Data Sheet HSMx-A10x-xxxxx PLCC-2, Surface Mount LED Indicator Description Features This family of SMT LEDs is packaged in the industry  Industry standard PLCC-2 package standard PLCC-2 package. These SMT LEDs have high  High reliability LED package reliability performance and are designed to work under a  High brightness using AlInGaP and InGaN dice wide range of environmental conditions. This high reliability technologies feature makes them ideally suited to be used under harsh  Available in full selection of colors interior automotive as well as interior signs application  Super wide viewing angle at 120 conditions.  Available in 8 mm carrier tape on 7 inch reel (2000 pieces) To facilitate easy pick and place assembly, the LEDs are packed in EIA-compliant tape and reel. Every reel will be  Compatible with both IR and TTW soldering process shipped in single intensity and color bin, except red color, to Applications provide close uniformity. These LEDs are compatible with IR solder reflow process.  Interior automotive Due to the high reliability feature of these products, they can – Instrument panel backlighting also be mounted using through-the-wave soldering process. – Central console backlighting – Switch/push button backlighting The super wide viewing angle at 120° makes these LEDs  Electronic signs and signals ideally suited for panel, push button, or general backlighting – Interior full color sign in automotive interior, office equipment, industrial – Variable message sign equipment, and home appliances. The flat top emitting  Office automation, home appliances, industrial surface makes it easy for these LEDs to mate with light equipment pipes. With the built-in reflector pushing up the intensity of – Front panel backlighting the light output, these LEDs are also suitable to be used as – Push button backlighting LED pixels in interior electronic signs. – Display backlighting CAUTION! HSMN, M, and E-A10x-xxxxx LEDs are Class 2 ESD sensitive. Please observe appropriate precautions during handling and processing. Refer to Broadcom Application Note AN-1142 for additional details. Broadcom AV02-0198EN February 16, 2018

HSMx-A10x-xxxxx Data Sheet PLCC-2, Surface Mount LED Indicator Package Dimensions 2.8 ±0.2 1.9 ±0.2 2.2 ±0.2 0.1 TYP. 0.8 ±0.1 3.2 ±0.2 3.5 ±0.2 0.8 ±0.3 0.5 ±0.1 CATHODE MARKING (ANODE MARKING FOR AlGaAs DEVICES) TOP MOUNT 2.8 ±0.2 1.9 ±0.2 2.2 ±0.2 3.2 ±0.2 5.2 ±0.2 0.1 TYP. CATHODE MARKING 0.5 ±0.1 REVERSE MOUNT NOTE: ALL DIMENSIONS IN MILLIMETERS. Broadcom AV02-0198EN 2

HSMx-A10x-xxxxx Data Sheet PLCC-2, Surface Mount LED Indicator Device Selection Guide Red Part Number Min IV (mcd) Typ. IV (mcd) Max. IV (mcd) Test Current (mA) Dice Technology HSMS-A100-J00J1 4.50 15.00 — 20 GaP HSMS-A100-L00J1 11.20 15.00 — 20 GaP HSMS-A100-J80J2 5.60 — 14.00 10 GaP HSMH-A100-L00J1 11.20 15.00 — 20 AlGaAs HSMH-A100-N00J1 28.50 50.00 — 20 AlGaAs HSMC-A100-Q00J1 71.50 100.00 — 20 AlInGaP HSMC-A100-R00J1 112.50 140.00 — 20 AlInGaP HSMC-A101-S00J1 180.00 220.00 — 20 AlInGaP HSMZ-A100-T00J1 285.00 350.00 — 20 AlInGaP HSMC-A100-N00H1 28.50 — — 20 AlInGaP HSMC-A100-Q70J1 90.00 — 180.0 20 AlInGaP HSMC-A101-S30J1 180.00 — 355.0 20 AlInGaP HSMC-A101-S40J1 180.00 — 450.0 20 AlInGaP HSMZ-A100-R00J1 112.50 — — 20 AlInGaP HSMZ-A100-T70J1 355.00 — 715.0 20 AlInGaP Red Orange Part Number Min IV (mcd) Typ. IV (mcd) Max. IV (mcd) Test Current (mA) Dice Technology HSMJ-A100-Q00J1 71.50 100.00 — 20 AlInGaP HSMJ-A101-S00J1 180.00 200.00 — 20 AlInGaP HSMJ-A100-T40J1 285.00 — 715.00 20 AlInGaP HSMV-A100-T00J1 285.00 350.00 — 20 AlInGaP HSMJ-A100-R40J1 112.50 — 285.00 20 AlInGaP Orange Part Number Min IV (mcd) Typ. IV (mcd) Max. IV (mcd) Test Current (mA) Dice Technology HSMD-A100-J00J1 4.50 15.00 — 20 GaP HSMD-A100-L00J1 11.20 15.00 — 20 GaP HSMD-A100-K4PJ2 7.20 — 18.00 10 GaP HSML-A100-Q00J1 71.50 100.00 — 20 AlInGaP HSML-A101-S00J1 180.00 220.00 — 20 AlInGaP Broadcom AV02-0198EN 3

HSMx-A10x-xxxxx Data Sheet PLCC-2, Surface Mount LED Indicator Yellow/Amber Part Number Min IV (mcd) Typ. IV (mcd) Max. IV (mcd) Test Current (mA) Dice Technology HSMY-A100-J00J1 4.50 12.00 — 20 GaP HSMY-A100-L00J1 11.20 12.00 — 20 GaP HSMA-A100-Q00J1 71.50 100.00 — 20 AlInGaP HSMA-A101-S00J1 180.00 220.00 — 20 AlInGaP HSMU-A100-S00J1 180.00 320.00 — 20 AlInGaP HSMA-A101-R8WJ1 140.00 — 355.00 20 AlInGaP HSMA-A100-Q00H1 71.50 — — 20 AlInGaP HSMA-A100-R40J1 112.50 — 285.00 20 AlInGaP HSMA-A100-R45J1 12.50 — 285.00 20 AlInGaP HSMA-A101-S3WJ1 180.00 — 355.00 20 AlInGaP Yellow Green Part Number Min IV (mcd) Typ. IV (mcd) Max. IV (mcd) Test Current (mA) Dice Technology HSMG-A100-J02J1 4.50 18.00 — 20 GaP HSMG-A100-K72J2 9.00 — 18.00 10 GaP HSME-A100-M02J1 18.00 70.00 — 20 AlInGaP HSME-A100-N82J1 35.50 — 90.00 20 AlInGaP Emerald Green Part Number Min IV (mcd) Typ. IV (mcd) Max. IV (mcd) Test Current (mA) Dice Technology HSMG-A100-H01J1 2.80 8.00 — 20 GaP HSME-A100-L01J1 11.20 40.00 — 20 AlInGaP HSME-A100-M3PJ1 18.00 — 35.50 20 AlInGaP HSMG-A100-K42J2 7.20 — 18 20 GaP HSMG-A100-L02J1 11.20 — — 20 GaP Green Part Number Min IV (mcd) Typ. IV (mcd) Max. IV (mcd) Test Current (mA) Dice Technology HSMM-A101-R00J1 112.50 200.00 — 20 InGaN HSMM-A100-S00J1 180.00 350.00 — 20 InGaN HSMM-A100-U4PJ1 450.00 — 1125.00 20 InGaN HSMM-A101-R00H1 112.50 — — 20 InGaN Broadcom AV02-0198EN 4

HSMx-A10x-xxxxx Data Sheet PLCC-2, Surface Mount LED Indicator Blue Part Number Min IV (mcd) Typ. IV (mcd) Max. IV (mcd) Test Current (mA) Dice Technology HSMN-A101-N00J1 28.50 50.00 — 20 InGaN HSMN-A100-P00J1 45.00 70.00 — 20 InGaN HSMN-A100-S4YJ1 180.00 — 450.00 20 InGaN HSMN-A100-R8YJ1 140.00 — 355.00 20 InGaN HSMN-A100-R00J1 112.50 — — 20 InGaN Part Numbering System HSM x - A x x x - x x x x x 1 2 3 4 5 6 7 8 9 Packaging Option Color Bin Selection Intensity Bin Select Device Specific Configuration Package Type LED Chip Color Absolute Maximum Ratings (T = 25°C) A Parameters HSMS/D/Y/G HSMH HSMC/J/L/A HSME HSMZ/V/U HSMM/N DC Forward Currenta 30 mA 30 mA 30 mAb, c 20 mAc 30 mAb, c 30 mA Peak Forward Currentd 100 mA 100 mA 100 mA 100 mA 100 mA 100 mA Power Dissipation 63 mW 60 mW 63 mW 48 mW 63 mW 114 mA Reverse Voltage 5V Junction Temperature 110°C Operating Temperature –55°C to +100°C Storage Temperature –55°C to +100°C a. Derate linearly as shown in Figure4. b. Drive current between 10 mA and 30 mA is recommended for best long term performance. c. Operation at current below 5 mA is not recommended. d. Duty factor = 10%, Frequency = 1 kHz. Broadcom AV02-0198EN 5

HSMx-A10x-xxxxx Data Sheet PLCC-2, Surface Mount LED Indicator Optical Characteristics (T = 25°C) A Peak Dominant Viewing Angle Luminous Luminous Wavelength Wavelengtha 2 θ b Efficacy ηvc Intensity/Total 1/2 Dice λPEAK (nm) λD (nm) (Degrees) (lm/W) Flux Iv(mcd)/ Color Part Number Technology Typ. Typ. Typ. Typ. Φv(mlm) Typ. Red HSMS-A100 GaP 635 626 120 120 0.45 HSMH-A100 AlGaAs 645 637 120 63 0.45 HSMC-A10x AlInGaP 635 626 120 150 0.45 HSMZ-A100 AlInGaP 635 626 120 155 0.45 Red HSMJ-A10x AlInGaP 621 615 120 240 0.45 Orange HSMV-A100 AlInGaP 623 617 120 263 0.45 Orange HSMD-A100 GaP 600 602 120 380 0.45 HSML-A10x AlInGaP 609 605 120 320 0.45 Amber HSMY-A100 GaP 583 585 120 520 0.45 HSMA-A10x AlInGaP 592 590 120 480 0.45 HSMU-A100 AlInGaP 594 592 120 500 0.45 Yellow HSMG-A100 GaP 565 569 120 590 0.45 Green HSME-A100 AlInGaP 575 570 120 560 0.45 Emerald HSMG-A100 GaP 558 560 120 650 0.45 Green HSME-A100 AlInGaP 566 560 120 610 0.45 Green HSMM-A10x InGaN 523 525 120 500 0.45 Blue HSMN-A10x InGaN 468 470 120 75 0.45 a. The dominant wavelength, λ , is derived from the CIE Chromaticity Diagram and represents the color of the device. D b. θ is the off -axis angle where the luminous intensity is 1/2 the peak intensity. 1/2 c. Radiant intensity, Ie in watts/steradian, may be calculated from the equation Ie = I /η , where I is the luminous intensity in candelas and η v v v v is the luminous efficacy in lumens/watt. Electrical Characteristics (T = 25°C) A Forward Voltage V (Volts) at I = 20 mA F F Reverse Voltage V Reverse Voltage V Thermal Resistance R R Part Number Typ. Max. at 100 µA Min. at 10 µA Min. RθJP (°CW) HSMS/D/Y/G 2.2 2.6 5 180 HSMH 1.9 2.6 5 180 HSMC/J/L/A/E 1.9 2.4 5 280 HSMZ/V/U 1.9 2.4 5 280 HSMM/N 3.4 4.05 5 280 Broadcom AV02-0198EN 6

HSMx-A10x-xxxxx Data Sheet PLCC-2, Surface Mount LED Indicator Figure 1: Relative Intensity vs. Wavelength 1.0 BLUE EMERALD GREEN 0.9 YELLOW GREEN 0.8 GREEN AMBER 0.7 NSITY 0.6 NTE 0.5 RELATIVE I 00..34 ORERDA NOGREANGE RED 0.2 0.1 0 380 430 480 530 580 630 680 730 780 WAVELENGTH – nm 1.0 GaP EMERALD GREEN 0.8 GaP GaP YELLOW YELLOW NSITY0.6 GREEN NTE GaP ORANGE ATIVE I0.4 REL GaP RED 0.2 0 380 430 480 530 580 630 680 730 780 WAVELENGTH – nm Broadcom AV02-0198EN 7

HSMx-A10x-xxxxx Data Sheet PLCC-2, Surface Mount LED Indicator Figure 2: Forward Current vs. Forward Voltage Figure 3: Relative Intensity vs. Forward Current 35 1.8 1.6 Gap 30 – mA 25 HSMS/D/Y/G NTENSITY0 mA) 11..24 AAlIlnGGaaAPs InGaN ORWARD CURRENT 121005 HSMC/J/L/A/EH/ZS/MVH/U HSMM/N LATIVE LUMINOUS I(NORMALIZED AT 2 0100....8064 F RE 5 0.2 0 0 0 5 10 15 20 25 30 35 0 1 2 3 4 5 DC FORWARD CURRENT – mA FORWARD VOLTAGE – V Figure 4: Maximum Forward Current vs. Ambient Temper- Figure 5: Maximum Forward Current vs. Solder Point ature, Derated Based on T MAX = 110°C, Rθ = 500 °C/W Temperature, Derated Based on T MAX = 110°C, Rθ = 180 J JA J JA °C/W or 280 °C/W 35 35 30 HSMS/D/G/ 30 Y/H/Z/V/U 25 HSMS/D/G/Y/H A HSMC/J/L/A 25 HSMC/J/L/A CURRENT - m 1250 HSME HSMM/N RRENT - mA 1250 HSME HSMHZS/MV/MU/N 10 U C 10 5 5 0 0 20 40 60 80 100 120 0 TEMPERATURE (°C) 0 20 40 60 80 100 120 TEMPERATURE (°C) Figure 6: Dominant Wavelength vs. Forward Current (InGaN Figure 7: Forward Voltage Shift vs. Temperature Devices) 540 0.5 530 0.4 H – nm 520 GREEN AT 25°C) 0.3 GT 510 D 0.2 LEN LIZE AVE 500 MA 0.1 T W 490 NOR 0 GaP/AlGaAs/ NAN V (F AlInGaP MI 480 TA -0.1 O L D E 470 BLUE D -0.2 InGaN/GaN 460 -0.3 0 5 10 15 20 25 30 35 -100 -50 0 50 100 150 CURRENT – mA TEMPERATURE – °C Broadcom AV02-0198EN 8

HSMx-A10x-xxxxx Data Sheet PLCC-2, Surface Mount LED Indicator Figure 8: Radiation Pattern 1.0 0.8 Y T SI N 0.6 E T N D I E Z LI 0.4 A M R O N 0.2 0 -90 -80 -70 -60 -50 -40 -30 -20 -10 0 10 20 30 40 50 60 70 80 90 ANGULAR DISPLACEMENT – DEGREES NOTE: For detailed information on reflow soldering of Broadcom surface mount LEDs, refer to Broadcom Application Note AN 1060, Surface Mounting SMT LED Indicator Components. Reflow soldering must not be done more than twice. Observe necessary precautions of handling moisture sensitive device as stated in the following section. Figure 9: Recommended Soldering Pad Pattern 4.50 1.50 2.60 SOLDER RESIST Broadcom AV02-0198EN 9

HSMx-A10x-xxxxx Data Sheet PLCC-2, Surface Mount LED Indicator Figure 10: Tape Leader and Trailer Dimensions TRAILER COMPONENT LEADER 200 mm MIN. FOR Ø180 REEL. 480 mm MIN. FOR Ø180 REEL. 200 mm MIN. FOR Ø330 REEL. 960 mm MIN. FOR Ø330 REEL. C A USER FEED DIRECTION Figure 11: Tape Dimensions 4 ±0.1 4 ±0.1 2 ±0.05 2.29 ±0.1 1.75 ±0.1 +0.1 Ø 1.5 –0 C 3.5 ±0.05 +0.3 3.81 ±0.1 8 –0.1 A +0.1 3.05 ±0.1 Ø1 –0 8° 0.229 ±0.01 Broadcom AV02-0198EN 10

HSMx-A10x-xxxxx Data Sheet PLCC-2, Surface Mount LED Indicator Figure 12: Reel Dimensions Ø 20.5 ± 0.3 2+0.5 –0 +0 62.5 180 –2.5 Ø 13 ± 0.2 +1.50 8.4 – 0 . 0 0 (MEASURED AT OUTER EDGE) 14.4 (MAX. MEASURED AT HUB) LABEL AREA (111 mm x 57 mm) 7.9 (MIN.) WITH DEPRESSION (0.25 mm) 10.9 (MAX.) Figure 13: Reeling Orientation USER FEED DIRECTION CATHODE SIDE PRINTED LABEL Broadcom AV02-0198EN 11

HSMx-A10x-xxxxx Data Sheet PLCC-2, Surface Mount LED Indicator Intensity Bin Select (X X ) Intensity Bin Limits 5 6 Individual reel will contain parts from one half bin only. Bin ID Min. (mcd) Max. (mcd) G1 1.80 2.24 X Min. I Bin 5 V G2 2.24 2.80 H1 2.80 3.55 X H2 3.55 4.50 6 J1 4.50 5.60 0 Full Distribution J2 5.60 7.20 2 2 half bins starting from X 1 5 K1 7.20 9.00 3 3 half bins starting from X 1 5 K2 9.00 11.20 4 4 half bins starting from X 1 5 L1 11.20 14.00 5 5 half bins starting from X 1 5 L2 14.00 18.00 6 2 half bins starting from X52 M1 18.00 22.40 7 3 half bins starting from X 2 M2 22.40 28.50 5 8 4 half bins starting from X 2 N1 28.50 35.50 5 9 5 half bins starting from X 2 N2 35.50 45.00 5 P1 45.00 56.00 P2 56.00 71.50 Q1 71.50 90.00 Q2 90.00 112.50 R1 112.50 140.00 R2 140.00 180.00 S1 180.00 224.00 S2 224.00 285.00 T1 285.00 355.00 T2 355.00 450.00 U1 450.00 560.00 U2 560.00 715.00 V1 715.00 900.00 V2 900.00 1125.00 W1 1125.00 1400.00 W2 1400.00 1800.00 X1 1800.00 2240.00 X2 2240.00 2850.00 Tolerance of each bin limit = ±12% Broadcom AV02-0198EN 12

HSMx-A10x-xxxxx Data Sheet PLCC-2, Surface Mount LED Indicator Color Bin Select (X ) Color Bin Limits 7 Individual reel will contain parts from one full bin only. Color Min. (nm) Max. (nm) Blue X 7 A 460.0 465.0 0 Full distribution B 465.0 470.0 Z A and B only C 470.0 475.0 Y B and C only D 475.0 480.0 W C and D only Green V D and E only U E and F only A 515.0 520.0 T F and G only B 520.0 525.0 S G and H only C 525.0 530.0 Q A, B, and C only D 530.0 535.0 P B, C, and D only Emerald Green N C, D, and E only A 552.5 555.5 M D, E, and F only B 555.5 558.5 L E, F, and G only C 558.5 561.5 K F, G, and H only D 561.5 564.5 1 A, B, C, and D only Yellow Green 2 E, F, G, and H only E 564.5 567.5 3 B, C, D, and E only F 567.5 570.5 4 C, D, E, and F only G 570.5 573.5 5 A, B, C, D, and E only H 573.5 576.5 6 B, C, D, E, and F only Amber A 582.0 584.5 B 584.5 587.0 C 587.0 589.5 D 589.5 592.0 E 592.0 594.5 F 594.5 597.0 Orange A 597.0 600.0 B 600.0 603.0 C 603.0 606.0 D 606.0 609.0 E 609.0 612.0 Red Orange A 611.0 616.0 B 616.0 620.0 Red Full distribution Broadcom AV02-0198EN 13

HSMx-A10x-xxxxx Data Sheet PLCC-2, Surface Mount LED Indicator Packaging Option (X X ) Figure 14: Recommended Pb-Free Reflow Soldering Profile 8 9 Option Test Current Package Type Reel Size 10 to 30 SEC. J1 20 mA Top Mount 7 inches J4 20 mA Top Mount 13 inches 255 - 260 C H1 20 mA Reverse Mount 7 inches 3 C/SEC. MAX. RE 217 C H4 20 mA Reverse Mount 13 inches ATU 200 C R 6 C/SEC. MAX. J2 10 mA Top Mount 7 inches E P M J5 10 mA Top Mount 13 inches E 150 C T H2 10 mA Reverse Mount 7 inches 3 C/SEC. MAX. H5 10 mA Reverse Mount 13 inches L2 2 mA Top Mount 7 inches 60 - 120 SEC. 100 SEC. MAX. Precautionary Notes TIME (Acc. to J-STD-020C) Soldering Figure 15: Recommended Board Reflow Direction  Do not perform reflow soldering more than twice. Observe necessary precautions of handling moisture- sensitive device as stated in the following section.  Do not apply any pressure or force on the LED during reflow and after reflow when the LED is still hot.  Use reflow soldering to solder the LED. Use hand soldering only for rework if unavoidable, but it must be strictly controlled to following conditions: – Soldering iron tip temperature = 315°C max. – Soldering duration = 3s max. – Number of cycles = 1 only – Power of soldering iron = 50W max. Handling Precautions  Do not touch the LED package body with the soldering iron except for the soldering terminals, as it may cause damage to the LED. For automated pick and place, Broadcom has tested a nozzle size with OD 1.5 mm to work with this LED. However,  Confirm beforehand whether the functionality and performance of the LED is affected by soldering with due to the possibility of variations in other parameters such hand soldering. as pick and place machine maker/model, and other settings of the machine, verify that the selected nozzle will not cause damage to the LED. Broadcom AV02-0198EN 14

HSMx-A10x-xxxxx Data Sheet PLCC-2, Surface Mount LED Indicator Handling of Moisture-Sensitive Devices Application Precautions  The drive current of the LED must not exceed the This product has a Moisture Sensitive Level 2a rating per maximum allowable limit across temperature as stated JEDEC J-STD-020. Refer to Broadcom Application Note in the data sheet. Constant current driving is AN5305, Handling of Moisture Sensitive Surface Mount recommended to ensure consistent performance. Devices for additional details and a review of proper  Circuit design must cater to the whole range of forward handling procedures. voltage (V ) of the LEDs to ensure the intended drive F  Before use: current can always be achieved. – An unopened moisture barrier bag (MBB) can be  The LED exhibits slightly different characteristics at stored at <40°C/90% RH for 12 months. If the actual different drive currents, which may result in a larger shelf life has exceeded 12 months and the Humidity variation of performance (meaning: intensity, Indicator Card (HIC) indicates that baking is not wavelength, and forward voltage). Set the application required, then it is safe to reflow the LEDs per the current as close as possible to the test current to original MSL rating. minimize these variations. – Do not open the MBB prior to assembly (for  The LED is not intended for reverse bias. Use other example, for IQC). If unavoidable, MBB must be appropriate components for such purposes. When properly resealed with fresh desiccant and HIC. The driving the LED in matrix form, ensure that the reverse exposed duration must be taken in as floor life. bias voltage does not exceed the allowable limit of the  Control after opening the MBB: LED. – Read the HIC immediately upon opening of MBB.  Do not use the LED in the vicinity of material with sulfur content or in environments of high gaseous sulfur – Keep the LEDs at <30°/60% RH at all times, and compounds and corrosive elements. Examples of complete all high temperature-related processes, material that might contain sulfur are rubber gaskets, including soldering, curing or rework within 672 room- temperature vulcanizing (RTV) silicone rubber, hours. rubber gloves, and so on. Prolonged exposure to such  Control for unfinished reel: environments may affect the optical characteristics and Store unused LEDs in a sealed MBB with desiccant or a product life. desiccator at <5% RH.  White LEDs must not be exposed to acidic  Control of assembled boards: environments and must not be used in the vicinity of If the PCB soldered with the LEDs is to be subjected to any compound that may have acidic outgas, such as, other high-temperature processes, store the PCB in a but not limited to, acrylate adhesive. These environments have an adverse effect on LED sealed MBB with desiccant or desiccator at <5% RH to performance. ensure that all LEDs have not exceeded their floor life of 168 hours.  This LED is designed to have enhanced gas corrosion resistance. Its performance has been tested according  Baking is required if: to the conditions below: – The HIC indicator indicates a change in color for – IEC 60068-2-43: 25°C/75% RH, H2S 15 ppm, 21 10% and 5%, as stated on the HIC. days – The LEDs are exposed to conditions of >30°C/60% – IEC 60068-2-42: 25°C/75% RH, SO2 25 ppm, 21 RH at any time. days – The LED's floor life exceeded 168 hours. – IEC 60068-2-60: 25°C/75% RH, SO2 200 ppb, NO2 The recommended baking condition is: 60±5°C for 20 200 ppb, H2S 10 ppb, Cl2 10 ppb, 21 days. hours.  As actual application might not be exactly similar to the Baking can only be done once. test conditions, do verify that the LED will not be damaged by prolonged exposure in the intended  Storage: environment. The soldering terminals of these Broadcom LEDs are  Avoid rapid change in ambient temperature, especially silver plated. If the LEDs are exposed in ambient in high-humidity environments, because they cause environment for too long, the silver plating might be condensation on the LED. oxidized, thus affecting its solderability performance. As such, keep unused LEDs in a sealed MBB with desiccant or in a desiccator at <5% RH. Broadcom AV02-0198EN 15

HSMx-A10x-xxxxx Data Sheet PLCC-2, Surface Mount LED Indicator  If the LED is intended to be used in harsh or outdoor TS can be easily measured by mounting a thermocouple on environment, protect the LED against damages caused the soldering joint as shown in preceding figure, while R θJ-S by rain water, water, dust, oil, corrosive gases, external is provided in the data sheet. Verify the T of the LED in the S mechanical stresses, and so on. final product to ensure that the LEDs are operating within all maximum ratings stated in the data sheet. Thermal Management Eye Safety Precautions The optical, electrical, and reliability characteristics of the LED are affected by temperature. Keep the junction LEDs may pose optical hazards when in operation. Do not temperature (T ) of the LED below the allowable limit at all J look directly at operating LEDs because it might be harmful times. T can be calculated as follows: J to the eyes. For safety reasons, use appropriate shielding or personal protective equipment. T = T + R x I x V J A θJ-A F Fmax where; T = ambient temperature (°C) A R = thermal resistance from LED junction to ambient θJ-A (°C/W) I = forward current (A) F V = maximum forward voltage (V) Fmax The complication of using this formula lies in T and R . A θJ-A Actual T is sometimes subjective and hard to determine. A R varies from system to system depending on design θJ-A and is usually not known. Another way of calculating T is by using the solder point J temperature, TS as follows: T = T + R x I x V J S θJ-S F Fmax where; T = LED solder point temperature as shown in the S following figure (°C) R = thermal resistance from junction to solder point θJ-S (°C/W) I = forward current (A) F V = maximum forward voltage (V) Fmax Figure 16: Solder Point Temperatures on PCB Package mark Ts point Broadcom AV02-0198EN 16

Disclaimer Broadcom's products and software are not specifically designed, manufactured, or authorized for sale as parts, components, or assemblies for the planning, construction, maintenance, or direct operation of a nuclear facility or for use in medical devices or applications. The customer is solely responsible, and waives all rights to make claims against Broadcom or its suppliers, for all loss, damage, expense, or liability in connection with such use. Broadcom, the pulse logo, Connecting everything, Avago Technologies, Avago, and the A logo are among the trademarks of Broadcom and/or its affiliates in the United States, certain other countries, and/or the EU. Copyright © 2017–2018 Broadcom. All Rights Reserved. The term “Broadcom” refers to Broadcom Limited and/or its subsidiaries. For more information, please visit www.broadcom.com. Broadcom reserves the right to make changes without further notice to any products or data herein to improve reliability, function, or design. Information furnished by Broadcom is believed to be accurate and reliable. However, Broadcom does not assume any liability arising out of the application or use of this information, nor the application or use of any product or circuit described herein, neither does it convey any license under its patent rights nor the rights of others.

Mouser Electronics Authorized Distributor Click to View Pricing, Inventory, Delivery & Lifecycle Information: A vago Technologies: HSMB-A100-K80J2 HSMK-A101-R4WJ1 HSMU-A100-R9PJ1 B roadcom Limited: HSMM-A100-U4PJ1 HSMB-A100-J00J1 HSME-A100-L01J1 HSME-A100-M02J1 HSME-A100-M3PJ1 HSME- A100-N32J1 HSME-A100-N82J1 HSMG-A100-H41J2 HSMG-A100-J02J1 HSMG-A100-J02J2 HSMG-A100-K42J2 HSMG-A100-K72J2 HSMG-A100-L02J1 HSMH-A100-M80J2 HSMH-A100-N00J1 HSMJ-A100-Q00J1 HSMJ-A100- R40J1 HSMJ-A101-R80J1 HSMJ-A101-S00J1 HSMK-A100-S00J1 HSMK-A100-S8WJ1 HSMK-A101-R00J1 HSML- A100-Q00J1 HSML-A100-Q0YJ1 HSML-A100-Q7PJ1 HSML-A100-R7PJ1 HSML-A101-S00J1 HSMM-A100-S00J1 HSMM-A100-S8PJ1 HSMM-A101-R00J1 HSMM-A101-R3PJ1 HSMM-A101-R7PJ1 HSMM-A101-R8PJ1 HSMN- A100-P00J1 HSMN-A100-R00J1 HSMN-A101-N00J1 HSMS-A100-H70J2 HSMS-A100-J00J1 HSMS-A100-K30J2 HSMS-A100-L00J1 HSMU-A100-R00J1 HSMU-A100-S4WJ1 HSMV-A100-R00J1 HSMV-A100-S80J1 HSMV-A100- T00J1 HSMY-A100-J00J1 HSMY-A100-J35J2 HSMY-A100-K45J2 HSMY-A100-L00J1 HSMZ-A100-R00J1 HSMZ- A100-S80J1 HSMZ-A100-T00J1 HSMZ-A100-T30J1 HSMZ-A100-T70J1 HSMN-A100-R4YJ1