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IP4285CZ9-TBB XSON9 ESD protection for high-speed interfaces Rev. 3 — 7 April 2014 Product data sheet 1. Product profile 1.1 General description The device is designed to protect high-speed interfaces such as High-Definition Multimedia Interface(HDMI), DisplayPort, USB, external Serial Advanced Technology Attachment(eSATA) and Low Voltage Differential Signaling(LVDS) interfaces against ElectroStatic Discharge(ESD). The device includes high-level ESDprotection diodes for high-speed signal lines in an ultra small and leadless plastic package DFN2110-9(SOT1178-1/XSON9). The extremely small package dimensions (2.1 mm1 mm0.5mm) make this product ideally suitable for portable devices. The pinout is designed for convenient flow-through routing of high-speed signal lines. All signal lines are protected by a special diode configuration offering ultra low line capacitance of 0.85pF maximum. These diodes provide protection to downstream components from ESDvoltages up to 12kV contact according to IEC61000-4-2, level4. 1.2 Features and benefits  System ESDprotection for USB2.0, HDMI1.3 and HDMI1.4, DisplayPort, eSATA andLVDS  All signal lines with integrated rail-to-rail clamping diodes for downstream ESDprotection of 12kV according to IEC61000-4-2, level4  Matched 0.4mm pitch trace spacing  Line capacitance of 0.85pF maximum for each channel  Design-friendly’flow-through’signal routing 1.3 Applications The device is designed for high-speed receiver and transmitter port protection:  Portable devices  Mobile handsets  TVs, monitors  DVD recorders and players  Notebooks, mother boards, graphic cards and ports  Set-top boxes and game consoles

IP4285CZ9-TBB NXP Semiconductors ESD protection for high-speed interfaces 2. Pinning information Table 1. Pinning Pin Description Simplified outline Graphic symbol 1 ESD protection 1 2 4 5 2 ESD protection 9 8 7 6 3 3 ground 1 2 4 5 4 ESD protection Transparent top view 5 ESD protection 6 not connected 3 7 not connected 018aaa116 8 not connected 9 not connected 3. Ordering information Table 2. Ordering information Type number Package Name Description Version IP4285CZ9-TBB DFN2110-9 ultra small and leadless plastic package; SOT1178-1 (XSON9) 9terminals; body 2.110.5mm 4. Marking Table 3. Marking codes Type number Marking code IP4285CZ9-TBB 85 5. Limiting values Table 4. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Parameter Conditions Min Max Unit V input voltage 0.5 +5.5 V I V electrostatic discharge pins 1, 2, 4, 5 to ground; - 12 kV ESD voltage IEC61000-4-2, level4; contactdischarge T ambient temperature 40 +85 C amb T storage temperature 55 +125 C stg IP4285CZ9-TBB All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 3 — 7 April 2014 2 of 12

IP4285CZ9-TBB NXP Semiconductors ESD protection for high-speed interfaces 6. Characteristics Table 5. Characteristics T =25C unless otherwise specified. amb Symbol Parameter Conditions Min Typ Max Unit V breakdownvoltage I =1mA 6 - 9 V BR test I reverse leakage current per channel; - - 1 A RM V =5.0V I V forward voltage - 0.7 - V F C line capacitance f=1MHz [1] line V =0V - - 0.85 pF bias V =2.5V - - 0.75 pF bias C line capacitance f=1MHz; [1] - - 0.1 pF line difference V =2.5V bias r dynamic resistance TLP [2] dyn positive transient - 0.42 -  negative transient - 0.33 -  surge [3] positive transient - 0.42 -  negative transient - 0.33 -  V clamping voltage I =4A [3] CL PP positive transient - 3.9 - V negative transient - 2.3 - V [1] This parameter is guaranteed by design. [2] 100ns TransmissionLinePulse(TLP); 50; pulser at 80ns. [3] According to IEC61000-4-5. IP4285CZ9-TBB All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 3 — 7 April 2014 3 of 12

IP4285CZ9-TBB NXP Semiconductors ESD protection for high-speed interfaces (cid:68)(cid:68)(cid:68)(cid:16)(cid:19)(cid:19)(cid:28)(cid:27)(cid:21)(cid:26) aaa-009828 (cid:19) 0 S21 (cid:54)(cid:71)(cid:71)(cid:21)(cid:20) (dB) (cid:11)(cid:71)(cid:37)(cid:12) -20 (cid:16)(cid:23) -40 (cid:16)(cid:27) -60 (cid:16)(cid:20)(cid:21) -80 (cid:20) (cid:20)(cid:19) (cid:20)(cid:19)(cid:21) (cid:20)(cid:19)(cid:22) (cid:20)(cid:19)(cid:23) 10 102 103 104 (cid:73)(cid:3)(cid:11)(cid:48)(cid:43)(cid:93)(cid:12) f (MHz) Differential mode Fig 1. Insertion loss, typical values Fig 2. Crosstalk response curves, typical values (cid:68)(cid:68)(cid:68)(cid:16)(cid:19)(cid:19)(cid:28)(cid:27)(cid:21)(cid:28) (cid:20)(cid:17)(cid:21)(cid:19) (cid:68) (cid:19)(cid:17)(cid:27)(cid:19) (cid:19)(cid:17)(cid:23)(cid:19) (cid:19)(cid:17)(cid:19)(cid:19) (cid:19) (cid:21) (cid:23) (cid:25) (cid:57)(cid:44)(cid:3)(cid:11)(cid:57)(cid:12) C a = ---------l--i-n---e----T---M-----D---S-------- C lineTMDSV I Fig 3. Relative channel capacitance as a function of bias voltage, typical values IP4285CZ9-TBB All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 3 — 7 April 2014 4 of 12

IP4285CZ9-TBB NXP Semiconductors ESD protection for high-speed interfaces (cid:68)(cid:68)(cid:68)(cid:16)(cid:19)(cid:19)(cid:28)(cid:27)(cid:22)(cid:19) (cid:68)(cid:68)(cid:68)(cid:16)(cid:19)(cid:19)(cid:28)(cid:27)(cid:22)(cid:20) (cid:25) (cid:19) (cid:44) (cid:44) (cid:11)(cid:36)(cid:12) (cid:11)(cid:36)(cid:12) (cid:23) (cid:16)(cid:21) (cid:21) (cid:16)(cid:23) (cid:19) (cid:16)(cid:25) (cid:19) (cid:20) (cid:21) (cid:22) (cid:23) (cid:24) (cid:16)(cid:22) (cid:16)(cid:21) (cid:16)(cid:20) (cid:19) (cid:57)(cid:38)(cid:47)(cid:3)(cid:11)(cid:57)(cid:12) (cid:57)(cid:38)(cid:47)(cid:3)(cid:11)(cid:57)(cid:12) IEC61000-4-5; tp=8/20s; positive pulse IEC61000-4-5; tp=8/20s; negative pulse Fig 4. Dynamic resistance with positive clamping Fig 5. Dynamic resistance with negative clamping (cid:68)(cid:68)(cid:68)(cid:16)(cid:19)(cid:19)(cid:28)(cid:27)(cid:22)(cid:21) (cid:68)(cid:68)(cid:68)(cid:16)(cid:19)(cid:19)(cid:28)(cid:27)(cid:22)(cid:22) (cid:20)(cid:25) (cid:19) (cid:44) (cid:44) (cid:11)(cid:36)(cid:12) (cid:11)(cid:36)(cid:12) (cid:20)(cid:21) (cid:16)(cid:23) (cid:27) (cid:16)(cid:27) (cid:23) (cid:16)(cid:20)(cid:21) (cid:19) (cid:16)(cid:20)(cid:25) (cid:19) (cid:23) (cid:27) (cid:20)(cid:21) (cid:16)(cid:27) (cid:16)(cid:25) (cid:16)(cid:23) (cid:16)(cid:21) (cid:19) (cid:57)(cid:38)(cid:47)(cid:3)(cid:11)(cid:57)(cid:12) (cid:57)(cid:38)(cid:47)(cid:3)(cid:11)(cid:57)(cid:12) t =100ns; Transmission Line Pulse (TLP) t =100ns; Transmission Line Pulse (TLP) p p Fig 6. Dynamic resistance with positive clamping Fig 7. Dynamic resistance with negative clamping The device uses an advanced clamping structure, which shows a negative dynamic resistance. This snap-back behavior strongly reduces the clamping voltage to the system behind the ESD protection during an ESD event. Do not connect unlimited DC current sources to the data lines to avoid keeping the ESD protection device in snap-back state after exceeding breakdown voltage (due to an ESD pulse for instance). IP4285CZ9-TBB All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 3 — 7 April 2014 5 of 12

IP4285CZ9-TBB NXP Semiconductors ESD protection for high-speed interfaces 7. Application information The device is designed to provide high-level ESDprotection for high-speed serial databuses such as HDMI, DisplayPort, eSATA and LVDS data lines. When designing the Printed-Circuit Board(PCB), careful consideration should be given to basic high-speed routing guidelines, impedance matching, and signal coupling. Signal pins1 and 2 (4 and 5) can be laid out through not connected pins9 and 8 (6 and 7) respectively to avoid the need for vias and stubs. Basic application diagrams for the ESDprotection of an HDMIinterface are shown inFigure8. IP4285CZ9-TBB TMDS_D2+ TMDS_CH2+ 5 TMDS_GND TMDS_CH2– 4 TMDS_D2– GND 3 TMDS_D1+ TMDS_CH1+ 2 TMDS_GND TMDS_CH1– 1 TMDS_D1– IP4285CZ9-TBB TMDS_D0+ TMDS_CH2+ 5 TMDS_GND TMDS_CH2– 4 TMDS_D0– GND 3 TMDS_CLK+ HDMI TMDS_CH1+ CONNECTOR 2 TMDS_GND TMDS_CH1– 1 TMDS_CLK– CEC n.c. DDC_CLK DDC_DAT GND +5 V HOT PLUG DETECTION 6 5 4 IP4221CZ6 100 nF 018aaa123 1 2 3 Fig 8. Application diagram of HDMI ESDprotection using IP4285CZ9-TBB IP4285CZ9-TBB All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 3 — 7 April 2014 6 of 12

IP4285CZ9-TBB NXP Semiconductors ESD protection for high-speed interfaces 8. Package outline (cid:20)(cid:17)(cid:20) (cid:19)(cid:17)(cid:20)(cid:21)(cid:26) (cid:19)(cid:17)(cid:28) (cid:24) (cid:25) (cid:19)(cid:17)(cid:21)(cid:24) (cid:19)(cid:17)(cid:20)(cid:24) (cid:21)(cid:17)(cid:21) (cid:20)(cid:17)(cid:25) (cid:22) (cid:21)(cid:17)(cid:19) (cid:19)(cid:17)(cid:23) (cid:20) (cid:28) (cid:19)(cid:17)(cid:21)(cid:3)(cid:80)(cid:76)(cid:81) (cid:19)(cid:17)(cid:19)(cid:24)(cid:3)(cid:80)(cid:68)(cid:91) (cid:19)(cid:17)(cid:23)(cid:22) (cid:19)(cid:17)(cid:24)(cid:3)(cid:80)(cid:68)(cid:91) (cid:19)(cid:17)(cid:22)(cid:22) (cid:39)(cid:76)(cid:80)(cid:72)(cid:81)(cid:86)(cid:76)(cid:82)(cid:81)(cid:86)(cid:3)(cid:76)(cid:81)(cid:3)(cid:80)(cid:80) (cid:20)(cid:21)(cid:16)(cid:19)(cid:24)(cid:16)(cid:21)(cid:22) Fig 9. Package outline DFN2110-9(SOT1178-1/XSON9) IP4285CZ9-TBB All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 3 — 7 April 2014 7 of 12

IP4285CZ9-TBB NXP Semiconductors ESD protection for high-speed interfaces 9. Soldering Footprint information for reflow soldering of XSON9 package SOT1178-1 Hx C Hy Ay By 0.025 D P 0.025 Generic footprint pattern Refer to the package outline drawing for actual layout solder land solder paste deposit solder land plus solder paste occupied area solder resist DIMENSIONS in mm P Ay By C D Hx Hy 0.4 1.35 0.25 0.55 0.22 2.05 1.6 11-06-27 sot1178-1_fr Issue date 11-07-06 Fig 10. Reflow soldering footprint DFN2110-9(SOT1178-1/XSON9) IP4285CZ9-TBB All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 3 — 7 April 2014 8 of 12

IP4285CZ9-TBB NXP Semiconductors ESD protection for high-speed interfaces 10. Revision history Table 6. Revision history Document ID Release date Data sheet status Change notice Supersedes IP4285CZ9-TBB v.3 20140407 Product data sheet - IP4285CZ9-TBB v.2 Modifications: • Measurements updated after silicon manufacturing transfer IP4285CZ9-TBB v.2 20120712 Product data sheet IP4285CZ9-TBB v.1 IP4285CZ9-TBB v.1 20110527 Product data sheet - - IP4285CZ9-TBB All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 3 — 7 April 2014 9 of 12

IP4285CZ9-TBB NXP Semiconductors ESD protection for high-speed interfaces 11. Legal information 11.1 Data sheet status Document status[1][2] Product status[3] Definition Objective [short] data sheet Development This document contains data from the objective specification for product development. Preliminary [short] data sheet Qualification This document contains data from the preliminary specification. Product [short] data sheet Production This document contains the product specification. [1] Please consult the most recently issued document before initiating or completing a design. [2] The term ‘short data sheet’ is explained in section “Definitions”. [3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URLhttp://www.nxp.com. 11.2 Definitions Suitability for use — NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in life support, life-critical or safety-critical systems or equipment, nor in applications where failure or Draft — The document is a draft version only. The content is still under malfunction of an NXP Semiconductors product can reasonably be expected internal review and subject to formal approval, which may result in to result in personal injury, death or severe property or environmental modifications or additions. NXP Semiconductors does not give any damage. 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NXP Semiconductors takes no Limiting values — Stress above one or more limiting values (as defined in responsibility for the content in this document if provided by an information the Absolute Maximum Ratings System of IEC60134) will cause permanent source outside of NXP Semiconductors. damage to the device. Limiting values are stress ratings only and (proper) operation of the device at these or any other conditions above those given in In no event shall NXP Semiconductors be liable for any indirect, incidental, the Recommended operating conditions section (if present) or the punitive, special or consequential damages (including - without limitation - lost Characteristics sections of this document is not warranted. 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In case an individual with the Terms and conditions of commercial sale of NXP Semiconductors. agreement is concluded only the terms and conditions of the respective agreement shall apply. NXP Semiconductors hereby expressly objects to Right to make changes — NXP Semiconductors reserves the right to make applying the customer’s general terms and conditions with regard to the changes to information published in this document, including without purchase of NXP Semiconductors products by customer. limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior No offer to sell or license — Nothing in this document may be interpreted or to the publication hereof. construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. 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IP4285CZ9-TBB NXP Semiconductors ESD protection for high-speed interfaces Export control — This document as well as the item(s) described herein product for such automotive applications, use and specifications, and (b) may be subject to export control regulations. Export might require a prior whenever customer uses the product for automotive applications beyond authorization from competent authorities. NXP Semiconductors’ specifications such use shall be solely at customer’s own risk, and (c) customer fully indemnifies NXP Semiconductors for any Quick reference data — The Quick reference data is an extract of the liability, damages or failed product claims resulting from customer design and product data given in the Limiting values and Characteristics sections of this use of the product for automotive applications beyond NXP Semiconductors’ document, and as such is not complete, exhaustive or legally binding. standard warranty and NXP Semiconductors’ product specifications. Non-automotive qualified products — Unless this data sheet expressly Translations — A non-English (translated) version of a document is for states that this specific NXP Semiconductors product is automotive qualified, reference only. The English version shall prevail in case of any discrepancy the product is not suitable for automotive use. It is neither qualified nor tested between the translated and English versions. in accordance with automotive testing or application requirements. NXP Semiconductors accepts no liability for inclusion and/or use of non-automotive qualified products in automotive equipment or applications. 11.4 Trademarks In the event that customer uses the product for design-in and use in automotive applications to automotive specifications and standards, customer Notice: All referenced brands, product names, service names and trademarks (a) shall use the product without NXP Semiconductors’ warranty of the are the property of their respective owners. 12. Contact information For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com IP4285CZ9-TBB All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 3 — 7 April 2014 11 of 12

IP4285CZ9-TBB NXP Semiconductors ESD protection for high-speed interfaces 13. Contents 1 Product profile. . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.1 General description . . . . . . . . . . . . . . . . . . . . . 1 1.2 Features and benefits. . . . . . . . . . . . . . . . . . . . 1 1.3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 2 Pinning information. . . . . . . . . . . . . . . . . . . . . . 2 3 Ordering information. . . . . . . . . . . . . . . . . . . . . 2 4 Marking. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 5 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 2 6 Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . 3 7 Application information. . . . . . . . . . . . . . . . . . . 6 8 Package outline. . . . . . . . . . . . . . . . . . . . . . . . . 7 9 Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 10 Revision history. . . . . . . . . . . . . . . . . . . . . . . . . 9 11 Legal information. . . . . . . . . . . . . . . . . . . . . . . 10 11.1 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 10 11.2 Definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 11.3 Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . . 10 11.4 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 11 12 Contact information. . . . . . . . . . . . . . . . . . . . . 11 13 Contents. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 Please be aware that important notices concerning this document and the product(s) described herein, have been included in section ‘Legal information’. © NXP Semiconductors N.V. 2014. All rights reserved. For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com Date of release: 7 April 2014 Document identifier: IP4285CZ9-TBB