MLOTM Hi-Q Inductors The Multilayer Organic Hi-Q Inductor is a low profile organic based inductor that can support mobile communications, satellite applications, GPS, matching networks, and collision avoidance. The MLOTM Hi-Q Inductor series of components are based on AVX’s patented multilayer organic technology (US patent 6,987,307 and 7,439,840). MLOTM Hi-Q Inductors incorporate very low loss organic materials and low profile copper which allow for high Q and high stability over frequency. MLOTMHi- Q Inductors are surface mountable and are expansion matched to FR4 printed wiring boards. MLOTM Hi-Q Inductors utilize fine line high density interconnect technology thereby allowing for tight tolerance control and high repeatability. Reliability testing is performed to JEDEC and mil standards. Finishes are available in RoHS compliant Sn. APPLICATIONS FEATURES SURFACE MOUNT ADVANTAGES • Mobile communications • High Q • Satellite Applications • High SRF • Inherent Low Profile • GPS • High Frequency • Excellent Solderability • Collision Avoidance • Low DC Resistance • Low Parasitics • Wireless LAN’s • Surface Mountable • Better Heat Dissipation • 0402 Case Size • Expansion Matched to PCB • RoHS Compliant Finishes • Available in Tape and Reel HOW TO ORDER HLQ 02 XXX X T TR Type Size Inductance Tolerance Termination Packaging HLQ = High Q 02 = 0402 Expressed in nH B = ±0.1nH Sn100 Tape & Reel (2 significant digits + number of zeros) C = ±0.2nH for values <10nH, H = ±3% letter R denotes decimal point. Example: 22nH = 220 4.7nH = 4R7 DIMENSIONS QUALITY INSPECTION Finished parts are 100% tested for electrical parameters and visual characteristics. R T TERMINATION RoHS compliant Sn finish. L W OPERATING TEMPERATURE mm (inches) -55ºC to +125ºC L W T R 1.00±0.10 0.58±0.075 0.35±0.10 0.125±0.050 (0.040±0.004) (0.023±0.003) (0.014±0.004) (0.005±0.002) 1

MLOTM Hi-Q Inductors 0402 ELECTRICAL SPECIFICATIONS Available L (nH) Inductance Tolerance Q min SRF min Rdc max Idc max 450MHz B = ±0.1nH, C = ±0.2nH 450MHz (GHz) (mΩ) (mA) H = ±3% 0.8 ±0.1nH, ±0.2nH 17 7 100 350 0.9 ±0.1nH, ±0.2nH 17 7 100 350 1 ±0.1nH, ±0.2nH 17 7 100 330 1.1 ±0.1nH, ±0.2nH 17 7 100 330 1.2 ±0.1nH, ±0.2nH 17 7 110 330 1.3 ±0.1nH, ±0.2nH 17 7 130 330 1.5 ±0.1nH, ±0.2nH 17 7 150 330 1.6 ±0.1nH, ±0.2nH 17 7 150 300 1.8 ±0.1nH, ±0.2nH 17 7 160 300 2 ±0.1nH, ±0.2nH 17 7 180 245 2.2 ±0.1nH, ±0.2nH 17 7 200 245 2.4 ±0.1nH, ±0.2nH 17 7 200 245 2.7 ±0.1nH, ±0.2nH 17 7 250 245 3 ±0.1nH, ±0.2nH 17 7 300 225 3.3 ±0.1nH, ±0.2nH 17 7 340 225 3.6 ±0.1nH, ±0.2nH 17 7 350 200 3.9 ±0.1nH, ±0.2nH 17 7 400 200 4.7 ±0.1nH, ±0.2nH 17 7 480 195 5.6 ±0.1nH, ±0.2nH 17 7 500 170 6.8 ±3% 17 7 600 160 8.2 ±3% 17 6 800 130 10 ±3% 17 5 1000 120 12 ±3% 17 4 1100 110 15 ±3% 17 4 1200 110 18 ±3% 17 3 1500 110 22 ±3% 17 3 1900 95 27 ±3% 17 3 2100 95 30 ±3% 17 2 2200 85 32 ±3% 17 2 2200 85 Specifications based on performance of component assembled properly on printed circuit board with 50Ωnominal impedance. Idc max: Maximum 15ºC rise in component temperature over ambient. 2