IP4233CZ6 Ultra low capacitance ESD protection for Ethernet ports Rev. 3 — 17 June 2010 Product data sheet 1. Product profile 1.1 General description The IP4233CZ6 is designed to protect Input/Output(I/O) ports that are sensitive to capacitive loads, such as Ethernet, from destruction by ElectroStatic Discharge(ESD). The IP4233CZ6 incorporates two pairs of ultra low capacitance back-to-back diodes which protect components from ESD voltages as high as ±8kV contact discharge according to IEC61000-4-2, level4. The back-to-back diodes prevent negative clipping of AC signals and voltages below zero. The IP4233CZ6 is fabricated using monolithic silicon technology integrating two ultra low capacitance back-to-back ESDprotection diodes in a very small 6-lead SOT363 package. 1.2 Features and benefits (cid:132) Pb-free and Restriction of Hazardous Substances(RoHS) compliant (cid:132) ESDprotection compliant to IEC61000-4-2 level4, ±8kV contact discharge (cid:132) Two low input capacitance (0.9pF typical) back-to-back ESDprotection diodes (cid:132) Very small 6-lead SOT363 package 1.3 Applications (cid:132) ESD protection high-frequency AC-coupled Ethernet ports 1.4 Quick reference data Table 1. Quick reference data T =25°C unless otherwise specified. amb Symbol Parameter Conditions Min Typ Max Unit V electrostatic all pins; IEC61000-4-2, - -± 8 kV ESD discharge voltage level4; contact discharge C input/output to V =0V; f=1MHz [1][2] - 0.9 1.3 pF (I/O-GND) I groundcapacitance [1] Guaranteed by design. [2] Pins2 to6 and pins3 to5.

IP4233CZ6 Nexperia Ultra low capacitance ESD protection for Ethernet ports 2. Pinning information Table 2. Pinning Pin Description Simplified outline Graphic symbol 1 not connected 6 5 4 2 ESD protection I/O channel 1 1 6 3 ESD protection I/O channel 2 2 5 4 not connected 3 4 5 ESD protection I/O channel 2 1 2 3 018aaa013 6 ESD protection I/O channel 1 3. Ordering information Table 3. Ordering information Type number Package Name Description Version IP4233CZ6 SC-88 plastic surface-mounted package; 6leads SOT363 4. Limiting values Table 4. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Parameter Conditions Min Max Unit V input voltage - ±5.5 V I V electrostatic discharge all pins; IEC61000-4-2, - ±8 kV ESD voltage level4; contact discharge T storage temperature −55 +125 °C stg T ambient temperature −40 +85 °C amb 5. Characteristics Table 5. Characteristics T =25°C unless otherwise specified. amb Symbol Parameter Conditions Min Typ Max Unit C input/output to V =0V; f=1MHz [1][2] - 0.9 1.3 pF (I/O-GND) I groundcapacitance I reverse leakage current V =3.0V [2] - - 100 nA RM I V breakdown voltage back-to-back diode; 6 - 9.5 V BR I=5mA [1] Guaranteed by design. [2] Pins2 to6 and pins3 to5. IP4233CZ6 All information provided in this document is subject to legal disclaimers. . Product data sheet Rev. 3 — 17 June 2010 2 of 11 © Nexperia B.V. 2017. All rights reserved

IP4233CZ6 Nexperia Ultra low capacitance ESD protection for Ethernet ports 6. Application information A typical application for protecting a 10/100Mbit/s Ethernet transceiver against ESD is shown in Figure1. not used not used PTC TX+ TX+ PTC TX− 1 6 TX− 2 5 Primary-Secondary RJ45 10/100 Coordinating BASE-T 3 4 Elements (Opt) ETHERNET IP4233CZ6 PTC RX+ RX+ PTC RX− not used RX− not used REMI REMI REMI REMI VCC VCC GND 018aaa014 Fig 1. Typical application for ESD protection of a 10/100Mbit/s Ethernet transceiver IP4233CZ6 All information provided in this document is subject to legal disclaimers. . Product data sheet Rev. 3 — 17 June 2010 3 of 11 © Nexperia B.V. 2017. All rights reserved

IP4233CZ6 Nexperia Ultra low capacitance ESD protection for Ethernet ports 7. Package outline Plastic surface-mounted package; 6 leads SOT363 D B E A X y HE v M A 6 5 4 Q pin 1 index A A1 1 2 3 c e1 bp w M B Lp e detail X 0 1 2 mm scale DIMENSIONS (mm are the original dimensions) A1 UNIT A max bp c D E e e1 HE Lp Q v w y 1.1 0.30 0.25 2.2 1.35 2.2 0.45 0.25 mm 0.1 1.3 0.65 0.2 0.2 0.1 0.8 0.20 0.10 1.8 1.15 2.0 0.15 0.15 OUTLINE REFERENCES EUROPEAN ISSUE DATE VERSION IEC JEDEC JEITA PROJECTION 04-11-08 SOT363 SC-88 06-03-16 Fig 2. Package outline SOT363(SC-88) IP4233CZ6 All information provided in this document is subject to legal disclaimers. . Product data sheet Rev. 3 — 17 June 2010 4 of 11 © Nexperia B.V. 2017. All rights reserved

IP4233CZ6 Nexperia Ultra low capacitance ESD protection for Ethernet ports 8. Soldering of SMD packages This text provides a very brief insight into a complex technology. A more in-depth account of soldering ICs can be found in Application Note AN10365 “Surface mount reflow soldering description”. 8.1 Introduction to soldering Soldering is one of the most common methods through which packages are attached to Printed Circuit Boards (PCBs), to form electrical circuits. The soldered joint provides both the mechanical and the electrical connection. There is no single soldering method that is ideal for all IC packages. Wave soldering is often preferred when through-hole and Surface Mount Devices (SMDs) are mixed on one printed wiring board; however, it is not suitable for fine pitch SMDs. Reflow soldering is ideal for the small pitches and high densities that come with increased miniaturization. 8.2 Wave and reflow soldering Wave soldering is a joining technology in which the joints are made by solder coming from a standing wave of liquid solder. The wave soldering process is suitable for the following: • Through-hole components • Leaded or leadless SMDs, which are glued to the surface of the printed circuit board Not all SMDs can be wave soldered. Packages with solder balls, and some leadless packages which have solder lands underneath the body, cannot be wave soldered. Also, leaded SMDs with leads having a pitch smaller than ~0.6mm cannot be wave soldered, due to an increased probability of bridging. The reflow soldering process involves applying solder paste to a board, followed by component placement and exposure to a temperature profile. Leaded packages, packages with solder balls, and leadless packages are all reflow solderable. Key characteristics in both wave and reflow soldering are: • Board specifications, including the board finish, solder masks and vias • Package footprints, including solder thieves and orientation • The moisture sensitivity level of the packages • Package placement • Inspection and repair • Lead-free soldering versus SnPb soldering 8.3 Wave soldering Key characteristics in wave soldering are: • Process issues, such as application of adhesive and flux, clinching of leads, board transport, the solder wave parameters, and the time during which components are exposed to the wave • Solder bath specifications, including temperature and impurities IP4233CZ6 All information provided in this document is subject to legal disclaimers. . Product data sheet Rev. 3 — 17 June 2010 5 of 11 © Nexperia B.V. 2017. All rights reserved

IP4233CZ6 Nexperia Ultra low capacitance ESD protection for Ethernet ports 8.4 Reflow soldering Key characteristics in reflow soldering are: • Lead-free versus SnPb soldering; note that a lead-free reflow process usually leads to higher minimum peak temperatures (see Figure3) than a SnPb process, thus reducing the process window • Solder paste printing issues including smearing, release, and adjusting the process window for a mix of large and small components on one board • Reflow temperature profile; this profile includes preheat, reflow (in which the board is heated to the peak temperature) and cooling down. It is imperative that the peak temperature is high enough for the solder to make reliable solder joints (a solder paste characteristic). In addition, the peak temperature must be low enough that the packages and/or boards are not damaged. The peak temperature of the package depends on package thickness and volume and is classified in accordance with Table6 and7 Table 6. SnPb eutectic process (from J-STD-020C) Package thickness (mm) Package reflow temperature (°C) Volume (mm3) < 350 ≥ 350 < 2.5 235 220 ≥ 2.5 220 220 Table 7. Lead-free process (from J-STD-020C) Package thickness (mm) Package reflow temperature (°C) Volume (mm3) < 350 350 to 2000 > 2000 < 1.6 260 260 260 1.6 to 2.5 260 250 245 > 2.5 250 245 245 Moisture sensitivity precautions, as indicated on the packing, must be respected at all times. Studies have shown that small packages reach higher temperatures during reflow soldering, see Figure3. IP4233CZ6 All information provided in this document is subject to legal disclaimers. . Product data sheet Rev. 3 — 17 June 2010 6 of 11 © Nexperia B.V. 2017. All rights reserved

IP4233CZ6 Nexperia Ultra low capacitance ESD protection for Ethernet ports maximum peak temperature = MSL limit, damage level temperature minimum peak temperature = minimum soldering temperature peak temperature time 001aac844 MSL: Moisture Sensitivity Level Fig 3. Temperature profiles for large and small components For further information on temperature profiles, refer to Application Note AN10365 “Surface mount reflow soldering description”. IP4233CZ6 All information provided in this document is subject to legal disclaimers. . Product data sheet Rev. 3 — 17 June 2010 7 of 11 © Nexperia B.V. 2017. All rights reserved

IP4233CZ6 Nexperia Ultra low capacitance ESD protection for Ethernet ports 9. Revision history Table 8. Revision history Document ID Release date Data sheet status Change notice Supersedes IP4233CZ6 v.3 20100617 Product data sheet - IP4233CZ6 v.2 Modifications: • Figure1: corrected • Section 10 “Legal information”: updated IP4233CZ6 v.2 20100506 Preliminary data sheet - IP4233CZ6_1 IP4233CZ6_1 20090330 Objective data sheet - - IP4233CZ6 All information provided in this document is subject to legal disclaimers. . Product data sheet Rev. 3 — 17 June 2010 8 of 11 © Nexperia B.V. 2017. All rights reserved

IP4233CZ6 Nexperia Ultra low capacitance ESD protection for Ethernet ports 10. Legal information 10.1 Data sheet status Document status[1][2] Product status[3] Definition Objective [short] data sheet Development This document contains data from the objective specification for product development. Preliminary [short] data sheet Qualification This document contains data from the preliminary specification. Product [short] data sheet Production This document contains the product specification. [1] Please consult the most recently issued document before initiating or completing a design. [2] The term ‘short data sheet’ is explained in section “Definitions”. [3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URLhttp://www.nexperia.com. 10.2 Definitions malfunction of a Nexperia product can reasonably be expected to result in personal injury, death or severe property or environmental damage. Nexperia accepts no liability for inclusion and/or use of Draft — The document is a draft version only. The content is still under Nexperia products in such equipment or applications and internal review and subject to formal approval, which may result in therefore such inclusion and/or use is at the customer’s own risk. modifications or additions. Nexperia does not give any representations or warranties as to the accuracy or completeness of Applications — Applications that are described herein for any of these information included herein and shall have no liability for the consequences of products are for illustrative purposes only. Nexperia makes no use of such information. representation or warranty that such applications will be suitable for the specified use without further testing or modification. Short data sheet — A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended Customers are responsible for the design and operation of their applications for quick reference only and should not be relied upon to contain detailed and and products using Nexperia products, and Nexperia full information. For detailed and full information see the relevant full data accepts no liability for any assistance with applications or customer product sheet, which is available on request via the local Nexperia sales design. It is customer’s sole responsibility to determine whether the Nexperia office. In case of any inconsistency or conflict with the short data sheet, the product is suitable and fit for the customer’s applications and full data sheet shall prevail. products planned, as well as for the planned application and use of customer’s third party customer(s). Customers should provide appropriate Product specification — The information and data provided in a Product design and operating safeguards to minimize the risks associated with their data sheet shall define the specification of the product as agreed between applications and products. Nexperia and its customer, unless Nexperia and Nexperia does not accept any liability related to any default, customer have explicitly agreed otherwise in writing. In no event however, damage, costs or problem which is based on any weakness or default in the shall an agreement be valid in which the Nexperia product is customer’s applications or products, or the application or use by customer’s deemed to offer functions and qualities beyond those described in the third party customer(s). Customer is responsible for doing all necessary Product data sheet. testing for the customer’s applications and products using Nexperia products in order to avoid a default of the applications and 10.3 Disclaimers the products or of the application or use by customer’s third party customer(s). Nexperia does not accept any liability in this respect. Limited warranty and liability — Information in this document is believed to Limiting values — Stress above one or more limiting values (as defined in be accurate and reliable. However, Nexperia does not give any the Absolute Maximum Ratings System of IEC60134) will cause permanent representations or warranties, expressed or implied, as to the accuracy or damage to the device. Limiting values are stress ratings only and (proper) completeness of such information and shall have no liability for the operation of the device at these or any other conditions above those given in consequences of use of such information. the Recommended operating conditions section (if present) or the Characteristics sections of this document is not warranted. Constant or In no event shall Nexperia be liable for any indirect, incidental, repeated exposure to limiting values will permanently and irreversibly affect punitive, special or consequential damages (including - without limitation - lost the quality and reliability of the device. profits, lost savings, business interruption, costs related to the removal or replacement of any products or rework charges) whether or not such Terms and conditions of commercial sale — Nexperia damages are based on tort (including negligence), warranty, breach of products are sold subject to the general terms and conditions of commercial contract or any other legal theory. sale, as published at http://www.nexperia.com/profile/terms, unless otherwise Notwithstanding any damages that customer might incur for any reason agreed in a valid written individual agreement. In case an individual whatsoever, Nexperia’s aggregate and cumulative liability towards agreement is concluded only the terms and conditions of the respective customer for the products described herein shall be limited in accordance agreement shall apply. Nexperia hereby expressly objects to with the Terms and conditions of commercial sale of Nexperia. applying the customer’s general terms and conditions with regard to the purchase of Nexperia products by customer. Right to make changes — Nexperia reserves the right to make changes to information published in this document, including without No offer to sell or license — Nothing in this document may be interpreted or limitation specifications and product descriptions, at any time and without construed as an offer to sell products that is open for acceptance or the grant, notice. This document supersedes and replaces all information supplied prior conveyance or implication of any license under any copyrights, patents or to the publication hereof. other industrial or intellectual property rights. Suitability for use — Nexperia products are not designed, Export control — This document as well as the item(s) described herein authorized or warranted to be suitable for use in life support, life-critical or may be subject to export control regulations. Export might require a prior safety-critical systems or equipment, nor in applications where failure or authorization from national authorities. IP4233CZ6 All information provided in this document is subject to legal disclaimers. . Product data sheet Rev. 3 — 17 June 2010 9 of 11 © Nexperia B.V. 2017. All rights reserved

IP4233CZ6 Nexperia Ultra low capacitance ESD protection for Ethernet ports Quick reference data — The Quick reference data is an extract of the product for such automotive applications, use and specifications, and (b) product data given in the Limiting values and Characteristics sections of this whenever customer uses the product for automotive applications beyond document, and as such is not complete, exhaustive or legally binding. Nexperia’s specifications such use shall be solely at customer’s own risk, and (c) customer fully indemnifies Nexperia for any Non-automotive qualified products — Unless this data sheet expressly liability, damages or failed product claims resulting from customer design and states that this specific Nexperia product is automotive qualified, use of the product for automotive applications beyond Nexperia’s the product is not suitable for automotive use. It is neither qualified nor tested standard warranty and Nexperia’s product specifications. in accordance with automotive testing or application requirements. Nexperia accepts no liability for inclusion and/or use of non-automotive qualified products in automotive equipment or applications. 10.4 Trademarks In the event that customer uses the product for design-in and use in automotive applications to automotive specifications and standards, customer Notice: All referenced brands, product names, service names and trademarks (a) shall use the product without Nexperia’s warranty of the are the property of their respective owners. 11. Contact information For more information, please visit: http://www.nexperia.com For sales office addresses, please send an email to: salesaddresses@nexperia.com IP4233CZ6 All information provided in this document is subject to legal disclaimers. . Product data sheet Rev. 3 — 17 June 2010 10 of 11 © Nexperia B.V. 2017. All rights reserved

IP4233CZ6 Nexperia Ultra low capacitance ESD protection for Ethernet ports 12. Contents 1 Product profile. . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.1 General description . . . . . . . . . . . . . . . . . . . . . 1 1.2 Features and benefits. . . . . . . . . . . . . . . . . . . . 1 1.3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.4 Quick reference data . . . . . . . . . . . . . . . . . . . . 1 2 Pinning information. . . . . . . . . . . . . . . . . . . . . . 2 3 Ordering information. . . . . . . . . . . . . . . . . . . . . 2 4 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 2 5 Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . 2 6 Application information. . . . . . . . . . . . . . . . . . . 3 7 Package outline. . . . . . . . . . . . . . . . . . . . . . . . . 4 8 Soldering of SMD packages . . . . . . . . . . . . . . . 5 8.1 Introduction to soldering. . . . . . . . . . . . . . . . . . 5 8.2 Wave and reflow soldering. . . . . . . . . . . . . . . . 5 8.3 Wave soldering. . . . . . . . . . . . . . . . . . . . . . . . . 5 8.4 Reflow soldering. . . . . . . . . . . . . . . . . . . . . . . . 6 9 Revision history. . . . . . . . . . . . . . . . . . . . . . . . . 8 10 Legal information. . . . . . . . . . . . . . . . . . . . . . . . 9 10.1 Data sheet status . . . . . . . . . . . . . . . . . . . . . . . 9 10.2 Definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 10.3 Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 10.4 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 10 11 Contact information. . . . . . . . . . . . . . . . . . . . . 10 12 Contents. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 © Nexperia B.V. 2017. All rights reserved For more information, please visit: http://www.nexperia.com For sales office addresses, please send an email to: salesaddresses@nexperia.com Date of release: 17 June 2010