GDZ8V2BLP3 ULTRA-SMALL LEADLESS SURFACE MOUNT ZENER DIODE Features Mechanical Data • Ultra-Small Leadless Surface Mount Package (0.6 x 0.3mm) • Case: X3-DFN0603-2 • Ultra-Low Profile Package (0.3mm) • Case Material: Molded Plastic, “Green” Molding Compound. • Ideally Suited for Automated Assembly Processes UL Flammability Classification Rating 94V-0 • Low Leakage Current, Suitable for Battery-Powered Applications • Moisture Sensitivity: Level 1 per J-STD-020 N • Lead Free By Design/RoHS Compliant (Note 1) • Terminal Connections: Cathode Bar O • Halogen and Antimony Free "Green" Device (Notes 2 & 3) • Terminals: Finish − Matte Tin over Copper leadframe. I T • Qualified to AEC-Q101 Standards for High Reliability Solderable per MIL-STD-202, Method 208 A • Weight: 0.2 mg (Approximate) M R O F N I E C N A V D A Top View Bottom View Ordering Information (Note 4) Part Number Case Packaging GDZ8V2BLP3-7 X3-DFN0603-2 10,000/Tape & Reel Notes: 1. Fully EU Directive 2002/95/EC (RoHS) & 2011/65/EU (RoHS 2) compliant. No purposely added lead. Halogen and Antimony free 2. Halogen and Antimony free "Green” products are defined as those which contain <900ppm bromine, <900ppm chlorine (<1500ppm total Br + Cl) and <1000ppm antimony compounds. 3. Diodes Inc.'s "Green" policy can be found on our website at http://www.diodes.com. 4. For packaging details, go to our website at http://www.diodes.com. Marking Information xx = Product Marking Code (See Electrical Characteristics Table) Line Denotes Cathode Side GDZ8V2BLP3 1 of 4 February 2012 Document number: DS35772 Rev. 1 - 2 www.diodes.com © Diodes Incorporated

GDZ8V2BLP3 Thermal Characteristics Characteristic Symbol Value Unit Power Dissipation (Note 5) TA = 25°C PD 250 mW Thermal Resistance, Junction to Ambient Air (Note 5) TA = 25°C RθJA 500 °C/W Operating and Storage Temperature Range TJ, TSTG -55 to +150 °C N Electrical Characteristics O @TA = 25°C unless otherwise specified I T Maximum A Zener Voltage Range Reverse M Type Marking (Note 6) Current Number Code (Note 6) R O VZ @ IZT IZT IR @ VR Nom (V) Min (V) Max (V) mA μA V F GDZ8V2BLP3 KI, KR 8.2 7.995 8.405 5 0.5 5.0 N I Notes: 5. Device mounted on FR-4 PCB with minimum recommended pad layout, as shown in Diodes Incorporated’s Suggested Pad Layout document, which can be found on our website at http://www.diodes.com. E 6. Short duration pulse test used to minimize self-heating effect. C N A V 0.30 A) 1,000 m D T ( A 0.25 Note 5 N W) RRE 100 N ( CU O 0.20 D ATI AR 10 P W SSI 0.15 OR DI F R S 1 E U W 0.10 O O E P N P, D NTA 0.1 0.05 A T S N 0 , IF 0.01 0 25 50 75 100 125 150 I 0.2 0.4 0.6 0.8 1.0 1.2 TA, AMBIENT TEMPERATURE (°C) VF, INSTANTANEOUS FORWARD VOLTAGE (V) Fig. 1 Power Derating Curve Fig. 2 Typical Forward Characteristics 10 20 f = 1MHz F) mA) 1 E (p 15 T ( NC N A E T R CI UR 0.1 PA 10 C A R C E L N A E OT Z I, Z 0.01 C, TT 5 0.001 0 7.0 7.5 8.0 8.5 9.0 9.5 10 0 1 2 3 4 5 V , ZENER VOLTAGE (V) V , REVERSE VOLTAGE (V) Z R Fig. 3 Typical Zener Breakdown Characteristics Fig. 4 Typical Total Capacitance GDZ8V2BLP3 2 of 4 February 2012 Document number: DS35772 Rev. 1 - 2 www.diodes.com © Diodes Incorporated

GDZ8V2BLP3 Package Outline Dimensions A N X3-DFN0603-2 O Dim Min Max Typ I A1 (2x) A 0.27 0.35 0.30 T A1 0.00 0.03 0.02 A M D b 0.19 0.29 0.24 e D 0.595 0.645 0.62 R E 0.295 0.345 0.32 O e - - 0.355 F L 0.14 0.24 0.19 N E b (2x) All Dimensions in mm I E C N L (2x) A V D A Suggested Pad Layout Z C Dimensions Value (in mm) C 0.355 Y (2x) X 0.230 Y 0.300 Z 0.610 X (2x) GDZ8V2BLP3 3 of 4 February 2012 Document number: DS35772 Rev. 1 - 2 www.diodes.com © Diodes Incorporated

GDZ8V2BLP3 IMPORTANT NOTICE DIODES INCORPORATED MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARDS TO THIS DOCUMENT, INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION). Diodes Incorporated and its subsidiaries reserve the right to make modifications, enhancements, improvements, corrections or other changes N without further notice to this document and any product described herein. Diodes Incorporated does not assume any liability arising out of the O application or use of this document or any product described herein; neither does Diodes Incorporated convey any license under its patent or trademark rights, nor the rights of others. Any Customer or user of this document or products described herein in such applications shall assume I T all risks of such use and will agree to hold Diodes Incorporated and all the companies whose products are represented on Diodes Incorporated A website, harmless against all damages. M Diodes Incorporated does not warrant or accept any liability whatsoever in respect of any products purchased through unauthorized sales channel. R Should Customers purchase or use Diodes Incorporated products for any unintended or unauthorized application, Customers shall indemnify and O hold Diodes Incorporated and its representatives harmless against all claims, damages, expenses, and attorney fees arising out of, directly or F indirectly, any claim of personal injury or death associated with such unintended or unauthorized application. N I Products described herein may be covered by one or more United States, international or foreign patents pending. Product names and markings E noted herein may also be covered by one or more United States, international or foreign trademarks. C LIFE SUPPORT N A Diodes Incorporated products are specifically not authorized for use as critical components in life support devices or systems without the express V written approval of the Chief Executive Officer of Diodes Incorporated. As used herein: D A A. Life support devices or systems are devices or systems which: 1. are intended to implant into the body, or 2. support or sustain life and whose failure to perform when properly used in accordance with instructions for use provided in the labeling can be reasonably expected to result in significant injury to the user. B. A critical component is any component in a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or to affect its safety or effectiveness. Customers represent that they have all necessary expertise in the safety and regulatory ramifications of their life support devices or systems, and acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any use of Diodes Incorporated products in such safety-critical, life support devices or systems, notwithstanding any devices- or systems-related information or support that may be provided by Diodes Incorporated. Further, Customers must fully indemnify Diodes Incorporated and its representatives against any damages arising out of the use of Diodes Incorporated products in such safety-critical, life support devices or systems. Copyright © 2012, Diodes Incorporated www.diodes.com GDZ8V2BLP3 4 of 4 February 2012 Document number: DS35772 Rev. 1 - 2 www.diodes.com © Diodes Incorporated

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