MLO® Tight Tolerance Inductors The Multilayer Organic Tight Tolerance Inductor is a low profile organic based inductor that can support mobile communications, satellite applications, GPS, matching networks, and collision avoidance. The MLO® Tight Tolerance Inductor series of components are based on AVX’s patented multilayer organic technology (US patent 6,987,307). MLO® Tight Tolerance Inductors incorporate very low loss organic materials which allow for high Q and high stability over frequency. MLO® Tight Tolerance Inductors are surface mountable and are expansion matched to FR4 printed wiring boards. MLO® Tight Tolerance Inductors utilize fine line high density interconnect technology thereby allowing for tight tolerance control and high repeatability. Reliability testing is performed to JEDEC and mil standards. Finishes are available in RoHS compliant Sn. APPLICATIONS FEATURES SURFACE MOUNT ADVANTAGES • Mobile communications • Tight Tolerance • Satellite Applications • High Frequency • Inherent Low Profile • GPS • High Withstanding Voltage • Excellent Solderability • Collision Avoidance • Low DC Resistance • Low Parasitics • Wireless LAN’s • Surface Mountable • Better Heat Dissipation • 0402 Case Size • Expansion Matched to PCB • RoHS Compliant Finishes • Available in Tape and Reel HOW TO ORDER HL 02 XXX X T TR Style Size Inductance Tolerance Termination Packaging Tight 02 = 0402 Expressed in nH A = ±0.05nH Sn100 5000pcs Tolerance (2 significant digits + number of zeros) B = ±0.1nH T&R for values <10nH, G = ±2% letter R denotes decimal point. Example: 22nH = 220 4.7nH = 4R7 DIMENSIONS QUALITY INSPECTION mm (inches) Finished parts are 100% tested for electrical R parameters and visual characteristics. T B TERMINATION L RoHS compliant Sn finish. W OPERATING TEMPERATURE mm (inches) L W T R B -55ºC to +125ºC 1.00±0.10 0.58±0.075 0.35±0.10 0.125±0.050 0.23±0.0508 (0.040±0.004) (0.023±0.003) (0.014±0.004) (0.005±0.002) (0.0092±0.002) 212 032219

MLO® Tight Tolerance Inductors RECOMMENDED FOOTPRINT mm (inches) Case Size D1 D2 D3 D4 D5 0201 0.85 (0.033) 0.30 (0.012) 0.25 (0.010) 0.30 (0.012) 0.35 (0.014) D2 0402 1.70 (0.067) 0.60 (0.024) 0.50 (0.020) 0.60 (0.024) 0.50 (0.020) 0603 2.30 (0.091) 0.80 (0.031) 0.70 (0.028) 0.80 (0.031) 0.75 (0.030) 0805 3.00 (0.118) 1.00 (0.039) 1.00 (0.039) 1.00 (0.039) 1.25 (0.049) D1 D3 1206 4.00 (0.157) 1.00 (0.039) 2.00 (0.079) 1.00 (0.039) 1.60 (0.063) 1210 4.00 (0.157) 1.00 (0.039) 2.00 (0.079) 1.00 (0.039) 2.50 (0.098) 1808 5.60 (0.220) 1.00 (0.039) 3.60 (0.142) 1.00 (0.039) 2.00 (0.079) D4 1812 5.60 (0.220) 1.00 (0.039) 3.60 (0.142) 1.00 (0.039) 3.00 (0.118) 1825 5.60 (0.220) 1.00 (0.039) 3.60 (0.142) 1.00 (0.039) 6.35 (0.250) 2220 6.60 (0.260) 1.00 (0.039) 4.60 (0.181) 01.00 (0.039) 5.00 (0.197) D5 2225 6.60 (0.260) 1.00 (0.039) 4.60 (0.181) 1.00 (0.039) 6.35 (0.250) Component Pad Design • Pad width equal to component width. It is permissible to decrease this to as low as 85% of compo- Component pads should be designed to achieve good solder filets and minimize component movement nent width but it is not advisable to go below this. during reflow soldering. pad designs are given below for the most common sizes of multilayer ceramic • Pad overlap 0.5mm beneath component. capacitors for both wave and reflow soldering. The basis of these designs is: • Pad extension 0.5mm beyond components for relow and 1.0mm to wave soldering. 0402 ELECTRICAL SPECIFICATIONS Available L (nH) Inductance Tolerance Q Idc max Rdc max SRF min 450MHz A = ±0.05nH, B = ±0.1nH 450MHz (mA) (mΩ) (GHz) G = ±2% 0.8 ±0.05nH, ±0.1nH 15 450 100 7 0.9 ±0.05nH, ±0.1nH 15 450 100 7 1 ±0.05nH, ±0.1nH 15 420 100 7 1.1 ±0.05nH, ±0.1nH 15 410 100 7 1.2 ±0.05nH, ±0.1nH 15 410 110 7 1.3 ±0.05nH, ±0.1nH 15 295 13 7 1.5 ±0.05nH, ±0.1nH 15 295 150 7 1.6 ±0.05nH, ±0.1nH 15 230 150 7 1.8 ±0.05nH, ±0.1nH 15 295 160 7 2 ±0.05nH, ±0.1nH 15 230 18 7 2.2 ±0.05nH, ±0.1nH 15 230 200 7 2.4 ±0.05nH, ±0.1nH 15 230 200 7 2.7 ±0.05nH, ±0.1nH 15 230 250 7 3 ±0.05nH, ±0.1nH 15 200 300 7 3.3 ±0.05nH, ±0.1nH 15 200 340 7 3.6 ±0.05nH, ±0.1nH 15 180 350 7 3.9 ±0.05nH, ±0.1nH 15 180 400 7 4.7 ±0.1nH 15 170 480 7 5.6 ±0.1nH 15 150 500 7 6.8 ±0.1nH 15 140 600 7 8.2 ±0.1nH 15 115 800 6 10 ±2% 15 105 1000 5 12 ±2% 15 95 1100 4 15 ±2% 15 95 1200 4 18 ±2% 15 85 1500 3 22 ±2% 15 75 1900 3 27 ±2% 15 75 2100 3 30 ±2% 15 65 2200 2 32 ±2% 15 65 2200 2 Specifications based on performance of component assembled properly on printed circuit board with 50Ω nominal impedance. 213 050416