GP1A52HRJ00F GP1A52HRJ00F Gap : 3mm, Slit : 0.5mm *OPIC Output Case package Transmissive Photointerrupter ■Description ■Agency approvals/Compliance GP1A52HRJ00F is a standard, OPIC output, trans- 1. Compliant with RoHS directive missive photointerrupter with opposing emitter and de- tector in a case, providing non-contact sensing. For this ■Applications family of devices, the emitter and detector are inserted in 1. General purpose detection of object presence or mo- a case, resulting in a through-hole design. tion. 2. Example : Printer, FAX, Optical storage unit ■Features 1. Transmissive with OPIC output 2. Highlights: • Vertical Slit for alternate motion detection • Output Low Level at intercepting optical path 3. Key Parameters: • Gap Width : 3mm • Slit Width (detector side) : 0.5mm • Package : 12.2×10×5mm 4. RoHS directive compliant * "OPIC"(Optical IC) is a trademark of the SHARP Corporation. An OPIC consists of a light-detecting element and a signal- processing Notice The content of data sheet is subject to change without prior notice. In the absence of confi rmation by device specifi cation sheets, SHARP takes no responsibility for any defects that may occur in equipment using any SHARP devices shown in catalogs, data books, etc. Contact SHARP in order to obtain the latest device specifi cation sheets before using any SHARP device. Sheet No.: D3-A03701FEN 1 Date Oct. 3. 2005 © SHARP Corporation

GP1A52HRJ00F ■Internal Connection Diagram Top view 1 Anode Amp 2 Cathode 3 2 3 VCC 4 VO 5 GND 4 1 (15kΩ) 5 Voltage regulator ■Outline Dimensions (Unit : mm) Top view 12.2±0.3 3+−00..21 5 25A Sharp mark “S” Model No. A-Aʼ er) B-Bʼ nt section ce section C1 0.5 A B 2.5Detctor 0.5 1.5 ( Date 5 E Model code 5 10 7. code 3. 2.5 AʼBʼ N. MI 5−0.4+−00..31 9 4−0.45+−00..31 (1.5) (9.2) (1.27) (1.27) 5 1 4 3 2 • Unspecified tolerance shall be as follows ; Dimensions(d) Tolerance d≤6 ±0.1 6<d≤18 ±0.2 • ( ) : Reference dimensions Product mass : approx. 0.7g Dip soldering material : Sn−3Ag−0.5Cu Sheet No.: D3-A03701FEN 2

GP1A52HRJ00F Date code Month of production Year of production Model code Month Mark (Christian year) 1 1 E Even year 2 2 e Odd year 3 3 4 4 5 5 6 6 7 7 8 8 9 9 10 X 11 Y 12 Z Country of origin Japan, Indonesia or Philippines (Indicated on the packing case) Sheet No.: D3-A03701FEN 3

GP1A52HRJ00F ■Absolute Maximum Ratings (Ta=25˚C) Parameter Symbol Rating Unit ∗1 Forward current I 50 mA F ∗1, 2Peak forward current I 1 A Input FM Reverse voltage V 6 V R Power dissipation P 75 mW Supply voltage VCC −0.5 to +17 V Output Output current I 50 mA O Power dissipation P 250 mW O Operating temperature Topr −25 to +85 ˚C Storage temperature Tstg −40 to +100 ˚C ∗3Soldering temperature T 260 ˚C sol ∗1 The derating factors of absolute maximum ratings due to ambient temperature are shown in Fig. 1, 2, 3 ∗2 Pulse width ≤ 100μs, Duty ratio=0.01 ∗3 For 5s or less ■Electro-optical Characteristics (Ta=25˚C) Parameter Symbol Condition MIN. TYP. MAX. Unit Input Forward voltage VF IF=5mA − 1.1 1.4 V Reverse current IR VR=3V − − 10 μA Operating supply voltage VCC − 4.5 − 17 V Low level output voltage VOL VCC=5V, IOL=16mA, IF=0 − 0.15 0.4 V Output High level output voltage VOH VCC=5V, IF=5mA 4.9 − − V Low level supply current ICCL VCC=5V, IF=0 − 1.7 3.8 mA High level supply current ICCH VCC=5V, IF=5mA − 0.7 2.2 mA ∗4 "Low→High" threshold input current IFLH VCC=5V − 1 5 mA Transfer ∗5 Hysteresis IFHL/IFLH VCC=5V 0.55 0.75 0.95 − charac- ∗me 6 "Low→High" Propagation delay time tPLH − 3 9 teristics once ti "RHisigeh t→imLeow" Propagation delay time tPtHrL VCC=5V, IF=5mA, RL=280Ω −− 05.1 01.55 μs p Res Fall time tf − 0.05 0.5 ∗4 I represents forward current when output goes from "Low" to "High". FLH ∗5 I represents forward current when output goes from "High" to "Low". FHL ∗6 Test circuit for response time is shown in Fig.12. Sheet No.: D3-A03701FEN 4

GP1A52HRJ00F Fig.1 Forward Current vs. Fig.2 Output Power Dissipation vs. Ambient Temperature Ambient Temperature 60 300 50 W) 250 m mA) 40 P (O 200 nt I (F ation Forward curre 2300 ut power dissip 115000 p 10 Out 50 0 0 −25 0 25 50 75 85 100 −25 0 25 50 75 85 100 Ambient temperature Ta (˚C) Ambient temperature T (C) a Fig.3 Low Level Output Current vs. Fig.4 Forward Current vs. Forward Voltage Ambient Temperature 60 Ta=75˚C 25˚C A) 50 50˚C 0˚C (mL A) 100 −25˚C ut current IO 4300 urrent I (mF p c ut d w level o 20 Forwar 10 o L 10 0 1 −20 0 25 50 75 85 100 0 0.5 1 1.5 2 2.5 3 3.5 Ambient temperature T (˚C) Foward voltage VF (V) a Fig.5 Relative Threshold Input Current vs. Fig.6 Relative Threshold Input Current vs. Supply Voltage Ambient Temperature 1.1 1.8 Ta=25˚C VCC=5V ,ILFLH 1 IFLH IaFtL VH=C1C=5V ,ILFLH 1.6 aIFt LTHa==125˚C H H F F urrent I 0.9 urrent I 1.4 IFLH c c 1.2 ut ut d inp 0.8 I d inp 1 IFHL ol FHL ol h h es 0.7 es hr hr 0.8 e t e t v v elati 0.6 elati 0.6 R R 0.5 0.4 0 5 10 15 20 25 −25 0 25 50 75 100 Supply voltage VCC (V) Ambient temperature Ta (˚C) Sheet No.: D3-A03701FEN 5

GP1A52HRJ00F Fig.7 Low Level Output Voltage vs. Fig.8 Low Level Output Voltage vs. Low Level Output Current Ambient Temperature 1 0.6 VCC=5V Ta=25˚C VCC=5V 0.5 V) V) (OL (OL V V e e 0.4 g g a a olt olt v v ut 0.1 ut 0.3 IOL=30mA p p ut ut o o el el 0.2 ev ev 16mA w l w l o o L L 0.1 5mA 0.01 0 1 2 5 10 20 50 100 −25 0 25 50 75 100 Low level output current IOL (mA) Ambient temperature Ta (˚C) Fig.9 Supply Current vs. Fig.10 Propagation Delay Time vs. Ambient Temperature Forward Current 3 12 VCC=5V RL=280Ω s) 10 Ta=25˚C tPHL μ (L mA) 2 VCC=17V , tHPH 8 Supply current I (CC 1 VCC=171V50VV ICCL gation delay time tPL 46 ICCH Propa 2 tPLH 10V 5V 0 0 −25 0 25 50 75 100 0 10 20 30 40 50 60 Ambient temperature T (˚C) Forward current I (mA) a F Fig.11 Rise Time,Fall Time vs. Fig.12 Test Circuit for Response Time Load Resistance 0.8 IF=5mA Voltage regulator Ta=25˚C Input +5V 0.7 VCC=5V 280Ω IF=5mA (15kΩ) e t, t(s)μrf 00..65 tZr=Ot=f=500.0Ω1μs47Ω Amp. 0.01OμuFtput m me, fall ti 00..43 tr GND se ti Input 50% Ri 0.2 0.1 tPLH tPHL t f V 90% OH 0 0.1 1 10 Output 10% 1.5V V OL Load resistance RL (kΩ) tr tf Remarks : Please be aware that all data in the graph are just for reference and not for guarantee. Sheet No.: D3-A03701FEN 6

GP1A52HRJ00F ■Design Considerations ●Recommended operating conditions Parameter Symbol MIN. TYP. MAX. Unit Output current IO − − 16 mA Forward current IF 10 − 20 mA Operating terperature Topr 0 − 70 ˚C ●Notes about static electricity Transisiter of detector side in bipolar confi guration may be damaged by static electricity due to its minute design. When handing these devices, general countermeasure against static electricity should be taken to avoid breakdown of devices or degradation of characteristics. ●Design guide 1) Prevention of detection error To prevent photointerrupter from faulty operation caused by external light, do not set the detecting face to the external light. 2) In order to stabilize power supply line, connect a by-pass capacitor of more than 0.01μF between V and CC GND near the device. 3) Position of opaque board Opaque board shall be installed at place 4mm or more from the top of elements. (Example) 4mm or more This product is not designed against irradiation and incorporates non-coherent IRED. ●Degradation In general, the emission of the IRED used in photocouplers will degrade over time. In the case of long term operation, please take the general IRED degradation (50% degradation over 5 years) into the design consideration. Sheet No.: D3-A03701FEN 7

GP1A52HRJ00F ●Parts This product is assembled using the below parts. • Photodetector (qty. : 1) [Using a silicon photodiode as light detecting portion, and a bipolar IC as signal processing circuit] Maximum Sensitivity Sensitivity Category Response time (μs) wavelength (nm) wavelength (nm) Photodiode 900 400 to 1 200 3 • Photo emitter (qty. : 1) Maximum light emitting Category Material I/O Frequency (MHz) wavelength (nm) Infrared emitting diode Gallium arsenide (GaAs) 950 0.3 (non-coherent) • Material Case Lead frame plating Black NORYL resin Solder dip. (Sn−3Ag−0.5Cu) • Others Laser generator is not used. Sheet No.: D3-A03701FEN 8

GP1A52HRJ00F ■Manufacturing Guidelines ●Soldering Method Flow Soldering: Soldering should be completed below 260˚C and within 5 s. Please take care not to let any external force exert on lead pins. Please don't do soldering with preheating, and please don't do soldering by refl ow. Hand soldering Hand soldering should be completed within 3 s when the point of solder iron is below 350̊C. Please solder within one time. Please don't touch the terminals directly by soldering iron. Soldered product shall treat at normal temperature. Other notice Please test the soldering method in actual condition and make sure the soldering works fine, since the impact on the junction between the device and PCB varies depending on the cooling and soldering conditions. Flux Some fl ux, which is used in soldering, may crack the package due to synergistic effect of alcohol in fl ux and the rise in temperature by heat in soldering. Therefore, in using fl ux, please make sure that it does not have any infl uence on appearance and reliability of the photointerrupter. Sheet No.: D3-A03701FEN 9

GP1A52HRJ00F ●Cleaning instructions Solvent cleaning : Solvent temperature should be 45˚C or below. Immersion time should be 3 minutes or less. Ultrasonic cleaning : The effect to device by ultrasonic cleaning differs by cleaning bath size, ultrasonic power output, cleaning time, PCB size or device mounting condition etc. Please test it in actual using condition and confi rm that doesn't occur any defect before starting the ultrasonic cleaning. Recommended solvent materials : Ethyl alcohol, Methyl alcohol and Isopropyl alcohol. ●Presence of ODC This product shall not contain the following materials. And they are not used in the production process for this product. Regulation substances : CFCs, Halon, Carbon tetrachloride, 1.1.1-Trichloroethane (Methylchloroform) Specifi c brominated fl ame retardants such as the PBBOs and PBBs are not used in this product at all. This product shall not contain the following materials banned in the RoHS Directive (2002/95/EC). •Lead, Mercury, Cadmium, Hexavalent chromium, Polybrominated biphenyls (PBB), Polybrominated diphenyl ethers (PBDE). Sheet No.: D3-A03701FEN 10

GP1A52HRJ00F ■Package specifi cation ●Case package Package materials Anti-static plastic bag : Polyethtylene Moltopren : Urethane Partition : Corrugated fi berboard Packing case : Corrugated fi berboard Package method 100 pcs of products shall be packaged in a plastic bag, Ends shall be fi xed by stoppers. The bottom ot the packing case is covered with moltopren, and the partition is set in the packing case. Each partition should have 1 plastic bag. The 10 plastic bags containing a product are put in the packing case. Moltopren should be located after all product are settled (1 packing contains 1 000 pcs). Packing composition Moltopren Partition Anti-static plastic bag Packing case Sheet No.: D3-A03701FEN 11

GP1A52HRJ00F ■Important Notices · The circuit application examples in this publication with equipment that requires higher reliability such as: are provided to explain representative applications of --- Transportation control and safety equipment (i.e., SHARP devices and are not intended to guarantee any aircraft, trains, automobiles, etc.) circuit design or license any intellectual property rights. --- Traffi c signals SHARP takes no responsibility for any problems related --- Gas leakage sensor breakers to any intellectual property right of a third party resulting --- Alarm equipment from the use of SHARP's devices. --- Various safety devices, etc. (iii) SHARP devices shall not be used for or in · Contact SHARP in order to obtain the latest device connection with equipment that requires an extremely specification sheets before using any SHARP device. high level of reliability and safety such as: SHARP reserves the right to make changes in the --- Space applications specifi cations, characteristics, data, materials, structure, --- Telecommunication equipment [trunk lines] and other contents described herein at any time --- Nuclear power control equipment without notice in order to improve design or reliability. --- Medical and other life support equipment (e.g., Manufacturing locations are also subject to change scuba). without notice. · If the SHARP devices listed in this publication fall · Observe the following points when using any devices within the scope of strategic products described in the in this publication. SHARP takes no responsibility for Foreign Exchange and Foreign Trade Law of Japan, it damage caused by improper use of the devices which is necessary to obtain approval to export such SHARP does not meet the conditions and absolute maximum devices. ratings to be used specifi ed in the relevant specifi cation sheet nor meet the following conditions: · This publication is the proprietary product of SHARP (i) The devices in this publication are designed for use and is copyrighted, with all rights reserved. Under in general electronic equipment designs such as: the copyright laws, no part of this publication may be --- Personal computers reproduced or transmitted in any form or by any means, --- Offi ce automation equipment electronic or mechanical, for any purpose, in whole or in --- Telecommunication equipment [terminal] part, without the express written permission of SHARP. --- Test and measurement equipment Express written permission is also required before any --- Industrial control use of this publication may be made by a third party. --- Audio visual equipment --- Consumer electronics · Contact and consult with a SHARP representative (ii) Measures such as fail-safe function and redundant if there are any questions about the contents of this design should be taken to ensure reliability and safety publication. when SHARP devices are used for or in connection [H162] Sheet No.: D3-A03701FEN 12