HLMP-3301, HLMP-3401, HLMP-3507, HLMP-3762, HLMP-3862, HLMP-3962, HLMP-D401 T-13/ (5 mm) Diffused LED Lamps 4 Data Sheet Description Features This family of T-13/4 tinted, diffused LED lamps is • High intensity widely used in general purpose indicator applica tions. • Choice of 4 bright colors Diffus ants, tints, and optical design are balanced to yield – High Efficiency Red superior light output and wide viewing angles. Several – Orange intensity choices are available in each color for increased – Yellow design flexibility. – High Performance Green • Popular T-13/4 diameter package Device Selection Guide • Selected minimum intensities Material/Color Part Number Luminous Intensity, • Wide viewing angle Iv (mcd) at 10mA • General purpose leads Min. Max. • Reliable and rugged GaP HER HLMP-3301 6.1 - • Available on tape and reel HLMP-3301-D00xx 2.4 - HLMP-3301-F00xx 6.1 - HLMP-3301-FG0xx 6.1 15.5 HLMP-3762 9.7 - HLMP-3762-G00xx 9.7 - GaP Yellow HLMP-3401 6.5 - HLMP-3401-E00xx 6.5 - HLMP-3862 10.3 - GaP Orange HLMP-D401 6.1 - HLMP-D401-EF0xx 3.8 9.7 GaP Green HLMP-3507 4.7 - HLMP-3507-D00xx 4.7 - HLMP-3507-EF0xx 7.6 19.1 HLMP-3962 12.0 - HLMP-3962-F00xx 12.0 -

Part Numbering System HLMP - x x xx - x x x xx Mechanical Option 00: Bulk 01: Tape & Reel, Crimped Leads 02: Tape & Reel, Straight Leads B1: Right Angle Housing, Uneven Leads B2: Right Angle Housing, Even Leads DD: Ammo Pack R4: Tape & Reel, Counter Clockwise Color Bin Options 0: Full Color Bin Distribution Maximum Iv Bin Options 0: Open (no max. limit) Others: Please refer to the Iv Bin Table Minimum Iv Bin Options Please refer to the Iv Bin Table Brightness Level 0x: Less Brightness 62: Higher Brightness Color Options 3,7: GaP HER 4,8: GaP Yellow (except D4xx) 5,9: GaP Green Package Options 3: T-1 3/4 (5 mm) D: T-1 3/4 (5 mm) GaP Orange Package Dimensions 0.89 (0.035) 6.10 (0.240) 0.64 (0.025) SQUARE TYP. 5.59 (0.220) 0.55 (0.022) 0.40 (0.016) 0.65 (0.026) max 5.08 (0.200) 4.57 (0.180) CATHODE LEAD 9.19 (0.362) 1.27(0.050) 2.54 (0.100) NOM. 8.43 (0.332) 25.40(1.00) NOM. MINIMUM Notes: 1. All dimensions are in mm (inches). 2. An epoxy meniscus may extend about 1 mm (0.040") down the leads. 3. For PCB hole recommendations, see the Precautions section. 2

Optical/Electrical Characteristics at T = 25°C A Test Symbol Parameter Color Min. Typ. Max. Units Condition 2q1/2 Included Angle High Efficiency Red 60 Deg. IF = 10 mA Between Half Orange 60 See Note 1 Luminous Intensity Yellow 60 Points Green 60 lPEAK Peak Wavelength High Efficiency Red 635 nm Measurement Orange 600 at Peak Yellow 583 Green 565 Dl1/2 Spectral Line Halfwidth HER/Orange 40 nm Yellow 36 Green 28 ld Dominant Wavelength High Efficiency Red 626 nm See Note 2 Orange 602 Yellow 585 Green 569 ts Speed of Response High Efficiency Red 90 ns Orange 280 Yellow 90 Green 500 C Capacitance High Efficiency Red 11 pF VF = 0; Orange 4 f = 1 MHz Yellow 15 Green 18 RqJ-PIN Thermal Resistance All 260 °C/W Junction to Cathode Lead VF Forward Voltage HER/Orange 1.9 2.4 V IF = 10 mA Yellow 2.0 2.4 Green 2.1 2.7 VR Reverse Breakdown All 5.0 V IR = 100 µA Voltage hV Luminous Efficacy High Efficiency Red – 145 lumens See Note 3 Orange 380 Watt Yellow – 500 Green 595 Notes: 1. q1/2 is the off-axis angle at which the luminous intensity is half the axial luminous intensity. 2. The dominant wavelength, ld, is derived from the CIE chromaticity diagram and represents the single wavelength which defines the color of the device. 3. Radiant intensity, Ie, in Watts/steradian, may be found from the equation Ie = Iv/hv, where Iv is the luminous intensity in candelas and hv is the luminous efficacy in lumens/Watt. 3

Absolute Maximum Ratings at T = 25°C A Green/ Parameter HER/Orange Yellow Emerald Green Units Peak Forward Current 90 60 90 mA Average Forward Current[1] 25 20 25 mA DC Current[2] 30 20 30 mA Power Dissipation[3] 135 85 135 mW Reverse Voltage (IR = 100 µA) 5 5 5 V Transient Forward Current[4] 500 500 500 mA (10 µsec Pulse) LED Junction Temperature 110 110 110 °C Operating Temperature Range -40 to +100 -40 to +100 -20 to +100 °C Storage Temperature Range -40 to +100 -40 to +100 -40 to +100 °C N otes: 1. See Figure 5 (Red/Orange), 10 (Yellow), or 15 (Green) to establish pulsed operating conditions. 2. For Red, Orange and Green series derate linearly from 50°C at 0.5 mA/°C. For Yellow series derate linearly from 50°C at 0.2 mA/°C. 3. 1.8 mW/°C. For Yellow series derate power linearly from 50°C at 1.6 mW/°C. 4. The transient peak current is the maximum non-recurring peak current that can be applied to the device without damaging the LED die and wirebond. It is not recommended that the device be operated at peak currents beyond the peak forward current listed in the Absolute Maxi- mum Ratings. 1.0 EMERALD GREEN ORANGE TA = 25 C Y SIT GREEN HIGH EFFICIENCY RED N E T E IN 0.5 V TI YELLOW A L E R 0 500 550 600 650 700 750 WAVELENGTH – nm Figure 1. Relative intensity vs. wavelength 4

T-13/ High Efficiency Red, Orange Diffused Lamps 4 Figure 2. Forward current vs. forward voltage Figure 3. Relative luminous intensity vs. Figure 4. Relative efficiency (luminous intensity per characteristics DC forward current unit current) vs. peak LED current Figure 5. Maximum tolerable peak current vs. Figure 6. Relative luminous intensity vs. angular displacement pulse duration. (IDC MAX as per MAX ratings) 5

T-13/ Yellow Diffused Lamps 4 Figure 7. Forward current vs. forward voltage Figure 8. Relative luminous intensity vs. Figure 9. Relative efficiency (luminous intensity per characteristics forward current unit current) vs. peak current Figure 10. Maximum tolerable peak current vs. Figure 11. Relative luminous intensity vs. angular displacement pulse duration. (IDC MAX as per MAX ratings) 6

T-13/ Green/Emerald Green Diffused Lamps 4 Figure 12. Forward current vs. forward voltage Figure 13. Relative luminous intensity vs. Figure 14. Relative efficiency (luminous intensity per characteristics DC forward current unit current) vs. peak LED current Figure 15. Maximum tolerable peak current vs. Figure 16. Relative luminous intensity vs. angular displacement pulse duration. (IDC MAX as per MAX ratings) 7

Intensity Bin Limits Intensity Range (mcd) Color Bin Min. Max. D 2.4 3.8 E 3.8 6.1 F 6.1 9.7 G 9.7 15.5 H 15.5 24.8 I 24.8 39.6 J 39.6 63.4 K 63.4 101.5 L 101.5 162.4 M 162.4 234.6 N 234.6 340.0 Red/Orange O 340.0 540.0 P 540.0 850.0 Q 850.0 1200.0 R 1200.0 1700.0 S 1700.0 2400.0 T 2400.0 3400.0 U 3400.0 4900.0 V 4900.0 7100.0 W 7100.0 10200.0 X 10200.0 14800.0 Y 14800.0 21400.0 Z 21400.0 30900.0 E 6.5 10.3 F 10.3 16.6 G 16.6 26.5 H 26.5 42.3 I 42.3 67.7 J 67.7 108.2 K 108.2 173.2 L 173.2 250.0 M 250.0 360.0 Yellow N 360.0 510.0 O 510.0 800.0 P 800.0 1250.0 Q 1250.0 1800.0 R 1800.0 2900.0 S 2900.0 4700.0 T 4700.0 7200.0 U 7200.0 11700.0 V 11700.0 18000.0 W 18000.0 27000.0 8

Intensity Bin Limits, continued Intensity Range (mcd) Color Bin Min. Max. D 4.7 7.6 E 7.6 12.0 F 12.0 19.1 G 19.1 30.7 H 30.7 49.1 I 49.1 78.5 J 78.5 125.7 K 125.7 201.1 L 201.1 289.0 Green M 289.0 417.0 N 417.0 680.0 O 680.0 1100.0 P 1100.0 1800.0 Q 1800.0 2700.0 R 2700.0 4300.0 S 4300.0 6800.0 T 6800.0 10800.0 U 10800.0 16000.0 V 16000.0 25000.0 W 25000.0 40000.0 Maximum tolerance for each bin limit is ±18%. Color Categories Lambda (nm) Color Category # Min. Max. 6 561.5 564.5 5 564.5 567.5 Green 4 567.5 570.5 3 570.5 573.5 2 573.5 576.5 1 582.0 584.5 3 584.5 587.0 Yellow 2 587.0 589.5 4 589.5 592.0 5 592.0 593.0 1 597.0 599.5 2 599.5 602.0 3 602.0 604.5 Orange 4 604.5 607.5 5 607.5 610.5 6 610.5 613.5 7 613.5 616.5 8 616.5 619.5 T olerance for each bin limit is ±0.5 nm. 9

Mechanical Option Matrix Mechanical Option Code Definition 00 Bulk Packaging, minimum increment 500 pcs/bag 01 Tape & Reel, crimped leads, minimum increment 1300 pcs/bag 02 Tape & Reel, straight leads, minimum increment 1300 pcs/bag B1 Right Angle Housing, uneven leads, minimum increment 500 pcs/bag B2 Right Angle Housing, even leads, minimum increment 500 pcs/bag DD Ammo Pack, straight leads with minimum increment 2K/pack R4 Tape & Reel, straight leads, counter clockwise, anode lead leaving the reel first Note: All categories are established for classification of products. Products may not be available in all categories. Please contact your local Avago repre- sentative for further clarification/information. 10

Precautions Lead Forming • The leads of an LED lamp may be preformed or cut to • Wave soldering parameter must be set and maintained length prior to insertion and soldering into PC board. according to recommended temperature and dwell time in the solder wave. Customer is advised to periodically • If lead forming is required before soldering, care must be check on the soldering profile to ensure the soldering taken to avoid any excessive mechanical stress induced profile used is always conforming to recommended to LED package. Otherwise, cut the leads of LED to length soldering condition. after soldering process at room temperature. The solder joint formed will absorb the mechanical stress of the • If necessary, use fixture to hold the LED component lead cutting from traveling to the LED chip die attach in proper orientation with respect to the PCB during and wirebond. soldering process. • It is recommended that tooling made to precisely form • Proper handling is imperative to avoid excessive thermal and cut the leads to length rather than rely upon hand stresses to LED components when heated. Therefore, operation. the soldered PCB must be allowed to cool to room temperature, 25°C, before handling. Soldering Conditions • Special attention must be given to board fabrication, • Care must be taken during PCB assembly and soldering solder masking, surface plating and lead holes size and process to prevent damage to LED component. component orientation to assure solderability. • The closest LED is allowed to solder on board is 1.59 mm below the body (encapsulant epoxy) for those parts • Recommended PC board plated through hole sizes for without standoff. LED component leads: • Recommended soldering conditions: LED Component Diagonal Plated Through- Lead Size Hole Diameter Manual Solder Lead size (typ.) 0.45 × 0.45 mm 0.636 mm 0.98 to 1.08 mm Wave Soldering Dipping (0.018 × 0.018 in.) (0.025 in) (0.039 to 0.043 in) Pre-heat Temperature 105 °C Max. – Dambar shear- 0.65 mm 0.919 mm Pre-heat Time 30 sec Max. – off area (max.) (0.026 in) (0.036 in) Peak Temperature 250 °C Max. 260 °C Max. Lead size (typ.) 0.50 × 0.50 mm 0.707 mm 1.05 to 1.15 mm (0.020 × 0.020 in.) (0.028 in) (0.041 to 0.045 in) Dwell Time 3 sec Max. 5 sec Max. Dambar shear- 0.70 mm 0.99 mm off area (max.) (0.028 in) (0.039 in) Note: Refer to application note AN1027 for more information on soldering LED components. TURBULENT WAVE LAMINAR WAVE BOTTOM SIDE 250 HOT AIR KNIFE OF PC BOARD TOP SIDE OF PC BOARD C 200 – E R CONVEYOR SPEED = 1.83 M/MIN (6 FT/MIN) U 150 PREHEAT SETTING = 150C (100C PCB) T A SOLDER WAVE TEMPERATURE = 245C ER FLUXING AIR KNIFE AIR TEMPERATURE = 390C P AIR KNIFE DISTANCE = 1.91 mm (0.25 IN.) M 100 AIR KNIFE ANGLE = 40 E T SOLDER: SN63; FLUX: RMA 50 NOTE: ALLOW FOR BOARDS TO BE 30 SUFFICIENTLY COOLED BEFORE EXERTING PREHEAT MECHANICAL FORCE. 0 10 20 30 40 50 60 70 80 90 100 TIME – SECONDS Figure 17. Recommended wave soldering profile For product information and a complete list of distributors, please go to our website: www.avagotech.com Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies in the United States and other countries. Data subject to change. Copyright © 2005-2015 Avago Technologies. All rights reserved. Obsoletes 5989-4258EN AV02-1558EN - March 30, 2015

Mouser Electronics Authorized Distributor Click to View Pricing, Inventory, Delivery & Lifecycle Information: B roadcom Limited: HLMP-3301 HLMP-3301-D0000 HLMP-3301-D0001 HLMP-3301-D0002 HLMP-3301-D00B2 HLMP-3301-F0001 HLMP-3301-F0002 HLMP-3301-F00B2 HLMP-3301-F00DD HLMP-3301-FG000 HLMP-3401 HLMP-3401-E0002 HLMP-3401-E00B2 HLMP-3507 HLMP-3507-D0001 HLMP-3507-D0002 HLMP-3507-D00B1 HLMP-3507-D00B2 HLMP-3507-EF000 HLMP-3762 HLMP-3762-G00B2 HLMP-3862 HLMP-3962 HLMP-3962-F0002 HLMP-3962- F00B2 HLMP-D401 HLMP-D401-EF0FH