Data Sheet HLMP-D150, HLMP-D155, HLMP-K150, and HLMP-K155 T-1¾ (5 mm), T-1 (3 mm), Low Current, Double Heterojunction AlGaAs Red LED Lamps Description Features These solid state LED lamps use double heterojunction  Minimum luminous intensity specified at 1 mA (DH) AlGaAs/GaAs material technology. This LED material  High light output at low currents has outstanding light output efficiency at very low drive  Wide viewing angle currents. The color is deep red at the dominant wavelength  Outstanding material efficiency of 637 nm. These lamps are ideally suited for use in  Low power/low forward voltage applications where high light output is required with  CMOS/MOS compatible minimum power output.  TTL compatible  Deep red color Applications  Low power circuits  Battery powered equipment  Telecommunication indicators Broadcom AV02-1562EN July 23, 2018

HLMP-D150, HLMP-D155, HLMP-K150, and HLMP-K155 Data Sheet T-1¾ (5 mm), T-1 (3 mm), Low Current, Double Heterojunction AlGaAs Red LED Lamps Package Dimensions Package Outline A Package Outline B 5.08 (0.200) 5.08 (0.200) 4.57 (0.180) 4.57 (0.180) 0.89 (0.035) 9.19 (0.362) 9.19 (0.362) 13.25 (0.522) 0.64 (0.025) 8.43 (0.332) 8.43 (0.332) 12.45 (0.490) 0.89 (0.035) 0.64 (0.025) 1.32 (0.052) CATHODE 0.65 (0.026) MAX. 1.02 (0.040) 25.40 (1.00) 23.0 MIN. MINIMUM (0.90) 0.46 (0.018) SQUARE NOMINAL 0.55 (0.022) 1.27 (0.050) SQ. TYP. 0.40 (0.016) NOM. 6.1 (0.240) 1.27(0.050) 5.6 (0.220) NOM. 6.10 (0.240) CATHODE 5.59 (0.220) 2.54 (0.100) NOM. 2.54 (0.100) NOM. A. B. Package Outline C NOTE: 1. All dimensions are in mm (in.). 2. An epoxy meniscus may extend about 1 mm (0.040 in.) down the leads. 3. For PCB hole recommendations, see the Precautions section. Broadcom AV02-1562EN 2

HLMP-D150, HLMP-D155, HLMP-K150, and HLMP-K155 Data Sheet T-1¾ (5 mm), T-1 (3 mm), Low Current, Double Heterojunction AlGaAs Red LED Lamps Selection Guide Luminous Intensity Iv (mcd) at 1 mA 2θ1/2a Package Package Description Device HLMP- Min. Typ. Max. Degree Outline T-1¾ Red Tinted Diffused D150 1.3 3.0 — 65 A D150-C00xx 1.3 3.0 — 65 A T-1¾ Red Untinted Non-diffused D155 5.4 10.0 — 24 B D155-F00xx 5.4 10.0 — 24 B T-1 Red Tinted Diffused K150 1.3 2.0 — 60 C K150-C00xx 1.3 2.0 — 60 C K150-CD0xx 1.3 2.0 4.2 60 C T-1 Red Untinted Non-diffused K155 2.1 3.0 — 45 C K155-D00xx 2.1 3.0 — 45 C a. θ is the off axis angle from lamp centerline where the luminous intensity is ½ the on-axis value. 1/2 Absolute Maximum Ratings at T = 25°C A Parameter Value Peak Forward Currenta 300 mA Average Forward Currentb 20 mA DC Currentb 30 mA Power Dissipation 87 mW Reverse Voltage (I = 100 µA) 5V R Transient Forward Current (10 µs Pulse)c 500 mA LED Junction Temperature 110°C Operating Temperature Range –20°C to +100°C Storage Temperature Range –40°C to +100°C a. Maximum I at f = 1 kHz, DF = 6.7%. PEAK b. Derate linearly as shown in Figure4. c. The transient peak current is the maximum non-recurring peak current the device can withstand without damaging the LED die and wire bonds. It is not recommended that the device be operated at peak currents beyond the Absolute Maximum Peak Forward Current. Broadcom AV02-1562EN 3

HLMP-D150, HLMP-D155, HLMP-K150, and HLMP-K155 Data Sheet T-1¾ (5 mm), T-1 (3 mm), Low Current, Double Heterojunction AlGaAs Red LED Lamps Electrical/Optical Characteristics at T = 25°C A Parameter Symbol Min. Typ. Max. Unit Test Condition Forward Voltage V — 1.6 2.2 V I = 1 mA F F Reverse Breakdown Voltage V 5.0 15.0 — V I = 100 µA R R Peak Wavelength  — 645 — nm Measurement at Peak p Dominant Wavelength d — 637 — nm Note a Spectral Line Halfwidth ½ — 20 — nm Wavelength width at spectral distribution ½ power point. Speed of Response S — 30 — ns Exponential Time Constant, e-t/TS Capacitance C — 30 — pF V = 0, f = 1 MHz F Thermal Resistance RθJ-PIN — 260b — °C/W Junction to Cathode Lead 210c 290d Luminous Efficacy V — 80 — Im/W Note e a. The dominant wavelength,  , is derived from the CIE chromaticity diagram and represents the color of the device. d b. HLMP-D150. c. HLMP-D155. d. HLMP-K150/-K155. e. The radiant intensity, I , in watts per steradian, may be found from the equation I = l / , where I is the luminous intensity in candelas and e e V V V  is luminous efficacy in lumens/watt. V Part Numbering System H L M P - X1 X2 X3 X4 - X5 X6 X7 X8 X9 Code Description Option X Package type D T-1¾ (5 mm) 1 K T-1 (3 mm) X Color options 1 AlGaAs Red 2 X X Lens type 50 Tinted, diffused 3 4 55 Untinted, non-diffused X Minimum intensity bin See Intensity Bin Limits 5 X Maximum intensity bin 0 Open binning (no maximum limit) 6 X Color bin selection 0 Full range 7 X X Packaging option 00 Bulk packaging 8 9 02 Tape and reel A1 Right angle housing, uneven leads B2 Right angle housing, even leads Broadcom AV02-1562EN 4

HLMP-D150, HLMP-D155, HLMP-K150, and HLMP-K155 Data Sheet T-1¾ (5 mm), T-1 (3 mm), Low Current, Double Heterojunction AlGaAs Red LED Lamps Intensity Bin Limits Intensity Range (mcd) Color Bin Min. Max. Red C 1.5 2.4 D 2.4 3.8 E 3.8 6.1 F 6.1 9.7 G 9.7 15.5 H 15.5 24.8 I 24.8 39.6 J 39.6 63.4 K 63.4 101.5 L 101.5 162.4 M 162.4 234.6 N 234.6 340.0 O 340.0 540.0 P 540.0 850.0 Q 850.0 1200.0 R 1200.0 1700.0 S 1700.0 2400.0 T 2400.0 3400.0 U 3400.0 4900.0 V 4900.0 7100.0 W 7100.0 10200.0 X 10200.0 14800.0 Y 14800.0 21400.0 Z 21400.0 30900.0 Maximum tolerance for each bin limit is ± 18%. Mechanical Option Matrix Mechanical Option Code Definition 00 Bulk Packaging, minimum increment 500 pieces/bag 02 Tape and Reel, straight leads, minimum increment 1300 pieces (T-1¾), 800 pieces (T-1) A1 T-1 Right Angle Housing, uneven leads, minimum increment 500 pieces/bag B2 T-1¾ Right Angle Housing, even leads, minimum increment 500 pieces/bag NOTE: All categories are established for classification of products. Products may not be available in all categories. Please contact your local Broadcom representative for further clarification/information. Broadcom AV02-1562EN 5

HLMP-D150, HLMP-D155, HLMP-K150, and HLMP-K155 Data Sheet T-1¾ (5 mm), T-1 (3 mm), Low Current, Double Heterojunction AlGaAs Red LED Lamps Figure 1: Relative Intensity vs. Wavelength Figure 2: Forward Current vs. Forward Voltage Figure 3: Relative Luminous Intensity vs. DC Forward Current Figure 4: Maximum Forward DC Current vs. Ambient Temperature. Derating based on T MAX. = 110°C. J Figure 5: Relative Luminous Intensity vs. Angular Figure 6: Relative Luminous Intensity vs. Angular Displacement, HLMP-D150 Displacement, HLMP-K150 Broadcom AV02-1562EN 6

HLMP-D150, HLMP-D155, HLMP-K150, and HLMP-K155 Data Sheet T-1¾ (5 mm), T-1 (3 mm), Low Current, Double Heterojunction AlGaAs Red LED Lamps Figure 7: Relative Luminous Intensity vs. Angular Figure 8: Relative Luminous Intensity vs. Angular Displacement, HLMP-D155 Displacement, HLMP-K155 Precautions Lead Forming  Apply ESD precautions on the soldering station and personnel to prevent ESD damage to the LED  The leads of an LED lamp may be preformed or cut to component that is ESD sensitive. Refer to Broadcom length prior to insertion and soldering on PC board. application note AN 1142 for details. The soldering iron  For better control, use the proper tool to precisely form used must have a grounded tip to ensure electrostatic and cut the leads to applicable length rather than doing charge is properly grounded. it manually.  Recommended soldering condition.  If manual lead cutting is necessary, cut the leads after the soldering process. The solder connection forms a Wave Solderinga, b Manual Solder Dipping mechanical ground that prevents mechanical stress due to lead cutting from traveling into LED package. Pre-heat Temperature 105°C max. — Use this method for the hand soldering operation, Pre-heat Time 60s max. — because the excess lead length also acts as small heat Peak Temperature 250°C max. 260°C max. sink. Dwell Time 3s max. 5s max. a. The preceding conditions refer to measurement with a Soldering and Handling thermocouple mounted at the bottom of the PCB.  Take care during the PCB assembly and soldering b. Use only bottom pre-heaters to reduce thermal stress experienced by LED. process to prevent damage to the LED component.  LED component may be effectively hand soldered to PCB. However, do this under unavoidable  Set and maintain wave soldering parameters according circumstances, such as rework. The closest manual to the recommended temperature and dwell time. soldering distance of the soldering heat source Perform daily checks on the soldering profile to ensure (soldering iron’s tip) to the body is 1.59 mm. Soldering that it always conforms to the recommended soldering the LED using soldering iron tip closer than 1.59 mm conditions. might damage the LED. 1.59 mm Broadcom AV02-1562EN 7

HLMP-D150, HLMP-D155, HLMP-K150, and HLMP-K155 Data Sheet T-1¾ (5 mm), T-1 (3 mm), Low Current, Double Heterojunction AlGaAs Red LED Lamps NOTE:  The recommended PC board plated through holes (PTH) size for LED component leads follows. 1. PCBs with different size and design (component density) will have a different heat mass (heat capacity). This might cause a change in temperature experienced LED Component Plated Through- by the board if the same wave soldering setting is used. Lead Size Diagonal Hole Diameter Therefore, re-calibrate the soldering profile again before Lead size (typ.) 0.45 × 0.45 mm 0.636 mm 0.98 to 1.08 mm loading a new type of PCB. (0.018 × 0.018 in.) (0.025 in.) (0.039 to 0.043 in.) 2. Take extra precautions during wave soldering to ensure Dambar shear- 0.65 mm 0.919 mm that the maximum wave temperature does not exceed off area (max.) (0.026 in.) (0.036 in.) 250°C and the solder contact time does not exceed 3s. Lead size (typ.) 0.50 × 0.50 mm 0.707 mm 1.05 to 1.15 mm Over-stressing the LED during the soldering process (0.020 × 0.020 in.) (0.028 in.) (0.041 to 0.045 in.) might cause premature failure to the LED due to Dambar shear- 0.70 mm 0.99 mm delamination. off area (max.) (0.028 in.) (0.039 in.)  Loosely fit any alignment fixture that is being applied during wave soldering and do not apply weight or force  Over-sizing the PTH can lead to twisted LED after on the LED. Use non-metal material because it will clinching. On the other hand under sizing the PTH can absorb less heat during the wave soldering process. cause difficulty inserting the TH LED.  At elevated temperature, LED is more susceptible to mechanical stress. Therefore, allow the PCB to cool Refer to application note AN5334 for more information down to room temperature prior to handling, which about soldering and handling of TH LED lamps. includes removal of alignment fixture or pallet.  If PCB board contains both through-hole (TH) LED and other surface-mount components, solder surface-mount components on the top side of the PCB. If the surface mount must be on the bottom side, solder these components using reflow soldering prior to the insertion of the TH LED. Figure 9: Example of Wave Soldering Temperature Profile for TH LED Recommended solder: LAMINAR TURBULENT WAVE Sn63 (Leaded solder alloy) 250 HOT AIR KNIFE SAC305 (Lead free solder alloy) Flux: Rosin flux Solder bath temperature: 200 245°C± 5°C (maximum peak temperature = 250°C) C) E (° Dwell time: 1.5s – 3.0s (maximum = 3 seconds) R TU 150 Note: Allow for board to be sufficiently cooled to A R room temperature before exerting mechanical force. E MP Recommended solder: E Sn63 (Leaded solder alloy) T 100 SAC305 (Lead free solder alloy) Flux: Rosin flux 50 Solder bath temperature: 245°C± 5°C (maximum peak temperature = 250°C) PREHEAT Dwell time: 1.5s – 3.0s (maximum = 3 seconds) 0 10 20 30 40 50 60 70 80 90 100 Note: Allow for board to be sufficiently cooled to room temperature before exerting mechanical force. TIME (SECONDS ) Broadcom AV02-1562EN 8

HLMP-D150, HLMP-D155, HLMP-K150, and HLMP-K155 Data Sheet T-1¾ (5 mm), T-1 (3 mm), Low Current, Double Heterojunction AlGaAs Red LED Lamps Packaging Label Avago Mother Label (Available on Packaging Box of Ammo Pack and Shipping Box) (1P) Item: Part Number STANDARD LABEL LS0002 RoHS Compliant e3 max temp 250C (1T) Lot: Lot Number (Q) QTY: Quantity LPN: CAT: Intensity Bin (9D)MFG Date: Manufacturing Date BIN: Color Bin (P) Customer Item: (V) Vendor ID: (9D) Date Code: Date Code DeptID: Made In: Country of Origin Avago Baby Label (Only Available on Bulk Packaging) RoHS Compliant Lamps Baby Label e3 max temp 250C (1P) PART #: Part Number (1T) LOT #: Lot Number (9D)MFG DATE: Manufacturing Date QUANTITY: Packing Quantity C/O: Country of Origin Customer P/N: CAT: Intensity Bin Supplier Code: BIN: Color Bin DATECODE: Date Code Broadcom AV02-1562EN 9

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