IRFP250, SiHFP250 Vishay Siliconix Power MOSFET FEATURES PRODUCT SUMMARY • Dynamic dV/dt Rating V (V) 200 DS • Repetitive Avalanche Rated Available R (Ω) V = 10 V 0.085 DS(on) GS • Isolated Central Mounting Hole RoHS* Q (Max.) (nC) 140 g • Fast Switching COMPLIANT Q (nC) 28 gs • Ease of Paralleling Q (nC) 74 gd • Simple Drive Requirements Configuration Single • Compliant to RoHS Directive 2002/95/EC D DESCRIPTION TO-247AC Third generation Power MOSFETs from Vishay provide the designer with the best combination of fast switching, ruggedized device design, low on-resistance and G cost-effictiveness. The TO-220AB package is universially preferred for commercial-industrial applications where higher power S levels preclude the use of TO-220AB devices. The D S TO-247AC is similar but superior to the earlier TO-218 G N-Channel MOSFET package because of its isolated mounting hole. It also provides greater creepage distance between pins to meet the requirements of most safety specifications. ORDERING INFORMATION Package TO-247AC IRFP250PbF Lead (Pb)-free SiHFP250-E3 IRFP250 SnPb SiHFP250 ABSOLUTE MAXIMUM RATINGS (T = 25 °C, unless otherwise noted) C PARAMETER SYMBOL LIMIT UNIT Drain-Source Voltage V 200 DS V Gate-Source Voltage V ± 20 GS T = 25 °C 30 Continuous Drain Current V at 10 V C I GS T = 100 °C D 19 A C Pulsed Drain Currenta I 120 DM Linear Derating Factor 1.5 W/°C Single Pulse Avalanche Energyb E 410 mJ AS Repetitive Avalanche Currenta I 30 A AR Repetitive Avalanche Energya E 19 mJ AR Maximum Power Dissipation T = 25 °C P 190 W C D Peak Diode Recovery dV/dtc dV/dt 5.0 V/ns Operating Junction and Storage Temperature Range T , T - 55 to + 150 J stg °C Soldering Recommendations (Peak Temperature) for 10 s 300d 10 lbf · in Mounting Torque 6-32 or M3 screw 1.1 N · m Notes a. Repetitive rating; pulse width limited by maximum junction temperature (see fig. 11). b. V = 50 V, starting T = 25 °C, L = 683 μH, R = 25 Ω, I = 30 A (see fig. 12). DD J g AS c. I ≤ 30 A, dI/dt ≤ 190 A/μs, V ≤ V , T ≤ 150 °C. SD DD DS J d. 1.6 mm from case. * Pb containing terminations are not RoHS compliant, exemptions may apply Document Number: 91212 www.vishay.com S11-0445-Rev. B, 21-Mar-11 1 This datasheet is subject to change without notice. THE PRODUCT DESCRIBED HEREIN AND THIS DATASHEET ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000

IRFP250, SiHFP250 Vishay Siliconix THERMAL RESISTANCE RATINGS PARAMETER SYMBOL TYP. MAX. UNIT Maximum Junction-to-Ambient R - 40 thJA Case-to-Sink, Flat, Greased Surface R 0.24 - °C/W thCS Maximum Junction-to-Case (Drain) R - 0.65 thJC SPECIFICATIONS (T = 25 °C, unless otherwise noted) J PARAMETER SYMBOL TEST CONDITIONS MIN. TYP. MAX. UNIT Static Drain-Source Breakdown Voltage V V = 0 V, I = 250 μA 200 - - V DS GS D V Temperature Coefficient ΔV /T Reference to 25 °C, I = 1 mA - 0.27 - V/°C DS DS J D Gate-Source Threshold Voltage V V = V , I = 250 μA 2.0 - 4.0 V GS(th) DS GS D Gate-Source Leakage I V = ± 20 V - - ± 100 nA GSS GS V = 200 V, V = 0 V - - 25 DS GS Zero Gate Voltage Drain Current I μA DSS V = 160 V, V = 0 V, T = 125 °C - - 250 DS GS J Drain-Source On-State Resistance R V = 10 V I = 18 Ab - - 0.085 Ω DS(on) GS D Forward Transconductance g V = 50 V, I = 18 A 12 - - S fs DS D Dynamic Input Capacitance C - 2800 - iss V = 0 V, GS Output Capacitance C V = 25 V, - 780 - pF oss DS f = 1.0 MHz, see fig. 5 Reverse Transfer Capacitance C - 250 - rss Total Gate Charge Q - - 140 g I = 30 A, V = 160 V, Gate-Source Charge Qgs VGS = 10 V Dsee fig. 6D aSnd 13b - - 28 nC Gate-Drain Charge Qgd - - 74 Turn-On Delay Time t - 16 - d(on) RTuisren -TOimff eDelay Time tdt(or ff) Rg = 6V.2D DΩ =, R 1D0 0= V3,. 2ID Ω =, 3se0e A f,i g. 10b -- 8760 -- ns Fall Time t - 62 - f Internal Drain Inductance L Between lead, D - 5.0 - D 6 mm (0.25") from package and center of nH G Internal Source Inductance L die contact - 13 - S S Drain-Source Body Diode Characteristics MOSFET symbol Continuous Source-Drain Diode Current I D - - 30 S showing the integral reverse G A Pulsed Diode Forward Currenta ISM p - n junction diode S - - 120 Body Diode Voltage V T = 25 °C, I = 30 A, V = 0 Vb - - 2.0 V SD J S GS Body Diode Reverse Recovery Time t - 360 540 ns rr T = 25 °C, I = 30 A, dI/dt = 100 A/μs J F Body Diode Reverse Recovery Charge Q - 4.6 6.9 μC rr Forward Turn-On Time t Intrinsic turn-on time is negligible (turn-on is dominated by L and L ) on S D Notes a. Repetitive rating; pulse width limited by maximum junction temperature (see fig. 11). b. Pulse width ≤ 300 μs; duty cycle ≤ 2 %. www.vishay.com Document Number: 91212 2 S11-0445-Rev. B, 21-Mar-11 This datasheet is subject to change without notice. THE PRODUCT DESCRIBED HEREIN AND THIS DATASHEET ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000

IRFP250, SiHFP250 Vishay Siliconix TYPICAL CHARACTERISTICS (25 °C, unless otherwise noted) Fig. 1 - Typical Output Characteristics, T = 25 °C Fig. 3 - Typical Transfer Characteristics C Fig. 2 -Typical Output Characteristics, T = 150 °C Fig. 4 - Normalized On-Resistance vs. Temperature C Document Number: 91212 www.vishay.com S11-0445-Rev. B, 21-Mar-11 3 This datasheet is subject to change without notice. THE PRODUCT DESCRIBED HEREIN AND THIS DATASHEET ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000

IRFP250, SiHFP250 Vishay Siliconix Fig. 5 - Typical Capacitance vs. Drain-to-Source Voltage Fig. 7 - Typical Source-Drain Diode Forward Voltage Fig. 6 - Typical Gate Charge vs. Gate-to-Source Voltage Fig. 8 - Maximum Safe Operating Area www.vishay.com Document Number: 91212 4 S11-0445-Rev. B, 21-Mar-11 This datasheet is subject to change without notice. THE PRODUCT DESCRIBED HEREIN AND THIS DATASHEET ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000

IRFP250, SiHFP250 Vishay Siliconix R D V DS V GS D.U.T. R G + -VDD 10 V Pulse width ≤ 1 µs Duty factor ≤ 0.1 % Fig. 10a - Switching Time Test Circuit V DS 90 % 10 % V Fig. 9 - Maximum Drain Current vs. Case Temperature GS t t t t d(on) r d(off) f Fig. 10b - Switching Time Waveforms Fig. 11 - Maximum Effective Transient Thermal Impedance, Junction-to-Case L VDS V Vary tp to obtain DS tp required IAS VDD RG D.U.T + V I - DD A VDS AS 10 V tp 0.01 Ω I AS Fig. 12a - Unclamped Inductive Test Circuit Fig. 12b - Unclamped Inductive Waveforms Document Number: 91212 www.vishay.com S11-0445-Rev. B, 21-Mar-11 5 This datasheet is subject to change without notice. THE PRODUCT DESCRIBED HEREIN AND THIS DATASHEET ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000

IRFP250, SiHFP250 Vishay Siliconix Fig. 12c - Maximum Avalanche Energy vs. Drain Current Current regulator Same type as D.U.T. Q 50 kΩ G 10 V 12 V 0.2 µF 0.3 µF QGS QGD + V D.U.T. - DS V G V GS 3 mA Charge I I G D Current sampling resistors Fig. 13a - Basic Gate Charge Waveform Fig. 13b - Gate Charge Test www.vishay.com Document Number: 91212 6 S11-0445-Rev. B, 21-Mar-11 This datasheet is subject to change without notice. THE PRODUCT DESCRIBED HEREIN AND THIS DATASHEET ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000

IRFP250, SiHFP250 Vishay Siliconix Peak Diode Recovery dV/dt Test Circuit + Circuit layout considerations D.U.T. (cid:129) Low stray inductance (cid:129) Ground plane (cid:129) Low leakage inductance current transformer - + - + - Rg (cid:129) dV/dt controlled by Rg + (cid:129) Driver same type as D.U.T. V - DD (cid:129) ISD controlled by duty factor “D” (cid:129) D.U.T. - device under test Driver gate drive P.W. Period D = P.W. Period V = 10 Va GS D.U.T. l waveform SD Reverse recovery Body diode forward current current dI/dt D.U.T. V waveform DS Diode recovery dV/dt V DD Re-applied voltage Body diode forward drop Inductor current Ripple ≤ 5 % ISD Note a. V = 5 V for logic level devices GS Fig. 14 - For N-Channel Vishay Siliconix maintains worldwide manufacturing capability. Products may be manufactured at one of several qualified locations. Reliability data for Silicon Technology and Package Reliability represent a composite of all qualified locations. For related documents such as package/tape drawings, part marking, and reliability data, see www.vishay.com/ppg?91212. Document Number: 91212 www.vishay.com S11-0445-Rev. B, 21-Mar-11 7 This datasheet is subject to change without notice. THE PRODUCT DESCRIBED HEREIN AND THIS DATASHEET ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000

Package Information www.vishay.com Vishay Siliconix TO-247AC (High Voltage) 4 A A B E 7 ØP (Datum B) E/2 S A2 Ø kMDBM 3 R/2 ØP1 A D2 Q 2 x R 4 4 (2) D D1 1 2 3 D 4 Thermal pad 5 L1 C L 4 E1 See view B A 0.01MDBM 2 x b2 C View A - A 2 x e 3 x b b4 A1 0.10MCAM (b1, b3, b5) Planting Base metal Lead Assignments 1. Gate D DE E 2. Drain 3. Source C C (c) c1 4. Drain (b, b2, b4) (4) Section C - C, D - D, E - E View B MILLIMETERS INCHES MILLIMETERS INCHES DIM. MIN. MAX. MIN. MAX. DIM. MIN. MAX. MIN. MAX. A 4.58 5.31 0.180 0.209 D2 0.51 1.30 0.020 0.051 A1 2.21 2.59 0.087 0.102 E 15.29 15.87 0.602 0.625 A2 1.17 2.49 0.046 0.098 E1 13.72 - 0.540 - b 0.99 1.40 0.039 0.055 e 5.46 BSC 0.215 BSC b1 0.99 1.35 0.039 0.053 Ø k 0.254 0.010 b2 1.53 2.39 0.060 0.094 L 14.20 16.25 0.559 0.640 b3 1.65 2.37 0.065 0.093 L1 3.71 4.29 0.146 0.169 b4 2.42 3.43 0.095 0.135 N 7.62 BSC 0.300 BSC b5 2.59 3.38 0.102 0.133 Ø P 3.51 3.66 0.138 0.144 c 0.38 0.86 0.015 0.034 Ø P1 - 7.39 - 0.291 c1 0.38 0.76 0.015 0.030 Q 5.31 5.69 0.209 0.224 D 19.71 20.82 0.776 0.820 R 4.52 5.49 0.178 0.216 D1 13.08 - 0.515 - S 5.51 BSC 0.217 BSC ECN: X13-0103-Rev. D, 01-Jul-13 DWG: 5971 Notes 1.Dimensioning and tolerancing per ASME Y14.5M-1994. 2.Contour of slot optional. 3.Dimension D and E do not include mold flash. Mold flash shall not exceed 0.127 mm (0.005") per side. These dimensions are measured at the outermost extremes of the plastic body. 4.Thermal pad contour optional with dimensions D1 and E1. 5.Lead finish uncontrolled in L1. 6.Ø P to have a maximum draft angle of 1.5 to the top of the part with a maximum hole diameter of 3.91 mm (0.154"). 7.Outline conforms to JEDEC outline TO-247 with exception of dimension c. 8.Xian and Mingxin actually photo. Revision: 01-Jul-13 1 Document Number: 91360 For technical questions, contact: hvm@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000

Legal Disclaimer Notice www.vishay.com Vishay Disclaimer  ALL PRODUCT, PRODUCT SPECIFICATIONS AND DATA ARE SUBJECT TO CHANGE WITHOUT NOTICE TO IMPROVE RELIABILITY, FUNCTION OR DESIGN OR OTHERWISE. Vishay Intertechnology, Inc., its affiliates, agents, and employees, and all persons acting on its or their behalf (collectively, “Vishay”), disclaim any and all liability for any errors, inaccuracies or incompleteness contained in any datasheet or in any other disclosure relating to any product. Vishay makes no warranty, representation or guarantee regarding the suitability of the products for any particular purpose or the continuing production of any product. To the maximum extent permitted by applicable law, Vishay disclaims (i) any and all liability arising out of the application or use of any product, (ii) any and all liability, including without limitation special, consequential or incidental damages, and (iii) any and all implied warranties, including warranties of fitness for particular purpose, non-infringement and merchantability. Statements regarding the suitability of products for certain types of applications are based on Vishay’s knowledge of typical requirements that are often placed on Vishay products in generic applications. Such statements are not binding statements about the suitability of products for a particular application. It is the customer’s responsibility to validate that a particular product with the properties described in the product specification is suitable for use in a particular application. Parameters provided in datasheets and / or specifications may vary in different applications and performance may vary over time. All operating parameters, including typical parameters, must be validated for each customer application by the customer’s technical experts. Product specifications do not expand or otherwise modify Vishay’s terms and conditions of purchase, including but not limited to the warranty expressed therein. Except as expressly indicated in writing, Vishay products are not designed for use in medical, life-saving, or life-sustaining applications or for any other application in which the failure of the Vishay product could result in personal injury or death. Customers using or selling Vishay products not expressly indicated for use in such applications do so at their own risk. Please contact authorized Vishay personnel to obtain written terms and conditions regarding products designed for such applications. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document or by any conduct of Vishay. Product names and markings noted herein may be trademarks of their respective owners. © 2017 VISHAY INTERTECHNOLOGY, INC. ALL RIGHTS RESERVED Revision: 08-Feb-17 1 Document Number: 91000

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