High Current, High Frequency, Power Inductors HCP0704 Series Applications: HALOGEN HF • Voltage Regulator Module (VRM) (cid:129) Multi-phase regulators FREE (cid:129) Desktop and servers (cid:129) Base station equipment (cid:129) Notebook regulators (cid:129) Data networking and storage systems (cid:129) Point-of-load modules (cid:129) Battery power systems (cid:129) DCR sensing SMD Device Environmental Data: (cid:129) Storage temperature range:-40°C to +155°C Description: (cid:129) Operating temperature range:-40°C to +155°C (Range is application specific) (cid:129) Halogen free (cid:129) Solder reflow temperature:J-STD-020D compliant (cid:129) 155°C maximum total temperature operation (cid:129) 6.8 x 6.8 x 4.2mm surface mount package Packaging: (cid:129) Powder iron core material (cid:129) Supplied in tape-and-reel packaging,1000 parts per reel, (cid:129) Magnetically shielded,low EMI 13”diameter reel (cid:129) High temperature core material eliminates thermal aging issues (cid:129) High current carrying capacity,low core losses (cid:129) Controlled DCR tolerance for sensing circuits (cid:129) Inductance range from 0.40μH to 4.7μH (cid:129) Current range from 5.0 to 27 amps (cid:129) Frequency range up to 2MHz (cid:129) RoHS compliant Product Specifications Part Number6 OCL1± 25% (μH) FLL2Min. (μH) Irms3(Amps) Isat4@ 25°C (Amps) DCR (mΩ) @ 20°C K-factor5 HCP0704-R40-R 0.40 0.28 17 27 3.2 ±10% 383.1 HCP0704-R60-R 0.60 0.42 14 21 4.5 ±10% 313.5 HCP0704-1R0-R 1.00 0.7 12 17 6.2 ±10% 265.3 HCP0704-1R8-R 1.80 1.26 8.5 13 11.0 ±10% 202.8 HCP0704-2R3-R 2.30 1.56 7.5 11.5 16.5 ±10% 164.2 HCP0704-3R3-R 3.30 2.31 6.0 9.5 25.0 ±10% 149.9 HCP0704-4R7-R 4.70 3.29 5.0 8.0 29.5 ±10% 127.7 1 Open Circuit Inductance (OCL) Test Parameters:100kHz,0.10Vrms,0.0Adc 4 Isat:Peak current for approximately 20% rolloff at +25°C. 2 Full Load Inductance (FLL) Test Parameters:100kHz,0.1Vrms,Isat1 5 K-factor:Used to determine Bp-pfor core loss (see graph).Bp-p= K *L *ΔI:(Gauss),K:(K-factor 3 Irms:DC current for an approximate temperature rise of 40°C without core loss.Derating is from table),L:(inductance in μH),ΔI (peak-to-peak ripple current in amps). necessary for AC currents.PCB pad layout,trace thickness and width,air-flow and proximity of 6 Part Number Definition:HCP0704-xxx-R other heat generating components will affect the temperature rise.It is recommended the part (cid:129) HCP0704 = Product code and size temperature not exceed 155°C under worst case operating conditions verified in the end (cid:129) xxx= Inductance value in μH,R = decimal point.If no “R”is present,then application. third character = # of zeros (cid:129) “-R”suffix = RoHS compliant 0209 BU-SB09086 Page 1 of 4 Data Sheet:4348

DDiimmeennssiioonnss -- mmmm Top View Side View Bottom View Recommended Pad Layout Schematic HCP0704-R40 to 1R0= 4.20 max HCP0704-R40 to 2R3= 1.20 +/- 0.2 HCP0704-1R8 to 4R7= 4.00 max HCP0704-3R3 to 4R7= 1.00 +/- 0.2 7.60 6.80 Max 2.50(2x) 3.3±0.3 1 4 0 R 6.80 Max1 HCP07 xxx wwllyy 2 2 1 4.00(2x) 2 The nominal DCR test point is in the middle of the terminal Part Marking:HCP0704 xxx = Inductance value in μH.(R = Decimal point).If no “R”is present,then last character is # of zeros wwllyy = Date code R = Revision level Packaging Information - mm 1.5 Dia. 1.5 Dia 4.0 +0.1/-0.0 min. 2.0 A 1.75 Section A-A 1 7.5 16.0 7.50 HCxPx0x704 ±0.3 wwllyy R 2 A 6.9 User direction of feed HCP0704-R40 to 1R0= 4.2 HCP0704-1R8 to 4R7= 4.0 12.0 Supplied in tape-and-reel packaging,1000 parts per reel,13”diameter reel. Temperature Rise vs.Total Loss 60 50 ) C (° 40 e s Ri e r 30 u t a t e p m 20 e T 10 0 0 0.2 0.4 0.6 0.8 1 1.2 1.4 Total Loss (W) 0209 BU-SB09086 Page 2 of 4 Data Sheet:4348

Core Loss Core Loss vs. Bp-p 500kHz 100kHz 1MHz 250kHz 10 1 ) W ( s s o 0.1 L e r o C 0.01 0.001 10 100 1000 10000 Bp - p (Gauss) Inductance Characteristics % of OCL vs % of I sat 100% 80% 25°C L 60% C O f o % 40% 20% 0% 0% 20% 40% 60% 80% 100% 120% 140% 160% % of I sat 0209 BU-SB09086 Page 3 of 4 Data Sheet:4348

Solder Reflow Profile TP T -5°C TTaabbllee 11 -- SSttaannddaarrdd SSnnPPbb SSoollddeerr ((TTcc)) C Max. Ramp Up Rate = 3°C/s tP Volume Volume Max. Ramp Down Rate = 6°C/s Package mm3 mm3 T Thickness <350 >_350 L Preheat t <2.5mm 235°C 220°C A >_2.5mm 220°C 220°C T e smax atur TTaabbllee 22 -- LLeeaadd ((PPbb)) FFrreeee SSoollddeerr ((TTcc)) mper Tsmin Volume Volume Volume e t Package mm3 mm3 mm3 T s Thickness <350 350 - 2000 >2000 <1.6mm 260°C 260°C 260°C 1.6 – 2.5mm 260°C 250°C 245°C >2.5mm 250°C 245°C 245°C 25°C Time 25°C to Peak Time Reference JDEC J-STD-020D Profile Feature Standard SnPb Solder Lead (Pb) Free Solder Preheat and Soak (cid:129) Temperature min.(Tsmin) 100°C 150°C (cid:129) Temperature max.(Tsmax) 150°C 200°C (cid:129) Time (Tsminto Tsmax) (ts) 60-120 Seconds 60-120 Seconds Average ramp up rate Tsmaxto Tp 3°C/ Second Max. 3°C/ Second Max. Liquidous temperature (TL) 183°C 217°C Time at liquidous (tL) 60-150 Seconds 60-150 Seconds Peak package body temperature (TP)* Table 1 Table 2 Time (tp)** within 5 °C of the specified classification temperature (Tc) 20 Seconds** 30 Seconds** Average ramp-down rate (Tpto Tsmax) 6°C/ Second Max. 6°C/ Second Max. Time 25°C to Peak Temperature 6 Minutes Max. 8 Minutes Max. * Tolerance for peak profile temperature (Tp) is defined as a supplier minimum and a user maximum. ** Tolerance for time at peak profile temperature (tp) is defined as a supplier minimum and a user maximum. North America Europe Asia Pacific Cooper Electronic Technologies Cooper Bussmann Cooper Electronic Technologies Cooper Electronic Technologies Cooper Electronic Technologies 1225 Broken Sound Parkway NW P.O. Box 14460 Cooper (UK) Limited Avda. Santa Eulalia, 290 1 Jalan Kilang Timor Suite F St. Louis, MO 63178-4460 Burton-on-the-Wolds 08223 #06-01 Pacific Tech Centre Boca Raton, FL 33487-3533 Tel: 1-636-394-2877 Leicestershire • LE12 5TH UK Terrassa, (Barcelona), Spain Singapore 159303 Tel: 1-561-998-4100 Fax: 1-636-527-1607 Tel: +44 (0) 1509 882 737 Tel: +34 937 362 812 Tel: +65 278 6151 Fax: 1-561-241-6640 Fax: +44 (0) 1509 882 786 +34 937 362 813 Fax: +65 270 4160 Toll Free: 1-888-414-2645 Fax: +34 937 362 719 The only controlled copy of this Data Sheet is the electronic read-only version located on the Cooper Bussmann Network Drive. All other copies of this document are by definition uncon- trolled. This bulletin is intended to clearly present comprehensive product data and provide technical information that will help the end user with design applications. Cooper Bussmann reserves the right, without notice, to change design or construction of any products and to discontinue or limit distribution of any products. Cooper Bussmann also reserves the right to change or update, without notice, any technical information contained in this bulletin. Once a product has been selected, it should be tested by the user in all possible applications. Life Support Policy: Cooper Bussmann does not authorize the use of any of its products for use in life support devices or systems without the express written approval of an officer of the Company. Life support systems are devices which support or sustain life, and whose failure to perform, when properly used in accordance with instructions for use provided in the label- ing, can be reasonably expected to result in significant injury to the user. ©2009 Cooper Bussmann St.Louis, MO 63178 www.cooperbussmann.com 0209 BU-SB09086 Page 4 of 4 Data Sheet:4348