Important notice Dear Customer, On 7 February 2017 the former NXP Standard Product business became a new company with the tradename Nexperia. Nexperia is an industry leading supplier of Discrete, Logic and PowerMOS semiconductors with its focus on the automotive, industrial, computing, consumer and wearable application markets In data sheets and application notes which still contain NXP or Philips Semiconductors references, use the references to Nexperia, as shown below. Instead of http://www.nxp.com, http://www.philips.com/ or http://www.semiconductors.philips.com/, use http://www.nexperia.com Instead of sales.addresses@www.nxp.com or sales.addresses@www.semiconductors.philips.com, use salesaddresses@nexperia.com (email) Replace the copyright notice at the bottom of each page or elsewhere in the document, depending on the version, as shown below: - © NXP N.V. (year). All rights reserved or © Koninklijke Philips Electronics N.V. (year). All rights reserved Should be replaced with: - © Nexperia B.V. (year). All rights reserved. If you have any questions related to the data sheet, please contact our nearest sales office via e-mail or telephone (details via salesaddresses@nexperia.com). Thank you for your cooperation and understanding, Kind regards, Team Nexperia

IP4221CZ6-S XSON6 ESD protection for high-speed interfaces Rev. 2 — 13 December 2012 Product data sheet 1. Product profile 1.1 General description The device is designed to protect high-speed interfaces such as USB2.0, Ethernet and Digital Visual Interface(DVI) against ElectroStatic Discharge(ESD). The device includes four high-level ESDprotection diode structures for high-speed signal lines and is encapsulated in a leadless ultra small DFN1410-6(SOT886) plastic package. Special diode configuration protects all signal lines and offers ultra low line capacitance of only 1pF. The rail-to-rail diodes are connected to the Zener diode which allows ESD protection to be independent of supply voltage. 1.2 Features and benefits  System ESD protection for high-speed data lines such as USB2.0, Ethernet and DVI  All signal lines with integrated rail-to-rail clamping diodes for downstream ESDprotection of 8kV according to IEC61000-4-2, level4  Line capacitance of only 1pF for each channel  Leadless ultra small DFN1410-6 package: 11.450.5mm; pitch 0.5mm 1.3 Applications The device is designed for high-speed receiver and transmitter port protection:  Mobile phones, smartphones and handsets  TVs and monitors  DVD recorders and players  Notebooks, mother boards, graphic cards and ports  Set-top boxes and game consoles

IP4221CZ6-S NXP Semiconductors ESD protection for high-speed interfaces 2. Pinning information Table 1. Pinning Pin Symbol Description Simplified outline Graphic symbol 1 I/O1 ESDprotection 6 5 4 6 5 4 2 GND ground 3 I/O2 ESDprotection 4 I/O3 ESDprotection 5 V supply voltage CC 1 2 3 6 I/O4 ESDprotection Transparent top view 1 2 3 001aag273 3. Ordering information Table 2. Ordering information Type number Package Name Description Version IP4221CZ6-S DFN1410-6 plastic extremely thin small outline package; SOT886 noleads; 6terminals; body 11.450.5mm 4. Marking Table 3. Marking codes Type number Marking code IP4221CZ6-S 1S 5. Limiting values Table 4. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Parameter Conditions Min Max Unit V input voltage 0.5 +5.5 V I V electrostatic discharge IEC61000-4-2, level4; [1] 8 +8 kV ESD voltage contactdischarge T storage temperature 55 +125 C stg T ambient temperature 40 +85 C amb [1] All pins to ground. IP4221CZ6-S All information provided in this document is subject to legal disclaimers. © NXP B.V. 2012. All rights reserved. Product data sheet Rev. 2 — 13 December 2012 2 of 12

IP4221CZ6-S NXP Semiconductors ESD protection for high-speed interfaces 6. Characteristics Table 5. Characteristics T =25C unless otherwise specified. amb Symbol Parameter Conditions Min Typ Max Unit C input/output to ground V =0 V; f=1MHz; [1][2] - 1 1.2 pF (I/O-GND) I capacitance V =3V CC I reverse leakage current V =3V [3][2] - - 100 nA RM I V Zener diode breakdown I =1mA [4] 6 - 9 V BRzd I voltage V forward voltage I =10mA - 0.7 - V F test [1] This parameter is guaranteed by design. [2] Pins 1, 3, 4 and 6 are measured to ground. [3] All pins measured to ground (pin 2). [4] Measured from pin 5 to pin 2. 7. Application information 7.1 USB 1.1 and 2.0 protection VBUS DAT+ DAT+ USB DAT− DAT− PORT GND 1 6 USB 2.0/ 2 5 IEEE 1394 CONTROLLER 3 4 VBUS DAT+ DAT+ USB DAT− DAT− PORT GND 001aah371 Each device is capable to protect USB data lines and V supply. BUS Fig 1. Typical application for USB ESD protection IP4221CZ6-S All information provided in this document is subject to legal disclaimers. © NXP B.V. 2012. All rights reserved. Product data sheet Rev. 2 — 13 December 2012 3 of 12

IP4221CZ6-S NXP Semiconductors ESD protection for high-speed interfaces 7.2 USB On-The-GO (OTG) protection VBUS DAT+ DAT− USB OTG to phone ID RECEPTACLE CARKIT GND Shld GND mini B receptacle mini A receptacle 1 6 2 5 3 4 001aag051 The device is capable to protect USB data lines, V supply and ID pin. BUS Fig 2. Typical application for USB OTG ESD protection 7.3 Universal SIM card protection I/O CLOCK RESET SIM VCC GND 1 6 2 5 3 4 001aag052 The device also protects V . CC Fig 3. Typical application for universal SIM card ESD protection IP4221CZ6-S All information provided in this document is subject to legal disclaimers. © NXP B.V. 2012. All rights reserved. Product data sheet Rev. 2 — 13 December 2012 4 of 12

IP4221CZ6-S NXP Semiconductors ESD protection for high-speed interfaces 7.4 IEEE 1394a/b protection TPBIAS Shld1 7 1 μF BUS PWR PWR 1 56 Ω 56 Ω TPA+ TPA+ 6 TPA− TPA− 5 IEEE 1394 1 6 PHYSICAL LAYER 1394 CONNECTOR 2 5 3 4 TPB+ TPB+ 4 TPB− TPB− 3 GND 2 56 Ω 56 Ω Shld2 8 220 pF 5 kΩ 1 nF 10 nF 1 MΩ 001aag050 Fig 4. Typical application for IEEE 1394a/b ESD protection IP4221CZ6-S All information provided in this document is subject to legal disclaimers. © NXP B.V. 2012. All rights reserved. Product data sheet Rev. 2 — 13 December 2012 5 of 12

IP4221CZ6-S NXP Semiconductors ESD protection for high-speed interfaces 7.5 Gigabit Ethernet transceiver protection TPOPA R1 C1 C5 TPONA 1 6 2 5 3 4 TPOPB R2 C2 C6 TPONB GIGABIT QUAD ETHERNET TPOPC TRANSFORMER RJ45 TRANSCEIVER R3 C3 C7 TPONC 1 6 2 5 3 4 TPOPD R4 C4 C8 TPOND 001aag053 Fig 5. Typical application for gigabit Ethernet transceiver ESD protection IP4221CZ6-S All information provided in this document is subject to legal disclaimers. © NXP B.V. 2012. All rights reserved. Product data sheet Rev. 2 — 13 December 2012 6 of 12

IP4221CZ6-S NXP Semiconductors ESD protection for high-speed interfaces 7.6 Universal microSD/TransFlash and SD memory card protection DAT0 DAT1 DAT2 DAT3/CD CMD TRANSFLASH CLK VCC GND 1 6 1 6 2 5 2 5 3 4 3 4 001aag054 Fig 6. Typical application for universal microSD/TransFlash and SD memory card ESD protection 8. Package outline 1.05 0.50 0.95 max 0.04 0.6 max 0.25 3 4 0.17 0.5 1.5 2 5 1.4 0.5 1 6 0.40 0.35 0.32 0.27 Dimensions in mm 04-07-22 Fig 7. Package outline DFN1410-6(SOT886) IP4221CZ6-S All information provided in this document is subject to legal disclaimers. © NXP B.V. 2012. All rights reserved. Product data sheet Rev. 2 — 13 December 2012 7 of 12

IP4221CZ6-S NXP Semiconductors ESD protection for high-speed interfaces 9. Packing information Table 6. Packing methods The indicated -xxx are the last three digits of the 12NC ordering code. [1] Type number Package Description Packing quantity 5000 IP4221CZ6-S DFN1410-6 4 mm pitch, 8 mm tape and reel; T1 [2] -115 (SOT886) 4 mm pitch, 8 mm tape and reel; T4 [3] -132 [1] For further information and the availability of packing methods, see Section13. [2] T1: normal taping [3] T4: reverse taping 10. Soldering 1.250 0.675 0.370 (6×) 0.500 1.700 solder resist 0.500 solder paste = solderland 0.270 (6×) occupied area Dimensions in mm 0.325 0.425 (6×) (6×) sot886_fr Fig 8. Reflow soldering footprint DFN1410-6(SOT886) IP4221CZ6-S All information provided in this document is subject to legal disclaimers. © NXP B.V. 2012. All rights reserved. Product data sheet Rev. 2 — 13 December 2012 8 of 12

IP4221CZ6-S NXP Semiconductors ESD protection for high-speed interfaces 11. Revision history Table 7. Revision history Document ID Release date Data sheet status Change notice Supersedes IP4221CZ6-Sv.2 20121213 Product data sheet - IP4221CZ6-Sv.1 Modifications: • Section 1 “Product profile”: updated • Section 4 “Marking”: added • Section 5 “Limiting values”: T added amb • Recommended operating conditions: removed • Table 5 “Characteristics”: updated • Section 7 “Application information”: updated • Section 8 “Package outline”: drawing replaced with minimized package outline drawing • Section 10 “Soldering”: updated • Section 12 “Legal information”: updated IP4221CZ6-Sv.1 20080429 Product data sheet - - IP4221CZ6-S All information provided in this document is subject to legal disclaimers. © NXP B.V. 2012. All rights reserved. Product data sheet Rev. 2 — 13 December 2012 9 of 12

IP4221CZ6-S NXP Semiconductors ESD protection for high-speed interfaces 12. Legal information 12.1 Data sheet status Document status[1][2] Product status[3] Definition Objective [short] data sheet Development This document contains data from the objective specification for product development. Preliminary [short] data sheet Qualification This document contains data from the preliminary specification. Product [short] data sheet Production This document contains the product specification. [1] Please consult the most recently issued document before initiating or completing a design. [2] The term ‘short data sheet’ is explained in section “Definitions”. [3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URLhttp://www.nxp.com. 12.2 Definitions Suitability for use — NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in life support, life-critical or safety-critical systems or equipment, nor in applications where failure or Draft — The document is a draft version only. The content is still under malfunction of an NXP Semiconductors product can reasonably be expected internal review and subject to formal approval, which may result in to result in personal injury, death or severe property or environmental modifications or additions. NXP Semiconductors does not give any damage. NXP Semiconductors and its suppliers accept no liability for representations or warranties as to the accuracy or completeness of inclusion and/or use of NXP Semiconductors products in such equipment or information included herein and shall have no liability for the consequences of applications and therefore such inclusion and/or use is at the customer’s own use of such information. risk. Short data sheet — A short data sheet is an extract from a full data sheet Applications — Applications that are described herein for any of these with the same product type number(s) and title. A short data sheet is intended products are for illustrative purposes only. NXP Semiconductors makes no for quick reference only and should not be relied upon to contain detailed and representation or warranty that such applications will be suitable for the full information. For detailed and full information see the relevant full data specified use without further testing or modification. sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the Customers are responsible for the design and operation of their applications full data sheet shall prevail. and products using NXP Semiconductors products, and NXP Semiconductors accepts no liability for any assistance with applications or customer product Product specification — The information and data provided in a Product design. It is customer’s sole responsibility to determine whether the NXP data sheet shall define the specification of the product as agreed between Semiconductors product is suitable and fit for the customer’s applications and NXP Semiconductors and its customer, unless NXP Semiconductors and products planned, as well as for the planned application and use of customer have explicitly agreed otherwise in writing. In no event however, customer’s third party customer(s). Customers should provide appropriate shall an agreement be valid in which the NXP Semiconductors product is design and operating safeguards to minimize the risks associated with their deemed to offer functions and qualities beyond those described in the applications and products. Product data sheet. NXP Semiconductors does not accept any liability related to any default, damage, costs or problem which is based on any weakness or default in the 12.3 Disclaimers customer’s applications or products, or the application or use by customer’s third party customer(s). Customer is responsible for doing all necessary testing for the customer’s applications and products using NXP Limited warranty and liability — Information in this document is believed to Semiconductors products in order to avoid a default of the applications and be accurate and reliable. However, NXP Semiconductors does not give any the products or of the application or use by customer’s third party representations or warranties, expressed or implied, as to the accuracy or customer(s). NXP does not accept any liability in this respect. completeness of such information and shall have no liability for the consequences of use of such information. NXP Semiconductors takes no Limiting values — Stress above one or more limiting values (as defined in responsibility for the content in this document if provided by an information the Absolute Maximum Ratings System of IEC60134) will cause permanent source outside of NXP Semiconductors. damage to the device. Limiting values are stress ratings only and (proper) operation of the device at these or any other conditions above those given in In no event shall NXP Semiconductors be liable for any indirect, incidental, the Recommended operating conditions section (if present) or the punitive, special or consequential damages (including - without limitation - lost Characteristics sections of this document is not warranted. Constant or profits, lost savings, business interruption, costs related to the removal or repeated exposure to limiting values will permanently and irreversibly affect replacement of any products or rework charges) whether or not such the quality and reliability of the device. damages are based on tort (including negligence), warranty, breach of contract or any other legal theory. Terms and conditions of commercial sale — NXP Semiconductors products are sold subject to the general terms and conditions of commercial Notwithstanding any damages that customer might incur for any reason whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards sale, as published at http://www.nxp.com/profile/terms, unless otherwise customer for the products described herein shall be limited in accordance agreed in a valid written individual agreement. In case an individual with the Terms and conditions of commercial sale of NXP Semiconductors. agreement is concluded only the terms and conditions of the respective agreement shall apply. NXP Semiconductors hereby expressly objects to Right to make changes — NXP Semiconductors reserves the right to make applying the customer’s general terms and conditions with regard to the changes to information published in this document, including without purchase of NXP Semiconductors products by customer. limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior No offer to sell or license — Nothing in this document may be interpreted or to the publication hereof. construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. IP4221CZ6-S All information provided in this document is subject to legal disclaimers. © NXP B.V. 2012. All rights reserved. Product data sheet Rev. 2 — 13 December 2012 10 of 12

IP4221CZ6-S NXP Semiconductors ESD protection for high-speed interfaces Export control — This document as well as the item(s) described herein In the event that customer uses the product for design-in and use in may be subject to export control regulations. Export might require a prior automotive applications to automotive specifications and standards, customer authorization from competent authorities. (a) shall use the product without NXP Semiconductors’ warranty of the product for such automotive applications, use and specifications, and (b) Quick reference data — The Quick reference data is an extract of the whenever customer uses the product for automotive applications beyond product data given in the Limiting values and Characteristics sections of this NXP Semiconductors’ specifications such use shall be solely at customer’s document, and as such is not complete, exhaustive or legally binding. own risk, and (c) customer fully indemnifies NXP Semiconductors for any Non-automotive qualified products — Unless this data sheet expressly liability, damages or failed product claims resulting from customer design and states that this specific NXP Semiconductors product is automotive qualified, use of the product for automotive applications beyond NXP Semiconductors’ the product is not suitable for automotive use. It is neither qualified nor tested standard warranty and NXP Semiconductors’ product specifications. in accordance with automotive testing or application requirements. NXP Semiconductors accepts no liability for inclusion and/or use of non-automotive qualified products in automotive equipment or applications. 12.4 Trademarks Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners. 13. Contact information For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com IP4221CZ6-S All information provided in this document is subject to legal disclaimers. © NXP B.V. 2012. All rights reserved. Product data sheet Rev. 2 — 13 December 2012 11 of 12

IP4221CZ6-S NXP Semiconductors ESD protection for high-speed interfaces 14. Contents 1 Product profile. . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.1 General description . . . . . . . . . . . . . . . . . . . . . 1 1.2 Features and benefits. . . . . . . . . . . . . . . . . . . . 1 1.3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 2 Pinning information. . . . . . . . . . . . . . . . . . . . . . 2 3 Ordering information. . . . . . . . . . . . . . . . . . . . . 2 4 Marking. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 5 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 2 6 Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . 3 7 Application information. . . . . . . . . . . . . . . . . . . 3 7.1 USB 1.1 and 2.0 protection . . . . . . . . . . . . . . . 3 7.2 USB On-The-GO (OTG) protection . . . . . . . . . 4 7.3 Universal SIM card protection. . . . . . . . . . . . . . 4 7.4 IEEE 1394a/b protection. . . . . . . . . . . . . . . . . . 5 7.5 Gigabit Ethernet transceiver protection . . . . . . 6 7.6 Universal microSD/TransFlash and SD memory card protection . . . . . . . . . . . . . . . . . . . . . . . . . 7 8 Package outline. . . . . . . . . . . . . . . . . . . . . . . . . 7 9 Packing information . . . . . . . . . . . . . . . . . . . . . 8 10 Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 11 Revision history. . . . . . . . . . . . . . . . . . . . . . . . . 9 12 Legal information. . . . . . . . . . . . . . . . . . . . . . . 10 12.1 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 10 12.2 Definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 12.3 Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . . 10 12.4 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 11 13 Contact information. . . . . . . . . . . . . . . . . . . . . 11 14 Contents. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 Please be aware that important notices concerning this document and the product(s) described herein, have been included in section ‘Legal information’. © NXP B.V. 2012. All rights reserved. For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com Date of release: 13 December 2012 Document identifier: IP4221CZ6-S