Notice for TAIYO YUDEN products Please read this notice before using the TAIYO YUDEN products. REMINDERS ■ Product Information in this Catalog (4) Power generation control equipment (nuclear power, Product information in this catalog is as of October 2019. All of the hydroelectric power, thermal power plant control system, etc.) contents specified herein and production status of the products listed (5) Undersea equipment (submarine repeating equipment, in this catalog are subject to change without notice due to technical underwater work equipment, etc.) improvement of our products, etc. Therefore, please check for the (6) Military equipment latest information carefully before practical application or use of our (7) Any other equipment requiring extremely high levels of safety products. and/or reliability equal to the equipment listed above Please note that TAIYO YUDEN shall not be in any way responsible *Notes: for any damages and defects in products or equipment incorporating 1. There is a possibility that our products can be used only our products, which are caused under the conditions other than those for aviation equipment that does not directly affect the safe specified in this catalog or individual product specification sheets. operation of aircraft (e.g., in-flight entertainment, cabin light, electric seat, cooking equipment) if such use meets ■ Approval of Product Specifications requirements specified separately by TAIYO YUDEN. Please Please contact TAIYO YUDEN for further details of product be sure to contact TAIYO YUDEN for further information specifications as the individual product specification sheets are before using our products for such aviation equipment. available. When using our products, please be sure to approve our 2. Implantable medical devices contain not only internal unit product specifications or make a written agreement on the product which is implanted in a body, but also external unit which is specification with TAIYO YUDEN in advance. connected to the internal unit. ■ Pre-Evaluation in the Actual Equipment and Conditions 4. Limitation of Liability Please conduct validation and verification of our products in actual Please note that unless you obtain prior written consent of TAIYO conditions of mounting and operating environment before using our YUDEN, TAIYO YUDEN shall not be in any way responsible for products. any damages incurred by you or third parties arising from use of the products listed in this catalog for any equipment that is not ■ Limited Application intended for use by TAIYO YUDEN, or any equipment requiring 1. Equipment Intended for Use inquiry to TAIYO YUDEN or prohibited for use by TAIYO YUDEN The products listed in this catalog are intended for general- as described above. purpose and standard use in general electronic equipment (e.g., AV equipment, OA equipment, home electric appliances, office ■ Safety Design equipment, information and communication equipment including, When using our products for high safety and/or reliability-required without limitation, mobile phone, and PC) and other equipment equipment or circuits, please fully perform safety and/or reliability specified in this catalog or the individual product specification sheets. evaluation. In addition, please install (i) systems equipped with a protection circuit and a protection device and/or (ii) systems TAIYO YUDEN has the line-up of the products intended for equipped with a redundant circuit or other system to prevent an use in automotive electronic equipment, telecommunications unsafe status in the event of a single fault for a failsafe design to infrastructure and industrial equipment, or medical devices ensure safety. classified as GHTF Classes A to C (Japan Classes I to III). Therefore, when using our products for these equipment, ■ Intellectual Property Rights please check available applications specified in this catalog Information contained in this catalog is intended to convey examples or the individual product specification sheets and use the of typical performances and/or applications of our products and is corresponding products. not intended to make any warranty with respect to the intellectual property rights or any other related rights of TAIYO YUDEN or any 2. Equipment Requiring Inquiry third parties nor grant any license under such rights. Please be sure to contact TAIYO YUDEN for further information before using the products listed in this catalog for the following ■ Limited Warranty equipment (excluding intended equipment as specified in this Please note that the scope of warranty for our products is limited to catalog or the individual product specification sheets) which may the delivered our products themselves and TAIYO YUDEN shall not cause loss of human life, bodily injury, serious property damage be in any way responsible for any damages resulting from a failure and/or serious public impact due to a failure or defect of the or defect in our products. Notwithstanding the foregoing, if there is products and/or malfunction attributed thereto. a written agreement (e.g., supply and purchase agreement, quality (1) Transportation equipment (automotive powertrain control assurance agreement) signed by TAIYO YUDEN and your company, system, train control system, and ship control system, etc.) TAIYO YUDEN will warrant our products in accordance with such (2) Traffic signal equipment agreement. (3) Disaster prevention equipment, crime prevention equipment (4) Medical devices classified as GHTF Class C (Japan Class III) ■ TAIYO YUDEN’s Official Sales Channel (5) Highly public information network equipment, data- The contents of this catalog are applicable to our products which are processing equipment (telephone exchange, and base purchased from our sales offices or authorized distributors (hereinafter station, etc.) “TAIYO YUDEN’s official sales channel”). Please note that the contents (6) Any other equipment requiring high levels of quality and/or of this catalog are not applicable to our products purchased from any reliability equal to the equipment listed above seller other than TAIYO YUDEN’s official sales channel. 3. Equipment Prohibited for Use ■ Caution for Export Please do not incorporate our products into the following Some of our products listed in this catalog may require specific equipment requiring extremely high levels of safety and/or procedures for export according to“ U.S. Export Administration reliability. Regulations”,“ Foreign Exchange and Foreign Trade Control Law” (1) Aerospace equipment (artificial satellite, rocket, etc.) of Japan, and other applicable regulations. Should you have any (2) Aviation equipment *1 questions on this matter, please contact our sales staff. (3) Medical devices classified as GHTF Class D (Japan Class IV), implantable medical devices *2 20

for General Electronic Equipment for General Electronic Equipment MULTILAYER CERAMIC CAPACITORS MULTILAYER CERAMIC CAPACITORS C WAVE REFLOW AC PAER WAVE REFLOW CA ■PARTS NUMBER ITM OIC RS J M K 3 1 6 △ B J 1 0 6 M L － T △ △＝Blank space ① ② ③ ④ ⑤ ⑥ ⑦ ⑧ ⑨ ⑩ ⑪ ⑫ M ①Rated voltage ③End termination U Code Rated voltage［VDC］ Code End termination L T P 2.5 K Plated ILA A 4 S Cu Internal Electrodes (For High Frequency) Y J 6.3 E R L 10 ④Dimension（L×W） C E 16 Type Dimensions EIA（inch） E T 25 （L×W）［mm］ R A G 35 021 0.25× 0.125 008004 M U 50 042 0.4 × 0.2 01005 IC H 100 063 0.6 × 0.3 0201 Q 250 1.0 × 0.5 0402 C 105 A S 630 0.52× 1.0 ※ 0204 P X 2000 1.6 × 0.8 0603 A 107 C 0.8 × 1.6 ※ 0306 IT ②Series name 212 2.0 × 1.25 0805 O Code Series name 1.25× 2.0 ※ 0508 R M Multilayer ceramic capacitor 316 3.2 × 1.6 1206 S V Multilayer ceramic capacitor for high frequency 325 3.2 × 2.5 1210 W LW reverse type multilayer capacitor 432 4.5 × 3.2 1812 Note : ※LW reverse type（□WK） only ⑤Dimension tolerance Code Type L［mm］ W［mm］ T［mm］ △ ALL Standard Standard Standard 063 0.6±0.05 0.3±0.05 0.3±0.05 105 1.0±0.10 0.5±0.10 0.5±0.10 107 1.6＋0.15/－0.05 0.8＋0.15/－0.05 0.8＋0.15/－0.05 0.45±0.05 A 212 2.0＋0.15/－0.05 1.25＋0.15/－0.05 0.85±0.10 1.25＋0.15/－0.05 0.85±0.10 316 3.2±0.20 1.6±0.20 1.6±0.20 325 3.2±0.30 2.5±0.30 2.5±0.30 063 0.6±0.09 0.3±0.09 0.3±0.09 105 1.0＋0.15/－0.05 0.5＋0.15/－0.05 0.5＋0.15/－0.05 0.45±0.05 107 1.6＋0.20/－0 0.8＋0.20/－0 0.8＋0.20/－0 B 0.45±0.05 212 2.0＋0.20/－0 1.25＋0.20/－0 0.85±0.10 1.25＋0.20/－0 316 3.2±0.30 1.6±0.30 1.6±0.30 C 105 1.0＋0.20/－0 0.5＋0.20/－0 0.5＋0.20/－0 063 0.6 + 0.25/- 0 0.3 + 0.25/- 0 0.3 + 0.25/ - 0 E 105 1.0＋0.30/－0 0.5＋0.30/－0 0.5＋0.30/－0 Note: cf. STANDARD EXTERNAL DIMENSIONS △= Blank space ⑥Temperature characteristics code ■High dielectric type（Excluding Super low distortion multilayer ceramic capacitor） Applicable Temperature Capacitance Tolerance Code Ref. Temp.［℃］ Capacitance change standard range［℃］ tolerance code ±10％ K JIS B －25～＋ 85 20 ±10％ ±20％ M BJ ±10％ K EIA X5R －55～＋ 85 25 ±15％ ±20％ M ±10％ K B7 EIA X7R －55～＋125 25 ±15％ ±20％ M ±10％ K C6 EIA X6S －55～＋105 25 ±22％ ±20％ M ±10％ K C7 EIA X7S －55～＋125 25 ±22％ ±20％ M ±10％ K LD(※) EIA X5R －55～＋ 85 25 ±15％ ±20％ M Note : ※.LD Low distortion high value multilayer ceramic capacitor △= Blank space c_mlcc_e-E08R01 ▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our product specification sheets. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our website (http://www.ty-top.com/) . 12 20

for General Electronic Equipment ■Temperature compensating type Applicable Temperature Capacitance Tolerance Code Ref. Temp.［℃］ Capacitance change standard range［℃］ tolerance code C ±0.05pF A AC ±0.1pF B PAER CA CG EIA C0G －55～＋125 25 0±30ppm/℃ ±0.25pF C ITM ±0.5pF D ORSIC ±5％ J ±0.25pF C JIS UJ 20 UJ －55～＋125 －750±120ppm/℃ ±0.5pF D M EIA U2J 25 ±5％ J U JIS UK －55～＋125 20 L UK －750±250ppm/℃ ±0.25pF C T EIA U2K －55～＋125 25 IL A Y ⑥Series code ⑨Thickness E R ・Super low distortion multilayer ceramic capacitor Code Thickness［mm］ C Code Series code K 0.125 E SD Standard H 0.13 R A E 0.18 M ・Medium-High Voltage Multilayer Ceramic Capacitor C 0.2 IC Code Series code D C SD Standard P A T 0.3 PA ⑦Nominal capacitance K 0.45（107type or more） C Code V IT Nominal capacitance 0.5 O （example） W R 0R5 0.5pF A 0.8 S 010 1pF D 0.85（212type or more） 100 10pF F 1.15 101 100pF G 1.25 102 1,000pF L 1.6 103 10,000pF N 1.9 104 0.1μF Y 2.0 max 105 1.0μF M 2.5 106 10μF 107 100μF ⑩Special code Note : R＝Decimal point Code Special code － Standard ⑧Capacitance tolerance Code Capacitance tolerance ⑪Packaging A ±0.05pF Code Packaging B ±0.1pF F φ178mm Taping （2mm pitch） C ±0.25pF T φ178mm Taping （4mm pitch） D ±0.5pF φ178mm Taping （4mm pitch, 1000 pcs/reel） P F ±1pF 325 type（Thickness code M） G ±2％ φ178mm Taping （2mm pitch）105type only R J ±5％ （Thickness code E,H） K ±10％ W φ178mm Taping（1mm pitch）021/042type only M ±20％ Z ＋80/－20％ ⑫Internal code Code Internal code △ Standard ▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our product specification sheets. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our website (http://www.ty-top.com/) . c_mlcc_e-E08R01 20 13

for General Electronic Equipment ■STANDARD EXTERNAL DIMENSIONS W Dimension [mm] Type( EIA ) L L W T *1 e C □MK021（008004） 0.25±0.013 0.125±0.013 0.125±0.013 K 0.0675±0.0275 AC PAER T □VS021（008004） 0.25±0.013 0.125±0.013 0.125±0.013 K 0.0675±0.0275 CA C ITM □MK042（01005） 0.4±0.02 0.2±0.02 0.2±0.02 0.1±0.03 OIC e D RS □VS042（01005） 0.4±0.02 0.2±0.02 0.2±0.02 C 0.1±0.03 P □MK063（0201） 0.6±0.03 0.3±0.03 0.3±0.03 0.15±0.05 T M 0.13±0.02 H L U 0.18±0.02 E LT □MK105（0402） 1.0±0.05 0.5±0.05 0.2±0.02 C 0.25±0.10 IL W 0.3±0.03 P A 0.5±0.05 V Y E □VK105（0402） 1.0±0.05 0.5±0.05 0.5±0.05 W 0.25±0.10 R □WK105（0204）※ 0.52±0.05 1.0±0.05 0.3±0.05 P 0.18±0.08 CE T □MK107（0603） 1.6±0.10 0.8±0.10 0.45±0.05 K 0.35±0.25 R 0.8±0.10 A A e □WK107（0306）※ 0.8±0.10 1.6±0.10 0.5±0.05 V 0.25±0.15 M 0.45±0.05 K IC □MK212（0805） 2.0±0.10 1.25±0.10 0.85±0.10 D 0.5±0.25 C ※ LW reverse type 1.25±0.10 G A □WK212（0508）※ 1.25±0.15 2.0±0.15 0.85±0.10 D 0.3±0.2 P A 0.85±0.10 D C □MK316（1206） 3.2±0.15 1.6±0.15 1.15±0.10 F 0.5＋0.35/－0.25 IT 1.6±0.20 L O 0.85±0.10 D R S 1.15±0.10 F □MK325（1210） 3.2±0.30 2.5±0.20 1.9±0.20 N 0.6±0.3 1.9＋0.1/－0.2 Y 2.5±0.20 M 2.0+0/-0.30 Y 0.6±0.4 □MK432（1812） 4.5±0.40 3.2±0.30 2.5±0.20 M 0.9±0.6 Note : ※. LW reverse type, *1.Thickness code ■STANDARD QUANTITY Dimension Standard quantity［pcs］ Type EIA（inch） ［mm］ Code Paper tape Embossed tape 021 008004 0.125 K － 50000 C 042 01005 0.2 － 40000 D P 063 0201 0.3 15000 － T 0.13 H － 20000 0.18 E － 15000 0.2 C 20000 － 0402 105 0.3 P 15000 － V 0.5 W 10000 － 0204 ※ 0.30 P 0.45 K 0603 4000 － 107 0.8 A 0306 ※ 0.50 V － 4000 0.45 K 4000 － 0805 0.85 D 212 1.25 G － 3000 0508 ※ 0.85 D 4000 － 0.85 D 4000 － 316 1206 1.15 F － 3000 1.6 L － 2000 0.85 D 1.15 F － 2000 325 1210 1.9 N 2.0 max Y 2.5 M － 1000 2.0 max Y － 1000 432 1812 2.5 M － 500 Note : ※.LW Reverse type（□WK） c_mlcc_e-E08R01 ▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our product specification sheets. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our website (http://www.ty-top.com/) . 14 20

for General Electronic Equipment ■PARTS NUMBER Medium-High Voltage Multilayer Ceramic Capacitors ●105TYPE C AC 【Temperature Characteristic B7 : X7R（－55～＋125℃）】　0.5mm thickness（V） PACITERAM Part number 1 Part number 2 Rated[ Vv]oltage cThaermapceteraritsutrices Capa c[Fit]ance Capacitan[c％e ]tolerance t a[％nδ] Rated vHoTltLaTge x ％Thickness*3 [mm] SRWo:R:lWdeeafrlvoinewg OIC HMK105 B7221[]V-F X7R 220p ±10, ±20 2.5 200 0.5±0.05 R RS HMK105 B7331[]V-F X7R 330p ±10, ±20 2.5 200 0.5±0.05 R HMK105 B7471[]V-F X7R 470p ±10, ±20 2.5 200 0.5±0.05 R HMK105 B7681[]V-F X7R 680p ±10, ±20 2.5 200 0.5±0.05 R HMK105 B7102[]V-F 100 X7R 1000p ±10, ±20 2.5 200 0.5±0.05 R M HMK105 B7152[]V-F X7R 1500p ±10, ±20 2.5 200 0.5±0.05 R U HMK105 B7222[]V-F X7R 2200p ±10, ±20 2.5 200 0.5±0.05 R HMK105 B7332[]V-F X7R 3300p ±10, ±20 2.5 200 0.5±0.05 R L T HMK105 B7472[]V-F X7R 4700p ±10, ±20 2.5 200 0.5±0.05 R IL A 【Temperature Characteristic CG : CG/C0G（－55～＋125℃）】　0.5mm thickness（V） YER Part number 1 Part number 2 Rated[ Vv]oltage cThaermapceteraritsutrices Capa c[Fit]ance Capacitance tolerance (at m1QMinHz) Rated vHoTltLaTge x ％Thickness*3 [mm] SRWo:R:lWdeeafrlvoinewg C HMK105 CG080DV-F CG C0G 8p ±0.5pF 560 200 0.5±0.05 R E HMK105 CG090DV-F CG C0G 9p ±0.5pF 580 200 0.5±0.05 R R HMK105 CG100DV-F CG C0G 10p ±0.5pF 600 200 0.5±0.05 R A HMK105 CG120JV-F CG C0G 12p ±5％ 640 200 0.5±0.05 R M HMK105 CG150JV-F CG C0G 15p ±5％ 700 200 0.5±0.05 R IC HMK105 CG180JV-F CG C0G 18p ±5％ 760 200 0.5±0.05 R HMK105 CG220JV-F CG C0G 22p ±5％ 840 200 0.5±0.05 R C HMK105 CG240JV-F CG C0G 24p ±5％ 880 200 0.5±0.05 R A HMK105 CG270JV-F 100 CG C0G 27p ±5％ 940 200 0.5±0.05 R P HMK105 CG330JV-F CG C0G 33p ±5％ 1000 200 0.5±0.05 R A HMK105 CG390JV-F CG C0G 39p ±5％ 1000 200 0.5±0.05 R C IT HHMMKK110055 CCGG457600JJVV--FF CCGG CC00GG 4576pp ±±55％％ 11000000 220000 00..55±±00..0055 RR O HMK105 CG680JV-F CG C0G 68p ±5％ 1000 200 0.5±0.05 R R HMK105 CG820JV-F CG C0G 82p ±5％ 1000 200 0.5±0.05 R S HMK105 CG101JV-F CG C0G 100p ±5％ 1000 200 0.5±0.05 R ●107TYPE 【Temperature Characteristic BJ : B（－25～＋85℃）/X5R（－55～＋85℃）】　0.8mm thickness（A） Part number 1 Part number 2 Rated[ Vv]oltage cThaermapceteraritsutrices Capa c[Fit]ance Capacitan[c％e ]tolerance t a[％nδ] Rated vHoTltLaTge x ％Thickness*3 [mm] SRWo:R:lWdeeafrlvoinewg HMK107 BJ102[]A-T B X5R*1 1000p ±10, ±20 3.5 200 0.8±0.10 R HMK107 BJ152[]A-T B X5R*1 1500p ±10, ±20 3.5 200 0.8±0.10 R HMK107 BJ222[]A-T B X5R*1 2200p ±10, ±20 3.5 200 0.8±0.10 R HMK107 BJ332[]A-T B X5R*1 3300p ±10, ±20 3.5 200 0.8±0.10 R HMK107 BJ472[]A-T B X5R*1 4700p ±10, ±20 3.5 200 0.8±0.10 R HMK107 BJ682[]A-T B X5R*1 6800p ±10, ±20 3.5 200 0.8±0.10 R HMK107 BJ103[]A-T 100 B X5R*1 0.01μ ±10, ±20 3.5 200 0.8±0.10 R HMK107 BJ153[]A-T B X5R*1 0.015μ ±10, ±20 3.5 200 0.8±0.10 R HMK107 BJ223[]A-T B X5R*1 0.022μ ±10, ±20 3.5 200 0.8±0.10 R HMK107 BJ333[]A-T B X5R*1 0.033μ ±10, ±20 3.5 200 0.8±0.10 R HMK107 BJ473[]A-T B X5R*1 0.047μ ±10, ±20 3.5 200 0.8±0.10 R HMK107 BJ104[]A-T B X5R*1 0.1μ ±10, ±20 3.5 200 0.8±0.10 R HMK107 BJ224[]A-TE B X5R*1 0.22μ ±10, ±20 3.5 150 0.8±0.10 R 【Temperature Characteristic C7 : X7S（－55～＋125℃）】　0.8mm thickness（A） Part number 1 Part number 2 Rated[ Vv]oltage cThaermapceteraritsutrices Capa c[Fit]ance Capacitan[c％e ]tolerance t a[％nδ] Rated vHoTltLaTge x ％Thickness*3 [mm] SRWo:R:lWdeeafrlvoinewg HMK107 C7224[]A-TE 100 X7S 0.22μ ±10, ±20 3.5 150 0.8±0.10 R 【Temperature Characteristic B7 : X7R（－55～＋125℃）】　0.8mm thickness（A） Part number 1 Part number 2 Rated[ Vv]oltage cThaermapceteraritsutrices Capa c[Fit]ance Capacitan[c％e ]tolerance t a[％nδ] Rated vHoTltLaTge x ％Thickness*3 [mm] SRWo:R:lWdeeafrlvoinewg HMK107 B7102[]A-T X7R 1000p ±10, ±20 3.5 200 0.8±0.10 R HMK107 B7152[]A-T X7R 1500p ±10, ±20 3.5 200 0.8±0.10 R HMK107 B7222[]A-T X7R 2200p ±10, ±20 3.5 200 0.8±0.10 R HMK107 B7332[]A-T X7R 3300p ±10, ±20 3.5 200 0.8±0.10 R HMK107 B7472[]A-T X7R 4700p ±10, ±20 3.5 200 0.8±0.10 R HMK107 B7682[]A-T X7R 6800p ±10, ±20 3.5 200 0.8±0.10 R 100 HMK107 B7103[]A-T X7R 0.01μ ±10, ±20 3.5 200 0.8±0.10 R HMK107 B7153[]A-T X7R 0.015μ ±10, ±20 3.5 200 0.8±0.10 R HMK107 B7223[]A-T X7R 0.022μ ±10, ±20 3.5 200 0.8±0.10 R HMK107 B7333[]A-T X7R 0.033μ ±10, ±20 3.5 200 0.8±0.10 R HMK107 B7473[]A-T X7R 0.047μ ±10, ±20 3.5 200 0.8±0.10 R HMK107 B7104[]A-T X7R 0.1μ ±10, ±20 3.5 200 0.8±0.10 R c_mlcc_e-E08R01 ▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our product specification sheets. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our website (http://www.ty-top.com/) . 34 20

for General Electronic Equipment ■PARTS NUMBER 【Temperature Characteristic SD : Standard（－55～＋125℃）】　0.8mm thickness（A） Part number 1 Part number 2 Rated[ Vv]oltage cThaermapceteraritsutrices Capa c[Fit]ance Capacitan[c％e ]tolerance t a[％nδ] Rated vHoTltLaTge x ％Thickness*3 [mm] SRWo:R:lWdeeafrlvoinewg C HHMMKK110077 SSDD112011KKAA--TT 112000pp ±±1100 00..11 220000 00..88±±00..1100 RR APACER HHMMKK110077 SSDD118511KKAA--TT 118500pp ±±1100 00..11 220000 00..88±±00..1100 RR CITOAMIC HHMMKK110077 SSDD227211KKAA--TT 227200pp ±±1100 00..11 220000 00..88±±00..1100 RR RS HMK107 SD331KA-T 100 Standard Type 330p ±10 0.1 200 0.8±0.10 R HMK107 SD391KA-T 390p ±10 0.1 200 0.8±0.10 R HMK107 SD471KA-T 470p ±10 0.1 200 0.8±0.10 R M HMK107 SD561KA-T 560p ±10 0.1 200 0.8±0.10 R HMK107 SD681KA-T 680p ±10 0.1 200 0.8±0.10 R U HMK107 SD821KA-T 820p ±10 0.1 200 0.8±0.10 R LT HMK107 SD102KA-T 1000p ±10 0.1 200 0.8±0.10 R IL A Y ●212TYPE E 【Temperature Characteristic BJ : B（－25～＋85℃）/X5R（－55～＋85℃）】　1.25mm thickness（G） R Part number 1 Part number 2 Rated[ Vv]oltage cThaermapceteraritsutrices Capa c[Fit]ance Capacitan[c％e ]tolerance t a[％nδ] Rated vHoTltLaTge x ％Thickness*3 [mm] SRWo:R:lWdeeafrlvoinewg CER HMK212 BJ103[]G-T B X5R*1 0.01μ ±10, ±20 3.5 200 1.25±0.10 R A HMK212 BJ153[]G-T B X5R*1 0.015μ ±10, ±20 3.5 200 1.25±0.10 R M HHMMKK221122 BBJJ232333[[]]GG--TT BB XX55RR**11 00..002323μμ ±±1100,, ±±2200 33..55 220000 11..2255±±00..1100 RR IC HMK212 BJ473[]G-T 100 B X5R*1 0.047μ ±10, ±20 3.5 200 1.25±0.10 R C HMK212 BJ683[]G-T B X5R*1 0.068μ ±10, ±20 3.5 200 1.25±0.10 R A HMK212 BJ104[]G-T B X5R*1 0.1μ ±10, ±20 3.5 200 1.25±0.10 R P HMK212 BJ224[]G-T B X5R*1 0.22μ ±10, ±20 3.5 200 1.25±0.10 R A HMK212 BJ474[]G-TE B X5R*1 0.47μ ±10, ±20 3.5 150 1.25±0.10 R C HMK212BBJ105[]G-TE B X5R*1 1μ ±10, ±20 3.5 150 1.25+0.20/-0 R IT QMK212 BJ472[]G-T B X5R*1 4700p ±10, ±20 2.5 150 1.25±0.10 R O QMK212 BJ682[]G-T B X5R*1 6800p ±10, ±20 2.5 150 1.25±0.10 R R QMK212 BJ103[]G-T 250 B X5R*1 0.01μ ±10, ±20 2.5 150 1.25±0.10 R S QMK212 BJ153[]G-T B X5R*1 0.015μ ±10, ±20 2.5 150 1.25±0.10 R QMK212 BJ223[]G-T B X5R*1 0.022μ ±10, ±20 2.5 150 1.25±0.10 R 【Temperature Characteristic BJ : B（－25～＋85℃）/X5R（－55～＋85℃）】　0.85mm thickness（D） Part number 1 Part number 2 Rated[ Vv]oltage cThaermapceteraritsutrices Capa c[Fit]ance Capacitan[c％e ]tolerance t a[％nδ] Rated vHoTltLaTge x ％Thickness*3 [mm] SRWo:R:lWdeeafrlvoinewg QMK212 BJ102[]D-T B X5R*1 1000p ±10, ±20 2.5 150 0.85±0.10 R QMK212 BJ152[]D-T 250 B X5R*1 1500p ±10, ±20 2.5 150 0.85±0.10 R QMK212 BJ222[]D-T B X5R*1 2200p ±10, ±20 2.5 150 0.85±0.10 R QMK212 BJ332[]D-T B X5R*1 3300p ±10, ±20 2.5 150 0.85±0.10 R 【Temperature Characteristic C7 : X7S（－55～＋125℃）】　1.25mm thickness（G） Part number 1 Part number 2 Rated[ Vv]oltage cThaermapceteraritsutrices Capa c[Fit]ance Capacitan[c％e ]tolerance t a[％nδ] Rated vHoTltLaTge x ％Thickness*3 [mm] SRWo:R:lWdeeafrlvoinewg HMK212 C7474[]G-TE 100 X7S 0.47μ ±10, ±20 3.5 150 1.25±0.10 R HMK212BC7105[]G-TE 100 X7S 1μ ±10, ±20 3.5 150 1.25+0.20/-0 R 【Temperature Characteristic B7 : X7R（－55～＋125℃）】　1.25mm thickness（G） Part number 1 Part number 2 Rated[ Vv]oltage cThaermapceteraritsutrices Capa c[Fit]ance Capacitan[c％e ]tolerance t a[％nδ] Rated vHoTltLaTge x ％Thickness*3 [mm] SRWo:R:lWdeeafrlvoinewg HMK212 B7103[]G-T X7R 0.01μ ±10, ±20 3.5 200 1.25±0.10 R HMK212 B7153[]G-T X7R 0.015μ ±10, ±20 3.5 200 1.25±0.10 R HMK212 B7223[]G-T X7R 0.022μ ±10, ±20 3.5 200 1.25±0.10 R HMK212 B7333[]G-T X7R 0.033μ ±10, ±20 3.5 200 1.25±0.10 R 100 HMK212 B7473[]G-T X7R 0.047μ ±10, ±20 3.5 200 1.25±0.10 R HMK212 B7683[]G-T X7R 0.068μ ±10, ±20 3.5 200 1.25±0.10 R HMK212 B7104[]G-T X7R 0.1μ ±10, ±20 3.5 200 1.25±0.10 R HMK212 B7224[]G-T X7R 0.22μ ±10, ±20 3.5 200 1.25±0.10 R QMK212 B7472[]G-T X7R 4700p ±10, ±20 2.5 150 1.25±0.10 R QMK212 B7682[]G-T X7R 6800p ±10, ±20 2.5 150 1.25±0.10 R QMK212 B7103[]G-T 250 X7R 0.01μ ±10, ±20 2.5 150 1.25±0.10 R QMK212 B7153[]G-T X7R 0.015μ ±10, ±20 2.5 150 1.25±0.10 R QMK212 B7223[]G-T X7R 0.022μ ±10, ±20 2.5 150 1.25±0.10 R 【Temperature Characteristic B7 : X7R（－55～＋125℃）】　0.85mm thickness（D） Part number 1 Part number 2 Rated[ Vv]oltage cThaermapceteraritsutrices Capa c[Fit]ance Capacitan[c％e ]tolerance t a[％nδ] Rated vHoTltLaTge x ％Thickness*3 [mm] SRWo:R:lWdeeafrlvoinewg QMK212 B7102[]D-T X7R 1000p ±10, ±20 2.5 150 0.85±0.10 R QMK212 B7152[]D-T X7R 1500p ±10, ±20 2.5 150 0.85±0.10 R 250 QMK212 B7222[]D-T X7R 2200p ±10, ±20 2.5 150 0.85±0.10 R QMK212 B7332[]D-T X7R 3300p ±10, ±20 2.5 150 0.85±0.10 R c_mlcc_e-E08R01 ▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our product specification sheets. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our website (http://www.ty-top.com/) . 20 35

for General Electronic Equipment ■PARTS NUMBER 【Temperature Characteristic SD : Standard（－55～＋125℃）】　0.85mm thickness（D） CAC Part number 1 Part number 2 Rated[ Vv]oltage cThaermapceteraritsutrices Capa c[Fit]ance Capacitan[c％e ]tolerance t a[％nδ] Rated vHoTltLaTge x ％Thickness*3 [mm] SRWo:R:lWdeeafrlvoinewg PACERA HHMMKK221122 SSDD242722KKDD--TT 100 24270000pp ±±1100 00..11 220000 00..8855±±00..1100 RR ITM QMK212 SD101KD-T 100p ±10 0.1 150 0.85±0.10 R OIC QMK212 SD121KD-T 120p ±10 0.1 150 0.85±0.10 R RS QMK212 SD151KD-T 150p ±10 0.1 150 0.85±0.10 R QMK212 SD181KD-T 180p ±10 0.1 150 0.85±0.10 R QMK212 SD221KD-T 220p ±10 0.1 150 0.85±0.10 R Standard Type QMK212 SD331KD-T 330p ±10 0.1 150 0.85±0.10 R 250 M QMK212 SD391KD-T 390p ±10 0.1 150 0.85±0.10 R U QMK212 SD471KD-T 470p ±10 0.1 150 0.85±0.10 R L QMK212 SD561KD-T 560p ±10 0.1 150 0.85±0.10 R T QMK212 SD681KD-T 680p ±10 0.1 150 0.85±0.10 R IL QMK212 SD821KD-T 820p ±10 0.1 150 0.85±0.10 R A QMK212 SD102KD-T 1000p ±10 0.1 150 0.85±0.10 R Y E 【Temperature Characteristic SD : Standard（－55～＋125℃）】　1.25mm thickness（G） R CE Part number 1 Part number 2 Rated[ Vv]oltage cThaermapceteraritsutrices Capa c[Fit]ance Capacitan[c％e ]tolerance t a[％nδ] Rated vHoTltLaTge x ％Thickness*3 [mm] SRWo:R:lWdeeafrlvoinewg R A HMK212 SD392KG-T 100 Standard Type 3900p ±10 0.1 200 1.25±0.10 R M IC ●316TYPE 【Temperature Characteristic BJ : B（－25～＋85℃）/X5R（－55～＋85℃）】　1.6mm thickness（L） C APA Part number 1 Part number 2 Rated[ Vv]oltage cThaermapceteraritsutrices Capa c[Fit]ance Capacitan[c％e ]tolerance t a[％nδ] Rated vHoTltLaTge x ％Thickness*3 [mm] SRWo:R:lWdeeafrlvoinewg C HMK316 BJ473[]L-T B X5R*1 0.047μ ±10, ±20 3.5 200 1.6±0.20 R IT HHMMKK331166 BBJJ618034[[]]LL--TT BB XX55RR**11 0.006.81μμ ±±1100,, ±±2200 33..55 220000 11..66±±00..2200 RR O HMK316 BJ154[]L-T B X5R*1 0.15μ ±10, ±20 3.5 200 1.6±0.20 R R HMK316 BJ224[]L-T 100 B X5R*1 0.22μ ±10, ±20 3.5 200 1.6±0.20 R S HMK316 BJ334[]L-T B X5R*1 0.33μ ±10, ±20 3.5 200 1.6±0.20 R HMK316 BJ474[]L-T B X5R*1 0.47μ ±10, ±20 3.5 200 1.6±0.20 R HMK316 BJ105[]L-T B X5R*1 1μ ±10, ±20 3.5 200 1.6±0.20 R HMK316ABJ225[]L-TE B X5R*1 2.2μ ±10, ±20 3.5 150 1.6±0.20 R QMK316 BJ333[]L-T B X5R*1 0.033μ ±10, ±20 2.5 150 1.6±0.20 R QMK316 BJ473[]L-T 250 B X5R*1 0.047μ ±10, ±20 2.5 150 1.6±0.20 R QMK316 BJ683[]L-T B X5R*1 0.068μ ±10, ±20 2.5 150 1.6±0.20 R QMK316 BJ104[]L-T B X5R*1 0.1μ ±10, ±20 2.5 150 1.6±0.20 R SMK316 BJ153[]L-T 630 B X5R*1 0.015μ ±10, ±20 2.5 120 1.6±0.20 R SMK316 BJ223[]L-T B X5R*1 0.022μ ±10, ±20 2.5 120 1.6±0.20 R 【Temperature Characteristic BJ : B（－25～＋85℃）/X5R（－55～＋85℃）】　1.15mm thickness（F） Part number 1 Part number 2 Rated[ Vv]oltage cThaermapceteraritsutrices Capa c[Fit]ance Capacitan[c％e ]tolerance t a[％nδ] Rated vHoTltLaTge x ％Thickness*3 [mm] SRWo:R:lWdeeafrlvoinewg SMK316 BJ102[]F-T B X5R*1 1000p ±10, ±20 2.5 120 1.15±0.10 R SMK316 BJ152[]F-T B X5R*1 1500p ±10, ±20 2.5 120 1.15±0.10 R SMK316 BJ222[]F-T B X5R*1 2200p ±10, ±20 2.5 120 1.15±0.10 R SMK316 BJ332[]F-T 630 B X5R*1 3300p ±10, ±20 2.5 120 1.15±0.10 R SMK316 BJ472[]F-T B X5R*1 4700p ±10, ±20 2.5 120 1.15±0.10 R SMK316 BJ682[]F-T B X5R*1 6800p ±10, ±20 2.5 120 1.15±0.10 R SMK316 BJ103[]F-T B X5R*1 0.01μ ±10, ±20 2.5 120 1.15±0.10 R 【Temperature Characteristic C7 : X7S（－55～＋125℃）】　1.6mm thickness（L） Part number 1 Part number 2 Rated[ Vv]oltage cThaermapceteraritsutrices Capa c[Fit]ance Capacitan[c％e ]tolerance t a[％nδ] Rated vHoTltLaTge x ％Thickness*3 [mm] SRWo:R:lWdeeafrlvoinewg HMK316AC7225[]L-TE 100 X7S 2.2μ ±10, ±20 3.5 150 1.6±0.20 R 【Temperature Characteristic B7 : X7R（－55～＋125℃）】　1.6mm thickness（L） Part number 1 Part number 2 Rated[ Vv]oltage cThaermapceteraritsutrices Capa c[Fit]ance Capacitan[c％e ]tolerance t a[％nδ] Rated vHoTltLaTge x ％Thickness*3 [mm] SRWo:R:lWdeeafrlvoinewg HMK316 B7473[]L-T X7R 0.047μ ±10, ±20 3.5 200 1.6±0.20 R HMK316 B7683[]L-T X7R 0.068μ ±10, ±20 3.5 200 1.6±0.20 R HMK316 B7104[]L-T X7R 0.1μ ±10, ±20 3.5 200 1.6±0.20 R HMK316 B7154[]L-T X7R 0.15μ ±10, ±20 3.5 200 1.6±0.20 R 100 HMK316 B7224[]L-T X7R 0.22μ ±10, ±20 3.5 200 1.6±0.20 R HMK316 B7334[]L-T X7R 0.33μ ±10, ±20 3.5 200 1.6±0.20 R HMK316 B7474[]L-T X7R 0.47μ ±10, ±20 3.5 200 1.6±0.20 R HMK316 B7105[]L-T X7R 1μ ±10, ±20 3.5 200 1.6±0.20 R QMK316 B7333[]L-T X7R 0.033μ ±10, ±20 2.5 150 1.6±0.20 R QMK316 B7473[]L-T X7R 0.047μ ±10, ±20 2.5 150 1.6±0.20 R 250 QMK316 B7683[]L-T X7R 0.068μ ±10, ±20 2.5 150 1.6±0.20 R QMK316 B7104[]L-T X7R 0.1μ ±10, ±20 2.5 150 1.6±0.20 R SMK316 B7153[]L-T X7R 0.015μ ±10, ±20 2.5 120 1.6±0.20 R SMK316 B7223[]L-T X7R 0.022μ ±10, ±20 2.5 120 1.6±0.20 R 630 SMK316AB7333[]L-T X7R 0.033μ ±10, ±20 2.5 120 1.6±0.20 R SMK316AB7473[]L-T X7R 0.047μ ±10, ±20 2.5 120 1.6±0.20 R c_mlcc_e-E08R01 ▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our product specification sheets. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our website (http://www.ty-top.com/) . 36 20

for General Electronic Equipment ■PARTS NUMBER 【Temperature Characteristic B7 : X7R（－55～＋125℃）】　1.15mm thickness（F） Part number 1 Part number 2 Rated[ Vv]oltage cThaermapceteraritsutrices Capa c[Fit]ance Capacitan[c％e ]tolerance t a[％nδ] Rated vHoTltLaTge x ％Thickness*3 [mm] SRWo:R:lWdeeafrlvoinewg CAC SSMMKK331166 BB77110522[[]]FF--TT XX77RR 11050000pp ±±1100,, ±±2200 22..55 112200 11..1155±±00..1100 RR PACERA SMK316 B7222[]F-T X7R 2200p ±10, ±20 2.5 120 1.15±0.10 R ITM SMK316 B7332[]F-T 630 X7R 3300p ±10, ±20 2.5 120 1.15±0.10 R OIC SMK316 B7472[]F-T X7R 4700p ±10, ±20 2.5 120 1.15±0.10 R RS SMK316 B7682[]F-T X7R 6800p ±10, ±20 2.5 120 1.15±0.10 R SMK316 B7103[]F-T X7R 0.01μ ±10, ±20 2.5 120 1.15±0.10 R 【Temperature Characteristic SD : Standard（－55～＋125℃）】　1.6mm thickness（L） M Part number 1 Part number 2 Rated[ Vv]oltage cThaermapceteraritsutrices Capa c[Fit]ance Capacitan[c％e ]tolerance t a[％nδ] Rated vHoTltLaTge x ％Thickness*3 [mm] SRWo:R:lWdeeafrlvoinewg ULT HMK316 SD223KL-T 100 Standard Type 0.022μ ±10 0.1 200 1.6±0.20 R IL QMK316 SD103KL-T 250 0.01μ ±10 0.1 150 1.6±0.20 R A Y E R ●325TYPE 【Temperature Characteristic BJ : B（－25～＋85℃）/X5R（－55～＋85℃）】　2.5mm thickness（M） C E Part number 1 Part number 2 Rated[ Vv]oltage cThaermapceteraritsutrices Capa c[Fit]ance Capacitan[c％e ]tolerance t a[％nδ] Rated vHoTltLaTge x ％Thickness*3 [mm] SRWo:R:lWdeeafrlvoinewg RA M HMK325 BJ225[]M-P 100 B X5R*1 2.2μ ±10, ±20 3.5 200 2.5±0.20 R HMK325 BJ475[]M-PE 100 B X5R*1 4.7μ ±10, ±20 3.5 150 2.5±0.20 R IC C 【Temperature Characteristic BJ : B（－25～＋85℃）/X5R（－55～＋85℃）】　1.9mm thickness（N） A Part number 1 Part number 2 Rated[ Vv]oltage cThaermapceteraritsutrices Capa c[Fit]ance Capacitan[c％e ]tolerance t a[％nδ] Rated vHoTltLaTge x ％Thickness*3 [mm] SRWo:R:lWdeeafrlvoinewg PAC HHMMKK332255 BBJJ125244[[]]NN--TT BB XX55RR**11 00..1252μμ ±±1100,, ±±2200 33..55 220000 11..99±±00..2200 RR IT O HMK325 BJ334[]N-T B X5R*1 0.33μ ±10, ±20 3.5 200 1.9±0.20 R HMK325 BJ474[]N-T 100 B X5R*1 0.47μ ±10, ±20 3.5 200 1.9±0.20 R R HMK325 BJ684[]N-T B X5R*1 0.68μ ±10, ±20 3.5 200 1.9±0.20 R S HMK325 BJ105[]N-T B X5R*1 1μ ±10, ±20 3.5 200 1.9±0.20 R HMK325 BJ475[]N-TE B X5R*1 4.7μ ±10, ±20 3.5 150 1.9±0.20 R QMK325 BJ473[]N-T B X5R*1 0.047μ ±10, ±20 2.5 150 1.9±0.20 R QMK325 BJ104[]N-T 250 B X5R*1 0.1μ ±10, ±20 2.5 150 1.9±0.20 R QMK325 BJ154[]N-T B X5R*1 0.15μ ±10, ±20 2.5 150 1.9±0.20 R QMK325 BJ224[]N-T B X5R*1 0.22μ ±10, ±20 2.5 150 1.9±0.20 R SMK325 BJ223[]N-T B X5R*1 0.022μ ±10, ±20 2.5 120 1.9±0.20 R SMK325 BJ333[]N-T 630 B X5R*1 0.033μ ±10, ±20 2.5 120 1.9±0.20 R SMK325 BJ473[]N-T B X5R*1 0.047μ ±10, ±20 2.5 120 1.9±0.20 R 【Temperature Characteristic BJ : B（－25～＋85℃）/X5R（－55～＋85℃）】　1.15mm thickness（F） Part number 1 Part number 2 Rated[ Vv]oltage cThaermapceteraritsutrices Capa c[Fit]ance Capacitan[c％e ]tolerance t a[％nδ] Rated vHoTltLaTge x ％Thickness*3 [mm] SRWo:R:lWdeeafrlvoinewg HMK325 BJ104[]F-T 100 B X5R*1 0.1μ ±10, ±20 3.5 200 1.15±0.10 R 【Temperature Characteristic B7 : X7R（－55～＋125℃）】　2.5mm thickness（M） Part number 1 Part number 2 Rated[ Vv]oltage cThaermapceteraritsutrices Capa c[Fit]ance Capacitan[c％e ]tolerance t a[％nδ] Rated vHoTltLaTge x ％Thickness*3 [mm] SRWo:R:lWdeeafrlvoinewg HMK325 B7225[]M-P 100 X7R 2.2μ ±10, ±20 3.5 200 2.5±0.20 R 【Temperature Characteristic B7 : X7R（－55～＋125℃）】　1.9mm thickness（N） Part number 1 Part number 2 Rated[ Vv]oltage cThaermapceteraritsutrices Capa c[Fit]ance Capacitan[c％e ]tolerance t a[％nδ] Rated vHoTltLaTge x ％Thickness*3 [mm] SRWo:R:lWdeeafrlvoinewg HMK325 B7154[]N-T X7R 0.15μ ±10, ±20 3.5 200 1.9±0.20 R HMK325 B7224[]N-T X7R 0.22μ ±10, ±20 3.5 200 1.9±0.20 R HMK325 B7334[]N-T X7R 0.33μ ±10, ±20 3.5 200 1.9±0.20 R 100 HMK325 B7474[]N-T X7R 0.47μ ±10, ±20 3.5 200 1.9±0.20 R HMK325 B7684[]N-T X7R 0.68μ ±10, ±20 3.5 200 1.9±0.20 R HMK325 B7105[]N-T X7R 1μ ±10, ±20 3.5 200 1.9±0.20 R QMK325 B7473[]N-T X7R 0.047μ ±10, ±20 2.5 150 1.9±0.20 R QMK325 B7104[]N-T X7R 0.1μ ±10, ±20 2.5 150 1.9±0.20 R 250 QMK325 B7154[]N-T X7R 0.15μ ±10, ±20 2.5 150 1.9±0.20 R QMK325 B7224[]N-T X7R 0.22μ ±10, ±20 2.5 150 1.9±0.20 R SMK325 B7223[]N-T X7R 0.022μ ±10, ±20 2.5 120 1.9±0.20 R SMK325 B7333[]N-T 630 X7R 0.033μ ±10, ±20 2.5 120 1.9±0.20 R SMK325 B7473[]N-T X7R 0.047μ ±10, ±20 2.5 120 1.9±0.20 R 【Temperature Characteristic C7 : X7S（－55～＋125℃）】　2.5mm thickness（M） Part number 1 Part number 2 Rated[ Vv]oltage cThaermapceteraritsutrices Capa c[Fit]ance Capacitan[c％e ]tolerance t a[％nδ] Rated vHoTltLaTge x ％Thickness*3 [mm] SRWo:R:lWdeeafrlvoinewg HMK325 C7475[]M-PE 100 X7S 4.7μ ±10, ±20 3.5 150 2.5±0.20 R 【Temperature Characteristic C7 : X7S（－55～＋125℃）】　1.9mm thickness（N） Part number 1 Part number 2 Rated[ Vv]oltage cThaermapceteraritsutrices Capa c[Fit]ance Capacitan[c％e ]tolerance t a[％nδ] Rated vHoTltLaTge x ％Thickness*3 [mm] SRWo:R:lWdeeafrlvoinewg HMK325 C7475[]N-TE 100 X7S 4.7μ ±10, ±20 3.5 150 1.9±0.20 R c_mlcc_e-E08R01 ▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our product specification sheets. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our website (http://www.ty-top.com/) . 20 37

for General Electronic Equipment ■PARTS NUMBER 【Temperature Characteristic B7 : X7R（－55～＋125℃）】　1.15mm thickness（F） CAC Part number 1 Part number 2 Rated[ Vv]oltage cThaermapceteraritsutrices Capa c[Fit]ance Capacitan[c％e ]tolerance t a[％nδ] Rated vHoTltLaTge x ％Thickness*3 [mm] SRWo:R:lWdeeafrlvoinewg PAER HMK325 B7104[]F-T 100 X7R 0.1μ ±10, ±20 3.5 200 1.15±0.10 R CA ITM OIC ●432TYPE RS 【Temperature Characteristic BJ : B（－25～＋85℃）/X5R（－55～＋85℃）】 2.5mm thickness（M） Part number 1 Part number 2 Rated[ Vv]oltage cThaermapceteraritsutrices Capa c[Fit]ance Capacitan[c％e ]tolerance t a[％nδ] Rated vHoTltLaTge x ％Thickness*3 [mm] SRWo:R:lWdeeafrlvoinewg M HMK432 BJ474[]M-T B X5R*1 0.47μ ±10, ±20 3.5 200 2.5±0.20 R U HMK432 BJ105[]M-T 100 B X5R*1 1μ ±10, ±20 3.5 200 2.5±0.20 R L HMK432 BJ155[]M-T B X5R*1 1.5μ ±10, ±20 3.5 200 2.5±0.20 R T HMK432 BJ225[]M-T B X5R*1 2.2μ ±10, ±20 3.5 200 2.5±0.20 R IL QMK432 BJ104[]M-T B X5R*1 0.1μ ±10, ±20 2.5 150 2.5±0.20 R AY QQMMKK443322 BBJJ233244[[]]MM--TT 250 BB XX55RR**11 00..2323μμ ±±1100,, ±±2200 22..55 115500 22..55±±00..2200 RR ER QMK432 BJ474[]M-T B X5R*1 0.47μ ±10, ±20 2.5 150 2.5±0.20 R SMK432 BJ473[]M-T B X5R*1 0.047μ ±10, ±20 2.5 120 2.5±0.20 R C SMK432 BJ683[]M-T 630 B X5R*1 0.068μ ±10, ±20 2.5 120 2.5±0.20 R E SMK432 BJ104[]M-T B X5R*1 0.1μ ±10, ±20 2.5 120 2.5±0.20 R R A M 【Temperature Characteristic B7 : X7R（－55～＋125℃）】 2.5mm thickness（M） IC Part number 1 Part number 2 Rated[ Vv]oltage cThaermapceteraritsutrices Capa c[Fit]ance Capacitan[c％e ]tolerance t a[％nδ] Rated vHoTltLaTge x ％Thickness*3 [mm] SRWo:R:lWdeeafrlvoinewg C HMK432 B7474[]M-T X7R 0.47μ ±10, ±20 3.5 200 2.5±0.20 R A HMK432 B7105[]M-T X7R 1μ ±10, ±20 3.5 200 2.5±0.20 R PA HMK432 B7155[]M-T 100 X7R 1.5μ ±10, ±20 3.5 200 2.5±0.20 R C HMK432 B7225[]M-T X7R 2.2μ ±10, ±20 3.5 200 2.5±0.20 R IT QQMMKK443322 BB77120244[[]]MM--TT XX77RR 0.02.21μμ ±±1100,, ±±2200 22..55 115500 22..55±±00..2200 RR O 250 QMK432 B7334[]M-T X7R 0.33μ ±10, ±20 2.5 150 2.5±0.20 R R QMK432 B7474[]M-T X7R 0.47μ ±10, ±20 2.5 150 2.5±0.20 R S SMK432 B7473[]M-T X7R 0.047μ ±10, ±20 2.5 120 2.5±0.20 R SMK432 B7683[]M-T 630 X7R 0.068μ ±10, ±20 2.5 120 2.5±0.20 R SMK432 B7104[]M-T X7R 0.1μ ±10, ±20 2.5 120 2.5±0.20 R 【Temperature Characteristic B7 : X7R（－55～＋125℃）】　2.0mm thickness（Y） Part number 1 Part number 2 Rated[ Vv]oltage cThaermapceteraritsutrices Capa c[Fit]ance Capacitan[c％e ]tolerance t a[％nδ] Rated vHoTltLaTge x ％Thickness*3 [mm] SRWo:R:lWdeeafrlvoinewg XMK432 B7472KY-TE 2000 X7R 4700p ±10 2.5 110 2.0+0/-0.30 R c_mlcc_e-E08R01 ▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our product specification sheets. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our website (http://www.ty-top.com/) . 38 20

Multilayer Ceramic Capacitors ■PACKAGING ①Minimum Quantity ●Taped package Thickness Standard quantity [pcs] Type(EIA) mm code Paper tape Embossed tape □MK021(008004) 0.125 K － 50000 □VS021(008004) □MK042(01005) 0.2 C, D － 40000 □VS042(01005) 0.2 C □MK063(0201) 0.3 P,T 15000 － □WK105(0204) ※ 0.3 P 10000 － 0.13 H － 20000 0.18 E － 15000 □MK105(0402) 0.2 C 20000 － □MF105(0402) 0.3 P 15000 － 0.5 V 10000 － □VK105(0402) 0.5 W 10000 － □MK107(0603) 0.45 K 4000 － □WK107(0306) ※ 0.5 V － 4000 □MF107(0603) 0.8 A 4000 － □VS107(0603) 0.7 C 4000 － □MJ107(0603) 0.8 A 3000 3000 □MK212(0805) 0.45 K 4000 － □WK212(0508) ※ 0.85 D □MF212(0805) 1.25 G － 3000 □VS212(0805) 0.85 D 4000 － 0.85 D 4000 － □MJ212(0805) 1.25 G － 2000 0.85 D 4000 － □MK316(1206) 1.15 F － 3000 □MF316(1206) 1.6 L － 2000 1.15 F － 3000 □MJ316(1206) 1.6 L － 2000 0.85 D 1.15 F □MK325(1210) － 2000 1.9 N □MF325(1210) 2.0max. Y 2.5 M － 1000 1.9 N － 2000 □MJ325(1210) 2.5 M － 500(T), 1000(P) □MK432(1812) 2.5 M － 500 Note : ※ LW Reverse type. ②Taping material ※No bottom tape for pressed carrier tape ●Card board carrier tape ●Embossed tape Top tape Top tape Base tape Sprocket hole Sprocket hole Bottom tape Chip cavity Base tape Chip cavity ▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) . c_mlcc_pack_e-E06R01

Chip filled Chip ※ LW Reverse type. ③Representative taping dimensions ●Paper Tape（8mm wide） ●Pressed carrier tape（ 2mm pitch） Unit：mm（inch） φ1.5＋0.1/－0 1.75±0.1 Sprockethole (φ0.059＋0.004/-0) (0.069±0.004） T A B 3.5±0.05(0.138±0.002) 8.0±0.30.315±0.012) ( T1 F 2.0±0.05 4.0±0.1 (0.079±0.002) (0.157±0.004) Chip Cavity Insertion Pitch Tape Thickness Type(EIA) Ａ Ｂ Ｆ Ｔ T1 □MK063(0201) 0.37 0.67 0.45max. 0.42max. □WK105(0204) ※ 2.0±0.05 □MK105(0402) （*1 C） 0.65 1.15 0.4max. 0.3max. □MK105(0402) （*1 P） 0.45max. 0.42max. Note *1 Thickness, C：0.2mm ,P：0.3mm. ※ LW Reverse type. Unit：mm ●Punched carrier tape （2mm pitch） Unit：mm（inch） φ1.5＋0.1/－0 1.75±0.1 Sprockethole (φ0.059＋0.004/-0) (0.069±0.004） T A B 3.5±0.05(0.138±0.002) 8.0±0.30.315±0.012) ( F 2.0±0.05 4.0±0.1 (0.079±0.002) (0.157±0.004) Chip Cavity Insertion Pitch Tape Thickness Type(EIA) Ａ Ｂ Ｆ Ｔ □MK105 (0402) □MF105 (0402) 0.65 1.15 2.0±0.05 0.8max. □VK105 (0402) Unit：mm ●Punched carrier tape （4mm pitch） Unit：mm（inch） φ1.5＋0.1/－0 1.75±0.1 Sprockethole (φ0.059＋0.004/-0) (0.069±0.004） T A B 3.5±0.050.138±0.002) 8.0±0.3315±0.012) ( 0. ( F 4.0±0.1 (0.157±0.004) 2.0±0.1 (0.079±0.004) ▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) . c_mlcc_pack_e-E06R01

Chip Cavity Insertion Pitch Tape Thickness Type(EIA) Ａ Ｂ Ｆ Ｔ □MK107(0603) □WK107(0306) ※ 1.0 1.8 1.1max. □MF107(0603) 4.0±0.1 □MK212(0805) 1.65 2.4 □WK212(0508) ※ 1.1max. □MK316(1206) 2.0 3.6 Note：Taping size might be different depending on the size of the product. ※ LW Reverse type. Unit：mm ●Embossed tape（4mm wide） Unit：mm（inch） φ0.8±0.04 0.9±0.05 Sprockethole (φ0.031±0.002) (0.035±0.002) A B 1.8±0.02(0.071±0.001) 4.0±0.050.157±0.002) ( F 1.0±0.02 2.0±0.04 (0.039±0.001) (0.079±0.002) Chip Cavity Insertion Pitch Tape Thickness Type(EIA) Ａ Ｂ Ｆ K T □MK021(008004) 0.135 0.27 □VS021(008004) 1.0±0.02 0.5max. 0.25max. □MK042(01005) 0.23 0.43 □VS042(01005) Unit：mm ●Embossed tape（8mm wide） Unit：mm（inch） φ1.5＋0.1/－0 1.75±0.1 Sprockethole (φ0.059＋0.004/-0) (0.069±0.004） A B 3.5±0.050.138±0.002) 8.0±0.3315±0.012) ( 0. ( F 4.0±0.1 (0.157±0.004) 2.0±0.1 (0.079±0.004) Chip Cavity Insertion Pitch Tape Thickness Type(EIA) Ａ Ｂ Ｆ K T □MK105(0402) 0.6 1.1 2.0±0.1 0.6max 0.2±0.1 □WK107(0306) ※ 1.0 1.8 1.3max. 0.25±0.1 □MK212(0805) 1.65 2.4 □MF212(0805) □MK316(1206) 4.0±0.1 2.0 3.6 3.4max. 0.6max. □MF316(1206) □MK325(1210) 2.8 3.6 □MF325(1210) Note： ※ LW Reverse type. Unit：mm ▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) . c_mlcc_pack_e-E06R01

●Embossed tape（12mm wide） Unit：mm（inch） φ1.5＋0.1/－0 1.75±0.1 Sprockethole (φ0.059＋0.004/-0) (0.069±0.004） B A 5.5±0.050.217±0.002) 12.0±0.3472±0.012) ( 0. ( 4.0±0.1 2.0±0.1 (0.157±0.004) (0.079±0.004) F Chip Cavity Insertion Pitch Tape Thickness Type(EIA) Ａ Ｂ Ｆ K T □MK325(1210) 3.1 4.0 8.0±0.1 4.0max. 0.6max. □MK432(1812) 3.7 4.9 8.0±0.1 4.0max. 0.6max. Unit：mm ④Trailer and Leader Blank portion Chip cavity Blank portion Leader 160mm or more 100mm or more (6.3inches or more) (3.94inches or more) 400mm or more Direction of tape feed (15.7inches or more) ⑤Reel size t E C B A R D W A B C D E R φ178±2.0 φ50min. φ13.0±0.2 φ21.0±0.8 2.0±0.5 1.0 T W 4mm wide tape 1.5max. 5±1.0 8mm wide tape 2.5max. 10±1.5 12mm wide tape 2.5max. 14±1.5 Unit：mm ⑥Top Tape Strength The top tape requires a peel-off force of 0.1 to 0.7N in the direction of the arrow as illustrated below. Pull direction 0～20° Top tape Base tape ▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) . c_mlcc_pack_e-E06R01

Multilayer Ceramic Capacitors , Super Low Distortion Multilayer Ceramic Capacitors and High Reliability Application Multilayer Ceramic Capacitors are noted separately. Medium-High Voltage Multilayer Ceramic Capacitor ■RELIABILITY DATA 1. Operating Temperature Range Temperature Compensating（Class1） CG : －55 to ＋125℃ X7R, X7S : －55 to ＋125℃ Specified Value X5R : －55 to ＋85℃ High Permittivity （Class2） B : －25 to ＋85℃ SD : －55 to ＋125℃ 2. Storage Temperature Range Temperature Compensating（Class1） CG : －55 to ＋125℃ X7R, X7S : －55 to ＋125℃ Specified Value X5R : －55 to ＋85℃ High Permittivity （Class2） B : －25 to ＋85℃ SD : －55 to ＋125℃ 3. Rated Voltage Temperature Compensating（Class1） 100VDC(HMK) Specified Value High Permittivity （Class2） 100VDC(HMK), 250VDC(QMK), 630VDC(SMK), 2000VDC(XMK) 4. Withstanding Voltage（Between terminals） Specified Value No breakdown or damage Applied voltage : Rated voltage×2.5（HMK）, Rated voltage×2（QMK）, Rated voltage×1.2（SMK）(XMK) Test Methods and Duration : 1 to 5sec. Remarks Charge/discharge current : 50mA max. 5. Insulation Resistance Temperature Compensating（Class1） 10000 MΩ min. Specified Value High Permittivity （Class2） 100MΩ・μF or 10GΩ, whichever is smaller. Applied voltage : Rated voltage（HMK, QMK）, 500V（SMK,XMK） Test Methods and Duration : 60±5sec. Remarks Charge/discharge current : 50mA max. 6. Capacitance （Tolerance） 0.2pF≦C≦5pF ： ±0.25pF Temperature Compensating（Class1） 0.2pF≦C≦10pF ： ±0.5pF Specified Value C＞10pF ： ±5% or ±10% High Permittivity （Class2） ±10%, ±20% Measuring frequency : 1MHz±10% Temperature Compensating（Class1） Measuring voltage : 0.5～5Vrms Test Methods and Bias application : None Remarks Measuring frequency : 1kHz±10% High Permittivity （Class2） Measuring voltage : 1±0.2Vrms Bias application : None 7. Q or Dissipation Factor C＜30pF : Q≧400＋20C Temperature Compensating（Class1） Specified Value C≧30pF : Q≧1000 （C：Nominal capacitance） High Permittivity （Class2） 3.5%max（HMK）,2.5%max（QMK, SMK） Measuring frequency : 1MHz±10% Temperature Compensating（Class1） Measuring voltage : 0.5～5Vrms Test Methods and Bias application : None Remarks Measuring frequency : 1kHz±10% High Permittivity （Class2） Measuring voltage : 1±0.2Vrms Bias application : None ▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) . c_mlcc_mhv_reli_e-E08R01

8. Temperature Characteristic of Capacitance Temperature Compensating（Class1） CG ：0±30ppm/℃(－55 to ＋125℃) B : ±10%（－25 to ＋85℃） X5R : ±15%（－55 to ＋85℃） Specified Value High Permittivity （Class2） X7R : ±15%（－55 to ＋125℃ X7S : ±22%（－55 to ＋125℃） SD : - （－55 to ＋125℃） Class 1 Capacitance at 20℃ and 85℃ shall be measured in thermal equilibrium, and the temperature characteristic shall be calculated from the following equation. （C －C ） 85 20 ×106（ppm/℃） C ×△T △T＝65 20 Class 2 Capacitance at each step shall be measured in thermal equilibrium, and the temperature characteristic shall be calculated from the Test Methods and following equation. Remarks Step B X5R、X7R、X6S、X7S 1 Minimum operating temperature 2 20℃ 25℃ 3 Maximum operating temperature （C－C） 2 ×100（%） C 2 C : Capacitance value in Step 1 or Step 3 C2 : Capacitance value in Step 2 9. Deflection Appearance : No abnormality Temperature Compensating（Class1） Capacitance change : Within ±5% or ±0.5 pF, whichever is larger. Specified Value Appearance : No abnormality High Permittivity （Class2） Capacitance change : Within±10% Warp : 1mm Duration : 10sec. Test board : Glass epoxy-resin substrate Thickness : 1.6mm Test Methods and Remarks Capacitance measurement shall be conducted with the board bent. 10. Adhesive Strength of Terminal Electrodes Temperature Compensating（Class1） Specified Value No terminal separation or its indication. High Permittivity （Class2） Test Methods and Applied force : 5N Remarks Duration : 30±5sec. 11. Solderability Temperature Compensating（Class1） Specified Value At least 95% of terminal electrode is covered by new solder High Permittivity （Class2） Eutectic solder Lead-free solder Test Methods and Solder type H60A or H63A Sn-3.0Ag-0.5Cu Remarks Solder temperature 230±5℃ 245±3℃ Duration 4±1 sec. ▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) . c_mlcc_mhv_reli_e-E08R01

12. Resistance to Soldering Appearance : No abnormality Capacitance change : Within ±2.5% or ±0.25pF, whichever is larger.(HMK) Temperature Compensating（Class1） Q : Initial value Insulation resistance : Initial value Withstanding voltage （between terminals） : No abnormality Specified Value Appearance : No abnormality Capacitance change : Within±15%（HMK）, ±10%（QMK, SMK,XMK） High Permittivity （Class2） Dissipation facto : Initial value Insulation resistance : Initial value Withstanding voltage （between terminals） : No abnormality Temperature Compensating（Class1） Preconditioning None Solder temperature 270±5℃ Duration 3±0.5sec. 80 to 100℃, 2 to 5 min. Preheating conditions 150 to 200℃, 2 to 5min. Recovery 24±2hrs under the standard condition Note3 Test Methods and Remarks High Permittivity （Class2） Preconditioning Thermal treatment（at 150℃ for 1hr） Note1 Solder temperature 270±5℃ Duration 3±0.5sec. 80 to 100℃, 2 to 5 min. Preheating conditions 150 to 200℃, 2 to 5min. Recovery 24±2hrs under the standard condition Note3 13. Temperature Cycle （Thermal Shock） Appearance : No abnormality Capacitance change : Within ±2.5% or ±0.25pF, whichever is larger.(HMK) Temperature Compensating（Class1） Q : Initial value Insulation resistance : Initial value Withstanding voltage （between terminals） : No abnormality Specified Value Appearance : No abnormality Capacitance change : Within±15%（HMK）, ±10%（QMK, SMK ,XMK） High Permittivity （Class2） Dissipation facto : Initial value Insulation resistance : Initial value Withstanding voltage （between terminals） : No abnormality Class 1 Class 2 Preconditioning None Thermal treatment （at 150℃ for 1 hr） Note 1 Step Temperature（℃） Time（min.） 1 Minimum operating temperature 30±3 Test Methods and 1 cycle 2 Normal temperature 2 to 3 Remarks 3 Maximum operating temperature 30±3 4 Normal temperature 2 to 3 Number of cycles 5 tim es Recovery 6 to 24 hrs （Standard condition） Note 3 24±2 hrs （Standard condition） Note 3 14. Humidity （Steady state） Appearance : No abnormality Capacitance change : Within ±5% or ±0.5pF, whichever is larger.(HMK) Q : C＜10pF : Q≧200＋10C Temperature Compensating（Class1） 10≦C＜30pF : Q≧275＋2.5C C≧30pF:Q≧350（C：Nominal capacitance） Specified Value Insulation resistance : 1000 MΩ min. Appearance : No abnormality Capacitance change : Within±15% High Permittivity （Class2） Dissipation factor : 7%max（HMK）, 5%max（QMK, SMK, XMK）. Insulation resistance : 25MΩμF or 1000MΩ, whichever is smaller. Class 1 Class 2 Preconditioning None Thermal treatment（ at 150℃ for 1 hr） Note 1 Test Methods and Temperature 40±2℃ 40±2℃ Remarks Humidity 90 to 95%RH 90 to 95%RH Duration 500＋24/－0 hrs 500＋24/－0 hrs Recovery 6 to 24 hrs （Standard condition） Note 3 24±2 hrs （Standard condition） Note 3 ▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) . c_mlcc_mhv_reli_e-E08R01

15. Humidity Loading Appearance : No abnormality Capacitance change : Within ±7.5% or ±0.75pF, whichever is larger (HMK). Temperature Compensating（Class1） Q : C＜30pF：Q≧100＋10C/3 C≧30pF：Q≧200 （C：Nominal capacitance） Specified Value Insulation resistance : 500 MΩ min. Appearance : No abnormality Capacitance change : Within±15% High Permittivity （Class2） Dissipation factor : 7%max（HMK）, 5%max（QMK, SMK, XMK）. Insulation resistance : 10MΩμF or 500MΩ, whichever is smaller. According to JIS 5101-1. Class 1 Class 2 Voltage treatment Preconditioning None （Rated voltage are applied for 1 hour at 40℃） Note 2 Temperature 40±2℃ 40±2℃ Test Methods and Humidity 90 to 95%RH 90 to 95%RH Remarks Duration 500＋24/－0 hrs 500＋24/－0 hrs Applied voltage Rated voltage Rated voltage Charge/discharge 50mA max. 50mA max. current Recovery 6 to 24 hrs （Standard condition） Note 3 24±2 hrs（Standard condition） Note 3 16. High Temperature Loading Appearance : No abnormality Capacitance change : Within ±7.5% or ±0.75pF, whichever is larger.(HMK) Temperature Compensating（Class1） Q : C＜30pF：Q≧100＋10C/3 C≧30pF：Q≧200 （C：Nominal capacitance） Specified Value Insulation resistance : 500 MΩ min. Appearance : No abnormality Capacitance change : Within±15% High Permittivity （Class2） Dissipation factor : 7%max（HMK）, 5%max（QMK, SMK, XMK）. Insulation resistance : 50MΩμF or 1000MΩ, whichever is smaller. According to JIS 5101-1. Class 1 Class 2 Preconditioning None Voltage treatment Note 2 Temperature Maximum operating temperature Maximum operating temperature Test Methods and Duration 1000＋48/－0 hrs 1000＋48/－0 hrs Remarks Rated voltage×2(HMK), Rated voltage×1.5（QMK）, Applied voltage Rated voltage×2(HMK) Rated voltage×1.2（SMK,XMK） Charge/discharge 50mA max. 50mA max. current Recovery 6 to 24hr （Standard condition） Note 3 24±2 hrs （Standard condition） Note 3 Note1 Thermal treatment : Initial value shall be measured after test sample is heat-treated at 150＋0/－10℃ for an hour and kept at room temperature for 24±2hours. Note2 Voltage treatment : Initial value shall be measured after test sample is voltage-treated for an hour at both the temperature and voltage specified in the test conditions, and kept at room temperature for 24±2hours. Note3 Standard condition : Temperature: 5 to 35℃, Relative humidity: 45 to 85 % RH, Air pressure: 86 to 106kPa When there are questions concerning measurement results, in order to provide correlation data, the test shall be conducted under the following condition. Temperature: 20±2℃, Relative humidity: 60 to 70 % RH, Air pressure: 86 to 106kPa Unless otherwise specified, all the tests are conducted under the "standard condition". ▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) . c_mlcc_mhv_reli_e-E08R01

High Reliability Application Multilayer Ceramic Capacitors are noted separately. Precautions on the use of Multilayer Ceramic Capacitors ■PRECAUTIONS 1. Circuit Design ◆Verification of operating environment, electrical rating and performance 1. A malfunction of equipment in fields such as medical, aerospace, nuclear control, etc. may cause serious harm to human life or have severe social ramifications. Therefore, any capacitors to be used in such equipment may require higher safety and reliability, and shall be clearly differentiated from them used in general purpose applications. Precautions ◆Operating Voltage （Verification of Rated voltage） 1. The operating voltage for capacitors must always be their rated voltage or less. If an AC voltage is loaded on a DC voltage, the sum of the two peak voltages shall be the rated voltage or less. For a circuit where an AC or a pulse voltage may be used, the sum of their peak voltages shall also be the rated voltage or less. 2. Even if an applied voltage is the rated voltage or less reliability of capacitors may be deteriorated in case that either a high frequency AC voltage or a pulse voltage having rapid rise time is used in a circuit. 2. PCB Design ◆Pattern configurations （Design of Land-patterns） 1. When capacitors are mounted on PCBs, the amount of solder used （size of fillet） can directly affect the capacitor performance. Therefore, the following items must be carefully considered in the design of land patterns: （1）Excessive solder applied can cause mechanical stresses which lead to chip breaking or cracking. Therefore, please consider appropriate land-patterns for proper amount of solder. Precautions （2）When more than one component are jointly soldered onto the same land, each component's soldering point shall be separated by solder-resist. ◆Pattern configurations （Capacitor layout on PCBs） After capacitors are mounted on boards, they can be subjected to mechanical stresses in subsequent manufacturing processes （PCB cutting, board inspection, mounting of additional parts, assembly into the chassis, wave soldering of the boards, etc.）. For this reason, land pattern configurations and positions of capacitors shall be carefully considered to minimize stresses. ◆Pattern configurations （Design of Land-patterns） The following diagrams and tables show some examples of recommended land patterns to prevent excessive solder amounts. （1）Recommended land dimensions for typical chip capacitors ●Multilayer Ceramic Capacitors : Recommended land dimensions Land patterns for PCBs （unit: mm） Land pattern Wave-soldering Chip capacitor Solder-resist Type 107 212 316 325 L 1.6 2.0 3.2 3.2 Size C W 0.8 1.25 1.6 2.5 A 0.8 to 1.0 1.0 to 1.4 1.8 to 2.5 1.8 to 2.5 B 0.5 to 0.8 0.8 to 1.5 0.8 to 1.7 0.8 to 1.7 B A B C 0.6 to 0.8 0.9 to 1.2 1.2 to 1.6 1.8 to 2.5 Chip capacitor W Technical L considerations Reflow-soldering Type 021 042 063 105 107 212 316 325 432 L 0.25 0.4 0.6 1.0 1.6 2.0 3.2 3.2 4.5 Size W 0.125 0.2 0.3 0.5 0.8 1.25 1.6 2.5 3.2 A 0.095～0.135 0.15～0.25 0.20～0.30 0.45～0.55 0.6～0.8 0.8～1.2 1.8～2.5 1.8～2.5 2.5～3.5 B 0.085～0.125 0.10～0.20 0.20～0.30 0.40～0.50 0.6～0.8 0.8～1.2 1.0～1.5 1.0～1.5 1.5～1.8 C 0.110～0.150 0.15～0.30 0.25～0.40 0.45～0.55 0.6～0.8 0.9～1.6 1.2～2.0 1.8～3.2 2.3～3.5 Note：Recommended land size might be different according to the allowance of the size of the product. ●LWDC: Recommended land dimensions for reflow-soldering LWDC （unit: mm） Type 105 107 212 L 0.52 0.8 1.25 Size W W 1.0 1.6 2.0 A 0.18～0.22 0.25～0.3 0.5～0.7 B 0.2～0.25 0.3～0.4 0.4～0.5 C 0.9～1.1 1.5～1.7 1.9～2.1 L ▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) . c_mlcc_prec_e-E08R01

（2）Examples of good and bad solder application Item Not recommended Recommended Lead wire of component Solder-resist Mixed mounting of SMD and leaded components Chassis Solder (for grounding) Solder-resist Component placement close to the chassis Electrode pattern Lead wire of component Soldering iron Hand-soldering of leaded Solder-resist components near mounted components Solder-resist Horizontal component placement ◆Pattern configurations （Capacitor layout on PCBs） 1-1. The following is examples of good and bad capacitor layouts ; capacitors shall be located to minimize any possible mechanical stresses from board warp or deflection. Items Not recommended Recommended Place the product at a right angle to the direction of the Deflection of board anticipated mechanical stress. 1-2. The amount of mechanical stresses given will vary depending on capacitor layout. Please refer to diagram below. E D Perforation C A B Slit Magnitude of stress A＞B＝C＞D＞E 1-3. When PCB is split, the amount of mechanical stress on the capacitors can vary according to the method used. The following methods are listed in order from least stressful to most stressful: push-back, slit, V-grooving, and perforation. Thus, please consider the PCB, split methods as well as chip location. 3. Mounting ◆Adjustment of mounting machine 1. When capacitors are mounted on PCB, excessive impact load shall not be imposed on them. 2. Maintenance and inspection of mounting machines shall be conducted periodically. ◆Selection of Adhesives Precautions 1. When chips are attached on PCBs with adhesives prior to soldering, it may cause capacitor characteristics degradation unless the following factors are appropriately checked : size of land patterns, type of adhesive, amount applied, hardening temperature and hardening period. Therefore, please contact us for further information. ▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) . c_mlcc_prec_e-E08R01

◆Adjustment of mounting machine 1. When the bottom dead center of a pick-up nozzle is too low, excessive force is imposed on capacitors and causes damages. To avoid this, the following points shall be considerable. （1）The bottom dead center of the pick-up nozzle shall be adjusted to the surface level of PCB without the board deflection. （2）The pressure of nozzle shall be adjusted between 1 and 3 N static loads. （3）To reduce the amount of deflection of the board caused by impact of the pick-up nozzle, supporting pins or back-up pins shall be used on the other side of the PCB. The following diagrams show some typical examples of good and bad pick-up nozzle placement: Item Improper method Proper method chipping Single-sided mounting or cracking supporting pins or back-up pins Double-sided mounting chipping supporting pins or cracking or back-up pins 2. As the alignment pin is worn out, adjustment of the nozzle height can cause chipping or cracking of capacitors because of mechanical Technical impact on the capacitors. considerations To avoid this, the monitoring of the width between the alignment pins in the stopped position, maintenance, check and replacement of the pin shall be conducted periodically. ◆Selection of Adhesives Some adhesives may cause IR deterioration. The different shrinkage percentage of between the adhesive and the capacitors may result in stresses on the capacitors and lead to cracking. Moreover, too little or too much adhesive applied to the board may adversely affect components. Therefore, the following precautions shall be noted in the application of adhesives. （1）Required adhesive characteristics a. The adhesive shall be strong enough to hold parts on the board during the mounting & solder process. b. The adhesive shall have sufficient strength at high temperatures. c. The adhesive shall have good coating and thickness consistency. d. The adhesive shall be used during its prescribed shelf life. e. The adhesive shall harden rapidly. f. The adhesive shall have corrosion resistance. g. The adhesive shall have excellent insulation characteristics. h. The adhesive shall have no emission of toxic gasses and no effect on the human body. （2）The recommended amount of adhesives is as follows; ［Recommended condition］ Amount adhesive After capacitor are bonded Figure 212/316 case sizes as examples a a a 0.3mm min b b 100 to 120μm c Adhesives shall not contact land c c 4. Soldering ◆Selection of Flux Since flux may have a significant effect on the performance of capacitors, it is necessary to verify the following conditions prior to use; （1）Flux used shall be less than or equal to 0.1 wt%（ in Cl equivalent） of halogenated content. Flux having a strong acidity content shall not be applied. （2）When shall capacitors are soldered on boards, the amount of flux applied shall be controlled at the optimum level. Precautions （3）When water-soluble flux is used, special care shall be taken to properly clean the boards. ◆Soldering Temperature, time, amount of solder, etc. shall be set in accordance with their recommended conditions. Sn-Zn solder paste can adversely affect MLCC reliability. Please contact us prior to usage of Sn-Zn solder. ◆Selection of Flux 1-1. When too much halogenated substance（Chlorine, etc.） content is used to activate flux, or highly acidic flux is used, it may lead to corrosion of terminal electrodes or degradation of insulation resistance on the surfaces of the capacitors. 1-2. Flux is used to increase solderability in wave soldering. However if too much flux is applied, a large amount of flux gas may be emitted Technical and may adversely affect the solderability. To minimize the amount of flux applied, it is recommended to use a flux-bubbling system. considerations 1-3. Since the residue of water-soluble flux is easily dissolved in moisture in the air, the residues on the surfaces of capacitors in high humidity conditions may cause a degradation of insulation resistance and reliability of the capacitors. Therefore, the cleaning methods and the capability of the machines used shall also be considered carefully when water-soluble flux is used. ▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) . c_mlcc_prec_e-E08R01

◆Soldering ･ Ceramic chip capacitors are susceptible to thermal shock when exposed to rapid or concentrated heating or rapid cooling. ･ Therefore, the soldering must be conducted with great care so as to prevent malfunction of the components due to excessive thermal shock. ･ Preheating : Capacitors shall be preheated sufficiently, and the temperature difference between the capacitors and solder shall be within 130℃. ･ Cooling : The temperature difference between the capacitors and cleaning process shall not be greater than 100℃. ［Reflow soldering］ 【Recommended conditions for eutectic 【Recommended condition for Pb-free soldering】 soldering】 300 300 Preheating 230℃ Peak Within 10sec. 260℃ Max. ℃） 200 60Msine.c . 6M0sine.c ℃） 200 Within 10sec. mperature（ 100 Slow cooling mperature（ 100 cSoololiwn g Te Te Preheating150℃ Heating above 60sec. Min. 230℃ 0 0 40sec. Max. 1/2T～1/3T Caution Capacitor ①The ideal condition is to have solder mass（fillet）controlled to 1/2 to 1/3 of the Solder T thickness of a capacitor. PC board ②Because excessive dwell times can adversely affect solderability, soldering duration shall be kept as close to recommended times as possible. soldering for 2 times. ［Wave soldering］ 【Recommended conditions for eutectic 【Recommended condition for Pb-free soldering】 soldering】 300 300 230～250℃ Peak Preheating Within 3sec. 260℃ Max. ℃） 200 120sec. Min. ℃） 200 120sec. Min. Within 10sec. mperature（ 100 Slow cooling mperature（ 100 P15re0h℃ea ting cSoololiwng Te Te 0 0 Caution ①Wave soldering must not be applied to capacitors designated as for reflow soldering only. soldering for 1 times. ［Hand soldering］ 【Recommended conditions for eutectic 【Recommended condition for Pb-free soldering】 soldering】 400 400 400 230～280℃ Peak Peak Within 3sec. 350℃ Max. 280℃ Max. Within 3sec. Within 3sec. 300 300 300 Temperature（℃） 210000 Slow cooling Temperature（℃） 210000 ⊿T P15re0h℃ea tMiningS. low cooling 温度（℃） 210000 ⊿T P15re0h℃ea tMinSinglo. w cooling Preheating 0 60sec. Min. 0 60sec. Min. 0 60sec. Min. ⊿T ⊿T 316type or less ⊿T≦150℃ 325type or more ⊿T≦130℃ Caution ①Use a 50W soldering iron with a maximum tip diameter of 1.0 mm. ②The soldering iron shall not directly touch capacitors. soldering for 1 times. ▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) . c_mlcc_prec_e-E08R01

5. Cleaning ◆Cleaning conditions 1. When PCBs are cleaned after capacitors mounting, please select the appropriate cleaning solution in accordance with the intended use Precautions of the cleaning. （e.g. to remove soldering flux or other materials from the production process.） 2. Cleaning condition shall be determined after it is verified by using actual cleaning machine that the cleaning process does not affect capacitor's characteristics. 1. The use of inappropriate cleaning solutions can cause foreign substances such as flux residue to adhere to capacitors or deteriorate their outer coating, resulting in a degradation of the capacitor's electrical properties （especially insulation resistance）. 2. Inappropriate cleaning conditions（ insufficient or excessive cleaning） may adversely affect the performance of the capacitors. Technical In the case of ultrasonic cleaning, too much power output can cause excessive vibration of PCBs which may lead to the cracking of considerations capacitors or the soldered portion, or decrease the terminal electrodes' strength. Therefore, the following conditions shall be carefully checked; Ultrasonic output : 20 W/ℓ or les Ultrasonic frequency : 40 kHz or less Ultrasonic washing period : 5 min. or less 6. Resin coating and mold 1. With some type of resins, decomposition gas or chemical reaction vapor may remain inside the resin during the hardening period or while left under normal storage conditions resulting in the deterioration of the capacitor's performance. Precautions 2. When a resin's hardening temperature is higher than capacitor's operating temperature, the stresses generated by the excessive heat may lead to damage or destruction of capacitors. The use of such resins, molding materials etc. is not recommended. 7. Handling ◆Splitting of PCB 1. When PCBs are split after components mounting, care shall be taken so as not to give any stresses of deflection or twisting to the board. 2. Board separation shall not be done manually, but by using the appropriate devices. Precautions ◆Mechanical considerations Be careful not to subject capacitors to excessive mechanical shocks. （1）If ceramic capacitors are dropped onto a floor or a hard surface, they shall not be used. （2）Please be careful that the mounted components do not come in contact with or bump against other boards or components. 8. Storage conditions ◆Storage 1. To maintain the solderability of terminal electrodes and to keep packaging materials in good condition, care must be taken to control temperature and humidity in the storage area. Humidity should especially be kept as low as possible. ・Recommended conditions Ambient temperature : Below 30℃ Humidity : Below 70% RH Precautions The ambient temperature must be kept below 40℃. Even under ideal storage conditions, solderability of capacitor is deteriorated as time passes, so capacitors shall be used within 6 months from the time of delivery. ・Ceramic chip capacitors shall be kept where no chlorine or sulfur exists in the air. 2. The capacitance values of high dielectric constant capacitors will gradually decrease with the passage of time, so care shall be taken to design circuits. Even if capacitance value decreases as time passes, it will get back to the initial value by a heat treatment at 150℃ for 1hour. If capacitors are stored in a high temperature and humidity environment, it might rapidly cause poor solderability due to terminal oxidation and Technical quality loss of taping/packaging materials. For this reason, capacitors shall be used within 6 months from the time of delivery. If exceeding the considerations above period, please check solderability before using the capacitors. ※RCR-2335B（Safety Application Guide for fixed ceramic capacitors for use in electronic equipment）is published by JEITA. Please check the guide regarding precautions for deflection test, soldering by spot heat, and so on. ▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) . c_mlcc_prec_e-E08R01