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Datasheet下载- 型号： HL022R0BTTR
- 制造商： AVX
- 库位|库存： xxxx|xxxx
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HL022R0BTTR产品简介：
ICGOO电子元器件商城为您提供HL022R0BTTR由AVX设计生产，在icgoo商城现货销售，并且可以通过原厂、代理商等渠道进行代购。 提供HL022R0BTTR价格参考以及AVXHL022R0BTTR封装/规格参数等产品信息。 你可以下载HL022R0BTTR参考资料、Datasheet数据手册功能说明书， 资料中有HL022R0BTTR详细功能的应用电路图电压和使用方法及教程。
| 参数 | 数值 |
| 产品目录 | |
| DC电阻(DCR) | 168 毫欧最大 |
| 描述 | INDUCTOR 2NH 335MA 0402固定电感器 2.0nH |
| 产品分类 | |
| 品牌 | AVX |
| 产品手册 | |
| 产品图片 |
|
| rohs | 符合RoHS无铅 / 符合限制有害物质指令(RoHS)规范要求 |
| 产品系列 | 固定电感器,AVX HL022R0BTTRMLO™ |
| 数据手册 | |
| 产品型号 | HL022R0BTTR |
| Q最小值 | 26 |
| 不同频率时的Q值 | 26 @ 450MHz |
| 产品培训模块 | http://www.digikey.cn/PTM/IndividualPTM.page?site=cn&lang=zhs&ptm=25884 |
| 产品种类 | 固定电感器 |
| 供应商器件封装 | 0402（1005 公制） |
| 其它名称 | 478-6915-1 |
| 包装 | 剪切带 （CT） |
| 商标 | AVX |
| 商标名 | MLO |
| 外壳宽度 | 0.58 mm |
| 外壳长度 | 1 mm |
| 外壳高度 | 0.35 mm |
| 大小/尺寸 | 0.039" 长 x 0.023" 宽 （1.00mm x 0.58mm） |
| 安装类型 | 表面贴装 |
| 容差 | 0.1 nH |
| 封装 | Reel |
| 封装/外壳 | 0402（1005 公制） |
| 封装/箱体 | 0402 (1005 metric) |
| 屏蔽 | 无屏蔽 |
| 工作温度 | -55°C ~ 125°C |
| 工作温度范围 | - 55 C to + 125 C |
| 工厂包装数量 | 5000 |
| 最大直流电流 | 335 mA |
| 最大直流电阻 | 168 mOhms |
| 材料-磁芯 | - |
| 标准包装 | 1 |
| 特色产品 | http://www.digikey.com/product-highlights/cn/zh/avx-mlo-organic-inductors/1344 |
| 电感 | 2 nH |
| 电流-饱和值 | - |
| 端接类型 | SMD/SMT |
| 类型 | 多层 |
| 自谐振频率 | 10.85 GHz |
| 频率-测试 | 450MHz |
| 频率-自谐振 | 10.85GHz |
| 额定电流 | 335mA |
| 高度-安装（最大值） | 0.018" （0.45mm） |
PDF Datasheet 数据手册内容提取
MLO® Tight Tolerance Inductors The Multilayer Organic Tight Tolerance Inductor is a low profile organic based inductor that can support mobile communications, satellite applications, GPS, matching networks, and collision avoidance. The MLO® Tight Tolerance Inductor series of components are based on AVX’s patented multilayer organic technology (US patent 6,987,307). MLO® Tight Tolerance Inductors incorporate very low loss organic materials which allow for high Q and high stability over frequency. MLO® Tight Tolerance Inductors are surface mountable and are expansion matched to FR4 printed wiring boards. MLO® Tight Tolerance Inductors utilize fine line high density interconnect technology thereby allowing for tight tolerance control and high repeatability. Reliability testing is performed to JEDEC and mil standards. Finishes are available in RoHS compliant Sn. APPLICATIONS FEATURES SURFACE MOUNT ADVANTAGES • Mobile communications • Tight Tolerance • Satellite Applications • High Frequency • Inherent Low Profile • GPS • High Withstanding Voltage • Excellent Solderability • Collision Avoidance • Low DC Resistance • Low Parasitics • Wireless LAN’s • Surface Mountable • Better Heat Dissipation • 0402 Case Size • Expansion Matched to PCB • RoHS Compliant Finishes • Available in Tape and Reel HOW TO ORDER HL 02 XXX X T TR Style Size Inductance Tolerance Termination Packaging Tight 02 = 0402 Expressed in nH A = ±0.05nH Sn100 5000pcs Tolerance (2 significant digits + number of zeros) B = ±0.1nH T&R for values <10nH, G = ±2% letter R denotes decimal point. Example: 22nH = 220 4.7nH = 4R7 DIMENSIONS QUALITY INSPECTION mm (inches) Finished parts are 100% tested for electrical R parameters and visual characteristics. T B TERMINATION L RoHS compliant Sn finish. W OPERATING TEMPERATURE mm (inches) L W T R B -55ºC to +125ºC 1.00±0.10 0.58±0.075 0.35±0.10 0.125±0.050 0.23±0.0508 (0.040±0.004) (0.023±0.003) (0.014±0.004) (0.005±0.002) (0.0092±0.002) 212 032219
MLO® Tight Tolerance Inductors RECOMMENDED FOOTPRINT mm (inches) Case Size D1 D2 D3 D4 D5 0201 0.85 (0.033) 0.30 (0.012) 0.25 (0.010) 0.30 (0.012) 0.35 (0.014) D2 0402 1.70 (0.067) 0.60 (0.024) 0.50 (0.020) 0.60 (0.024) 0.50 (0.020) 0603 2.30 (0.091) 0.80 (0.031) 0.70 (0.028) 0.80 (0.031) 0.75 (0.030) 0805 3.00 (0.118) 1.00 (0.039) 1.00 (0.039) 1.00 (0.039) 1.25 (0.049) D1 D3 1206 4.00 (0.157) 1.00 (0.039) 2.00 (0.079) 1.00 (0.039) 1.60 (0.063) 1210 4.00 (0.157) 1.00 (0.039) 2.00 (0.079) 1.00 (0.039) 2.50 (0.098) 1808 5.60 (0.220) 1.00 (0.039) 3.60 (0.142) 1.00 (0.039) 2.00 (0.079) D4 1812 5.60 (0.220) 1.00 (0.039) 3.60 (0.142) 1.00 (0.039) 3.00 (0.118) 1825 5.60 (0.220) 1.00 (0.039) 3.60 (0.142) 1.00 (0.039) 6.35 (0.250) 2220 6.60 (0.260) 1.00 (0.039) 4.60 (0.181) 01.00 (0.039) 5.00 (0.197) D5 2225 6.60 (0.260) 1.00 (0.039) 4.60 (0.181) 1.00 (0.039) 6.35 (0.250) Component Pad Design • Pad width equal to component width. It is permissible to decrease this to as low as 85% of compo- Component pads should be designed to achieve good solder filets and minimize component movement nent width but it is not advisable to go below this. during reflow soldering. pad designs are given below for the most common sizes of multilayer ceramic • Pad overlap 0.5mm beneath component. capacitors for both wave and reflow soldering. The basis of these designs is: • Pad extension 0.5mm beyond components for relow and 1.0mm to wave soldering. 0402 ELECTRICAL SPECIFICATIONS Available L (nH) Inductance Tolerance Q Idc max Rdc max SRF min 450MHz A = ±0.05nH, B = ±0.1nH 450MHz (mA) (mΩ) (GHz) G = ±2% 0.8 ±0.05nH, ±0.1nH 15 450 100 7 0.9 ±0.05nH, ±0.1nH 15 450 100 7 1 ±0.05nH, ±0.1nH 15 420 100 7 1.1 ±0.05nH, ±0.1nH 15 410 100 7 1.2 ±0.05nH, ±0.1nH 15 410 110 7 1.3 ±0.05nH, ±0.1nH 15 295 13 7 1.5 ±0.05nH, ±0.1nH 15 295 150 7 1.6 ±0.05nH, ±0.1nH 15 230 150 7 1.8 ±0.05nH, ±0.1nH 15 295 160 7 2 ±0.05nH, ±0.1nH 15 230 18 7 2.2 ±0.05nH, ±0.1nH 15 230 200 7 2.4 ±0.05nH, ±0.1nH 15 230 200 7 2.7 ±0.05nH, ±0.1nH 15 230 250 7 3 ±0.05nH, ±0.1nH 15 200 300 7 3.3 ±0.05nH, ±0.1nH 15 200 340 7 3.6 ±0.05nH, ±0.1nH 15 180 350 7 3.9 ±0.05nH, ±0.1nH 15 180 400 7 4.7 ±0.1nH 15 170 480 7 5.6 ±0.1nH 15 150 500 7 6.8 ±0.1nH 15 140 600 7 8.2 ±0.1nH 15 115 800 6 10 ±2% 15 105 1000 5 12 ±2% 15 95 1100 4 15 ±2% 15 95 1200 4 18 ±2% 15 85 1500 3 22 ±2% 15 75 1900 3 27 ±2% 15 75 2100 3 30 ±2% 15 65 2200 2 32 ±2% 15 65 2200 2 Specifications based on performance of component assembled properly on printed circuit board with 50Ω nominal impedance. 213 050416