Important notice Dear Customer, On 7 February 2017 the former NXP Standard Product business became a new company with the tradename Nexperia. Nexperia is an industry leading supplier of Discrete, Logic and PowerMOS semiconductors with its focus on the automotive, industrial, computing, consumer and wearable application markets In data sheets and application notes which still contain NXP or Philips Semiconductors references, use the references to Nexperia, as shown below. Instead of http://www.nxp.com, http://www.philips.com/ or http://www.semiconductors.philips.com/, use http://www.nexperia.com Instead of sales.addresses@www.nxp.com or sales.addresses@www.semiconductors.philips.com, use salesaddresses@nexperia.com (email) Replace the copyright notice at the bottom of each page or elsewhere in the document, depending on the version, as shown below: - © NXP N.V. (year). All rights reserved or © Koninklijke Philips Electronics N.V. (year). All rights reserved Should be replaced with: - © Nexperia B.V. (year). All rights reserved. If you have any questions related to the data sheet, please contact our nearest sales office via e-mail or telephone (details via salesaddresses@nexperia.com). Thank you for your cooperation and understanding, Kind regards, Team Nexperia

IP4264CZ8-10/20/40-TTL Integrated (U)SIM card passive filter array with ESD protection Rev. 2 — 12 October 2011 Product data sheet 1. Product profile 1.1 General description The IP4264CZ8-10-TTL, IP4264CZ8-20-TTL and IP4264CZ8-40-TTL are 3-channel RClow-pass filter arrays. They are designed to provide filtering of undesired RF signals in the 800MHz-to-3000MHz frequency band. They incorporate diodes to provide protection to downstream components from ElectroStatic Discharge(ESD) voltages up to 25kV contact and higher than 25kVair discharge, far exceeding IEC61000-4-2, level4. The devices support ESD protection of the USB data pins of a Universal Subscriber Identity Module(USIM) interface, as well as the digital standard SIM interface ESDprotection and ElectroMagnetic Interface(EMI) filtering. The devices are fabricated using monolithic silicon technology. They integrate three resistors and eight high-level ESD protection diodes in a 0.4mm pitch Quad Flat-pack No-leads(QFN) plastic package with a height of only 0.5mm. These features make all three devices ideal for use in applications requiring component miniaturization, such as mobile phone handsets, cordless telephones and personal digital devices. Similar products are available in Wafer Level Chip-Size Package(WLCSP). IP4365CX11/P(0.4mm pitch, 11-ball WLCSP11) is designed for USIM interfaces. IP4364CX8 (0.4mm pitch, 8-ball WLCSP8) and IP4064CX8(0.5mmpitch,8-ballWLCSP8) are designed for SIM interfaces. 1.2 Features and benefits  Pb-free, Restriction of Hazardous Substances(RoHS) compliant and free of halogen and antimony (Dark Green compliant)  3-channel SIM card interface integrated RC-filter array and SIM voltage ESDprotection  2 USIM (USB1.1) compliant ESD protection diodes with 20pF channel capacitance  Integrated 100/100/47 series channel resistors  Total channel capacitance of 10pF (IP4264CZ8-10-TTL), 20pF (IP4264CZ8-20-TTL) or 40pF (IP4264CZ8-40-TTL)  Downstream ESD protection up to 25kV (contact) according to IEC 61000-4-2  Micropak (QFN compatible) plastic package with 0.4mm pitch 1.3 Applications  SIM interfaces in for example, cellular phone and Personal Communication System(PCS) mobile handsets

IP4264CZ8-10/20/40-TTL NXP Semiconductors Integrated (U)SIM card passive filter array with ESD protection 2. Pinning information Table 1. Pinning Pin Description Simplified outline Graphic symbol 1 and 8 filter channel 1 8 5 2 and 7 filter channel 2 R1 1 8 3 and 6 filter channel 3 100 Ω R2 4 and 5 ESD protection 1 4 2 7 47 Ω GND ground Transparent top view R3 3 6 100 Ω 4 5 018aaa015 3. Ordering information Table 2. Ordering info rmation Type number Package Name Description Version IP4264CZ8-10-TTL HUSON8 plastic thermal enhanced extremely thin small outline package; SOT1166-1 noleads; 8terminals; body 1.351.70.55mm IP4264CZ8-20-TTL IP4264CZ8-40-TTL 4. Marking Table 3. Marking codes Type number Marking code IP4264CZ8-10-TTL N1 IP4264CZ8-20-TTL N2 IP4264CZ8-40-TTL N4 IP4264CZ8-10_20_40-TTL All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved. Product data sheet Rev. 2 — 12 October 2011 2 of 15

IP4264CZ8-10/20/40-TTL NXP Semiconductors Integrated (U)SIM card passive filter array with ESD protection 5. Limiting values Table 4. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Parameter Conditions Min Max Unit IP4264CZ8-10-TTL V electrostatic discharge pins 1, 2 and 3 to ground [1] ESD voltage contact discharge 10 +10 kV air discharge 15 +15 kV pins 6, 7 and 8 to ground [1] contact discharge 8 +8 kV air discharge 15 +15 kV pins 5 and 6 to ground [1] contact discharge 15 +15 kV air discharge 15 +15 kV IP4264CZ8-20-TTL V electrostatic discharge all pins to ground [1] ESD voltage contact discharge 15 +15 kV air discharge 15 +15 kV IP4264CZ8-40-TTL V electrostatic discharge all pins to ground [1] ESD voltage contact discharge 25 +25 kV air discharge 25 +25 kV IP4264CZ8-10-TTL, IP4264CZ8-20-TTL and IP4264CZ8-40-TTL V electrostatic discharge IEC61000-4-2, level 4; ESD voltage allpins to ground contact discharge 8 +8 kV air discharge 15 +15 kV V input voltage at I/O pins 0.5 +5.5 V I P channel power T =70C - 60 mW ch amb dissipation P total power dissipation T =70C - 180 mW tot amb T storage temperature 55 +150 C stg T peak reflow t 10s - 260 C reflow(peak) p temperature T ambient temperature 30 +85 C amb [1] All devices are qualified using 1000 contact discharges of 8kV (IP4264CZ8-10-TTL and IP4264CZ8-20-TTL) or25 kV (IP4264CZ8-40-TTL) using the IEC 61000-4-2 model, far exceeding the specified IEC61000-4-2, level4 (8kV contact discharge). IP4264CZ8-10_20_40-TTL All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved. Product data sheet Rev. 2 — 12 October 2011 3 of 15

IP4264CZ8-10/20/40-TTL NXP Semiconductors Integrated (U)SIM card passive filter array with ESD protection 6. Characteristics Table 5. Channel resistance T =25C unless otherwise specified. amb Symbol Parameter Conditions Min Typ Max Unit R channel series R1, R3 85 100 115  s(ch) resistance R2 40 47 54  Table 6. Channel characteristics T =25C unless otherwise specified. amb Symbol Parameter Conditions Min Typ Max Unit I reverse leakage V =3V - - 50 nA RM I current V breakdown voltage I =1mA 6 - 10 V BR test IP4264CZ8-10-TTL C channel capacitance f=1MHz [1][2] ch V =0V 8 10 12 pF bias(DC) V =2.5V 4 6 8 pF bias(DC) C diode capacitance f=1MHz [1][3] d V =0V 8 10 12 pF bias(DC) V =2.5V 4 6 8 pF bias(DC) IP4264CZ8-20-TTL C channel capacitance f=1MHz [1][2] ch V =0V - 17 20 pF bias(DC) V =2.5V - 11 15 pF bias(DC) IP4264CZ8-40-TTL C channel capacitance f=1MHz [1][2] ch V =0V - 35 40 pF bias(DC) V =2.5V - 23 28 pF bias(DC) IP4264CZ8-20-TTL and IP4264CZ8-40-TTL C diode capacitance f=1MHz [3] d V =0V 12 16 20 pF bias(DC) V =2.5V 8 11 14 pF bias(DC) [1] Guaranteed by design. [2] Total line capacitance including diode capacitance, per channel. [3] Pins 4 and 5 to ground. IP4264CZ8-10_20_40-TTL All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved. Product data sheet Rev. 2 — 12 October 2011 4 of 15

IP4264CZ8-10/20/40-TTL NXP Semiconductors Integrated (U)SIM card passive filter array with ESD protection 7. Application information 7.1 Insertion loss The devices are designed as EMI/Radio Frequency Interference(RFI) filters for SIMcard interfaces. The setup for measuring return loss is shown in Figure1. The insertion loss in a 50 system for all three channels of IP4264CZ8-10-TTL(C =10pF) is shown in Figure2. The same measurements for ch IP4264CZ8-20-TTL (C =20pF) are shown in Figure3. The insertion loss for ch IP4264CZ8-40-TTL (C =10pF) is shown in Figure4. ch 018aaa145 0 S21 (dB) (1) –10 –20 DUT IN OUT (2) –30 50 Ω TEST BOARD 50 Ω (3) Vgen –40 10–1 1 10 102 103 104 018aaa016 f (MHz) C =10pF ch (1) Pin 2 to 7 (2) Pin 1 to 8 (3) Pin 3 to 6 Fig 1. Frequency response setup Fig 2. IP4264CZ8-10-TTL: Frequency response curves IP4264CZ8-10_20_40-TTL All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved. Product data sheet Rev. 2 — 12 October 2011 5 of 15

IP4264CZ8-10/20/40-TTL NXP Semiconductors Integrated (U)SIM card passive filter array with ESD protection 018aaa017 018aaa018 0 0 S21 S21 (dB) (dB) (1) (1) −10 −10 −20 −20 (2) (2) −30 −30 (3) (3) −40 −40 10−1 1 10 102 103 104 10−1 1 10 102 103 104 f (MHz) f (MHz) Cch=20pF Cch=40pF (1) Pin 2 to 7 (1) Pin 2 to 7 (2) Pin 1 to 8 (2) Pin 1 to 8 (3) Pin 3 to 6 (3) Pin 3 to 6 Fig 3. IP4264CZ8-20-TTL: Frequency response Fig 4. IP4264CZ8-40-TTL: Frequency response curves curves IP4264CZ8-10_20_40-TTL All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved. Product data sheet Rev. 2 — 12 October 2011 6 of 15

IP4264CZ8-10/20/40-TTL NXP Semiconductors Integrated (U)SIM card passive filter array with ESD protection 7.2 Crosstalk The setup for measuring crosstalk between channels in a 50 system is shown in Figure5. The crosstalk for IP4264CZ8-10-TTL is shown in Figure6, for IP4264CZ8-20-TTL in Figure7 and for IP4264CZ8-40-TTL in Figure8. Unused channels are terminated with a 50 resistor to ground. The crosstalk between any pin and pin 4 and pin 5 is similar to the crosstalk between the channels. 018aaa146 0 S21 (dB) –30 (1) IN1 OUT2 DUT –60 (3) (2) 50 Ω 50 Ω IN2 OUT1 TEST BOARD Vgen 50 Ω 50 Ω –90 10–1 1 10 102 103 104 018aaa019 f (MHz) C =10pF ch (1) Pin 1 to 7 (2) Pin 2 to 6 (3) Pin 3 to 8 Fig 5. Crosstalk measurement setup Fig 6. IP4264CZ8-10-TTL: Crosstalk behavior IP4264CZ8-10_20_40-TTL All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved. Product data sheet Rev. 2 — 12 October 2011 7 of 15

IP4264CZ8-10/20/40-TTL NXP Semiconductors Integrated (U)SIM card passive filter array with ESD protection 018aaa020 018aaa021 0 0 S21 S21 (dB) (dB) −20 −20 (1) (1) −40 (2) −40 (3) (2) (3) −60 −60 −80 −80 −100 −100 10−1 1 10 102 103 104 10−1 1 10 102 103 104 f (MHz) f (MHz) Cch=20pF Cch=40pF (1) Pin 1 to 7 (1) Pin 1 to 7 (2) Pin 2 to 6 (2) Pin 2 to 6 (3) Pin 3 to 8 (3) Pin 3 to 8 Fig 7. IP4264CZ8-20-TTL: Crosstalk behavior Fig 8. IP4264CZ8-40-TTL: Crosstalk behavior IP4264CZ8-10_20_40-TTL All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved. Product data sheet Rev. 2 — 12 October 2011 8 of 15

IP4264CZ8-10/20/40-TTL NXP Semiconductors Integrated (U)SIM card passive filter array with ESD protection 7.3 USIM and SIM interface application schematic The application schematic diagram depicted in Figure9 demonstrates how the three NXPSIMcard EMI filter and ESD protection devices are used in a typical USIM interface application. For example, in case a standard SIM interface without USB1.1 is used, the two single diodes (pins4and5) can protect the VSIM line. It is only one example dependent on layout constraints. For example, channels1to8 can be swapped with channels 3to6. Also, the USB interface ESD protection pins 4and5 can be exchanged. Due to both sides of the devices containing identical protection diodes, baseband and SIM card side can be swapped, too (pin1with pin8, pin2 with pin7 etc.). A standard SIM interface application is depicted in Figure10. In this case, both ESDprotection diodes (pins 1 and 8) are used to protect VSIM. VSIM VSIM protection diode VCC GND 1 R3 8 RST RST SPU 100 Ω 2 R2 7 CLK 47 Ω CLK I/O 3 R1 6 I/O 100 Ω 5 D+ AUX 1 AUX 2 USB 4 D– SIM CARD BASEBAND CENTER GROUND PAD 018aaa147 Fig 9. USIM application schematic IP4264CZ8-10_20_40-TTL All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved. Product data sheet Rev. 2 — 12 October 2011 9 of 15

IP4264CZ8-10/20/40-TTL NXP Semiconductors Integrated (U)SIM card passive filter array with ESD protection VSIM 4 5 VCC GND 1 R3 8 RST RST SPU 100 Ω 2 R2 7 CLK CLK I/O 47 Ω 3 R1 6 I/O AUX 1 AUX 2 100 Ω SIM CARD BASEBAND CENTER GROUND PAD 018aaa148 Fig 10. SIM application schematic 7.4 Compatible devices in WLCSP The IP4264CZ8-10-TTL and IP4264CZ8-20-TTL are optimized for SIM and USIM interfaces. Comparable devices are also available in WLCSP: • IP4064CX8, 0.5mm pitch SIM interface device compatible with IP4264CZ8-20-TTL • IP4364CX8, 0.4mm pitch SIM interface device compatible with IP4264CZ8-20-TTL • IP4366CX8/P, 0.4mm pitch SIM interface device compatible with IP4264CZ8-10-TTL • IP4365CX11/P, 0.4mm pitch USIM interface device compatible with IP4264CZ8-10-TTL IP4264CZ8-10_20_40-TTL All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved. Product data sheet Rev. 2 — 12 October 2011 10 of 15

IP4264CZ8-10/20/40-TTL NXP Semiconductors Integrated (U)SIM card passive filter array with ESD protection 8. Package outline HUSON8: plastic, thermal enhanced ultra thin small outline package; no leads; 8 terminals; body 1.35 x 1.7 x 0.55 mm SOT1166-1 X D B A E A A1 c terminal 1 index area detail X e1 C terminal 1 e v C A B index area b w C y1C y 1 4 L k Eh 8 5 Dh tiebars are indicated on arbitrary location and size 0 1 2 mm scale Dimensions Unit(1) A A1 b c D Dh E Eh e e1 k L v w y y1 max 0.55 0.05 0.25 1.8 1.3 1.45 0.45 0.30 mm nom 0.20 0.127 1.7 1.2 1.35 0.40 0.4 1.2 0.25 0.1 0.05 0.05 0.05 min 0.00 0.15 1.6 1.1 1.25 0.35 0.2 0.20 Note 1. Plastic or metal protrusions of 0.075 mm maximum per side are not included. sot1166-1_po Outline References European Issue date version IEC JEDEC JEITA projection 10-03-18 SOT1166-1 - - - - - - - - - 10-03-22 Fig 11. Package outline SOT1166-1(HUSON8) IP4264CZ8-10_20_40-TTL All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved. Product data sheet Rev. 2 — 12 October 2011 11 of 15

IP4264CZ8-10/20/40-TTL NXP Semiconductors Integrated (U)SIM card passive filter array with ESD protection 9. Revision history Table 7. Revision history Document ID Release date Data sheet status Change notice Supersedes IP4264CZ8-10_20_40-TTLv.2 20111012 Product data sheet - IP4264CZ8-10_20_40-TTLv.1 Modifications: • Figure2: corrected title • Section 10 “Legal information”: updated IP4264CZ8-10_20_40-TTLv.1 20110708 Product data sheet - - IP4264CZ8-10_20_40-TTL All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved. Product data sheet Rev. 2 — 12 October 2011 12 of 15

IP4264CZ8-10/20/40-TTL NXP Semiconductors Integrated (U)SIM card passive filter array with ESD protection 10. Legal information 10.1 Data sheet status Document status[1][2] Product status[3] Definition Objective [short] data sheet Development This document contains data from the objective specification for product development. Preliminary [short] data sheet Qualification This document contains data from the preliminary specification. Product [short] data sheet Production This document contains the product specification. [1] Please consult the most recently issued document before initiating or completing a design. [2] The term ‘short data sheet’ is explained in section “Definitions”. [3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URLhttp://www.nxp.com. 10.2 Definitions malfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. NXP Semiconductors accepts no liability for inclusion and/or use of Draft — The document is a draft version only. The content is still under NXP Semiconductors products in such equipment or applications and internal review and subject to formal approval, which may result in therefore such inclusion and/or use is at the customer’s own risk. modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of Applications — Applications that are described herein for any of these information included herein and shall have no liability for the consequences of products are for illustrative purposes only. NXP Semiconductors makes no use of such information. representation or warranty that such applications will be suitable for the specified use without further testing or modification. Short data sheet — A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended Customers are responsible for the design and operation of their applications for quick reference only and should not be relied upon to contain detailed and and products using NXP Semiconductors products, and NXP Semiconductors full information. For detailed and full information see the relevant full data accepts no liability for any assistance with applications or customer product sheet, which is available on request via the local NXP Semiconductors sales design. It is customer’s sole responsibility to determine whether the NXP office. In case of any inconsistency or conflict with the short data sheet, the Semiconductors product is suitable and fit for the customer’s applications and full data sheet shall prevail. products planned, as well as for the planned application and use of customer’s third party customer(s). Customers should provide appropriate Product specification — The information and data provided in a Product design and operating safeguards to minimize the risks associated with their data sheet shall define the specification of the product as agreed between applications and products. NXP Semiconductors and its customer, unless NXP Semiconductors and NXP Semiconductors does not accept any liability related to any default, customer have explicitly agreed otherwise in writing. In no event however, damage, costs or problem which is based on any weakness or default in the shall an agreement be valid in which the NXP Semiconductors product is customer’s applications or products, or the application or use by customer’s deemed to offer functions and qualities beyond those described in the third party customer(s). Customer is responsible for doing all necessary Product data sheet. testing for the customer’s applications and products using NXP Semiconductors products in order to avoid a default of the applications and 10.3 Disclaimers the products or of the application or use by customer’s third party customer(s). NXP does not accept any liability in this respect. Limited warranty and liability — Information in this document is believed to Limiting values — Stress above one or more limiting values (as defined in be accurate and reliable. However, NXP Semiconductors does not give any the Absolute Maximum Ratings System of IEC60134) will cause permanent representations or warranties, expressed or implied, as to the accuracy or damage to the device. Limiting values are stress ratings only and (proper) completeness of such information and shall have no liability for the operation of the device at these or any other conditions above those given in consequences of use of such information. the Recommended operating conditions section (if present) or the Characteristics sections of this document is not warranted. Constant or In no event shall NXP Semiconductors be liable for any indirect, incidental, repeated exposure to limiting values will permanently and irreversibly affect punitive, special or consequential damages (including - without limitation - lost the quality and reliability of the device. profits, lost savings, business interruption, costs related to the removal or replacement of any products or rework charges) whether or not such Terms and conditions of commercial sale — NXP Semiconductors damages are based on tort (including negligence), warranty, breach of products are sold subject to the general terms and conditions of commercial contract or any other legal theory. sale, as published at http://www.nxp.com/profile/terms, unless otherwise Notwithstanding any damages that customer might incur for any reason agreed in a valid written individual agreement. In case an individual whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards agreement is concluded only the terms and conditions of the respective customer for the products described herein shall be limited in accordance agreement shall apply. NXP Semiconductors hereby expressly objects to with the Terms and conditions of commercial sale of NXP Semiconductors. applying the customer’s general terms and conditions with regard to the purchase of NXP Semiconductors products by customer. Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without No offer to sell or license — Nothing in this document may be interpreted or limitation specifications and product descriptions, at any time and without construed as an offer to sell products that is open for acceptance or the grant, notice. This document supersedes and replaces all information supplied prior conveyance or implication of any license under any copyrights, patents or to the publication hereof. other industrial or intellectual property rights. Suitability for use — NXP Semiconductors products are not designed, Export control — This document as well as the item(s) described herein authorized or warranted to be suitable for use in life support, life-critical or may be subject to export control regulations. Export might require a prior safety-critical systems or equipment, nor in applications where failure or authorization from competent authorities. IP4264CZ8-10_20_40-TTL All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved. Product data sheet Rev. 2 — 12 October 2011 13 of 15

IP4264CZ8-10/20/40-TTL NXP Semiconductors Integrated (U)SIM card passive filter array with ESD protection Quick reference data — The Quick reference data is an extract of the product for such automotive applications, use and specifications, and (b) product data given in the Limiting values and Characteristics sections of this whenever customer uses the product for automotive applications beyond document, and as such is not complete, exhaustive or legally binding. NXP Semiconductors’ specifications such use shall be solely at customer’s own risk, and (c) customer fully indemnifies NXP Semiconductors for any Non-automotive qualified products — Unless this data sheet expressly liability, damages or failed product claims resulting from customer design and states that this specific NXP Semiconductors product is automotive qualified, use of the product for automotive applications beyond NXP Semiconductors’ the product is not suitable for automotive use. It is neither qualified nor tested standard warranty and NXP Semiconductors’ product specifications. in accordance with automotive testing or application requirements. NXP Semiconductors accepts no liability for inclusion and/or use of non-automotive qualified products in automotive equipment or applications. 10.4 Trademarks In the event that customer uses the product for design-in and use in automotive applications to automotive specifications and standards, customer Notice: All referenced brands, product names, service names and trademarks (a) shall use the product without NXP Semiconductors’ warranty of the are the property of their respective owners. 11. Contact information For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com IP4264CZ8-10_20_40-TTL All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved. Product data sheet Rev. 2 — 12 October 2011 14 of 15

IP4264CZ8-10/20/40-TTL NXP Semiconductors Integrated (U)SIM card passive filter array with ESD protection 12. Contents 1 Product profile. . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.1 General description . . . . . . . . . . . . . . . . . . . . . 1 1.2 Features and benefits. . . . . . . . . . . . . . . . . . . . 1 1.3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 2 Pinning information. . . . . . . . . . . . . . . . . . . . . . 2 3 Ordering information. . . . . . . . . . . . . . . . . . . . . 2 4 Marking. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 5 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 3 6 Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . 4 7 Application information. . . . . . . . . . . . . . . . . . . 5 7.1 Insertion loss . . . . . . . . . . . . . . . . . . . . . . . . . . 5 7.2 Crosstalk. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 7.3 USIM and SIM interface application schematic. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 7.4 Compatible devices in WLCSP. . . . . . . . . . . . 10 8 Package outline. . . . . . . . . . . . . . . . . . . . . . . . 11 9 Revision history. . . . . . . . . . . . . . . . . . . . . . . . 12 10 Legal information. . . . . . . . . . . . . . . . . . . . . . . 13 10.1 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 13 10.2 Definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 10.3 Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . . 13 10.4 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 14 11 Contact information. . . . . . . . . . . . . . . . . . . . . 14 12 Contents. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 Please be aware that important notices concerning this document and the product(s) described herein, have been included in section ‘Legal information’. © NXP B.V. 2011. All rights reserved. For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com Date of release: 12 October 2011 Document identifier: IP4264CZ8-10_20_40-TTL