GP1S092HCPIF GP1S092HCPIF SMT, Gap : 2mm, Slit : 0.3mm Phototransistor Output, Compact Transmissive Photointerrupter ■Description ■Agency approvals/Compliance GP1S092HCPIF is a compact-package, photo- 1. Compliant with RoHS directive transistor output, transmissive photointerrupter, with opposing emitter and detector in a molding that provides ■Applications non-contact sensing. The compact package series is 1. General purpose detection of object presence or a result of unique technology combing transfer and motion. injection molding. 2. Example: printer, lens control for camera This surface mount device has a shaped positioning pin to assure accurate PCB placement, of the emitter and detector. It is unique, because it is one of the few photointerrupters that comes in Tape and Reel packaging, for use with highly automated pick and place equipment. ■Features 1. Transmissive with phototransistor output 2. Highlights: • Compact Size • Positioning Pin “D” shaped to prevent misalignment • Surface Mount Type (SMT) • Tape and Reel (T&R) 2 000 pcs per reel 3. Key Parameters: • Gap Width : 2mm • Slit Width (detector side): 0.3mm • Package : 4.5×2.6×2.9 mm 4. RoHS directive compliant Notice The content of data sheet is subject to change without prior notice. In the absence of confi rmation by device specifi cation sheets, SHARP takes no responsibility for any defects that may occur in equipment using any SHARP devices shown in catalogs, data books, etc. Contact SHARP in order to obtain the latest device specifi cation sheets before using any SHARP device. Sheet No.: D3-A00201FEN 1 Date Oct. 3. 2005 © SHARP Corporation

GP1S092HCPIF ■Internal Connection Diagram Top view 2 1 1 Anode 2 Collector 3 Emitter 4 Cathode 3 4 ■Outline Dimensions (Unit : mm) Top view a' φ1.2MAX. (C0.3) a a-a' section 4.5±0.1 (0.3) 75) 2+−00..21 (C0.4) 2.6±0.1 Slit width 0. 0.1±0.7 ( C liegnhtte pra othf 0.1±9 Date (C0.3) 2. code m 0.1 +50.05− 0.8 0.5+−00..12 0.4 o 0 3.4 * 2 ott 0. b ckage 3R0.6±0.1 4 0.05±1− •• UDnimsepnesciiofi ends itno lpeararennceth sehsaisl l abree ±s h0o.2wmn mfor reference a 2 P • The dimensions indicated by ∗ refer to those measured from the lead base • The dimensions shown do not include those of burrs 2 1 1.2±0.05 • Leads coplanarity Difference of distance between package bottom and bottom side of each shall be MAX. 0.1mm • Coplanarity of the boss and gap of the device shall be 0.1mm • portion : No solder plating • The marking specifi cations are shown below Product mass : approx. 0.05g Plating material : SnCu (Cu : TYP. 2%) ■Details of positioning pin dimensions (Unit : mm) 2 0. 8 0. 5) 0.3 30˚ ( (0.08) 0.2 1.2±0.05 R0.6±0.1 0.2 30˚ 4 0.05±1 0. 0.05±1 0.4 08) 0. ( 0.2 Sheet No.: D3-A00201FEN 2

GP1S092HCPIF Date code (2 digit) 1st digit 2nd digit Year of production Month of production A.D. Mark Month Mark 2000 0 1 1 2001 1 2 2 2002 2 3 3 2003 3 4 4 2004 4 5 5 2005 5 6 6 2006 6 7 7 2007 7 8 8 2008 8 9 9 2009 9 10 X 2010 0 11 Y : : 12 Z repeats in a 10 year cycle Rank mark There is no rank indicator. Country of origin Japan Sheet No.: D3-A00201FEN 3

GP1S092HCPIF ■Absolute Maximum Ratings (Ta=25˚C) Parameter Symbol Rating Unit Forward current I 50 mA F Input Reverse voltage V 6 V R Power dissipation P 75 mW Collector-emitter voltage V 35 V CEO Emitter-collector voltage V 6 V Output ECO Collector current I 20 mA C Collector power dissipation P 75 mW C Total power dissipation P 100 mW tot Operating temperature Topr −25 to +85 ˚C Storage temperature Tstg −40 to +100 ˚C ∗1Soldering temperature T 260 ˚C sol ∗1 For 5s or less ■Electro-optical Characteristics (Ta=25˚C) Parameter Symbol Condition MIN. TYP. MAX. Unit Input Forward voltage VF IF=20mA − 1.2 1.4 V Reverse current IR VR=3V − − 10 μA Output Collector dark current ICEO VCE=20V − − 100 nA Transfer Collector current IC VCE=5V, IF=5mA 100 − 400 μA charac- Collector-emitter saturation voltage VCE(sat) IF=10mA, IC=40μA − − 0.4 V teristics Response time RFiaslel ttiimmee ttrf VCE=5V, IC=100μA, RL=1kΩ −− 5500 115500 μμss Sheet No.: D3-A00201FEN 4

GP1S092HCPIF Fig.1 Forward Current vs. Fig.2 Power Dissipation vs. Ambient Temperature Ambient Temperature 60 120 Ptot 50 100 W) m urrent I (mA)F 4300 on P, P, P (ctot 768500 P,P c Forward c 20 er dissipati 40 w 10 Po 20 15 0 0 (cid:13)25 0 25 50 75 85 100 −25 0 25 50 75 85 100 Ambient temperature Ta (˚C) Ambient temperature Ta (˚C) Fig.3 Forward Current vs. Forward Voltage Fig.4 Collector Current vs. Forward Current 1.1 100 1 VCE=5V Ta=25˚C 0.9 (cid:11)25˚C (cid:13)25˚C A) 0˚C A) 0.8 m (cid:11)50˚C m ward current I (F 10 (cid:11)75˚C ector current I (C 0000....7654 For Coll 0.3 0.2 0.1 1 0 0 0.3 0.6 0.9 1.2 1.5 1.8 2.1 2.4 2.7 3 0 2 4 6 8 10 12 14 16 18 20 Forward voltage VF (V) Forward current IF (mA) Fig.5 Collector Current vs. Fig.6 Relative Collector Current vs. Collector-emitter Voltage Ambient Temperature 3.3 120 3 Ta=25˚C 110 IF(cid:29)5mA VCE(cid:29)5V 2.7 100 Collector current I (mA)C 2211100.......4185296 IF=5ImF=A4II0FFm==32A00mmAAIIFF==1500mmAA Relative collector current (%) 9876543200000000 0.3 10 0 0 0 1 2 3 4 5 6 7 8 9 10 (cid:13)25 0 25 50 75 Collector-emitter voltage VCE (V) Ambient temperature Ta (˚C) Sheet No.: D3-A00201FEN 5

GP1S092HCPIF Fig.7 Collector-emitter Saturation Voltage vs. Fig.8 Collector Dark Current vs. Ambient Temperature Ambient Temperature 0.2 10(cid:13)6 V) IF(cid:29)10mA VCE(cid:29)20V e V (CE (sat) 00..1186 IC(cid:29)40(cid:77)A (A)O 10(cid:13)7 g E a C volt 0.14 nt I emitter saturation 00.0.10.218 ollector dark curre 1100(cid:13)(cid:13)98 or- C ect 0.06 oll C 0.04 10(cid:13)10 (cid:13)25 0 25 50 75 0 25 50 75 100 Ambient temperature Ta (˚C) Ambient temperature Ta (˚C) Fig.9 Response Time vs. Load Resistance Fig.10 Test Circuit for Response Time 1 000 VCE(cid:29)5V VCC IC(cid:29)100(cid:77)A Ta(cid:29)25˚C RD RL Output Input Input Output s)(cid:77) 100 tf 10% e ( m 90% e ti tr td ts ons tr tf p s Re 10 td ts 1 0.1 1 10 100 Load resistance RL (k(cid:55)) Fig.11 Detecting Position Characteristics (1) Fig.12 Detecting Position Characteristics (2) 100 100 IF=5mA IF=5mA 90 90 VCE=5V VCE=5V 80 80 %) L=0 L %) L=0 nt ( 70 nt ( 70 e e curr 60 curr 60 L ctor 50 ctor 50 e e coll 40 coll 40 e e v v ati 30 ati 30 el el R R 20 20 10 10 0 0 0 0.5 1 1.5 2 0 0.5 1 1.5 2 Shield moving distance L (mm) Shield moving distance L (mm) Remarks : Please be aware that all data in the graph are just for reference and not for guarantee. Sheet No.: D3-A00201FEN 6

GP1S092HCPIF ■Design Considerations ●Design guide 1) Prevention of detection error To prevent photointerrupter from faulty operation caused by external light, do not set the detecting face to the external light. 2) Position of opaque board Opaque board shall be installed at place 1.6mm or more from the top of elements. (Example) 1.6mm or more 1.6mm or more This product is not designed against irradiation and incorporates non-coherent IRED. ●Degradation In general, the emission of the IRED used in photointerrupter will degrade over time. In the case of long term operation, please take the general IRED degradation (50% degradation over 5 years) into the design consideration. ●Used parts This product is assembled using the below parts. • Photodetector (qty. : 1) Maximum Sensitivity Sensitivity Category Material Response time (μs) wavelength (nm) wavelength (nm) Phototransistor Silicon (Si) 930 700 to 1 200 20 • Photo emitter (qty. : 1) Maximum light emitting Category Material I/O Frequency (MHz) wavelength (nm) Infrared emitting diode Gallium arsenide (GaAs) 950 0.3 (non-coherent) • Material Case Lead frame Lead frame plating Black polyphernylene 42Alloy SnCu plating sulfi de resin (UL94 V-0) Sheet No.: D3-A00201FEN 7

GP1S092HCPIF ■Manufacturing Guidelines ●Storage and management after open Storage condition Storage temp.: 5 to 30˚C, Storage humidity : 70%RH or less at regular packaging. Treatment after opening the moisture-proof package After opening, you should mount the products while keeping them on the condition of 5 to 25˚C and 70%RH or less in humidity within 4 days. After opening the bag once even if the prolonged storage is necessary, you should mount the products within two weeks. And when you store the rest of products you should put into a DRY BOX. Otherwise after the rest of products and silicagel are sealed up again, you should keep them under the condition of 5 to 30˚C and 70%RH or less in humidity. Baking before mounting When the above-mentioned storage method could not be executed, please process the baking treatment before mounting the products. However the baking treatment is permitted within one time. Recommended condition : 125˚C, 16 to 24 hours ∗Do not process the baking treatment with the product wrapped. When the baking treatment processing, you should move the products to a metallic tray or fi x temporarily the products to substrate. Sheet No.: D3-A00201FEN 8

GP1S092HCPIF ●Soldering Method Refl ow Soldering: Refl ow soldering should follow the temperature profi le shown below. Soldering should not exceed the curve of temperature profi le and time. Please solder within one time. MAX 240˚C 1 to 4˚C/s 200˚C MAX 160˚C 1 to 4˚C/s 1 to 4˚C/s 25˚C MAX10s MAX60s MAX120s MAX90s Hand soldering Hand soldering should be completed within 3 s when the point of solder iron is below 350̊C. Please solder within one time. Please don't touch the terminals directly by soldering iron. Soldered product shall treat at normal temperature. Other notice Please take care not to let any external force exert on lead pins. Please test the soldering method in actual condition and make sure the soldering works fine, since the impact on the junction between the device and PCB varies depending on the cooling and soldering conditions. Lead terminals Lead terminals of this product are tin copper alloy plated. Before usage, please evaluate solderability with actual conditions and confi rm. And the uniformity in color for the lead terminals are not specifi ed. Sheet No.: D3-A00201FEN 9

GP1S092HCPIF ●Cleaning instructions Solvent cleaning : Solvent temperature should be 45˚C or below. Immersion time should be 3 minutes or less. Ultrasonic cleaning : Do not execute ultrasonic cleaning. Recommended solvent materials : Ethyl alcohol, Methyl alcohol and Isopropyl alcohol. ●Presence of ODC This product shall not contain the following materials. And they are not used in the production process for this product. Regulation substances : CFCs, Halon, Carbon tetrachloride, 1.1.1-Trichloroethane (Methylchloroform) Specifi c brominated fl ame retardants such as the PBBOs and PBBs are not used in this product at all. This product shall not contain the following materials banned in the RoHS Directive (2002/95/EC). •Lead, Mercury, Cadmium, Hexavalent chromium, Polybrominated biphenyls (PBB), Polybrominated diphenyl ethers (PBDE). Sheet No.: D3-A00201FEN 10

GP1S092HCPIF ■Package specifi cation Package materials Carrier tape : PS (with anti-static material) Cover tape : PET (three layer system) Reel : PS Package method 2 000 pcs of products shall be packaged in a reel. One reed with silicagel is endased in aluminum laminated bag. After sealing up the bag, it encased in one case (5 bags/case). Carrier tape structure and Dimensions M E K F G H J D C A B I N .X A L M˚5 5˚MAX. Dimensions List (Unit : mm) A B C D E F G 12±0.3 9.5+0.3 5.5±0.05 1.75±0.1 8±0.1 2±0.05 4±0.1 −0.2 H I J K L M N φ1 . 5 −+00.1 6.1±0.1 0.4±0.05 3.2±0.1 2.8±0.1 4.3±0.1 1.45±0.1 Reel structure and Dimensions e d g c Dimensions List (Unit : mm) a b c d 330±1 13±1 80±1 13±0.5 f e f g a b 21±1 2±0.5 2±0.5 Sheet No.: D3-A00201FEN 11

GP1S092HCPIF Direction of product insertion Model name and quantity shall be printed on the back side of the real Pull-out direction [Packing : 2 000pcs/reel] Storage method Storage conditions should follow the condition shown below. Storage temperature : 5 to 30˚C Storage hunidity : 70%RH or less Sheet No.: D3-A00201FEN 12

GP1S092HCPIF ■Important Notices · The circuit application examples in this publication with equipment that requires higher reliability such as: are provided to explain representative applications of --- Transportation control and safety equipment (i.e., SHARP devices and are not intended to guarantee any aircraft, trains, automobiles, etc.) circuit design or license any intellectual property rights. --- Traffi c signals SHARP takes no responsibility for any problems related --- Gas leakage sensor breakers to any intellectual property right of a third party resulting --- Alarm equipment from the use of SHARP's devices. --- Various safety devices, etc. (iii) SHARP devices shall not be used for or in · Contact SHARP in order to obtain the latest device connection with equipment that requires an extremely specification sheets before using any SHARP device. high level of reliability and safety such as: SHARP reserves the right to make changes in the --- Space applications specifi cations, characteristics, data, materials, structure, --- Telecommunication equipment [trunk lines] and other contents described herein at any time --- Nuclear power control equipment without notice in order to improve design or reliability. --- Medical and other life support equipment (e.g., Manufacturing locations are also subject to change scuba). without notice. · If the SHARP devices listed in this publication fall · Observe the following points when using any devices within the scope of strategic products described in the in this publication. SHARP takes no responsibility for Foreign Exchange and Foreign Trade Law of Japan, it damage caused by improper use of the devices which is necessary to obtain approval to export such SHARP does not meet the conditions and absolute maximum devices. ratings to be used specifi ed in the relevant specifi cation sheet nor meet the following conditions: · This publication is the proprietary product of SHARP (i) The devices in this publication are designed for use and is copyrighted, with all rights reserved. Under in general electronic equipment designs such as: the copyright laws, no part of this publication may be --- Personal computers reproduced or transmitted in any form or by any means, --- Offi ce automation equipment electronic or mechanical, for any purpose, in whole or in --- Telecommunication equipment [terminal] part, without the express written permission of SHARP. --- Test and measurement equipment Express written permission is also required before any --- Industrial control use of this publication may be made by a third party. --- Audio visual equipment --- Consumer electronics · Contact and consult with a SHARP representative (ii) Measures such as fail-safe function and redundant if there are any questions about the contents of this design should be taken to ensure reliability and safety publication. when SHARP devices are used for or in connection [H128] Sheet No.: D3-A00201FEN 13

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