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IP4294CZ10-TBR XSON10 ESD protection for ultra high-speed interfaces Rev. 4 — 1 November 2013 Product data sheet 1. Product profile 1.1 General description The device is designed to protect high-speed interfaces such as SuperSpeed USB, High-Definition Multimedia Interface(HDMI), DisplayPort, external Serial Advanced Technology Attachment(eSATA) and Low Voltage Differential Signaling(LVDS) interfaces against ElectroStatic Discharge(ESD). The device includes four high-level ESDprotection diode structures for ultra high-speed signal lines and is encapsulated in a leadless small DFN2510A-10(SOT1176-1) plastic package. All signal lines are protected by a special diode configuration offering ultra low line capacitance of only 0.5pF. These diodes utilize a unique snap-back structure in order to provide protection to downstream components from ESDvoltages up to 10kV contact exceeding IEC61000-4-2, level4. 1.2 Features and benefits  System ESD protection for USB2.0 and SuperSpeed USB3.0, HDMI, DisplayPort, eSATA and LVDS  All signal lines with integrated rail-to-rail clamping diodes for downstream ESDprotection of 10kV exceeding IEC61000-4-2, level4  Matched 0.5mm trace spacing  Signal lines with 0.05pF matching capacitance between signal pairs  Line capacitance of only 0.5pF for each channel  Design-friendly ‘pass-through’ signal routing 1.3 Applications The device is designed for high-speed receiver and transmitter port protection:  TVs and monitors  DVD recorders and players  Notebooks, main board graphic cards and ports  Set-top boxes and game consoles

IP4294CZ10-TBR NXP Semiconductors ESD protection for ultra high-speed interfaces 2. Pinning information Table 1. Pinning Pin Symbol Description Simplified outline Graphic symbol 1 CH1 channel 1 ESDprotection 10 9 8 7 6 1 2 4 5 2 CH2 channel 2 ESDprotection 3 GND ground 4 CH3 channel 3 ESDprotection 1 2 3 4 5 5 CH4 channel 4 ESDprotection Transparent top view 6 n.c. not connected 3, 8 018aaa001 7 n.c. not connected 8 GND ground 9 n.c. not connected 10 n.c. not connected 3. Ordering information Table 2. Ordering information Type number Package Name Description Version IP4294CZ10-TBR DFN2510A-10 plastic extremely thin small outline package; SOT1176-1 noleads; 10terminals; body 12.50.5mm 4. Marking Table 3. Marking codes Type number Marking code IP4294CZ10-TBR 94 5. Limiting values Table 4. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Parameter Conditions Min Max Unit V input voltage 0.5 +5.5 V I V electrostatic discharge IEC61000-4-2, level4 [1] ESD voltage contactdischarge 10 +10 kV air discharge 15 +15 kV T ambient temperature 40 +85 C amb T storage temperature 55 +125 C stg [1] All pins to ground. IP4294CZ10-TBR All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved. Product data sheet Rev. 4 — 1 November 2013 2 of 12

IP4294CZ10-TBR NXP Semiconductors ESD protection for ultra high-speed interfaces 6. Characteristics Table 5. Characteristics T =25C unless otherwise specified. amb Symbol Parameter Conditions Min Typ Max Unit V breakdownvoltage I =1mA 6 - - V BR I I reverse leakage current per channel; V =3V - - 1 A LR I V forward voltage I =1mA - 0.7 - V F I C line capacitance f=1MHz; V =3.3V [1] - 0.5 0.6 pF line I C line capacitance f=1MHz; V =3.3V [1] - 0.05 - pF line I difference r dynamic resistance surge [2] dyn positive transient - 0.36 -  negative transient - 0.35 -  TLP [3] positive transient - 0.41 -  negative transient - 0.34 -  V clamping voltage I =4A [2] CL PP positive transient - 4.1 - V I =4A [2] PP negative transient - 2.2 - V [1] This parameter is guaranteed by design. [2] According to IEC61000-4-5 (8/20s current waveform). [3] 100ns Transmission Line Pulse(TLP); 50; pulser at 80ns. IP4294CZ10-TBR All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved. Product data sheet Rev. 4 — 1 November 2013 3 of 12

IP4294CZ10-TBR NXP Semiconductors ESD protection for ultra high-speed interfaces aaa-009367 aaa-009368 2 1.2 Sdd21 (dB) a -2 0.8 -6 0.4 -10 -14 0 106 107 108 109 1010 0 1 2 3 4 5 f (MHz) VI (V) differential mode C a = ---------------l--i--n--e------------ C lineV =0 V I Fig 1. Insertion loss; typical values Fig 2. Relative capacitance as a function of input voltage; typical values aaa-009369 aaa-009370 0 120 Zdif Sdd21 (Ω) (dB) 110 -20 (2) 100 -40 90 (1) -60 80 106 107 108 109 1010 40.0 40.5 41.0 41.5 42.0 f (MHz) t (ns) Sdd21 normalized to 100; tr=200ps; differential pair CH1+CH2 differentialpairsCH1/CH2versusCH3/CH4 (1) IP4294CZ10-TBR on reference board (2) Reference board without device under test (DUT) Fig 3. Crosstalk; typical values Fig 4. Differential Time Domain Reflectometer(TDR) plot; typical values IP4294CZ10-TBR All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved. Product data sheet Rev. 4 — 1 November 2013 4 of 12

IP4294CZ10-TBR NXP Semiconductors ESD protection for ultra high-speed interfaces 018aaa206 018aaa207 5 0 IPP IPP (A) (A) 4 -0.9 3 -1.8 2 -2.7 1 -3.6 0 -4.5 0 1 2 3 4 5 -2.5 -2.0 -1.5 -1.0 -0.5 0 VCL (V) VCL (V) IEC61000-4-5; tp=8/20s; positive pulse IEC61000-4-5; tp=8/20s; negative pulse Fig 5. Dynamic resistance with positive clamping; Fig 6. Dynamic resistance with negative clamping; typical values typical values aaa-009373 aaa-009374 14 0 I I (A) (A) 12 -2 10 -4 8 -6 6 -8 4 -10 2 -12 0 -14 0 4 8 12 -6 -4 -2 0 VCL (V) VCL (V) t =100ns; Transmission Line Pulse(TLP) t =100ns; Transmission Line Pulse(TLP) p p Fig 7. Dynamic resistance with positive clamping; Fig 8. Dynamic resistance with negative clamping; typical values typical values The device uses an advanced clamping structure showing a negative dynamic resistance. This snap-back behavior strongly reduces the clamping voltage to the system behind the ESD protection during an ESD event. Do not connect unlimited DC current sources to the data lines to avoid keeping the ESD protection device in snap-back state after exceeding breakdown voltage (due to an ESD pulse for instance). IP4294CZ10-TBR All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved. Product data sheet Rev. 4 — 1 November 2013 5 of 12

IP4294CZ10-TBR NXP Semiconductors ESD protection for ultra high-speed interfaces 7. Application information The device is designed to provide high-level ESDprotection for high-speed serial databuses such as HDMI, DisplayPort, eSATA and LVDS data lines. When designing the Printed-Circuit Board(PCB), give careful consideration to impedance matching and signal coupling. Do not connect the signal lines to unlimited current sources like, for example, a battery. A basic application diagram for the ESD protection of an HDMI interface is shown in Figure9. IP4294CZ10-TBR TMDS_D2+ TMDS_CH2+ 5 TMDS_GND TMDS_CH2– 4 TMDS_D2– GND 8 3 TMDS_D1+ TMDS_CH1+ 2 TMDS_GND TMDS_CH1– 1 TMDS_D1– IP4294CZ10-TBR TMDS_D0+ TMDS_CH2+ 5 TMDS_GND TMDS_CH2– 4 TMDS_D0– GND 8 3 TMDS_CLK+ HDMI TMDS_CH1+ CONNECTOR 2 TMDS_GND TMDS_CH1– 1 TMDS_CLK- CEC n.c. DDC_CLK DDC_DAT GND +5 V HOT PLUG DETECTION 6 5 4 IP4221CZ6 100 nF 1 2 3 018aaa174 Fig 9. Application diagram of HDMI ESD protection using IP4294CZ10-TBR IP4294CZ10-TBR All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved. Product data sheet Rev. 4 — 1 November 2013 6 of 12

IP4294CZ10-TBR NXP Semiconductors ESD protection for ultra high-speed interfaces 8. Package outline 1.1 0.9 0.127 0.2 min 5 6 2.6 0.25 2 2.4 0.15 0.5 1 10 0.4 0.45 0.3 0.05 max 0.35 0.5 max Dimensions in mm 12-05-23 Fig 10. Package outline DFN2510A-10(SOT1176-1) IP4294CZ10-TBR All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved. Product data sheet Rev. 4 — 1 November 2013 7 of 12

IP4294CZ10-TBR NXP Semiconductors ESD protection for ultra high-speed interfaces 9. Soldering Footprint information for reflow soldering of DFN2510A-10 package SOT1176-1 Hx C Hy Ay By 0.05 D P 0.05 Generic footprint pattern Refer to the package outline drawing for actual layout solder land solder paste deposit solder land plus solder paste occupied area solder resist Dimensions in mm Remark: P Ay By C D Hx Hy Stencil of 75 μm is recommended. A stencil of 75 μm gives an aspect ratio of 0.77 0.5 1.25 0.3 0.475 0.2 2.45 1.5 With a stencil of 100 μm one will obtain an aspect ratio of 0.58 sot1176-1_fr Fig 11. Reflow soldering footprint DFN2510A-10(SOT1176-1) IP4294CZ10-TBR All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved. Product data sheet Rev. 4 — 1 November 2013 8 of 12

IP4294CZ10-TBR NXP Semiconductors ESD protection for ultra high-speed interfaces 10. Revision history Table 6. Revision history Document ID Release date Data sheet status Change notice Supersedes IP4294CZ10-TBRv.4 20131101 Product data sheet - IP4294CZ10-TBRv.3 Modifications: • Measurements updated after silicon manufacturing transfer. IP4294CZ10-TBRv.3 20120224 Product data sheet - IP4294CZ10-TBRv.2 IP4294CZ10-TBRv.2 20120229 Preliminary data sheet - IP4294CZ10-TBRv.1 IP4294CZ10-TBRv.1 20111125 Preliminary data sheet - - IP4294CZ10-TBR All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved. Product data sheet Rev. 4 — 1 November 2013 9 of 12

IP4294CZ10-TBR NXP Semiconductors ESD protection for ultra high-speed interfaces 11. Legal information 11.1 Data sheet status Document status[1][2] Product status[3] Definition Objective [short] data sheet Development This document contains data from the objective specification for product development. Preliminary [short] data sheet Qualification This document contains data from the preliminary specification. Product [short] data sheet Production This document contains the product specification. [1] Please consult the most recently issued document before initiating or completing a design. [2] The term ‘short data sheet’ is explained in section “Definitions”. [3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URLhttp://www.nxp.com. 11.2 Definitions Suitability for use — NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in life support, life-critical or safety-critical systems or equipment, nor in applications where failure or Draft — The document is a draft version only. The content is still under malfunction of an NXP Semiconductors product can reasonably be expected internal review and subject to formal approval, which may result in to result in personal injury, death or severe property or environmental modifications or additions. NXP Semiconductors does not give any damage. NXP Semiconductors and its suppliers accept no liability for representations or warranties as to the accuracy or completeness of inclusion and/or use of NXP Semiconductors products in such equipment or information included herein and shall have no liability for the consequences of applications and therefore such inclusion and/or use is at the customer’s own use of such information. risk. Short data sheet — A short data sheet is an extract from a full data sheet Applications — Applications that are described herein for any of these with the same product type number(s) and title. A short data sheet is intended products are for illustrative purposes only. NXP Semiconductors makes no for quick reference only and should not be relied upon to contain detailed and representation or warranty that such applications will be suitable for the full information. For detailed and full information see the relevant full data specified use without further testing or modification. sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the Customers are responsible for the design and operation of their applications full data sheet shall prevail. and products using NXP Semiconductors products, and NXP Semiconductors accepts no liability for any assistance with applications or customer product Product specification — The information and data provided in a Product design. 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NXP Semiconductors takes no Limiting values — Stress above one or more limiting values (as defined in responsibility for the content in this document if provided by an information the Absolute Maximum Ratings System of IEC60134) will cause permanent source outside of NXP Semiconductors. damage to the device. Limiting values are stress ratings only and (proper) operation of the device at these or any other conditions above those given in In no event shall NXP Semiconductors be liable for any indirect, incidental, the Recommended operating conditions section (if present) or the punitive, special or consequential damages (including - without limitation - lost Characteristics sections of this document is not warranted. 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In case an individual with the Terms and conditions of commercial sale of NXP Semiconductors. agreement is concluded only the terms and conditions of the respective agreement shall apply. NXP Semiconductors hereby expressly objects to Right to make changes — NXP Semiconductors reserves the right to make applying the customer’s general terms and conditions with regard to the changes to information published in this document, including without purchase of NXP Semiconductors products by customer. limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior No offer to sell or license — Nothing in this document may be interpreted or to the publication hereof. construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. IP4294CZ10-TBR All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved. Product data sheet Rev. 4 — 1 November 2013 10 of 12

IP4294CZ10-TBR NXP Semiconductors ESD protection for ultra high-speed interfaces Export control — This document as well as the item(s) described herein product for such automotive applications, use and specifications, and (b) may be subject to export control regulations. Export might require a prior whenever customer uses the product for automotive applications beyond authorization from competent authorities. NXP Semiconductors’ specifications such use shall be solely at customer’s own risk, and (c) customer fully indemnifies NXP Semiconductors for any Quick reference data — The Quick reference data is an extract of the liability, damages or failed product claims resulting from customer design and product data given in the Limiting values and Characteristics sections of this use of the product for automotive applications beyond NXP Semiconductors’ document, and as such is not complete, exhaustive or legally binding. standard warranty and NXP Semiconductors’ product specifications. Non-automotive qualified products — Unless this data sheet expressly Translations — A non-English (translated) version of a document is for states that this specific NXP Semiconductors product is automotive qualified, reference only. The English version shall prevail in case of any discrepancy the product is not suitable for automotive use. It is neither qualified nor tested between the translated and English versions. in accordance with automotive testing or application requirements. NXP Semiconductors accepts no liability for inclusion and/or use of non-automotive qualified products in automotive equipment or applications. 11.4 Trademarks In the event that customer uses the product for design-in and use in automotive applications to automotive specifications and standards, customer Notice: All referenced brands, product names, service names and trademarks (a) shall use the product without NXP Semiconductors’ warranty of the are the property of their respective owners. 12. Contact information For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com IP4294CZ10-TBR All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved. Product data sheet Rev. 4 — 1 November 2013 11 of 12

IP4294CZ10-TBR NXP Semiconductors ESD protection for ultra high-speed interfaces 13. Contents 1 Product profile. . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.1 General description . . . . . . . . . . . . . . . . . . . . . 1 1.2 Features and benefits. . . . . . . . . . . . . . . . . . . . 1 1.3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 2 Pinning information. . . . . . . . . . . . . . . . . . . . . . 2 3 Ordering information. . . . . . . . . . . . . . . . . . . . . 2 4 Marking. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 5 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 2 6 Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . 3 7 Application information. . . . . . . . . . . . . . . . . . . 6 8 Package outline. . . . . . . . . . . . . . . . . . . . . . . . . 7 9 Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 10 Revision history. . . . . . . . . . . . . . . . . . . . . . . . . 9 11 Legal information. . . . . . . . . . . . . . . . . . . . . . . 10 11.1 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 10 11.2 Definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 11.3 Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . . 10 11.4 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 11 12 Contact information. . . . . . . . . . . . . . . . . . . . . 11 13 Contents. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 Please be aware that important notices concerning this document and the product(s) described herein, have been included in section ‘Legal information’. © NXP B.V. 2013. All rights reserved. For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com Date of release: 1 November 2013 Document identifier: IP4294CZ10-TBR