Effective February 2017 Technical Data 4122 Supersedes October 2015 HC3 High current power inductors Applications • Distributed power systems DC-DC converters • General-purpose low voltage supplies • Computer systems • Servers • Point of Load (POL) converters • Industrial Equipment Environmental data • Storage temperature range (component): -40°C to +125°C • Operating temperature range: -40°C to +125°C Product description (ambient plus self-temperature rise) • Compact footprint • Solder reflow temperature: J-STD-020D compli- ant. • Designed for high density, high current/low voltage applications • Foil technology that adds higher reliability factor Packaging over the traditional magnet wire used for higher • Supplied in bulk packaging, 24 parts per tray frequency circuit designs • Inductance range from 0.50uH to 6.52uH Pb • Current range from 30 to 120 Amps • Ferrite core material

Technical Data 4122 HC3 Effective February 2017 High current power inductors Product specifications Part number5 OCL1 (μH) ±20% l 2 (amps) l 3 (amps) DCR (mΩ) maximum @ 20°C Volt-μsec4 (V-μs) ref. rms sat HC3-R50-R 0.50 78.00 120 0.42 17.33 HC3-1R0-R 1.05 78.00 78 0.42 17.33 HC3-2R2-R 2.05 55.50 60 0.70 26.01 HC3-3R3-R 3.63 42.45 46 1.20 34.65 HC3-4R7-R 4.98 33.80 38 2.17 43.30 HC3-5R6-R 5.68 33.80 34.5 2.17 43.30 HC3-6R0-R 6.52 33.80 30.0 2.17 43.30 1. OCL (Open Circuit Inductance) Test parameters: 300kHz, .25Vrms, 0.0ADC & Isat. 3. Peak current for approximately 30% rolloff (@20°C). 2. DC current for approximately ∆T of 40°C without core loss De-rating is necessary for AC currents. 4. Applied Volt-Time product (V-μs) across the inductor. This value represents the applied V-μs at 300kHz PCB layout, trace thickness and width, air flow and proximity of other heat generating components necessary to generate a core loss equal to 10% of the total losses for a 40°C temperature rise. will affect temperature rise. It is recommended that the temperature of the part not exceed 125°C 5. Part number definition - HC3-xxx-R: under worst case conditions verified in the end application. HC3 = Product code and size -xxx = Inductance value R = Decimal point (if no “R” is present, last character equals number of zeros ) -R Suffix = RoHS compliant Dimensions–mm RECOMMENDED TOP VIEW PCB PAD LAYOUT FRONT VIEW SCHEMATIC 14.5 typ 1 22.0 4.0 typ HT max HC3-xxx 30.0 max wwllyy R 2 5.50 19.0 5.50 3.0 typ 25.3 max Part number Height max HC3-R50-R 18.0 Part marking: HC3-xxx (-xxx= inductance value, R= decimal point, HC3-1R0-R 17.5 if no R is present then last character equals number of zeros) HC3-2R2-R 17.5 wwllyy= date code, R= Revision level HC3-3R3-R 17.5 HC3-4R7-R 17.5 HC3-5R6-R 17.5 HC3-6R0-R 17.5 2 www.eaton.com/electronics

HC3 Technical Data 4122 High current power inductors Effective February 2017 Inductance characteristics OCL vs Isat 100 90 80 70 L C60 O of50 % 40 30 20 10 0 0 10 20 30 40 50 60 70 80 90 100 110 120 130 %of Isat Core loss Irms DERATING WITH CORE LOSS for HC3 %Applied Volt-u Seconds 10 30 50 70 90 110 130 150 170 190 30 m n o o 40 fr ti d a fie plic 50 100kHz i c p 200kHz e a 60 p s e 300kHz l ms pp 70 400kHz i r r ofI ero 80 500kHz % z 90 100 www.eaton.com/electronics 3

Technical Data 4122 HC3 Effective February 2017 High current power inductors Solder reflow profile TP Table 1 - Standard SnPb Solder (Tc) TC -5°C Max. Ramp Up Rate = 3°C/s tP Volume Volume Package mm3 mm3 Max. Ramp Down Rate = 6°C/s Thickness <350 ≥350 TL <2.5mm) 235°C 220°C Preheat t ≥2.5mm 220°C 220°C A e Tsmax atur Table 2 - Lead (Pb) Free Solder (Tc) per Volume Volume Volume Tem Tsmin ts PThacickkangees s m<3m503 m35m03 - 2000 m>2m003 0 <1.6mm 260°C 260°C 260°C 1.6 – 2.5mm 260°C 250°C 245°C >2.5mm 250°C 245°C 245°C 25°C Time 25°C to Peak Time Reference JDEC J-STD-020D Profile Feature Standard SnPb Solder Lead (Pb) Free Solder Preheat and Soak • Temperature min. (Tsmin) 100°C 150°C • Temperature max. (Tsmax) 150°C 200°C • Time (Tsmin to Tsmax) (ts) 60-120 Seconds 60-120 Seconds Average ramp up rate Tsmax to Tp 3°C/ Second Max. 3°C/ Second Max. Liquidous temperature (Tl) 183°C 217°C Time at liquidous (tL) 60-150 Seconds 60-150 Seconds Peak package body temperature (TP)* Table 1 Table 2 Time (tp)** within 5 °C of the specified classification temperature (Tc) 20 Seconds** 30 Seconds** Average ramp-down rate (Tp to Tsmax) 6°C/ Second Max. 6°C/ Second Max. Time 25°C to Peak Temperature 6 Minutes Max. 8 Minutes Max. * Tolerance for peak profile temperature (Tp) is defined as a supplier minimum and a user maximum. ** Tolerance for time at peak profile temperature (tp) is defined as a supplier minimum and a user maximum. Life Support Policy: Eaton does not authorize the use of any of its products for use in life support devices or systems without the express written approval of an officer of the Company. Life support systems are devices which support or sustain life, and whose failure to perform, when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in significant injury to the user. Eaton reserves the right, without notice, to change design or construction of any products and to discontinue or limit distribution of any products. Eaton also reserves the right to change or update, without notice, any technical information contained in this bulletin. Eaton Electronics Division 1000 Eaton Boulevard Cleveland, OH 44122 United States www.eaton.com/electronics © 2017 Eaton All Rights Reserved Eaton is a registered trademark. Printed in USA Publication No. 4122 All other trademarks are property February 2017 of their respective owners.