFU320 www.vishay.com Vishay Siliconix TYPICAL CHARACTERISTICS (25 °C, unless otherwise noted) 10 T = 25 °C J T = 150 °C J A) nt ( urre 1 C e c ur o S o- n-t 0.1 ai Dr I, D V = 26.2V 0.01 DS 4 5 6 7 8 9 10 V , Gate-to-Source Voltage (V) GS Fig. 1 - Typical Output Characteristics, T = 25 °C Fig. 3 - Typical Transfer Characteristics C Fig. 2 - Typical Output Characteristics, T = 150 °C Fig. 4 - Normalized On-Resistance vs. Temperature C S14-2355-Rev. E, 08-Dec-14 3 Document Number: 91273 For technical questions, contact: hvm@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
IRFR320, IRFU320, SiHFR320, SiHFU320 www.vishay.com Vishay Siliconix Fig. 5 - Typical Capacitance vs. Drain-to-Source Voltage Fig. 7 - Typical Source-Drain Diode Forward Voltage Fig. 6 - Typical Gate Charge vs. Gate-to-Source Voltage Fig. 8 - Maximum Safe Operating Area S14-2355-Rev. E, 08-Dec-14 4 Document Number: 91273 For technical questions, contact: hvm@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
IRFR320, IRFU320, SiHFR320, SiHFU320 www.vishay.com Vishay Siliconix R D V DS V GS D.U.T. R g + -VDD 10 V Pulse width ≤ 1 µs Duty factor ≤ 0.1 % Fig. 10a - Switching Time Test Circuit V DS 90 % 10 % V GS t t t t d(on) r d(off) f Fig. 9 - Maximum Drain Current vs. Case Temperature Fig. 10b - Switching Time Waveforms Fig. 10 - Maximum Effective Transient Thermal Impedance, Junction-to-Case S14-2355-Rev. E, 08-Dec-14 5 Document Number: 91273 For technical questions, contact: hvm@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
IRFR320, IRFU320, SiHFR320, SiHFU320 www.vishay.com Vishay Siliconix L V V DS DS Vary tp to obtain tp required I AS V DD Rg D.U.T + V - DD V DS I AS 10 V t 0.01 Ω p I AS Fig. 12a - Unclamped Inductive Test Circuit Fig. 12b - Unclamped Inductive Waveforms Fig. 12c - Maximum Avalanche Energy vs. Drain Current Current regulator Same type as D.U.T. Q 50 kΩ G VGS 12 V 0.2 µF 0.3 µF QGS QGD + V D.U.T. - DS V G V GS 3 mA Charge I I G D Current sampling resistors Fig. 13a - Basic Gate Charge Waveform Fig. 13b - Gate Charge Test Circuit S14-2355-Rev. E, 08-Dec-14 6 Document Number: 91273 For technical questions, contact: hvm@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
IRFR320, IRFU320, SiHFR320, SiHFU320 www.vishay.com Vishay Siliconix Peak Diode Recovery dV/dt Test Circuit + Circuit layout considerations D.U.T. • Low stray inductance • Ground plane • Low leakage inductance current transformer - + - + - Rg • dV/dt controlled by Rg + • Driver same type as D.U.T. V - DD • ISD controlled by duty factor “D” • D.U.T. - device under test Driver gate drive P.W. Period D = P.W. Period V = 10 Va GS D.U.T. l waveform SD Reverse recovery Body diode forward current current dI/dt D.U.T. V waveform DS Diode recovery dV/dt V DD Re-applied voltage Body diode forward drop Inductor current Ripple ≤ 5 % ISD Note a. V = 5 V for logic level devices GS Fig. 14 - For N-Channel Vishay Siliconix maintains worldwide manufacturing capability. Products may be manufactured at one of several qualified locations. Reliability data for Silicon Technology and Package Reliability represent a composite of all qualified locations. For related documents such as package/tape drawings, part marking, and reliability data, see www.vishay.com/ppg?91273. S14-2355-Rev. E, 08-Dec-14 7 Document Number: 91273 For technical questions, contact: hvm@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
Package Information www.vishay.com Vishay Siliconix TO-252AA Case Outline E A MILLIMETERS INCHES C2 b3 DIM. MIN. MAX. MIN. MAX. 3 A 2.18 2.38 0.086 0.094 L A1 - 0.127 - 0.005 b 0.64 0.88 0.025 0.035 b2 0.76 1.14 0.030 0.045 D b3 4.95 5.46 0.195 0.215 H C 0.46 0.61 0.018 0.024 C2 0.46 0.89 0.018 0.035 L4 5 D 5.97 6.22 0.235 0.245 L L m) D1 4.10 - 0.161 - m 5 E 6.35 6.73 0.250 0.265 0. b b2 ght ( C E1 4.32 - 0.170 - e ei H 9.40 10.41 0.370 0.410 h A1 e1 ne e 2.28 BSC 0.090 BSC a pl e1 4.56 BSC 0.180 BSC e g a L 1.40 1.78 0.055 0.070 g L3 0.89 1.27 0.035 0.050 1 D L4 - 1.02 - 0.040 L5 1.01 1.52 0.040 0.060 ECN: T16-0236-Rev. P, 16-May-16 DWG: 5347 E1 Notes • Dimension L3 is for reference only. Revision: 16-May-16 1 Document Number: 71197 For technical questions, contact: pmostechsupport@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
Package Information Vishay Siliconix TO-251AA (HIGH VOLTAGE) 4 3 A E1 Thermal PAD E A 4 b4 0.0100.25 M C A B c2 L2 4 A θ2 θ1 D1 4 B D 3 C Seating 5 plane L1 L3 C C (Datum A) L B B A A1 3 x b2 c 3 x b View A - A 2 x e 0.0100.25 M C A B Base 5 metal Plating b1, b3 Lead tip (c) c1 5 (b, b2) Section B - B and C - C MILLIMETERS INCHES MILLIMETERS INCHES DIM. MIN. MAX. MIN. MAX. DIM. MIN. MAX. MIN. MAX. A 2.18 2.39 0.086 0.094 D1 5.21 - 0.205 - A1 0.89 1.14 0.035 0.045 E 6.35 6.73 0.250 0.265 b 0.64 0.89 0.025 0.035 E1 4.32 - 0.170 - b1 0.65 0.79 0.026 0.031 e 2.29 BSC 2.29 BSC b2 0.76 1.14 0.030 0.045 L 8.89 9.65 0.350 0.380 b3 0.76 1.04 0.030 0.041 L1 1.91 2.29 0.075 0.090 b4 4.95 5.46 0.195 0.215 L2 0.89 1.27 0.035 0.050 c 0.46 0.61 0.018 0.024 L3 1.14 1.52 0.045 0.060 c1 0.41 0.56 0.016 0.022 θ1 0' 15' 0' 15' c2 0.46 0.86 0.018 0.034 θ2 25' 35' 25' 35' D 5.97 6.22 0.235 0.245 ECN: S-82111-Rev. A, 15-Sep-08 DWG: 5968 Notes 1. Dimensioning and tolerancing per ASME Y14.5M-1994. 2. Dimension are shown in inches and millimeters. 3. Dimension D and E do not include mold flash. Mold flash shall not exceed 0.13 mm (0.005") per side. These dimensions are measured at the outermost extremes of the plastic body. 4. Thermal pad contour optional with dimensions b4, L2, E1 and D1. 5. Lead dimension uncontrolled in L3. 6. Dimension b1, b3 and c1 apply to base metal only. 7. Outline conforms to JEDEC outline TO-251AA. Document Number: 91362 www.vishay.com Revision: 15-Sep-08 1
Application Note 826 Vishay Siliconix RECOMMENDED MINIMUM PADS FOR DPAK (TO-252) 0.224 (5.690) 3 0) 4 8 2 1 0. 6. ( 0.420 10.668) ( 7 2) 8 0 0 2 0. 2. ( 0 6) 9 8 0 2 0. 2. ( 0.180 0.055 (4.572) (1.397) Recommended Minimum Pads Dimensions in Inches/(mm) Return to Index Return to Index A P P L I C A T I O N N O T E Document Number: 72594 www.vishay.com Revision: 21-Jan-08 3
Legal Disclaimer Notice www.vishay.com Vishay Disclaimer ALL PRODUCT, PRODUCT SPECIFICATIONS AND DATA ARE SUBJECT TO CHANGE WITHOUT NOTICE TO IMPROVE RELIABILITY, FUNCTION OR DESIGN OR OTHERWISE. Vishay Intertechnology, Inc., its affiliates, agents, and employees, and all persons acting on its or their behalf (collectively, “Vishay”), disclaim any and all liability for any errors, inaccuracies or incompleteness contained in any datasheet or in any other disclosure relating to any product. Vishay makes no warranty, representation or guarantee regarding the suitability of the products for any particular purpose or the continuing production of any product. To the maximum extent permitted by applicable law, Vishay disclaims (i) any and all liability arising out of the application or use of any product, (ii) any and all liability, including without limitation special, consequential or incidental damages, and (iii) any and all implied warranties, including warranties of fitness for particular purpose, non-infringement and merchantability. Statements regarding the suitability of products for certain types of applications are based on Vishay’s knowledge of typical requirements that are often placed on Vishay products in generic applications. Such statements are not binding statements about the suitability of products for a particular application. It is the customer’s responsibility to validate that a particular product with the properties described in the product specification is suitable for use in a particular application. Parameters provided in datasheets and / or specifications may vary in different applications and performance may vary over time. All operating parameters, including typical parameters, must be validated for each customer application by the customer’s technical experts. Product specifications do not expand or otherwise modify Vishay’s terms and conditions of purchase, including but not limited to the warranty expressed therein. Except as expressly indicated in writing, Vishay products are not designed for use in medical, life-saving, or life-sustaining applications or for any other application in which the failure of the Vishay product could result in personal injury or death. Customers using or selling Vishay products not expressly indicated for use in such applications do so at their own risk. Please contact authorized Vishay personnel to obtain written terms and conditions regarding products designed for such applications. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document or by any conduct of Vishay. Product names and markings noted herein may be trademarks of their respective owners. © 2017 VISHAY INTERTECHNOLOGY, INC. ALL RIGHTS RESERVED Revision: 08-Feb-17 1 Document Number: 91000
Mouser Electronics Authorized Distributor Click to View Pricing, Inventory, Delivery & Lifecycle Information: V ishay: IRFR320TRLPBF IRFR320TRPBF IRFR320TRRPBF IRFR320TR IRFR320TRL IRFR320TRR IRFU320 IRFR320PBF IRFU320PBF IRFR320 SIHFR320-GE3