Effective December 2015 Technical Data DS4312 Supersedes December 2007 HC9 High current power inductors Applications • Multi-phase regulators • Voltage Regulator Modules (VRMs) • Distributed power systems DC-DC converters • Desktop and server VRMs and EVRDs • Point-of-Load (POL) modules • Field Programmable Gate Array (FPGA) DC-DC converters • Battery power systems • High current power supplies • Data networking and storage systems Product description Environmental data • Surface mount inductors designed for higher • Storage temperature range (component): -40°C speed switch mode applications requiring lower to +155°C inductance, low voltage and high current • Operating temperature range: -40°C to +155°C • Design utilizes high temperature powder iron (Ambient plus self-temperature rise) material with a non-organic binder to eliminate thermal aging • Solder reflow temperature: J-STD-020D compliant • Inductance Range from 0.2μH to 47.0μH • Current Range from 3.65 amps to 95.0 amps Pb • Frequency Range 1kHz to 500kHz

Technical Data DS4312 HC9 Effective December 2015 High current power inductors Product specifications lsat3 (amps) 20% lsat4 (amps) 30% DCR (mΩ) Part number6 OCL1 (μH) ±15% l 2 (amps) rolloff rolloff maximum @ 20°C Volt-μsec5 (V-μs) rms HC9-R20-R 0.218 46.7 65 95 0.50 2.87 HC9-R47-R 0.544 33.7 40 57 0.88 4.78 HC9-1R0-R 1.04 23.7 28 41 1.87 6.70 HC9-1R5-R 1.70 21.0 22 32 2.27 8.46 HC9-2R2-R 2.53 17.2 18 26 3.37 10.4 HC9-3R3-R 3.52 14.3 15 22 4.87 12.4 HC9-4R3-R 4.67 13.0 13.2 19.1 5.90 14.4 HC9-6R8-R 7.45 10.3 11.4 15.1 9.40 18.1 HC9-100-R 10.9 8.50 8.6 12.5 14.0 22.0 HC9-220-R 22.4 6.30 6.0 8.7 25.7 31.5 HC9-330-R 34.5 4.42 4.8 7.0 48.8 37.3 HC9-470-R 49.2 3.65 3.9 5.7 72.3 44.8 1. Open Circuit Inductance (OCL) Test Parameters: 100kHz, 1.0Vrms, 0.0Adc, @ +25°C 6. Part number definition: HC9-xxx-R 2. Irms: DC current for an approximately ∆T of 40°C without core loss. Derating is necessary for HC9= Product code and size AC currents. Pad layout, trace thickness and width, airflow, and proximity of other heat generating xxx = Inductance in μH. R = decimal point. If no R is present last character equals number of zeros. components will affect the temperature rise. It is recommended that the temperature of the part -R suffix = RoHS compliant not exceed 155°C under worst case conditions verified in the end application. 3. Peak current for approximately 20% rolloff @20°C 4. Peak current for approximately 30% rolloff @20°C 5. Applied Volt-Time product (V-μs) across the inductor. This value represents the applied V-μs at operating frequency necessary to generate additional core loss which contributes to the 40°C temperature rise. De-rating of the I is required to prevent excessive temperature rise. rms The 100% Vμs rating is equivalent to a ripple current Ip-p of 20% of Isat (30% rolloff option). Dimensions–mm HC9-xxx-R Part marking: HC9= (Product code and size)-xxx=(inductance value in uH, R= decimal point. If no R is present then last character equals number of zeros. wwlyly=date code, R=revision level Tolerances are ±0.2 millimeters unless stated otherwise Do not route traces or vias underneath the inductor Packaging information–mm Supplied in tape and reel packaging, 450 parts per reel, 13” diameter reel. HC9-xxx-R 2 www.eaton.com/elx

HC9 Technical Data DS4312 High current power inductors Effective December 2015 Rolloff Core loss www.eaton.com/elx 3

Technical Data DS4312 HC9 Effective December 2015 High current power inductors Solder reflow profile TP Table 1 - Standard SnPb Solder (Tc) TC -5°C Max. Ramp Up Rate = 3°C/s tP Volume Volume Package mm3 mm3 Max. Ramp Down Rate = 6°C/s Thickness <350 ≥350 TL <2.5mm) 235°C 220°C Preheat t ≥2.5mm 220°C 220°C A e Tsmax atur Table 2 - Lead (Pb) Free Solder (Tc) per Volume Volume Volume Tem Tsmin ts PThacickkangees s m<3m503 m35m03 - 2000 m>2m003 0 <1.6mm 260°C 260°C 260°C 1.6 – 2.5mm 260°C 250°C 245°C >2.5mm 250°C 245°C 245°C 25°C Time 25°C to Peak Time Reference JDEC J-STD-020D Profile Feature Standard SnPb Solder Lead (Pb) Free Solder Preheat and Soak • Temperature min. (Tsmin) 100°C 150°C • Temperature max. (Tsmax) 150°C 200°C • Time (Tsmin to Tsmax) (ts) 60-120 Seconds 60-120 Seconds Average ramp up rate Tsmax to Tp 3°C/ Second Max. 3°C/ Second Max. Liquidous temperature (Tl) 183°C 217°C Time at liquidous (tL) 60-150 Seconds 60-150 Seconds Peak package body temperature (TP)* Table 1 Table 2 Time (tp)** within 5 °C of the specified classification temperature (Tc) 20 Seconds** 30 Seconds** Average ramp-down rate (Tp to Tsmax) 6°C/ Second Max. 6°C/ Second Max. Time 25°C to Peak Temperature 6 Minutes Max. 8 Minutes Max. * Tolerance for peak profile temperature (Tp) is defined as a supplier minimum and a user maximum. ** Tolerance for time at peak profile temperature (tp) is defined as a supplier minimum and a user maximum. Life Support Policy: Eaton does not authorize the use of any of its products for use in life support devices or systems without the express written approval of an officer of the Company. Life support systems are devices which support or sustain life, and whose failure to perform, when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in significant injury to the user. Eaton reserves the right, without notice, to change design or construction of any products and to discontinue or limit distribution of any products. Eaton also reserves the right to change or update, without notice, any technical information contained in this bulletin. Eaton Electronics Division 1000 Eaton Boulevard Cleveland, OH 44122 United States www.eaton.com/elx © 2015 Eaton All Rights Reserved Eaton is a registered trademark. Printed in USA Publication No. DS4312 All other trademarks are property December 2015 of their respective owners.