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  • 型号: HS247180
  • 制造商: American Microsemiconductor, Inc.
  • 库位|库存: xxxx|xxxx
  • 要求:
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+xxxx $xxxx ¥xxxx

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HS247180产品简介:

ICGOO电子元器件商城为您提供HS247180由American Microsemiconductor, Inc.设计生产,在icgoo商城现货销售,并且可以通过原厂、代理商等渠道进行代购。 提供HS247180价格参考以及American Microsemiconductor, Inc.HS247180封装/规格参数等产品信息。 你可以下载HS247180参考资料、Datasheet数据手册功能说明书, 资料中有HS247180详细功能的应用电路图电压和使用方法及教程。

产品参数 图文手册 常见问题
参数 数值
产品目录

分立半导体产品

描述

POWER MOD SCHOTTKY 240A 180V

产品分类

二极管,整流器 - 模块

品牌

Microsemi Power Products Group

数据手册

http://www.microsemi.com/document-portal/doc_download/123503-hs247180-200-rev4-pdf

产品图片

产品型号

HS247180

rohs

无铅 / 符合限制有害物质指令(RoHS)规范要求

产品系列

-

不同If时的电压-正向(Vf)

860mV @ 240A

不同 Vr时的电流-反向漏电流

8mA @ 180V

二极管类型

肖特基

二极管配置

单路

供应商器件封装

HALF-PAK

包装

散装

反向恢复时间(trr)

-

安装类型

底座安装

封装/外壳

HALF-PAK

标准包装

1

热阻

*

电压-DC反向(Vr)(最大值)

180V

电流-平均整流(Io)(每二极管)

240A

速度

快速恢复 =< 500 ns,> 200mA(Io)

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PDF Datasheet 数据手册内容提取

240 Amp Schottky Rectifier HS247180-HS247200 G D J Dim. Inches Millimeter Std. Polarity Minimum Maximum Minimum Maximum Notes Base is cathode B Rev. Polarity A 1.52 1.56 38.61 39.62 Base is anode B .725 .775 18.42 19.69 C .605 .625 15.37 15.88 D 1.182 1.192 30.02 30.28 K F C E .745 .755 18.92 19.18 Sq. H F .152 .160 3.86 4.06 Dia. E G 1/4-20 UNC-2B H .525 .580 13.34 14.73 J .156 .160 3.96 4.06 K .495 .505 12.57 12.83 Dia. L .120 .130 3.05 3.30 A L Microsemi Industry Working Peak Repetitive Peak Schottky Barrier Rectifier Catalog Number Part Number Reverse Voltage Reverse Voltage Guard Ring Protection HS247180* 180V 180V 240 Amperes 180-200 Volts HS247200* 200V 200V 175°C Junction Temperature Reverse Energy Tested ROHS Compliant *Add Suffix R for Reverse Polarity Electrical Characteristics Average forward current IF(AV) 240 Amps TC = 118°C, Square wave,R 0JC =.24°C/W Maximum surge current IFSM 3300 Amps 8.3ms, half sine, T J = 175°C Maximum repetitive reverse current IR(OV) 2 Amps f = 1 KHZ, 25°C Typical peak forward voltage VFM 0.65 Volts IFM = 240A: T J = 175°C* Max peak forward voltage VFM 0.86 Volts IFM = 240A: T J = 25°C* Typical peak reverse current IRM 150mA VRRM, T J = 125°C* Max peak reverse current IRM 8.0mA VRRM, T J = 25°C Typical junction capacitance CJ 6000pF VR = 5.0V, T C = 25°C *Pulse test: Pulse width 300µsec, Duty cycle 2% Thermal and Mechanical Characteristics Storage temp range TSTG -55°C to 175°C Operating junction temp range TJ -55°C to 175°C Max thermal resistance ROJC 0.21°C/W Junction to case Typical thermal resistance (greased) ROCS 0.12°C/W Case to sink Terminal Torque 35-40 inch pounds Mounting Base Torque 20-25 inch pounds Weight 1.1 ounces (32 grams) typical www.microsemi.com October, 2012 - Rev. 4

HS247180-HS247200 Figure 1 Figure 3 Typical Forward Characteristics Typical Junction Capacitance 10,000 100,000 60,000 40,000 5000 F p 20,000 - e c n 10,000 a t ci 6000 a p Ca 4000 n 1000 tio 2000 c n u J 1000 0.1 0.5 1.0 5.0 10 50 100 500 Reverse Voltage - Volts Figure 4 s 125 C ere 175 C 25 C CForward Current Derating p m - 180 A - ure 100 at 170 nt er e p rr m 160 u e C T ward 50 Case 150 For ble 140 a s w u o aneo m All 130 nt mu 120 a t xi Ins 10 Ma 110 120 180 DC 0 100 200 300 400 500 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 Instantaneous Forward Voltage - Volts Average Forward Current - Amperes Figure 2 Figure 5 Typical Reverse Characteristics Maximum Forward Power Dissipation s 10000 att 280 DC W A m - 240 1000 - n Current 100 175 C Dissipatio 216000 120 180 e evers 10 125 C ower 120 R P 80 al 75 C m c 1 u pi m 40 Ty xi 0.1 25 C Ma 0 0 40 80 120 160 200 0 100 200 300 400 500 Reverse Voltage - Volts Average Forward Current - Amperes www.microsemi.com October, 2012 - Rev. 4

DISCLAIMER The information contained in the document (unless it is publicly available on the Web without access restrictions) is PROPRIETARY AND CONFIDENTIAL information of Microsemi and cannot be copied, published, uploaded, posted, transmitted, distributed or disclosed or used without the express duly signed written consent of Microsemi. If the recipient of this document has entered into a disclosure agreement with Microsemi, then the terms of such Agreement will also apply. This document and the information contained herein may not be modified, by any person other than authorized personnel of Microsemi. No license under any patent, copyright, trade secret or other intellectual property right is granted to or conferred upon you by disclosure or delivery of the information, either expressly, by implication, inducement, estoppels or otherwise. Any license under such intellectual property rights must be approved by Microsemi in writing signed by an officer of Microsemi. Microsemi reserves the right to change the configuration, functionality and performance of its products at anytime without any notice. This product has been subject to limited testing and should not be used in conjunction with life- support or other mission-critical equipment or applications. Microsemi assumes no liability whatsoever, and Microsemi disclaims any express or implied warranty, relating to sale and/or use of Microsemi products including liability or warranties relating to fitness for a particular purpose, merchantability, or infringement of any patent, copyright or other intellectual property right. Any performance specifications believed to be reliable but are not verified and customer or user must conduct and complete all performance and other testing of this product as well as any user or customers final application. User or customer shall not rely on any data and performance specifications or parameters provided by Microsemi. It is the customer’s and user’s responsibility to independently determine suitability of any Microsemi product and to test and verify the same. The information contained herein is provided “AS IS, WHERE IS” and with all faults, and the entire risk associated with such information is entirely with the User. Microsemi specifically disclaims any liability of any kind including for consequential, incidental and punitive damages as well as lost profit. The product is subject to other terms and conditions which can be located on the web at http://www.microsemi.com/legal/tnc.asp Life Support Application Seller's Products are not designed, intended, or authorized for use as components in systems intended for space, aviation, surgical implant into the body, in other applications intended to support or sustain life, or for any other application in which the failure of the Seller's Product could create a situation where personal injury, death or property damage or loss may occur (collectively "Life Support Applications"). Buyer agrees not to use Products in any Life Support Applications and to the extent it does it shall conduct extensive testing of the Product in such applications and further agrees to indemnify and hold Seller, and its officers, employees, subsidiaries, affiliates, agents, sales representatives and distributors harmless against all claims, costs, damages and expenses, and attorneys' fees and costs arising, directly or directly, out of any claims of personal injury, death, damage or otherwise associated with the use of the goods in Life Support Applications, even if such claim includes allegations that Seller was negligent regarding the design or manufacture of the goods. Buyer must notify Seller in writing before using Seller’s Products in Life Support Applications. Seller will study with Buyer alternative solutions to meet Buyer application specification based on Sellers sales conditions applicable for the new proposed specific part. www.microsemi.com October, 2012