Effective July 2017 Technical Data 4133 Supersedes March 2007 HCF1305 High frequency, high current power inductors Applications • Next generation processors • High current DC-DC converters • VRM, multi-phase buck regulators • PC Workstations, Routers, Servers • Telecom soft switches • Base stations Environmental data • Storage temperature range (component): -40 °C to +125 °C Product features • Operating temperature range: -40 °C to +125 °C • 12.5 mm x 12.5 mm x 5.0 mm surface mount (ambient plus self-temperature rise) package • Solder reflow temperature: • Ferrite core material J-STD-020 (latest revision) compliant • Inductors designed for higher speed switch mode applications requiring low voltage and high Pb HHALOFGEN current FREE • Design utilizes ferrite core with high DC bias resistance and low core loss • Inductance range from 0.47 µH to 4.7 µH • Current range from 36.0 A to 10.4 A • Frequency range 100 kHz to 1 MHz

Technical Data 4133 HCF1305 Effective July 2017 High frequency, high current power inductors Product specifications Part Number Rated OCL (1) Irms (2) Isat (3) Isat2 (4) DCR DCR K-factor Inductance µH ±20% Amperes Amperes Amperes mΩ@20°C mΩ@20°C (5) (µH) (Typical) (Maximum) HCF1305-R47-R 0.47 0.47 32.0 36.0 30.0 0.83 1.00 21 HCF1305-R56-R 0.56 0.56 32.0 30.0 22.5 0.83 1.00 21 HCF1305-1R0-R 1.00 1.00 22.0 24.0 20.0 1.58 1.90 14 HCF1305-1R2-R 1.20 1.20 22.0 20.0 15.0 1.58 1.90 14 HCF1305-1R8-R 1.80 1.80 16.3 18.0 15.0 2.58 3.10 10 HCF1305-2R2-R 2.20 2.20 16.3 15.0 11.2 2.58 3.10 10 HCF1305-3R0-R 3.00 3.00 13.2 14.4 12.0 4.08 4.90 8.3 HCF1305-3R3-R 3.30 3.30 13.2 12.5 9.0 4.08 4.90 8.3 HCF1305-4R0-R 4.00 4.00 10.9 12.0 10.0 6.0 7.2 6.9 HCF1305-4R7-R 4.70 4.70 10.9 10.4 7.5 6.0 7.2 6.9 1)OCL: Open Circuit Inductance test parameters: 100 kHz, 0.1 Vrms, 0.0 Adc. OCL@-40 °C can 5) K-factor: Used to determine B p-p for core loss (see graph). B p-p = K*L*∆I be lower than OCL@+20 °C by 15% max. B p-p:(mT), K: (K factor from table), L: (Inductance in µH), ∆I (Peak to peak ripple current in 2)Irms: DC current for an approximate DT of 40 °C without core loss. Derating is necessary for Amps). AC currents. PCB layout, trace thickness and width, air-flow, and proximity of other heat generating components will affect the temperature rise. It is recommended that the Part number definition: temperature of the part not exceed +125 °C under worst case operating conditions verified in HCF1305-XXX-R the end application. HCF1305 = Product code and size 3) Isat1: Amperes Peak for approximately 30% rolloff (@+25 °C) XXX = Inductance value in uH. 4) Isat2: Amperes Peak for approximately 30% rolloff (@+125 °C) R = Decimal point. If no R is present, third character = #of zeros -R suffix indicates RoHS compliant Dimensions- mm TOP V IEW BOTTOM VI EW FRONT VIEW DIMENSION TABLE RECOMMENDED PCB LAYOUT SCHEMATIC A F L A:12.5max G:4.00 Re.f 1 2 C CB:: 51.20.m5maxax IH::35..0400 RReeff.. K 1 2 B D: 2.00 ref J: 4.00 Ref. G H HwCwFll1y3y0 R5-XXX 3 D EF:: 62..9400 ++//-- 00..3100 LK:: 43..040 R Reef.f. J wwllyy=Date code, R=Revision Level I I E Do not route traces or vias underneath the inductor Packaging information - mm 1.5 dia 4.0 +0.1/-0.0 1.5 dia 2.0 min A 1.75 11.5 B0 wwllyy-RHCF1305-XX +2/4-0.0.3 X K0 A A0 16.00 SECTION A-A A0= 12.60 mm B0= 12.60mm User direction of feed K0= 5.50 mm Parts packaged on a13"Diameter reel. 600parts per reel. 2 www.eaton.com/electronics

HCF1305 Technical Data 4133 High frequency, high current power inductor Effective July 2017 Temperature rise vs total loss 100 C) 80 º ( e s Ri 60 e r u 40 at r e p m 20 e T 0 0 0.4 0.8 1.2 1.6 2 Total Power Loss (W) Core loss vs Bp-p 10 500 kHz 1 MHz 300 kHz 1 200 kHz 100 kHz W) 0.1 ( s s o L re 0.01 o C 0.001 0.0001 1 10 100 1000 Bp-p (mT) Inductance characteristics Normalized Rolloff Curves at 25 Deg. C Normali Curves at 125 Deg. C 100.0% 100.0% 90.0% 90.0% 80.0% 80.0% %ofOCL 70.0% %ofOCL 7600..00%% R47, 1R0, 1R8 ,3R0 and 4R0 R47, 1R0, 1R8, 3R0 and 4R0 60.0% R56, 1R2 and2R2 R56, 1R2 and 2R2 50.0% 3R3 and 4R7 3R3 and 4R7 50.0% 40.0% 30.0% 40.0% 0.0% 20.0% 40.0% 60.0% 80.0% 100.0% 120.0% 140.0% 0.0% 20.0% 40.0% 60.0% 80.0% 100.0% 120.0% 140.0% %of ISAT2 %of ISAT1 www.eaton.com/electronics 3

Technical Data 4133 HCF1305 Effective July 2017 High frequency, high current power inductor Solder Reflow Profile TP T -5°C TTaabbllee 11 -- SSttaannddaarrdd SSnnPPbb SSoollddeerr ((TTcc)) C Max. Ramp Up Rate = 3°C/s tP Volume Volume Max. Ramp Down Rate = 6°C/s Package mm3 mm3 T Thickness <350 >_350 L Preheat t <2.5mm 235°C 220°C A >_2.5mm 220°C 220°C T e smax atur TTaabbllee 22 -- LLeeaadd ((PPbb)) FFrreeee SSoollddeerr ((TTcc)) mper Tsmin Volume Volume Volume e t Package mm3 mm3 mm3 T s Thickness <350 350 - 2000 >2000 <1.6mm 260°C 260°C 260°C 1.6 – 2.5mm 260°C 250°C 245°C >2.5mm 250°C 245°C 245°C 25°C Time 25°C to Peak Time Reference JDEC J-STD-020 Profile Feature Standard SnPb Solder Lead (Pb) Free Solder Preheat and Soak (cid:129)Temperature min.(Tsmin) 100°C 150°C (cid:129)Temperature max.(Tsmax) 150°C 200°C (cid:129)Time (Tsminto Tsmax) (ts) 60-120 Seconds 60-120 Seconds Average ramp up rate Tsmaxto Tp 3°C/ Second Max. 3°C/ Second Max. Liquidous temperature (TL) 183°C 217°C Time at liquidous (tL) 60-150 Seconds 60-150 Seconds Peak package body temperature (TP)* Table 1 Table 2 Time (tp)** within 5 °C of the specified classification temperature (Tc) 20 Seconds** 30 Seconds** Average ramp-down rate (Tpto Tsmax) 6°C/ Second Max. 6°C/ Second Max. Time 25°C to Peak Temperature 6 Minutes Max. 8 Minutes Max. *Tolerance for peak profile temperature (Tp) is defined as a supplier minimum and a user maximum. ** Tolerance for time at peak profile temperature (tp) is defined as a supplier minimum and a user maximum. Life Support Policy: Eaton does not authorize the use of any of its products for use in life support devices or systems without the express written approval of an officer of the Company. Life support systems are devices which support or sustain life, and whose failure to perform, when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in significant injury to the user. Eaton reserves the right, without notice, to change design or construction of any products and to discontinue or limit distribution of any products. Eaton also reserves the right to change or update, without notice, any technical information contained in this bulletin. Eaton Electronics Division 1000 Eaton Boulevard Cleveland, OH 44122 United States www.eaton.com/electronics © 2017 Eaton All Rights Reserved Eaton is a registered trademark. Printed in USA Publication No. 4133 All other trademarks are property July 2017 of their respective owners.