MOS FET Relays G3VM-61B1/E1 Analog-switching MOS FET Relays for High Switching Currents, with Dielectric Strength of 2.5 kVAC between I/O. (cid:127)Upgraded G3VM-61 B/E Series. (cid:127)Switches minute analog signals. (cid:127)Leakage current of 1 µA max. when output relay is open. RoHS compliant .! ■Application Examples Note: The actual product is marked differently from the image shown here. (cid:127)Measurement devices (cid:127)Security systems (cid:127)Amusement machines ■List of Models Contact form Terminals Load voltage (peak value) Model Number per stick Number per tape SPST-NO PCB terminals 60 VAC G3VM-61B1 50 --- Surface-mounting G3VM-61E1 terminals G3VM-61E1(TR) --- 1,500 ■Dimensions Note: All units are in millimeters unless otherwise indicated. G3VM-61B1 7.12±0.25 G3VM-61E1 7.12±0.25 6.4±0.25 6.4±0.25 0.8±0.25 7.62±0.25 7.62±0.25 3.65+−00..2155 3.65+−00..2155 1.0 4.0+−00..225 0.25+−00..015 min. Note: Tilysh fmero aamrck tetuhdae ld ipmifrfoeadrgeuenc tt- 2.5 min. 0.5±10..12±0.15 7.85 to 8.80 Note: Tilysh fmero aamrck tetuhdae ld ipmifrfoeadrgeuenc tt- 2.54±0.215.2±0.15 10.0 max. 1.0 min. shown here. 2.54±0.25 Weight: 0.38 g shown here. Weight: 0.38 g ■Terminal Arrangement/Internal Connections (Top View) G3VM-61B1 G3VM-61E1 6 5 4 6 5 4 1 2 3 1 2 3 ■PCB Dimensions (Bottom View) ■Actual Mounting Pad Dimensions (Recommended Value, Top View) G3VM-61B1 Six 0.8-dia. holes 2.54 (0.61) G3VM-61E1 2.54 2.54 2.54 8.3 to 8.8 (0.61) (1.52) (1.52) 1.3 1.5 12

G3VM-61B1/E1 G3VM-61B1/E1 ■Absolute Maximum Ratings (Ta = 25°C) Item Symbol Rating Unit Measurement Conditions Input LED forward current IF 50 mA Note: 1. Touhtep udti ewleacstr icch setcreknegdt hb yb eatpwpelyeinn gth veo ilntapguet abned- Repetitive peak LED forward IFP 1 A 100 µs pulses, 100 pps tween all pins as a group on the LED side and current all pins as a group on the light-receiving side. LraEteD forward current reduction ∆ IF/°C −0.5 mA/°C Ta ≥ 25°C Connection Diagram LED reverse voltage VR 5 V Connection temperature Tj 125 °C 1 6 Load Output Output dielectric strength VOFF 60 V ConnAection 2 5 o r DACC 3 4 Continuous Connection A IO 500 mA load current Connection B 500 Connection C 1,000 1 6 Load OrreaNdteu ccutirorenn t CCoonnnneeccttiioonn AB ∆ ION/°C −−55 mA/°C Ta ≥ 25°C ConnBection 23 54 DC Connection C −10.0 Connection temperature Tj 125 °C Dielectric strength between input and VI-O 2,500 Vrms AC for 1 min 1 6 Load output (See note 1.) Connection 2 5 DC Operating temperature Ta −40 to +85 °C With no icing or condensation C 3 4 Storage temperature Tstg −55 to +125 °C With no icing or condensation Soldering temperature (10 s) --- 260 °C 10 s ■Electrical Characteristics (Ta = 25°C) Item Symbol Mini- Typical Maxi- Unit Measurement mum mum conditions Input LED forward voltage VF 1.0 1.15 1.3 V IF = 10 mA Note: 2. TTuimrne-sON and Turn-OFF Reverse current IR --- --- 10 µA VR = 5 V Capacity between terminals CT --- 30 --- pF V = 0, f = 1 MHz IF 1 6 RL VDD Trigger LED forward current IFT --- 1.6 3 mA IO = 500 mA 2 4 VOUT Output Maximum resistance Connection A RON --- 1 2 Ω IF = 5 mA, with output ON IO = 500 mA Connection B --- 0.5 1 Ω IF = 5 mA, IO = 500 mA IF Connection C --- 0.25 --- Ω IF = 5 mA, Copuerrnent leakage when the relay is ILEAK --- --- 1.0 µA IVOO =F F1 =,0 6000 Vm A VOUTtON 10% 9t0O%FF Capacity between I/O terminals CI-O --- 0.8 --- pF f = 1 MHz, Vs = 0 V Insulation resistance RI-O 1,000 --- --- MΩ VI-O = 500 VDC, RoH ≤ 60% Turn-ON time tON --- 0.8 2.0 ms IF = 5 mA, RL = 200 Ω, Turn-OFF time tOFF --- 0.1 0.5 ms VDD = 20 V (See note 2.) ■Recommended Operating Conditions Use the G3VM under the following conditions so that the Relay will operate properly. Item Symbol Minimum Typical Maximum Unit Output dielectric strength VDD --- --- 48 V Operating LED forward current IF 5 7.5 25 mA Continuous load current IO --- --- 500 mA Operating temperature Ta − 20 --- 65 °C ■Engineering Data ■Safety Precautions Load Current vs. Ambient Temperature Refer to “Common Precautions” for all G3VM models. G3VM-61B1(E1) A)1,200 m nt ( Connection C urre1,000 d c a Lo 800 600 Connection A or connection B 400 200 0 −20 0 20 40 60 80 100 Ambient temperature (°C) 13

G3VM Series G3VM Series Common Precautions Protection from Surge Voltage on the Input !WARNING Terminals Be sure to turn OFF the power when wiring the Relay, other- wise an electric shock may be received. If any reversed surge voltage is imposed on the input terminals, insert a diode in parallel to the input terminals as shown in the fol- !WARNING lowing circuit diagram and do not impose a reversed voltage value of 3V or more. Do not touch the charged terminals of the SSR, otherwise an electric shock may be received. Surge Voltage Protection Circuit Example !Caution Do not apply overvoltage or overcurrent to the I/O circuits of the SSR, otherwise the SSR may malfunction or burn. !Caution Protection from Spike Voltage on the Output Terminals Be sure to wire and solder the Relay under the proper soldering conditions, otherwise the Relay in operation may generate ex- If a spike voltage exceeding the absolute maximum rated value is cessive heat and the Relay may burn. generated between the output terminals, insert a C-R snubber or clamping diode in parallel to the load as shown in the following Typical Relay Driving Circuit Examples circuit diagram to limit the spike voltage. C-MOS Spike Voltage Protection Circuit Example Load Unused Terminals (6-pin models only) Transistor Terminal 3 is connected to the internal circuit. Do not connect anything to terminal 3 externally. 10 to 100 kΩ Load Pin Strength for Automatic Mounting In order to maintain the characteristics of the relay, the force imposed on any pin of the relay for automatic mounting must not exceed the following. Use the following formula to obtain the LED current limiting resis- tance value to assure that the relay operates accurately. R = VCC − VOL − VF (ON) In direction A: 1.96 N 1 5 to 20 mA In direction B: 1.96 N Use the following formula to obtain the LED forward voltage value to assure that the relay releases accurately. V = V − V < 0.8 V F (OFF) CC OH 4

G3VM Series G3VM Series Load Connection Solder Mounting Do not short-circuit the input and output terminals while the relay Perform solder mounting under the following recommended con- is operating or the relay may malfunction. ditions to prevent the temperature of the Relays from rising. AC Connection <Flow Soldering> Through-hole Mounting (Once Only) Load Solder type Preheating Soldering Lead solder 150°C 230 to 260°C SnPb 60 to 120 s 10 s max. DC Single Connection Lead-free solder 150°C 245 to 260°C SnAgCu 60 to 120 s 10 s max. Load Note: We recommend that the suitability of solder mounting be verified under actual conditions. <Reflow Soldering> Surface Mounting DIP or SOP Packages (Twice Max.) Load Solder type Preheating Soldering Lead solder 140→160°C 210°C Peak DC Parallel Connection SnPb 60 to 120 s 30 s max. 240°C max. Load Lead-free solder 180→190°C 230°C Peak SnAgCu 60 to 120 s 30 to 50 s 260°C max. Surface Mounting SSOP Packages (Twice Max.) Solder type Preheating Soldering Lead solder 140→160°C 210°C Peak SnPb 60 to 120 s 30 s max. 240°C max. Lead-free solder 150→180°C 230°C Peak SnAgCu 120 s max. 30 s max. 250°C max. Note: 1. We recommend that the suitability of solder mounting be verified under actual conditions. 2. Tape cut SSOPs are packaged without humidity resis- tance. Use manual soldering to mount them. Manual Soldering (Once Only) Manually solder at 350°C for 3 s or less or at 260°C for 10 s or less. SSOP Handling Precautions <Humidity-resistant Packaging> Component packages can crack if surface-mounted components that have absorbed moisture are subjected to thermal stress when mounting. To prevent this, observe the following precau- tions. 1. Unopened components can be stored in the packaging at 5 to 30°C and a humidity of 90% max., but they should be used within 12 months. 2. After the packaging has been opened, components can be stored at 5 to 30°C and a humidity of 60% max., but they should be mounted within 168 hours. 3. If, after opening the packaging, the humidity indicator turns pink to the 30% mark or the expiration data is exceeded, bake the components while they are still on the taping reel, and use them within 72 hours. Do not bake the same com- ponents more than once. Baking conditions: 60±5°C, 64 to 72 h Expiration date: 12 months from the seal date (given on the label) 4. If the same components are baked repeatedly, the tape detachment strength will change, causing problems when mounting. When mounting using dehumidifying measures, always take countermeasures against component damage from static electricity. 5. Do not throw or drop components. If the laminated packag- ing material is damaged, airtightness will be lost. 6. Tape cut SSOPs are packaged without humidity resistance. Use manual soldering to mount them. 5

Mouser Electronics Authorized Distributor Click to View Pricing, Inventory, Delivery & Lifecycle Information: O mron: G3VM-61B1 G3VM-61E1 G3VM-61B G3VM-61E1(TR) G3VM-61D1(TR)