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  • 型号: FQA160N08
  • 制造商: Fairchild Semiconductor
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FQA160N08产品简介:

ICGOO电子元器件商城为您提供FQA160N08由Fairchild Semiconductor设计生产,在icgoo商城现货销售,并且可以通过原厂、代理商等渠道进行代购。 FQA160N08价格参考。Fairchild SemiconductorFQA160N08封装/规格:晶体管 - FET,MOSFET - 单, 通孔 N 沟道 80V 160A(Tc) 375W(Tc) TO-3PN。您可以下载FQA160N08参考资料、Datasheet数据手册功能说明书,资料中有FQA160N08 详细功能的应用电路图电压和使用方法及教程。

FQA160N08是一款N沟道功率MOSFET(金属氧化物场效应晶体管),其主要特性包括低导通电阻、快速开关速度和高耐压能力。这款器件广泛应用于各种电力电子设备中,尤其适合需要高效能、低损耗的场景。以下是FQA160N08的一些典型应用场景:

1. 电源管理:FQA160N08常用于开关电源(SMPS)和直流-直流转换器(DC-DC Converter)中,作为主开关管或同步整流管。它能够有效降低导通损耗,提高电源效率,特别适用于笔记本电脑适配器、服务器电源等对能效要求较高的场合。

2. 电机驱动:在无刷直流电机(BLDC)、步进电机和其他电动机控制系统中,FQA160N08可以作为驱动电路中的功率开关,控制电机的启停、调速等功能。其快速开关特性和低导通电阻有助于减少发热,提升系统的可靠性和性能。

3. 电池管理系统(BMS):FQA160N08可用于电动汽车、储能系统等领域的电池保护电路中,实现过充、过放、短路等异常情况下的快速切断功能,确保电池组的安全运行。

4. 逆变器与变频器:该器件适用于太阳能逆变器、家用电器变频控制器等领域,通过精确控制电流和电压波形,实现高效的能量转换和输出调节。

5. 工业自动化:在工业控制领域,如PLC(可编程逻辑控制器)、伺服驱动器等设备中,FQA160N08可以作为负载开关或信号隔离元件,保证信号传输的稳定性和准确性。

总之,FQA160N08凭借其优异的电气性能,在众多电力电子应用中发挥着重要作用,特别是在那些追求高效、紧凑设计且对成本敏感的产品开发过程中。
产品参数 图文手册 常见问题
参数 数值
产品目录

分立半导体产品

ChannelMode

Enhancement

描述

MOSFET N-CH 80V 160A TO-3PMOSFET 80V N-Channel QFET

产品分类

FET - 单分离式半导体

FET功能

标准

FET类型

MOSFET N 通道,金属氧化物

Id-ContinuousDrainCurrent

160 A

Id-连续漏极电流

160 A

品牌

Fairchild Semiconductor

产品手册

点击此处下载产品Datasheet

产品图片

rohs

符合RoHS无铅 / 符合限制有害物质指令(RoHS)规范要求

产品系列

晶体管,MOSFET,Fairchild Semiconductor FQA160N08QFET®

数据手册

点击此处下载产品Datasheet

产品型号

FQA160N08

PCN封装

点击此处下载产品Datasheet

PCN设计/规格

点击此处下载产品Datasheet

Pd-PowerDissipation

375 W

Pd-功率耗散

375 W

RdsOn-Drain-SourceResistance

7 mOhms

RdsOn-漏源导通电阻

7 mOhms

Vds-Drain-SourceBreakdownVoltage

80 V

Vds-漏源极击穿电压

80 V

Vgs-Gate-SourceBreakdownVoltage

+/- 25 V

Vgs-栅源极击穿电压

25 V

上升时间

970 ns

下降时间

410 ns

不同Id时的Vgs(th)(最大值)

4V @ 250µA

不同Vds时的输入电容(Ciss)

7900pF @ 25V

不同Vgs时的栅极电荷(Qg)

290nC @ 10V

不同 Id、Vgs时的 RdsOn(最大值)

7 毫欧 @ 80A,10V

产品培训模块

http://www.digikey.cn/PTM/IndividualPTM.page?site=cn&lang=zhs&ptm=356

产品种类

MOSFET

供应商器件封装

TO-3PN

典型关闭延迟时间

260 ns

功率-最大值

375W

包装

管件

单位重量

6.401 g

商标

Fairchild Semiconductor

安装类型

通孔

安装风格

Through Hole

封装

Tube

封装/外壳

TO-3P-3,SC-65-3

封装/箱体

TO-3PN-3

工厂包装数量

30

晶体管极性

N-Channel

最大工作温度

+ 175 C

最小工作温度

- 55 C

标准包装

30

正向跨导-最小值

92 S

漏源极电压(Vdss)

80V

电流-连续漏极(Id)(25°C时)

160A (Tc)

系列

FQA160N08

通道模式

Enhancement

配置

Single

零件号别名

FQA160N08_NL

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PDF Datasheet 数据手册内容提取

Is Now Part of To learn more about ON Semiconductor, please visit our website at www.onsemi.com Please note: As part of the Fairchild Semiconductor integration, some of the Fairchild orderable part numbers will need to change in order to meet ON Semiconductor’s system requirements. Since the ON Semiconductor product management systems do not have the ability to manage part nomenclature that utilizes an underscore (_), the underscore (_) in the Fairchild part numbers will be changed to a dash (-). This document may contain device numbers with an underscore (_). Please check the ON Semiconductor website to verify the updated device numbers. The most current and up-to-date ordering information can be found at www.onsemi.com. Please email any questions regarding the system integration to Fairchild_questions@onsemi.com. ON Semiconductor and the ON Semiconductor logo are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries. ON Semiconductor owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of ON Semiconductor’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent-Marking.pdf. ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. Buyer is responsible for its products and applications using ON Semiconductor products, including compliance with all laws, regulations and safety requirements or standards, regardless of any support or applications information provided by ON Semiconductor. “Typical” parameters which may be provided in ON Semiconductor data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. ON Semiconductor does not convey any license under its patent rights nor the rights of others. ON Semiconductor products are not designed, intended, or authorized for use as a critical component in life support systems or any FDA Class 3 medical devices or medical devices with a same or similar classification in a foreign jurisdiction or any devices intended for implantation in the human body. Should Buyer purchase or use ON Semiconductor products for any such unintended or unauthorized application, Buyer shall indemnify and hold ON Semiconductor and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that ON Semiconductor was negligent regarding the design or manufacture of the part. ON Semiconductor is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.

F Q A 1 6 June 2014 0 N FQA160N08 0 8 — N-Channel QFET® MOSFET N - 80 V, 160 A, 7 mΩ C h a n n Description Features e l This N-Channel enhancement mode power MOSFET is • 160 A, 80 V, RDS(on) = 7 mΩ (Max.) @ VGS = 10 V, Q produced using Fairchild Semiconductor’s proprietary planar I = 80 A F D stripe and DMOS technology. This advanced MOSFET E technology has been especially tailored to reduce on-state • Low Gate Charge (Typ. (cid:21)(cid:21)0 nC) T resistance, and to provide superior switching performance and ® • Low Crss (Typ. 530 pF) high avalanche energy strength. These devices are suitable M for switched mode power supplies, audio amplifier, DC motor • 100% Avalanche Tested O control, and variable switching power applications. S • 17(cid:24)(cid:131)(cid:38)(cid:3)(cid:48)(cid:68)(cid:91)(cid:76)(cid:80)(cid:88)(cid:80)(cid:3)(cid:45)(cid:88)(cid:81)(cid:70)(cid:87)(cid:76)(cid:82)(cid:81)(cid:3)(cid:55)(cid:72)(cid:80)(cid:83)(cid:72)(cid:85)(cid:68)(cid:87)(cid:88)(cid:85)(cid:72)(cid:3)(cid:53)(cid:68)(cid:87)(cid:76)(cid:81)(cid:74) F E T D G G D TO-3PN S S Absolute Maximum Ratings TC = 25°C unless otherwise noted. Symbol Parameter FQA160N08 Unit VDSS Drain-Source Voltage 80 V ID Drain Current - Continuous (TC = 25°C) 160 A - Continuous (TC = 100°C) 113 A IDM Drain Current - Pulsed (Note 1) 640 A VGSS Gate-Source Voltage ± 25 V EAS Single Pulsed Avalanche Energy (Note 2) 1600 mJ IAR Avalanche Current (Note 1) 160 A EAR Repetitive Avalanche Energy (Note 1) 37.5 mJ dv/dt Peak Diode Recovery dv/dt (Note 3) 6.5 V/ns PD Power Dissipation (TC = 25°C) 375 W - Derate above 25°C 2.5 W/°C TJ, TSTG Operating and Storage Temperature Range -55 to +175 °C Maximum lead temperature for soldering, TL 1/8" from case for 5 seconds. 300 °C Thermal Characteristics (cid:3)(cid:4)(cid:5)(cid:6)(cid:7)(cid:8) (cid:9)(cid:10)(cid:11)(cid:10)(cid:5)(cid:12)(cid:13)(cid:12)(cid:11) FQA160N08 (cid:19)(cid:20)(cid:21)(cid:13) +θ(cid:12)(cid:8) Thermal Resistance, Junction-to-Case, Max. 0.4 6(cid:8)(cid:2)? +θ(cid:12)(cid:10) Thermal Resistance, Junction-to-Ambient, Max. 40 6(cid:8)(cid:2)? ©2000 Fairchild Semiconductor Corporation 1 www.fairchildsemi.com FQA160N08 Rev. C2

F Package Marking and Ordering Information Q A Part Number Top Mark Package Packing Method Reel Size Tape Width Quantity 1 6 FQA160N08 FQA160N08 TO-3PN Tube N/A N/A 30 units 0 N 0 Electrical Characteristics TC = 25°C unless otherwise noted. 8 — Symbol Parameter Test Conditions Min. Typ. Max. Unit N Off Characteristics -C BVDSS Drain-Source Breakdown Voltage VGS = 0 V, ID = 250 μA 80 -- -- V ha Δ /B VΔTDSJS CBroeeaffkicdioewntn Voltage Temperature ID = 250 μA, Referenced to 25°C -- 0.08 -- V/°C nne l IDSS VDS = 80 V, VGS = 0 V -- -- 1 μA Q Zero Gate Voltage Drain Current VDS = 64 V, TC = 150°C -- -- 10 μA FE IGSSF Gate-Body Leakage Current, Forward VGS = 25 V, VDS = 0 V -- -- 100 nA T ® IGSSR Gate-Body Leakage Current, Reverse VGS = -25 V, VDS = 0 V -- -- -100 nA M O On Characteristics S VGS(th) Gate Threshold Voltage VDS = VGS, ID = 250 μA 2.0 -- 4.0 V FE RDS(on) OStna-tRice Dsrisatiann-Sceource VGS = 10 V, ID = 80 A -- 0.0056 0.007 Ω T gFS Forward Transconductance VDS = 30 V, ID = 80 A -- 92 -- S Dynamic Characteristics Ciss Input Capacitance V = 25 V, V = 0 V, -- 6100 7900 pF DS GS Coss Output Capacitance f = 1.0 MHz -- 2400 3100 pF Crss Reverse Transfer Capacitance -- 530 690 pF Switching Characteristics td(on) Turn-On Delay Time V = 40 V, I = 160 A, -- 85 180 ns DD D tr Turn-On Rise Time R = 25 Ω -- 970 2000 ns G td(off) Turn-Off Delay Time -- 260 530 ns tf Turn-Off Fall Time (Note4) -- 410 830 ns Qg Total Gate Charge VDS = 64 V, ID = 160 A, -- 225 290 nC Qgs Gate-Source Charge VGS = 10 V -- 43 -- nC Qgd Gate-Drain Charge (Note4) -- 120 -- nC Drain-Source Diode Characteristics and Maximum Ratings IS Maximum Continuous Drain-Source Diode Forward Current (Note 5) -- -- 160 A ISM Maximum Pulsed Drain-Source Diode Forward Current -- -- 640 A VSD Drain-Source Diode Forward Voltage VGS = 0 V, IS = 160 A -- -- 1.5 V trr Reverse Recovery Time VGS = 0 V, IS = 160 A, -- 125 -- ns Qrr Reverse Recovery Charge dIF / dt = 100 A/μs -- 510 -- nC Notes: 1.Repetitive rating : pulse-width limited by maximum junction temperature. 2.L = 0.115 mH, IAS = 140 A, VDD = 25 V, RG = 25 Ω, starting TJ = 25°C. 3.ISD ≤ 140 A, di/dt ≤ 300 A/μs, VDD ≤ BVDSS, starting TJ = 25°C. 4. Essentially independent of operating temperature. 5.Continuous drain current calculated by maximum junction temperature : limited by package. ©2000 Fairchild Semiconductor Corporation 2 www.fairchildsemi.com FQA160N08 Rev. C2

F TTyyppiiccaall CChhaarraacctteerriissttiiccss Q A 1 6 0 N Top : 1 5 .V0 GVS 0 10.0 V 8 87..00 VV 102 — 6.0 V urrent [A] 102 Bottom : 455...550 VVV urrent [A] 101 175℃ N-C C C h I, Drain D ※12 N.. 2To5Cte 0=sμ 2:s5 P℃ulse Test I, Drain D100 25℃ -55℃ anne ※ Notes : 101 12.. 2V5DS0 μ= s3 0PVulse Test l Q 10-1 F 10-1 100 101 2 44 6 8 10 E VDS, Drain-Source Voltage [V] VGS, Gate-Source Voltage [V] T® M Figure 1. On-Region Characteristics Figure 2. Transfer Characteristics O S F E 20 T e mΩ],n-Resistanc15 VVGGSS == 2100VV Current [A] 102 R [DS(ON)ource O10 e Drain 101 S s Drain- 5 Rever 100 ※ Note : TJ = 25℃ I, DR 175℃ 25℃ ※12 N.. V2o5Gte0S sμ= : s0 VPulse Test 0 10-1 0 200 400 600 800 1000 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 ID , Drain Current [A] VSD, Source-Drain voltage [V] Figure 3. On-Resistance Variation vs. Figure 4. Body Diode Forward Voltage Drain Current and Gate Voltage Variation vs. Source Current and Temperature 20000 12 18000 CCCiorssssss === CCCggdsds ++ CCggdd (Cds = shorted) 10 acitance [pF] 111102468000000000000000 CCoissss ※ 21 N.. fVo =GteS 1 s= M: 0H Vz Source Voltage [V] 68 VDS V=D 6S 4=V 40V Cap 6000 ate- 4 G 4000 Crss V, GS 2 2000 ※ Note : ID = 160A 0 0 10-1 100 101 0 40 80 120 160 200 240 VDS, Drain-Source Voltage [V] QG, Total Gate Charge [nC] Figure 5. Capacitance Characteristics Figure 6. Gate Charge Characteristics ©2000 Fairchild Semiconductor Corporation 3 www.fairchildsemi.com FQA160N08 Rev. C2

F TTyyppiiccaall CChhaarraacctteerriissttiiccss (Continued) Q A 1 6 0 N 1.2 3.0 0 e 8 oltag ce 2.5 — BV, (Normalized)DSSDrain-Source Breakdown V 011...901 ※ 12 .N. VIoDG t=eS s =2 : 500 V μA R, (Normalized)DS(ON)Drain-Source On-Resistan 0112....5050 ※21 .N. IVoDG t=eS s =8 : 01 0A V N-Channel QFE 0.8-100 -50 0 50 100 150 200 0.0-100 -50 0 50 100 150 200 T ® TJ, Junction Temperature [oC] TJ, Junction Temperature [oC] M O Figure 7. Breakdown Voltage Variation Figure 8. On-Resistance Variation S vs. Temperature vs. Temperature F E T 180 Operation in This Area 103 is Limited by R DS(on) 150 nt [A] 102 1 ms100 μs 10 μs nt [A] 120 Curre DC 10 ms Curre 90 ain 101 ain Dr Dr 60 Limited by Package I, D I, D 100 ※ Notes : 1. TC = 25 oC 30 23.. TSJin =g l1e7 P5 uolCse 10-1 0 100 101 102 25 50 75 100 125 150 175 VDS, Drain-Source Voltage [V] TC, Case Temperature [℃] Figure 9. Maximum Safe Operating Area Figure 10. Maximum Drain Current vs. Case Temperature W] oe [C/ D=0.5 Respons 10-1 00..12 ※ 132 N... ZTDoθJtuMeJt Cys-( tTF:) Ca= c= t0 oP.r4D, M℃D *=/ WZt1θ/t 2JMC(at)x. mal 0.05 her 0.02 PDM T (t), C 10-2 0.01 single pulse t1t2 ZJ 10-5 10-4 10-3 10-2 10-1 100 101 t , Square Wave Pulse Duration [sec] 1 Figure 11. Transient Thermal Response Curve ©2000 Fairchild Semiconductor Corporation 4 www.fairchildsemi.com FQA160N08 Rev. C2

F Q A 1 6 0 N 0 8 — VV SSaammee TTyyppee GGSS N 5500KKΩΩ aass DDUUTT QQ -C 1122VV 220000nnFF 1100VV gg h 330000nnFF a n VV n VVGGSS DDSS QQ QQ e ggss ggdd l Q F DDUUTT E T IG = co33nmmsAAt. ® M O CChhaarrggee S F E Figure 12. Gate Charge Test Circuit & Waveform T VVDDSS RRLL VVDDSS 9900%% VVGGSS VVDDDD RR GG 1100%% VV V1100GVVS DDUUTT GGSS tt tt tt dd((oonn)) rr dd((ooffff)) tt ff tt tt oonn ooffff Figure 13. Resistive Switching Test Circuit & Waveforms BBVV LLL 1111 DDSSSS EEE === ---------------- LLLIII 222 ---------------------------------------- VVDDSS AAASSS 2222 AAASSS BBVV --VV DDSSSS DDDD BBVV III DDSSSS DDD II AASS RR GG VVDDDD IIDD ((tt)) VV11G00GVVSS DDUUTT VVDDDD VVDDSS ((tt)) tt pp tt TTiimmee pp Figure 14. Unclamped Inductive Switching Test Circuit & Waveforms ©2000 Fairchild Semiconductor Corporation 5 www.fairchildsemi.com FQA160N08 Rev. C2

F Q A 1 6 0 N 0 8 DDUUTT ++ — N - C VV DDSS h a n __ n e l Q IISSDD F E LLL T ® M DDrriivveerr O S RR GG F SSaammee TTyyppee E aass DDUUTT VVDDDD T VV GGSS ••ddvv//ddttccoonnttrroolllleedd bbyy RR GG ••II ccoonnttrroolllleedd bbyy ppuullssee ppeerriioodd SSDD GGGaaattteee PPPuuulllssseee WWWiiidddttthhh VV DDD ===------------------------------------------------------------------------------ GGSS GGGaaattteee PPPuuulllssseee PPPeeerrriiioooddd 1100VV (( DDrriivveerr )) II ,, BBooddyy DDiiooddee FFoorrwwaarrdd CCuurrrreenntt FFMM II SSDD ddii//ddtt (( DDUUTT )) II RRMM BBooddyy DDiiooddee RReevveerrssee CCuurrrreenntt VV DDSS (( DDUUTT )) BBooddyy DDiiooddee RReeccoovveerryyddvv//ddtt VV VV SSDD DDDD BBooddyy DDiiooddee FFoorrwwaarrdd VVoollttaaggee DDrroopp Figure 15. Peak Diode Recovery dv/dt Test Circuit & Waveforms ©2000 Fairchild Semiconductor Corporation 6 www.fairchildsemi.com FQA160N08 Rev. C2

F Q Mechanical Dimensions A 1 6 0 N 0 8 — N - C h a n n e l Q F E T ® M O S F E T Figure 16. TO3PN, 3-Lead, Plastic, EIAJ SC-65 Package drawings are provided as a service to customers considering Fairchild components. Drawings may change in any manner without notice. Please note the revision and/or date on the drawing and contact a Fairchild Semiconductor representative to verify or obtain the most recent revision. Package specifications do not expand the terms of Fairchild’s worldwide terms and conditions, specif- ically the warranty therein, which covers Fairchild products. Always visit Fairchild Semiconductor’s online packaging area for the most recent package drawings: http://www.fairchildsemi.com/package/packageDetails.html?id=PN_TT3PN-003 ©2000 Fairchild Semiconductor Corporation 7 www.fairchildsemi.com FQA160N08 Rev. C2

F Q A 1 6 0 N 0 8 TRADEMARKS — The following includes registered and unregistered trademarks and service marks, owned by Fairchild Semiconductor and/or its global subsidiaries, and is not intended to be an exhaustive list of all such trademarks. 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