IPD90R1K2C3 CoolMOS™ Power Transistor Product Summary Features V @ T =25°C 900 V DS J • Lowest figure-of-merit R x Q ON g R @T =25°C 1.2 Ω DS(on),max J • Extreme dv/dt rated Q 28 nC g,typ • High peak current capability • Qualified according to JEDEC1) for target applications • Pb-free lead plating; RoHS compliant • Ultra low gate charge PG-TO252 CoolMOS™ 900V is designed for: • Quasi Resonant Flyback / Forward topologies • PC Silverbox and consumer applications • Industrial SMPS Type Package Marking IPD90R1K2C3 PG-TO252 9R1K2C Maximum ratings, at T =25 °C, unless otherwise specified J Parameter Symbol Conditions Value Unit Continuous drain current I T =25 °C 5.1 A D C T =100 °C 3.2 C Pulsed drain current 2) ID,pulse TC=25 °C 10 Avalanche energy, single pulse E I =0.92 A, V =50 V 68 mJ AS D DD Avalanche energy, repetitive t 2),3) E I =0.92 A, V =50 V 0.31 AR AR D DD Avalanche current, repetitive t 2),3) I 0.92 A AR AR MOSFET dv/dt ruggedness dv/dt V =0...400 V 50 V/ns DS Gate source voltage V static ±20 V GS AC (f>1 Hz) ±30 Power dissipation P T =25 °C 83 W tot C Operating and storage temperature T , T -55 ... 150 °C J stg Rev. 1.0 page 1 2008-07-29

IPD90R1K2C3 Maximum ratings, at T =25 °C, unless otherwise specified J Parameter Symbol Conditions Value Unit Continuous diode forward current I 2.8 A S T =25 °C C Diode pulse current 2) IS,pulse 11 Reverse diode dv/dt 4) dv/dt 4 V/ns Parameter Symbol Conditions Values Unit min. typ. max. Thermal characteristics Thermal resistance, junction - case R - - 1.5 K/W thJC Thermal resistance, junction - R leaded - - 62 ambient thJA Soldering temperature, 1.6 mm (0.063 in.) T - - 260 °C wavesoldering only allowed at leads sold from case for 10 s Electrical characteristics, at T =25 °C, unless otherwise specified J Static characteristics Drain-source breakdown voltage V V =0 V, I =250 µA 900 - - V (BR)DSS GS D Gate threshold voltage V V =V , I =0.31 mA 2.5 3 3.5 GS(th) DS GS D V =900 V, V =0 V, Zero gate voltage drain current I DS GS - - 1 µA DSS T=25 °C j V =900 V, V =0 V, DS GS - 10 - T=150 °C j Gate-source leakage current I V =20 V, V =0 V - - 100 nA GSS GS DS V =10 V, I =2.8 A, Drain-source on-state resistance R GS D - 0.94 1.2 Ω DS(on) T=25 °C j V =10 V, I =2.8 A, GS D - 2.5 - T=150 °C j Gate resistance R f=1 MHz, open drain - 1.3 - Ω G Rev. 1.0 page 2 2008-07-29

IPD90R1K2C3 Parameter Symbol Conditions Values Unit min. typ. max. Dynamic characteristics Input capacitance C - 710 - pF iss V =0 V, V =100 V, GS DS f=1 MHz Output capacitance C - 35 - oss Effective output capacitance, energy C - 23 - related 5) o(er) V =0 V, V =0 V GS DS to 500 V Effective output capacitance, time C - 86 - related 6) o(tr) Turn-on delay time t - 70 - ns d(on) V =400 V, Rise time t DD - 20 - r V =10 V, I =2.8 A, GS D Turn-off delay time td(off) RG=81.3 Ω - 400 - Fall time t - 40 - f Gate Charge Characteristics Gate to source charge Q - 3.2 - nC gs Gate to drain charge Qgd V =400 V, I =2.8 A, - 12 - DD D V =0 to 10 V Gate charge total Q GS - 28 tbd g Gate plateau voltage V - 4.6 - V plateau Reverse Diode V =0 V, I =2.8 A, Diode forward voltage V GS F - 0.8 1.2 V SD T=25 °C j Reverse recovery time t - 310 - ns rr V =400 V, I =I , Reverse recovery charge Q R F S - 3.7 - µC rr di /dt=100 A/µs F Peak reverse recovery current I - 19 - A rrm 1) J-STD20 and JESD22 2) Pulse width t limited by T p J,max 3) Repetitive avalanche causes additional power losses that can be calculated as P =E *f. AV AR 4) I ≤I , di/dt≤200A/µs, V =400V, V <V , T<T , identical low side and high side switch SD D DClink peak (BR)DSS J J,max 5) C is a fixed capacitance that gives the same stored energy as C while V is rising from 0 to 50% V . o(er) oss DS DSS 6) C is a fixed capacitance that gives the same charging time as C while V is rising from 0 to 50% V o(tr) oss DS DSS. Rev. 1.0 page 3 2008-07-29

IPD90R1K2C3 1 Power dissipation 2 Safe operating area P =f(T ) I =f(V ); T =25 °C; D=0 tot C D DS C parameter: t p 90 102 limited by on-state resistance 80 70 60 101 100 µs 10 µs 1 µs 1 ms W] 50 A] [ot [D Pt 40 I DC 10 ms 30 100 20 10 0 10-1 0 25 50 75 100 125 150 1 10 100 1000 T [°C] V [V] C DS 3 Max. transient thermal impedance 4 Typ. output characteristics Z =f(t ) I =f(V ); T =25 °C thJC P D DS J parameter: D=t /T parameter: V p GS 111000111 15 20 V 10 V 8 V 6 V 111000000 10 5.5 V 000...555 W]W]W] K/K/K/ 000...222 A] [ [ [thJCthJCthJC 000...111 I [D ZZZ 000...000555 111000---111 00..000022.0.02100..0011 5 5 V single pulse ssiinnggllee ppuullssee 4.5 V 4 V 111000---222 0 111000---555 111000---444 111000---333 111000---222 111000---111 0 5 10 15 20 25 ttt [[[sss]]] V [V] ppp DS Rev. 1.0 page 4 2008-07-29

IPD90R1K2C3 5 Typ. output characteristics 6 Typ. drain-source on-state resistance I =f(V ); T =150 °C R =f(I ); T =150 °C D DS J DS(on) D J parameter: V parameter: V GS GS 7 14 20 V 10 V 6 8 V 12 6 V 5.5 V 5 V 5 10 4.5 V 4 Ω] 8 [A]D [S(on) 10 V I D 3 R 6 5 V 4 V 4.8 V 2 4 4.5 V 4 V 1 2 0 0 0 5 10 15 20 25 0 2 4 6 8 10 V [V] I [A] DS D 7 Drain-source on-state resistance 8 Typ. transfer characteristics R =f(T ); I =2.8 A; V =10 V I =f(V ); V =20V DS(on) J D GS D GS DS parameter: T J 3.5 15 3 25 °C 2.5 10 Ω] 2 [S(on) [A]D D I R 1.5 98 % 150 °C 5 typ 1 0.5 0 0 -60 -20 20 60 100 140 180 0 2 4 6 8 10 T [°C] V [V] j GS Rev. 1.0 page 5 2008-07-29

IPD90R1K2C3 9 Typ. gate charge 10 Forward characteristics of reverse diode V =f(Q ); I =2.8 A pulsed I =f(V ) GS gate D F SD parameter: V parameter: T DD J 10 102 8 25 °C, 98% 150 °C, 98% 400 V 101 6 V [V]GS 720 V I [A]F 25 °C 4 150 °C 100 2 0 10-1 0 10 20 30 0 0.5 1 1.5 2 Q [nC] V [V] gate SD 11 Avalanche energy 12 Drain-source breakdown voltage E =f(T); I =0.92 A; V =50 V V =f(T); I =0.25 mA AS j D DD BR(DSS) j D 70 1050 60 1000 50 950 mJ] 40 [V]S) [AS R(DS E 30 B V 900 20 850 10 0 800 25 50 75 100 125 150 -60 -20 20 60 100 140 180 T [°C] T [°C] J J Rev. 1.0 page 6 2008-07-29

IPD90R1K2C3 13 Typ. capacitances 14 Typ. C stored energy oss C=f(V ); V =0 V; f=1 MHz E =f(V ) DS GS oss DS 10000 4 1000 Ciss 3 F] µJ] C [p 100 [oss 2 E Coss 10 1 Crss 1 0 0 100 200 300 400 500 600 0 100 200 300 400 500 600 V [V] V [V] DS DS Rev. 1.0 page 7 2008-07-29

IPD90R1K2C3 Definition of diode switching characteristics Rev. 1.0 page 8 2008-07-29

IPD90R1K2C3 PG-TO252 Outlines Dimensions in mm/inches Rev. 1.0 page 9 2008-07-29

IPD90R1K2C3 Published by Infineon Technologies AG 81726 Munich, Germany © 2008 Infineon Technologies AG All Rights Reserved. Legal Disclaimer The information given in this document shall in no event be regarded as a guarantee of conditions or characteristics. With respect to any examples or hints given herein, any typical values stated herein and/or any information regarding the application of the device, Infineon Technologies hereby disclaims any and all warranties and liabilities of any kind, including without limitation, warranties of non-infringement of intellectual property rights of any third party. Information For further information on technology, delivery terms and conditions and prices, please contact the nearest Infineon Technologies Office (www.infineon.com). Warnings Due to technical requirements, components may contain dangerous substances. For information on the types in question, please contact the nearest Infineon Technologies Office. Infineon Technologies components may be used in life-support devices or systems only with the express written approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure of that life-support device or system or to affect the safety or effectiveness of that device or system. Life support devices or systems are intended to be implanted in the human body or to support and/or maintain and sustain and/or protect human life. If they fail, it is reasonable to assume that the health of the user or other persons may be endangered. Rev. 1.0 page 10 2008-07-29

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