Effective October 2015 Technical Data 4109 Supersedes August 2006 HC2 High current power inductors Applications • Distributed power systems DC-DC converters • General-purpose low voltage supplies • Computer systems • Servers • Point of Load (POL) converters • Industrial Equipment • Networking/Telecom power supplies Environmental data • Storage temperature range (component): - Product description 40°C to +125°C • Compact footprint • Operating temperature range: -40°C to +125°C (ambient + self-temperature rise). • Designed for high density, high current/low voltage applications • Solder reflow temperature: J-STD-020D compliant • Foil technology that adds higher reliability factor over the traditional magnet wire used for higher frequency circuit designs Pb • Frequency Range up to 1MHz

Technical Data 4109 HC2 Effective October 2015 High current power inductors Product specifications Part number DCR (Ω)4 Volt-μsec5 Part number (Tape and reel) OCL1 (μH) ±20% l 2 amps l 3 amps maximum @ 20°C (V-μs) rms sat HC2-R47-R HC2-R47TR-R .52 52.9 63.75 .0006 6.87 HC2-R68-R HC2-R68TR-R .63 52.9 50.00 .0006 6.87 HC2-1R0-R HC2-1R0TR-R 1.15 33.0 42.50 .0013 10.31 HC2-2R2-R HC2-2R2TR-R 2.00 24.3 31.90 .0023 13.75 HC2-4R7-R HC2-4R7TR-R 4.55 17.0 21.25 .0046 20.62 HC2-6R0-R HC2-6R0TR-R 6.00 17.0 16.50 .0046 20.62 1. Open Circuit Inductance Test Parameters: 300kHz, 0.250 Vrms, 0.0 Adc 3. Peak current for approximately 30% rolloff. 2. DC current for an approximate temperature change of 40°C without core loss. Derating is necessary 4. Values @ 20°C for AC currents. PCB layout, trace thickness and width, air-flow and proximity of other heat 5. Applied Volt-Time product (V-μs) across the inductor. This value represents the applied V-μs at generating components will affect the temperature rise. It is recommended that the temperature 300KHz neccessary to generate a core loss equal to 10% of the total losses for 40°C temperature rise. of the part not exceed 125°C under worst case operating conditions verified in the end application. Dimensions–mm TOP VIEW RECOMMENDED PCB PAD LAYOUT 10.00 1 HC2 - XXX 2 19.0 19.00 wwllyy R max 9.5 typ 5.50 5.50 19.2 max FRONT VIEW SCHEMATIC 1 12.7 max 2 3.5 2.3 typ typ Packaging information (mm) Bulk packaging: 45 parts per tray Tape and reel packaging: 110 parts per 13” diameter reel 1.5Dia +0.10 4.0 2.0Dia -0.00 2.0 min 1.75 A R0.5 ref 20.2 Ao= 19.3mm BKoo== 1129..39mmmm BBo HwCw2ll-yxyx xR +4/-000.4.1 +4/-400.0.3 A Ko Ao 32 SECTION A-A User direction of feed 2 www.eaton.com/elx

HC2 Technical Data 4109 High current power inductors Effective October 2015 Rolloff INDUCTANCE VERSUS SATURATION CURRENT 100 90 80 70 CL60 O of 50 % 40 30 20 10 0 0 20 40 60 80 100 120 140 160 180 200 % of ISAT Core loss IRMS DERATING WITH CORE LOSS 0 m)20 u40 m50 xi60 a m70 rms (80 1MHz 500KHz 300KHz200KHz 100KHz m I90 o92 r es f9954 s96 s o97 L of 98 % 99 10 20 30 40 50 60 80 100 200 300 400 500600 800 1000 % of Applied Volt-μ-Seconds www.eaton.com/elx 3

Technical Data 4109 HC2 Effective October 2015 High current power inductors Solder reflow profile TP Table 1 - Standard SnPb Solder (Tc) TC -5°C Max. Ramp Up Rate = 3°C/s tP Volume Volume Package mm3 mm3 Max. Ramp Down Rate = 6°C/s Thickness <350 ≥350 TL <2.5mm) 235°C 220°C Preheat t ≥2.5mm 220°C 220°C A e Tsmax atur Table 2 - Lead (Pb) Free Solder (Tc) per Volume Volume Volume Tem Tsmin ts PThacickkangees s m<3m503 m35m03 - 2000 m>2m003 0 <1.6mm 260°C 260°C 260°C 1.6 – 2.5mm 260°C 250°C 245°C >2.5mm 250°C 245°C 245°C 25°C Time 25°C to Peak Time Reference JDEC J-STD-020D Profile Feature Standard SnPb Solder Lead (Pb) Free Solder Preheat and Soak • Temperature min. (Tsmin) 100°C 150°C • Temperature max. (Tsmax) 150°C 200°C • Time (Tsmin to Tsmax) (ts) 60-120 Seconds 60-120 Seconds Average ramp up rate Tsmax to Tp 3°C/ Second Max. 3°C/ Second Max. Liquidous temperature (Tl) 183°C 217°C Time at liquidous (tL) 60-150 Seconds 60-150 Seconds Peak package body temperature (TP)* Table 1 Table 2 Time (tp)** within 5 °C of the specified classification temperature (Tc) 20 Seconds** 30 Seconds** Average ramp-down rate (Tp to Tsmax) 6°C/ Second Max. 6°C/ Second Max. Time 25°C to Peak Temperature 6 Minutes Max. 8 Minutes Max. * Tolerance for peak profile temperature (Tp) is defined as a supplier minimum and a user maximum. ** Tolerance for time at peak profile temperature (tp) is defined as a supplier minimum and a user maximum. Life Support Policy: Eaton does not authorize the use of any of its products for use in life support devices or systems without the express written approval of an officer of the Company. Life support systems are devices which support or sustain life, and whose failure to perform, when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in significant injury to the user. Eaton reserves the right, without notice, to change design or construction of any products and to discontinue or limit distribution of any products. Eaton also reserves the right to change or update, without notice, any technical information contained in this bulletin. Eaton Electronics Division 1000 Eaton Boulevard Cleveland, OH 44122 United States www.eaton.com/elx © 2015 Eaton All Rights Reserved Eaton is a registered trademark. Printed in USA Publication No. 4109 All other trademarks are property October 2015 of their respective owners.