Important notice Dear Customer, On 7 February 2017 the former NXP Standard Product business became a new company with the tradename Nexperia. Nexperia is an industry leading supplier of Discrete, Logic and PowerMOS semiconductors with its focus on the automotive, industrial, computing, consumer and wearable application markets In data sheets and application notes which still contain NXP or Philips Semiconductors references, use the references to Nexperia, as shown below. Instead of http://www.nxp.com, http://www.philips.com/ or http://www.semiconductors.philips.com/, use http://www.nexperia.com Instead of sales.addresses@www.nxp.com or sales.addresses@www.semiconductors.philips.com, use salesaddresses@nexperia.com (email) Replace the copyright notice at the bottom of each page or elsewhere in the document, depending on the version, as shown below: - © NXP N.V. (year). All rights reserved or © Koninklijke Philips Electronics N.V. (year). All rights reserved Should be replaced with: - © Nexperia B.V. (year). All rights reserved. If you have any questions related to the data sheet, please contact our nearest sales office via e-mail or telephone (details via salesaddresses@nexperia.com). Thank you for your cooperation and understanding, Kind regards, Team Nexperia

IP3088CX5; IP3088CX10; IP3088CX15; IP3088CX20 Integrated 2, 4, 6 and 8-channel passive LC-filter network with ESD protection to IEC 61000-4-2 level 4 Rev. 01 — 12 February 2010 Product data sheet 1. Product profile 1.1 General description IP3088CX5, IP3088CX10, IP3088CX15 and IP3088CX20 is a 2, 4, 6 and 8-channel LC low-pass filter array family which is designed to provide filtering of undesired RF signals on the I/O ports of portable communication or computing devices. In addition, IP3088CX5, IP3088CX10, IP3088CX15 and IP3088CX20 incorporates diodes to provide protection to downstream components from ElectroStatic Discharge (ESD) voltages as high as ±15 kV according IEC 61000-4-2 level 4. The devices are fabricated using monolithic silicon technology and integrate and incorporate up to 16 coils and 24 diodes in a 0.5 mm pitch Wafer-Level Chip-Scale Package (WLCSP). 1.2 Features and benefits (cid:132) Pb-free, RoHS compliant and free of halogen and antimony (Dark Green compliant) (cid:132) Integrated 2, 4, 6 and 8-channel π-type LC-filter network (cid:132) 18 Ω channel series resistance; ≤ 45 pF (at 2.5 V DC) channel capacitance (cid:132) Integrated ESD protection withstanding ±15 kV contact discharge, far exceeding IEC 61000-4-2 level 4 (cid:132) ESD protection to ±30 kV contact discharge, per MIL-STD-883D, Method 3 015 (cid:132) WLCSP with 0.5 mm pitch 1.3 Applications (cid:132) Cellular and Personal Communication System (PCS) mobile handsets (cid:132) Cordless telephones (cid:132) Wireless data (WAN/LAN) systems and PDAs

IP3088CX5/CX10/CX15/CX20 NXP Semiconductors 2, 4, 6 and 8-channel passive LC-filter network with ESD protection 2. Pinning information 2.1 Pinning bump A1 bump A1 index area index area 1 2 1 2 3 4 A A B B1 B B1 B2 C C 001aak061 001aak062 transparent top view, transparent top view, solder balls facing down solder balls facing down Fig 1. Pin configuration IP3088CX5 Fig 2. Pin configuration IP3088CX10 bump A1 bump A1 index area index area 1 2 3 4 5 6 1 2 3 4 5 6 7 8 A A B B1 B2 B3 B B1 B2 B3 B4 C C 001aak063 001aak064 transparent top view, transparent top view, solder balls facing down solder balls facing down Fig 3. Pin configuration IP3088CX15 Fig 4. Pin configuration IP3088CX20 2.2 Pin description Table 1. Pinning Pin Description IP3088CX5 IP3088CX10 IP3088CX15 IP3088CX20 A1 and C1 A1 and C1 A1 and C1 A1 and C1 filter channel 1 A2 and C2 A2 and C2 A2 and C2 A2 and C2 filter channel 2 - A3 and C3 A3 and C3 A3 and C3 filter channel 3 - A4 and C4 A4 and C4 A4 and C4 filter channel 4 - - A5 and C5 A5 and C5 filter channel 5 - - A6 and C6 A6 and C6 filter channel 6 - - - A7 and C7 filter channel 7 - - - A8 and C8 filter channel 8 B1 B1 and B2 B1, B2 and B3 B1, B2, B3 and B4 ground IP3088CX5_CX10_CX15_CX20_1 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2010. All rights reserved. Product data sheet Rev. 01 — 12 February 2010 2 of 15

IP3088CX5/CX10/CX15/CX20 NXP Semiconductors 2, 4, 6 and 8-channel passive LC-filter network with ESD protection 3. Ordering information Table 2. Ordering info rmation Type number Package Name Description Version IP3088CX5 WLCSP5 wafer level chip-size package; 5 bumps; 0.96 × 1.28 × 0.65 mm IP3088CX5 IP3088CX10 WLCSP10 wafer level chip-size package; 10 bumps; 1.96 × 1.28 × 0.65 mm IP3088CX10 IP3088CX15 WLCSP15 wafer level chip-size package; 15 bumps; 2.96 × 1.28 × 0.65 mm IP3088CX15 IP3088CX20 WLCSP20 wafer level chip-size package; 20 bumps; 3.96 × 1.28 × 0.65 mm IP3088CX20 4. Functional diagram A1 to A8 C1 to C8 B1 to B4 008aaa184 Fig 5. Schematic diagram IP3088CX5; IP3088CX10; IP3088CX15; IP3088CX20 5. Limiting values Table 3. Limiting valu es In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Parameter Conditions Min Max Unit V supply voltage −0.5 +5.6 V CC V electrostatic discharge voltage all pins to ground ESD contact discharge [1] −15 +15 kV air discharge [1] −15 +15 kV IEC 61000-4-2 level 4; all pins to ground contact discharge −8 +8 kV air discharge −15 +15 kV MIL-STD-883D (method 3 015) −30 +30 kV HBM contact discharge I channel current (DC) per inductor; T = 85 °C - 30 mA ch amb T storage temperature −65 +150 °C stg T ambient temperature −40 +85 °C amb [1] Device is qualified with 1 000 pulses of ±15 kV contact discharges each, according to the IEC 61000-4-2 model and far exceeds the specified level 4 (8 kV contact discharge). IP3088CX5_CX10_CX15_CX20_1 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2010. All rights reserved. Product data sheet Rev. 01 — 12 February 2010 3 of 15

IP3088CX5/CX10/CX15/CX20 NXP Semiconductors 2, 4, 6 and 8-channel passive LC-filter network with ESD protection 6. Characteristics Table 4. Channel characteristics T = 25 °C; unless otherwise specified. amb Symbol Parameter Conditions Min Typ Max Unit R channel series resistance - 18 - Ω s(ch) L channel series inductance - 40 - nH s(ch) C channel capacitance V = 0 V; [1] - 65 - pF ch bias(DC) f = 100 kHz V = 2.5 V; [1] - 42 - pF bias(DC) f = 100 kHz V breakdown voltage positive clamp; 5.8 - 10 V BR I = 1 mA test V forward voltage negative clamp; −1.5 - −0.4 V F I = −1 mA F I reverse leakage current per channel; V = 3.5 V - - 0.1 μA LR I [1] Guaranteed by design. Table 5. Frequency characteristics T = 25 °C; unless otherwise specified. amb Symbol Parameter Conditions Min Typ Max Unit α insertion loss R = 50 Ω; R = 50 Ω il gen L 800 MHz < f < 1.5 GHz - 40 - dB 1.5 GHz < f < 3.0 GHz - 33 - dB f cut-off frequency R = 50 Ω; R = 50 Ω; - 175 - MHz −3dB gen L V = 0 V; bias(DC) α at 1 MHz − 3 dB il 7. Application information 7.1 Insertion loss IP3088CX5, IP3088CX10, IP3088CX15 and IP3088CX20 is mainly designed as an ElectroMagnetic Interference (EMI) and Radio Frequency Interference (RFI) filter for Subscriber Identity Module (SIM) card interfaces. The setup for measuring insertion loss in a 50 Ω system is shown in Figure 6. IN OUT DUT 50 Ω 50 Ω TEST BOARD Vgen 001aai755 Fig 6. Frequency response measurement configuration IP3088CX5_CX10_CX15_CX20_1 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2010. All rights reserved. Product data sheet Rev. 01 — 12 February 2010 4 of 15

IP3088CX5/CX10/CX15/CX20 NXP Semiconductors 2, 4, 6 and 8-channel passive LC-filter network with ESD protection As an example, the measured insertion loss magnitude for all channels of the IP3088CX10 are shown in Figure 7. 001aak295 001aak296 0 0 s21 s21 (dB) (dB) −10 −10 −20 −20 −30 −30 −40 −40 −50 −50 1 10 102 103 104 1 10 102 103 104 f (MHz) f (MHz) a. Channel 1 (pins A1 and C1) b. Channel 2 (pins A2 and C2) 001aak294 001aak297 0 0 s21 s21 (dB) (dB) −10 −10 −20 −20 −30 −30 −40 −40 −50 −50 1 10 102 103 104 1 10 102 103 104 f (MHz) f (MHz) c. Channel 3 (pins A3 and C3) d. Channel 4 (pins A4 and C4) Fig 7. Measured insertion loss magnitude IP3088CX5_CX10_CX15_CX20_1 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2010. All rights reserved. Product data sheet Rev. 01 — 12 February 2010 5 of 15

IP3088CX5/CX10/CX15/CX20 NXP Semiconductors 2, 4, 6 and 8-channel passive LC-filter network with ESD protection 8. Package outline WLCSP20: wafer level chip-size package; 20 bumps (8-4-8) D bump A1 index area A2 E A A1 detail X e 1/2 e b C e1 B B1 B2 B3 B4 e2 A 1 2 3 4 5 6 7 8 e3 X European projection wlcsp20_8-4-8_po Fig 8. Package outline IP3088CX20 (WLCSP20) Table 6. Dimensions for Figure 8 Symbol Min Typ Max Unit A 0.60 0.65 0.70 mm A 0.22 0.24 0.26 mm 1 A 0.38 0.41 0.44 mm 2 b 0.27 0.32 0.37 mm D 3.91 3.96 4.01 mm E 1.23 1.28 1.33 mm e - 0.5 - mm e - 0.435 - mm 1 e - 0.87 - mm 2 e - 1.0 - mm 3 IP3088CX5_CX10_CX15_CX20_1 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2010. All rights reserved. Product data sheet Rev. 01 — 12 February 2010 6 of 15

IP3088CX5/CX10/CX15/CX20 NXP Semiconductors 2, 4, 6 and 8-channel passive LC-filter network with ESD protection WLCSP15: wafer level chip-size package; 15 bumps (6-3-6) D bump A1 index area A2 E A A1 detail X e 1/2 e b C e1 B B1 B2 B3 e2 A 1 2 3 4 5 6 e3 X European projection wlcsp15_6-3-6_po Fig 9. Package outline IP3088CX15 (WLCSP15) Table 7. Dimensions for Figure 9 Symbol Min Typ Max Unit A 0.60 0.65 0.70 mm A 0.22 0.24 0.26 mm 1 A 0.38 0.41 0.44 mm 2 b 0.27 0.32 0.37 mm D 2.91 2.96 3.01 mm E 1.23 1.28 1.33 mm e - 0.5 - mm e - 0.435 - mm 1 e - 0.87 - mm 2 e - 1.0 - mm 3 IP3088CX5_CX10_CX15_CX20_1 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2010. All rights reserved. Product data sheet Rev. 01 — 12 February 2010 7 of 15

IP3088CX5/CX10/CX15/CX20 NXP Semiconductors 2, 4, 6 and 8-channel passive LC-filter network with ESD protection WLCSP10: wafer level chip-size package; 10 bumps (4-2-4) D bump A1 index area A2 E A A1 detail X e b C e1 B1 B2 B e2 A 1 2 3 4 e3 X 1/2 e European projection wlcsp10_4-2-4_po Fig 10. Package outline IP3088CX10 (WLCSP10) Table 8. Dimensions for Figure 10 Symbol Min Typ Max Unit A 0.60 0.65 0.70 mm A 0.22 0.24 0.26 mm 1 A 0.38 0.41 0.44 mm 2 b 0.27 0.32 0.37 mm D 1.91 1.96 2.01 mm E 1.23 1.28 1.33 mm e - 0.5 - mm e - 0.435 - mm 1 e - 0.87 - mm 2 e - 1.0 - mm 3 IP3088CX5_CX10_CX15_CX20_1 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2010. All rights reserved. Product data sheet Rev. 01 — 12 February 2010 8 of 15

IP3088CX5/CX10/CX15/CX20 NXP Semiconductors 2, 4, 6 and 8-channel passive LC-filter network with ESD protection WLCSP5: wafer level chip-size package; 5 bumps (2-1-2) D bump A1 index area A2 E A A1 detail X e 1/2 e b C e1 B1 B e2 A 1 2 X European projection wlcsp5_2-1-2_po Fig 11. Package outline IP3088CX5 (WLCSP5) Table 9. Dimensions for Figure 11 Symbol Min Typ Max Unit A 0.60 0.65 0.70 mm A 0.22 0.24 0.26 mm 1 A 0.38 0.41 0.44 mm 2 b 0.27 0.32 0.37 mm D 0.91 0.96 1.01 mm E 1.23 1.28 1.33 mm e - 0.5 - mm e - 0.435 - mm 1 e - 0.87 - mm 2 IP3088CX5_CX10_CX15_CX20_1 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2010. All rights reserved. Product data sheet Rev. 01 — 12 February 2010 9 of 15

IP3088CX5/CX10/CX15/CX20 NXP Semiconductors 2, 4, 6 and 8-channel passive LC-filter network with ESD protection 9. Soldering of WLCSP packages 9.1 Introduction to soldering WLCSP packages This text provides a very brief insight into a complex technology. A more in-depth account of soldering WLCSP (Wafer Level Chip-Size Packages) can be found in application note AN10439 “Wafer Level Chip Scale Package” and in application note AN10365 “Surface mount reflow soldering description”. Wave soldering is not suitable for this package. All NXP WLCSP packages are lead-free. 9.2 Board mounting Board mounting of a WLCSP requires several steps: 1. Solder paste printing on the PCB 2. Component placement with a pick and place machine 3. The reflow soldering itself 9.3 Reflow soldering Key characteristics in reflow soldering are: • Lead-free versus SnPb soldering; note that a lead-free reflow process usually leads to higher minimum peak temperatures (see Figure 12) than a PbSn process, thus reducing the process window • Solder paste printing issues, such as smearing, release, and adjusting the process window for a mix of large and small components on one board • Reflow temperature profile; this profile includes preheat, reflow (in which the board is heated to the peak temperature), and cooling down. It is imperative that the peak temperature is high enough for the solder to make reliable solder joints (a solder paste characteristic) while being low enough that the packages and/or boards are not damaged. The peak temperature of the package depends on package thickness and volume and is classified in accordance with Table 10. Table 10. Lead-free process (from J-STD-020C) Package thickness (mm) Package reflow temperature (°C) Volume (mm3) < 350 350 to 2 000 > 2 000 < 1.6 260 260 260 1.6 to 2.5 260 250 245 > 2.5 250 245 245 Moisture sensitivity precautions, as indicated on the packing, must be respected at all times. Studies have shown that small packages reach higher temperatures during reflow soldering, see Figure 12. IP3088CX5_CX10_CX15_CX20_1 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2010. All rights reserved. Product data sheet Rev. 01 — 12 February 2010 10 of 15

IP3088CX5/CX10/CX15/CX20 NXP Semiconductors 2, 4, 6 and 8-channel passive LC-filter network with ESD protection maximum peak temperature = MSL limit, damage level temperature minimum peak temperature = minimum soldering temperature peak temperature time 001aac844 MSL: Moisture Sensitivity Level Fig 12. Temperature profiles for large and small components For further information on temperature profiles, refer to application note AN10365 “Surface mount reflow soldering description”. 9.3.1 Stand off The stand off between the substrate and the chip is determined by: • The amount of printed solder on the substrate • The size of the solder land on the substrate • The bump height on the chip The higher the stand off, the better the stresses are released due to TEC (Thermal Expansion Coefficient) differences between substrate and chip. 9.3.2 Quality of solder joint A flip-chip joint is considered to be a good joint when the entire solder land has been wetted by the solder from the bump. The surface of the joint should be smooth and the shape symmetrical. The soldered joints on a chip should be uniform. Voids in the bumps after reflow can occur during the reflow process in bumps with high ratio of bump diameter to bump height, i.e. low bumps with large diameter. No failures have been found to be related to these voids. Solder joint inspection after reflow can be done with X-ray to monitor defects such as bridging, open circuits and voids. 9.3.3 Rework In general, rework is not recommended. By rework we mean the process of removing the chip from the substrate and replacing it with a new chip. If a chip is removed from the substrate, most solder balls of the chip will be damaged. In that case it is recommended not to re-use the chip again. IP3088CX5_CX10_CX15_CX20_1 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2010. All rights reserved. Product data sheet Rev. 01 — 12 February 2010 11 of 15

IP3088CX5/CX10/CX15/CX20 NXP Semiconductors 2, 4, 6 and 8-channel passive LC-filter network with ESD protection Device removal can be done when the substrate is heated until it is certain that all solder joints are molten. The chip can then be carefully removed from the substrate without damaging the tracks and solder lands on the substrate. Removing the device must be done using plastic tweezers, because metal tweezers can damage the silicon. The surface of the substrate should be carefully cleaned and all solder and flux residues and/or underfill removed. When a new chip is placed on the substrate, use the flux process instead of solder on the solder lands. Apply flux on the bumps at the chip side as well as on the solder pads on the substrate. Place and align the new chip while viewing with a microscope. To reflow the solder, use the solder profile shown in application note AN10365 “Surface mount reflow soldering description”. 9.3.4 Cleaning Cleaning can be done after reflow soldering. 10. Abbreviations Table 11. Abbreviation s Acronym Description DUT Device Under Test EMI ElectroMagnetic Interference ESD ElectroStatic Discharge HBM Human Body Model LAN Local Area Network PCB Printed-Circuit Board PCS Personal Communication System PDA Personal Digital Assistant RFI Radio Frequency Interference RoHS Restriction of Hazardous Substances SIM Subscriber Identity Module WAN Wide Area Network WLCSP Wafer-Level Chip-Scale Package 11. Revision history Table 12. Revision history Document ID Release date Data sheet status Change notice Supersedes IP3088CX5_CX10_CX15_CX20_1 20100212 Product data sheet - - IP3088CX5_CX10_CX15_CX20_1 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2010. All rights reserved. Product data sheet Rev. 01 — 12 February 2010 12 of 15

IP3088CX5/CX10/CX15/CX20 NXP Semiconductors 2, 4, 6 and 8-channel passive LC-filter network with ESD protection 12. Legal information 12.1 Data sheet status Document status[1][2] Product status[3] Definition Objective [short] data sheet Development This document contains data from the objective specification for product development. Preliminary [short] data sheet Qualification This document contains data from the preliminary specification. Product [short] data sheet Production This document contains the product specification. [1] Please consult the most recently issued document before initiating or completing a design. [2] The term ‘short data sheet’ is explained in section “Definitions”. [3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com. 12.2 Definitions malfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. NXP Semiconductors accepts no liability for inclusion and/or use of Draft — The document is a draft version only. The content is still under NXP Semiconductors products in such equipment or applications and internal review and subject to formal approval, which may result in therefore such inclusion and/or use is at the customer’s own risk. modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of Applications — Applications that are described herein for any of these information included herein and shall have no liability for the consequences of products are for illustrative purposes only. NXP Semiconductors makes no use of such information. representation or warranty that such applications will be suitable for the specified use without further testing or modification. Short data sheet — A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended NXP Semiconductors does not accept any liability related to any default, for quick reference only and should not be relied upon to contain detailed and damage, costs or problem which is based on a weakness or default in the full information. For detailed and full information see the relevant full data customer application/use or the application/use of customer’s third party sheet, which is available on request via the local NXP Semiconductors sales customer(s) (hereinafter both referred to as “Application”). It is customer’s office. In case of any inconsistency or conflict with the short data sheet, the sole responsibility to check whether the NXP Semiconductors product is full data sheet shall prevail. suitable and fit for the Application planned. Customer has to do all necessary testing for the Application in order to avoid a default of the Application and the Product specification — The information and data provided in a Product product. NXP Semiconductors does not accept any liability in this respect. data sheet shall define the specification of the product as agreed between NXP Semiconductors and its customer, unless NXP Semiconductors and Limiting values — Stress above one or more limiting values (as defined in customer have explicitly agreed otherwise in writing. In no event however, the Absolute Maximum Ratings System of IEC 60134) will cause permanent shall an agreement be valid in which the NXP Semiconductors product is damage to the device. Limiting values are stress ratings only and (proper) deemed to offer functions and qualities beyond those described in the operation of the device at these or any other conditions above those given in Product data sheet. the Recommended operating conditions section (if present) or the Characteristics sections of this document is not warranted. Constant or repeated exposure to limiting values will permanently and irreversibly affect 12.3 Disclaimers the quality and reliability of the device. Terms and conditions of commercial sale — NXP Semiconductors Limited warranty and liability — Information in this document is believed to products are sold subject to the general terms and conditions of commercial be accurate and reliable. However, NXP Semiconductors does not give any sale, as published at http://www.nxp.com/profile/terms, unless otherwise representations or warranties, expressed or implied, as to the accuracy or agreed in a valid written individual agreement. In case an individual completeness of such information and shall have no liability for the agreement is concluded only the terms and conditions of the respective consequences of use of such information. agreement shall apply. NXP Semiconductors hereby expressly objects to In no event shall NXP Semiconductors be liable for any indirect, incidental, applying the customer’s general terms and conditions with regard to the punitive, special or consequential damages (including - without limitation - lost purchase of NXP Semiconductors products by customer. profits, lost savings, business interruption, costs related to the removal or No offer to sell or license — Nothing in this document may be interpreted or replacement of any products or rework charges) whether or not such construed as an offer to sell products that is open for acceptance or the grant, damages are based on tort (including negligence), warranty, breach of conveyance or implication of any license under any copyrights, patents or contract or any other legal theory. other industrial or intellectual property rights. Notwithstanding any damages that customer might incur for any reason Export control — This document as well as the item(s) described herein whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards may be subject to export control regulations. Export might require a prior customer for the products described herein shall be limited in accordance authorization from national authorities. with the Terms and conditions of commercial sale of NXP Semiconductors. Non-automotive qualified products — Unless the data sheet of an NXP Right to make changes — NXP Semiconductors reserves the right to make Semiconductors product expressly states that the product is automotive changes to information published in this document, including without qualified, the product is not suitable for automotive use. It is neither qualified limitation specifications and product descriptions, at any time and without nor tested in accordance with automotive testing or application requirements. notice. This document supersedes and replaces all information supplied prior NXP Semiconductors accepts no liability for inclusion and/or use of to the publication hereof. non-automotive qualified products in automotive equipment or applications. Suitability for use — NXP Semiconductors products are not designed, In the event that customer uses the product for design-in and use in authorized or warranted to be suitable for use in medical, military, aircraft, automotive applications to automotive specifications and standards, customer space or life support equipment, nor in applications where failure or (a) shall use the product without NXP Semiconductors’ warranty of the IP3088CX5_CX10_CX15_CX20_1 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2010. All rights reserved. Product data sheet Rev. 01 — 12 February 2010 13 of 15

IP3088CX5/CX10/CX15/CX20 NXP Semiconductors 2, 4, 6 and 8-channel passive LC-filter network with ESD protection product for such automotive applications, use and specifications, and (b) 12.4 Trademarks whenever customer uses the product for automotive applications beyond NXP Semiconductors’ specifications such use shall be solely at customer’s Notice: All referenced brands, product names, service names and trademarks own risk, and (c) customer fully indemnifies NXP Semiconductors for any are the property of their respective owners. liability, damages or failed product claims resulting from customer design and use of the product for automotive applications beyond NXP Semiconductors’ standard warranty and NXP Semiconductors’ product specifications. 13. Contact information For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com IP3088CX5_CX10_CX15_CX20_1 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2010. All rights reserved. Product data sheet Rev. 01 — 12 February 2010 14 of 15

IP3088CX5/CX10/CX15/CX20 NXP Semiconductors 2, 4, 6 and 8-channel passive LC-filter network with ESD protection 14. Contents 1 Product profile. . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.1 General description . . . . . . . . . . . . . . . . . . . . . 1 1.2 Features and benefits. . . . . . . . . . . . . . . . . . . . 1 1.3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 2 Pinning information. . . . . . . . . . . . . . . . . . . . . . 2 2.1 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 2.2 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 2 3 Ordering information. . . . . . . . . . . . . . . . . . . . . 3 4 Functional diagram . . . . . . . . . . . . . . . . . . . . . . 3 5 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 3 6 Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . 4 7 Application information. . . . . . . . . . . . . . . . . . . 4 7.1 Insertion loss . . . . . . . . . . . . . . . . . . . . . . . . . . 4 8 Package outline. . . . . . . . . . . . . . . . . . . . . . . . . 6 9 Soldering of WLCSP packages. . . . . . . . . . . . 10 9.1 Introduction to soldering WLCSP packages. . 10 9.2 Board mounting . . . . . . . . . . . . . . . . . . . . . . . 10 9.3 Reflow soldering. . . . . . . . . . . . . . . . . . . . . . . 10 9.3.1 Stand off . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 9.3.2 Quality of solder joint . . . . . . . . . . . . . . . . . . . 11 9.3.3 Rework. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 9.3.4 Cleaning. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 10 Abbreviations. . . . . . . . . . . . . . . . . . . . . . . . . . 12 11 Revision history. . . . . . . . . . . . . . . . . . . . . . . . 12 12 Legal information. . . . . . . . . . . . . . . . . . . . . . . 13 12.1 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 13 12.2 Definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 12.3 Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . . 13 12.4 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 14 13 Contact information. . . . . . . . . . . . . . . . . . . . . 14 14 Contents. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 Please be aware that important notices concerning this document and the product(s) described herein, have been included in section ‘Legal information’. © NXP B.V. 2010. All rights reserved. For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com Date of release: 12 February 2010 Document identifier: IP3088CX5_CX10_CX15_CX20_1