HMC311LP3 / 311LP3E v06.0617 InGaP HBT GAIN BLOCK MMIC AMPLIFIER, DC - 6 GHz Typical Applications Features The HMC311LP3(E) is ideal for: P1dB Output Power: +15.5 dBm T • Cellular / PCS / 3G Output IP3: +32 dBm M • Fixed Wireless & WLAN Gain: 14.5 dB S • CATV & Cable Modem 50 Ohm I/O’s - S • Microwave Radio 16 Lead 3x3mm SMT Package: 9mm2 R E I Functional Diagram General Description F I L The HMC311LP3(E) is a GaAs InGaP Heterojunction P Bipolar Transistor (HBT) Gain Block MMIC M SMT DC to 6 GHz amplifiers. This 3x3mm A QFN packaged amplifier can be used as either a K cascadable 50 Ohm gain stage or to drive the LO of C HMC mixers with up to +17 dBm output power. The O HMC311LP3(E) offers 14.5 dB of gain and an output L IP3 of +32 dBm while requiring only 56 mA from a B +5V supply. The Darlington feedback pair used results N in reduced sensitivity to normal process variations I and yields excellent gain stability over temperature A while requiring a minimal number of external bias G components. & R E V Electrical Specifications, Vs= 5V, Rbias= 22 Ohm, T = +25° C A I R Parameter Min. Typ. Max. Units D DC - 1.0 GHz 13.0 14.5 dB Gain 1.0 - 4.0 GHz 12.5 14.3 dB 4.0 - 6.0 GHz 12.0 14.0 dB DC - 2.0 GHz 0.005 0.008 dB/ °C Gain Variation Over Temperature 2.0 - 4.0 GHz 0.008 0.012 dB/ °C 4.0 - 6.0 GHz 0.012 0.016 dB/ °C DC - 1.0 GHz 13 dB Return Loss Input / Output 1.0 - 3.0 GHz 11 dB 3.0 - 6.0 GHz 15 dB Reverse Isolation DC - 6 GHz 18 dB DC - 2.0 GHz 13.5 15.5 dBm Output Power for 1 dB Compression (P1dB) 2.0 - 4.0 GHz 12.0 15.0 dBm 4.0 - 6.0 GHz 10.0 13.0 dBm DC - 1.0 GHz 32 dBm 1.0 - 2.0 GHz 30 dBm Output Third Order Intercept (IP3) 2.0 - 4.0 GHz 28 dBm 4.0 - 6.0 GHz 24 dBm Noise Figure DC - 6 GHz 4.5 dB Supply Current (Icq) 55 74 mA Note: Data taken with broadband bias tee on device output. Information furnished by Analog Devices is believed to be accurate and reliable. However, no For price, delivery, and to place orders: Analog Devices, Inc., responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106 1 rliicgehntss eo fi sth girrda nptaerdti ebsy t himatp mlicaayt iroens uolrt fortohme riwtsi sues eu.n Sdpeer caifinyc aptiaotnesn ts ourb jpeactte tnot crhigahntgs eo wf Aitnhaoluotg n oDteicveic. eNso. Phone: 781-329-4700 • Order online at www.analog.com Trademarks and registered trademarks are the property of their respective owners. Application Support: Phone: 1-800-ANALOG-D

HMC311LP3 / 311LP3E v06.0617 InGaP HBT GAIN BLOCK MMIC AMPLIFIER, DC - 6 GHz Gain & Return Loss Gain vs. Temperature 20 20 19 15 18 T 10 17 M B) 16 SE (d 05 B) 1145 S SPON -5 AIN (d 1123 - E -10 G 11 S R -15 10 R 9 -20 8 E -25 7 0 1 2 3 4 5 6 7 8 9 6 FI 5 FREQUENCY (GHz) 0 1 2 3 4 5 6 7 8 LI S21 S11 S22 FREQUENCY (GHz) P +25 C +85 C -40 C M A Input Return Loss vs. Temperature Output Return Loss vs. Temperature K C 0 0 O B) dB) L S (d -5 SS ( -5 B N LOS RN LO N TUR -10 ETU -10 AI E R T R UT G INPU -15 OUTP -15 & R -20 -20 0 1 2 3 4 5 6 7 8 0 1 2 3 4 5 6 7 8 E FREQUENCY (GHz) FREQUENCY (GHz) V I +25 C +85 C -40 C +25 C +85 C -40 C R D Reverse Isolation vs. Temperature Noise Figure vs. Temperature 0 10 9 dB) -5 8 ATION ( -10 RE (dB) 67 SE ISOL -15 SE FIGU 45 VER NOI 3 RE -20 2 1 -25 0 0 1 2 3 4 5 6 7 8 1 2 3 4 5 6 7 8 FREQUENCY (GHz) FREQUENCY (GHz) +25 C +85 C -40 C +25 C +85 C -40 C For price, delivery, and to place orders: Analog Devices, Inc., One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106 Phone: 781-329-4700 • Order online at www.analog.com 2 Application Support: Phone: 1-800-ANALOG-D

HMC311LP3 / 311LP3E v06.0617 InGaP HBT GAIN BLOCK MMIC AMPLIFIER, DC - 6 GHz P1dB vs. Temperature Psat vs. Temperature 20 20 T 18 18 M 16 16 14 14 S - S P1dB (dBm) 11802 Psat (dBm) 11802 R 6 6 E 4 4 I 2 2 F 0 0 I L 0 1 2 3 4 5 6 7 8 0 1 2 3 4 5 6 7 8 P FREQUENCY (GHz) FREQUENCY (GHz) M +25 C +85 C -40 C +25 C +85 C -40 C A K Power Compression @ 1 GHz Power Compression @ 6 GHz C 20 20 O 18 18 L %) 16 %) 16 B PAE ( 1124 PAE ( 1124 N dB), 180 dB), 180 N ( 6 N ( 6 AI GAI 4 GAI 4 G m), 02 m), 02 B B & out (d --42 out (d --42 P -6 P -6 -8 -8 R -10 -10 E -20 -18 -16 -14 -12 -10 -8 -6 -4 -2 0 2 4 6 8 -20 -18 -16 -14 -12 -10 -8 -6 -4 -2 0 2 4 6 V INPUT POWER (dBm) INPUT POWER (dBm) I R Pout Gain PAE Pout Gain PAE D Gain, Power, Output IP3 & Supply Current Output IP3 vs. Temperature vs. Supply Voltage @ 1 GHz 34 m) B 32 d 30 3 ( 40 80 P 28 OI 35 m) 2246 Bm), 30 60 B d IP3 (d 122802 m), Psat ( 2205 40 Icq (m 16 dB 15 A) 14 B ( 10 20 12 1d 100 1 2 3 4 5 6 7 8 dB), P 05 0 FREQUENCY (GHz) N ( 4.5 4.75 5 5.25 5.5 AI G Vs(Vdc) +25 C +85 C -40 C Gain Psat P1dB OIP3 Icq For price, delivery, and to place orders: Analog Devices, Inc., One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106 Phone: 781-329-4700 • Order online at www.analog.com 3 Application Support: Phone: 1-800-ANALOG-D

HMC311LP3 / 311LP3E v06.0617 InGaP HBT GAIN BLOCK MMIC AMPLIFIER, DC - 6 GHz Absolute Maximum Ratings Collector Bias Voltage (Vcc) +7V ELECTROSTATIC SENSITIVE DEVICE RF Input Power (RFIN)(Vs = +5V) +10 dBm T Junction Temperature 150 °C OBSERVE HANDLING PRECAUTIONS M Continuous Pdiss (T = 85 °C) S 0.339 W (derate 5.21 mW/°C above 85 °C) - Thermal Resistance 192 °C/W S (junction to ground paddle) R Storage Temperature -65 to +150 °C E Operating Temperature -40 to +85 °C I Class 1A, F ESD Sensitivity (HBM) Passed 250V I L P Outline Drawing M A K C O L B N I A G & R E V NOTES: RI 1. LEADFRAME MATERIAL: COPPER ALLOY D 2. DIMENSIONS ARE IN INCHES [MILLIMETERS] 3. LEAD SPACING TOLERANCE IS NON-CUMULATIVE 4. PAD BURR LENGTH SHALL BE 0.15mm MAXIMUM. PAD BURR HEIGHT SHALL BE 0.05mm MAXIMUM. 5. PACKAGE WARP SHALL NOT EXCEED 0.05mm. 6. ALL GROUND LEADS AND GROUND PADDLE MUST BE SOLDERED TO PCB RF GROUND. 7. REFER TO HITTITE APPLICATION NOTE FOR SUGGESTED LAND PATTERN. Package Information Part Number Package Body Material Lead Finish MSL Rating Package Marking [3] HMC311LP3 Low Stress Injection Molded Plastic Sn/Pb Solder MSL1 [1] 311 XXXX HMC311LP3E RoHS-compliant Low Stress Injection Molded Plastic 100% matte Sn MSL1 [2] 311 XXXX [1] Max peak reflow temperature of 235 °C [2] Max peak reflow temperature of 260 °C [3] 4-Digit lot number XXXX For price, delivery, and to place orders: Analog Devices, Inc., One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106 Phone: 781-329-4700 • Order online at www.analog.com 4 Application Support: Phone: 1-800-ANALOG-D

HMC311LP3 / 311LP3E v06.0617 InGaP HBT GAIN BLOCK MMIC AMPLIFIER, DC - 6 GHz Pin Descriptions Pin Number Function Description Interface Schematic T 1, 2, 4 - 9, N/C This pin may be connected to RF ground. M 11 - 16 S - 3 RFIN This pin is DC coupled. An off chip DC blocking capacitor is required. S R E I 10 RFOUT RF output and DC Bias for the output stage. F I L P GND Package bottom must be connected to RF/DC ground. M A K C Application Circuit O L B N I A G Note: 1. Select Rbias to achieve Icq using equation below, & Rbias > 22 Ohm. R 2. External blocking capacitors are required on RFIN and RFOUT. E V Icq = Vs - 3.8 I R Rbias D Recommended Component Values Frequency (MHz) Component 50 900 1900 2200 2400 3500 5200 5800 L1 270 nH 56 nH 18 nH 18 nH 15 nH 8.2 nH 3.3 nH 3.3 nH C1, C2 0.01 µF 100 pF 100 pF 100 pF 100 pF 100 pF 100 pF 100 pF For price, delivery, and to place orders: Analog Devices, Inc., One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106 Phone: 781-329-4700 • Order online at www.analog.com 5 Application Support: Phone: 1-800-ANALOG-D

HMC311LP3 / 311LP3E v06.0617 InGaP HBT GAIN BLOCK MMIC AMPLIFIER, DC - 6 GHz Evaluation PCB T M S - S R E I F I L P M A K C O L B N I A G J3 & Pin Number Description R 1, 2, 3 Vs E 4, 5, 6 GND V I R D List of Materials for Evaluation PCB 106789 [1] The circuit board used in the final application Item Description should use RF circuit design techniques. Signal J1 - J2 PC Mount SMA Connector lines should have 50 Ohm impedance while the J3 2 mm DC Header package ground leads and exposed paddle should C1, C2 Capacitor, 0402 Pkg. be connected directly to the ground plane similar to C3 10,000 pF Capacitor, 0805 Pkg. that shown. A sufficient number of via holes should R1 22 Ohm Resistor, 0805 Pkg. be used to connect the top and bottom ground L1 Inductor, 0805 Pkg. planes. The evaluation board should be mounted U1 HMC311LP3 / HMC311LP3E to an appropriate heat sink. The evaluation circuit PCB [2] 106493 Evaluation PCB board shown is available from Hittite upon request. [1] Reference this number when ordering complete evaluation PCB [2] Circuit Board Material: Rogers 4350 For price, delivery, and to place orders: Analog Devices, Inc., One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106 Phone: 781-329-4700 • Order online at www.analog.com 6 Application Support: Phone: 1-800-ANALOG-D