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FPF2496UCX产品简介:
ICGOO电子元器件商城为您提供FPF2496UCX由Fairchild Semiconductor设计生产,在icgoo商城现货销售,并且可以通过原厂、代理商等渠道进行代购。 FPF2496UCX价格参考。Fairchild SemiconductorFPF2496UCX封装/规格:PMIC - 配电开关,负载驱动器, 。您可以下载FPF2496UCX参考资料、Datasheet数据手册功能说明书,资料中有FPF2496UCX 详细功能的应用电路图电压和使用方法及教程。
参数 | 数值 |
产品目录 | 集成电路 (IC)半导体 |
描述 | IC LOAD SWITCH OCP 28V 9WLCSP电源开关 IC - 配电 IntelliMAX 28 V, Over-Voltage, Over-Current Protection Load Switch with Adjustable Current-Limit Control |
产品分类 | PMIC - 电源分配开关集成电路 - IC |
品牌 | Fairchild Semiconductor |
产品手册 | |
产品图片 | |
产品系列 | 开关 IC,电源开关 IC - 配电,Fairchild Semiconductor FPF2496UCXIntelliMax™ |
数据手册 | |
产品型号 | FPF2496UCX |
Rds(On) | - |
rohs | 无铅 / 符合限制有害物质指令(RoHS)规范要求 |
产品 | Load Switches |
产品种类 | 电源开关 IC - 配电 |
供应商器件封装 | 9-WLCSP(1.2x1.2) |
其它名称 | FPF2496UCXCT |
内部开关 | - |
包装 | 剪切带 (CT) |
单位重量 | 42 mg |
商标 | Fairchild Semiconductor |
安装类型 | 表面贴装 |
安装风格 | SMD/SMT |
导通电阻—最大值 | 100 mOhms |
封装 | Reel |
封装/外壳 | 9-UFBGA,WLCSP |
封装/箱体 | WLCSP-9 |
工作温度 | -40°C ~ 150°C |
工作电源电压 | 3.5 V to 5.5 V |
工厂包装数量 | 3000 |
最大工作温度 | + 150 C |
最小工作温度 | - 40 C |
标准包装 | 1 |
电压-输入 | 3.5 V ~ 5.5 V |
电流限制 | 1.5A |
电源电流—最大值 | 1.5 A |
类型 | 负载断开开关 |
系列 | FPF2496 |
输出数 | 1 |
输出端数量 | 1 Output |
Is Now Part of To learn more about ON Semiconductor, please visit our website at www.onsemi.com Please note: As part of the Fairchild Semiconductor integration, some of the Fairchild orderable part numbers will need to change in order to meet ON Semiconductor’s system requirements. Since the ON Semiconductor product management systems do not have the ability to manage part nomenclature that utilizes an underscore (_), the underscore (_) in the Fairchild part numbers will be changed to a dash (-). This document may contain device numbers with an underscore (_). Please check the ON Semiconductor website to verify the updated device numbers. The most current and up-to-date ordering information can be found at www.onsemi.com. Please email any questions regarding the system integration to Fairchild_questions@onsemi.com. ON Semiconductor and the ON Semiconductor logo are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries. ON Semiconductor owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of ON Semiconductor’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent-Marking.pdf. ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. Buyer is responsible for its products and applications using ON Semiconductor products, including compliance with all laws, regulations and safety requirements or standards, regardless of any support or applications information provided by ON Semiconductor. “Typical” parameters which may be provided in ON Semiconductor data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. ON Semiconductor does not convey any license under its patent rights nor the rights of others. ON Semiconductor products are not designed, intended, or authorized for use as a critical component in life support systems or any FDA Class 3 medical devices or medical devices with a same or similar classification in a foreign jurisdiction or any devices intended for implantation in the human body. Should Buyer purchase or use ON Semiconductor products for any such unintended or unauthorized application, Buyer shall indemnify and hold ON Semiconductor and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that ON Semiconductor was negligent regarding the design or manufacture of the part. ON Semiconductor is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
F P F 2 4 April 2017 9 6 — I n te l l i FPF2496 M A IntelliMAX™ 28 V, Over-Voltage, Over-Current Protection X ™ Load Switch with Adjustable Current-Limit Control 2 8 V O v Features Description er - V VIN: 3.5 V~5.5 V The FPF2496 advanced load-management switch o l 28 V Absolute Ratings at VIN tsaorlguetitosn . aItp pdliicsacotionnnse ctsre qlouairdinsg poaw erheigdh lfyr omin ttehger aDteCd tag Current Capability: 2.5 A power rail (<6 V) with stringent off-state current targets e , Adjustable Current Limit: (Typ.) 0.1 A~2.5 A and high load capacitances (<100 µF). The FPF2496 O consists of a slew-rate controlled low-impedance v with 10% Accuracy e MOSFET switch (100 mΩ maximum) and integrated r RON: Maximum 100 mΩ at 5 VIN and 1A IOUT analog features. The slew-rate controlled turn-on -C Input OVP: Min.=5.6 V, Typ.=5.8 V, Max.=6 V characteristic prevents inrush current and the resulting ur excessive voltage droop on power rails. FPF2496 has r e Output Discharge During Off State over-voltage and over-temperature protection. n t Open-Drain OVP on FLAGB The FPF2496 has a True Reverse-Current Blocking P r Thermal Shutdown (TRCB) function that obstructs unwanted reverse o current from VOUT to VIN during ON and OFF states. te Under-Voltage Lockout (UVLO) The exceptionally low off-state current drain (<2 µA c t True Reverse-Current Blocking (TRCB) maximum) facilitates compliance with standby power io requirements. The input voltage range operates from n Logic CMOS IO Meets JESD76 Standard for 3.5 V to 5.5 VDC to support a wide range of L o GPIO Interface and Related Power Supply applications in consumer, optical, medical, storage, a Requirements portable, and industrial-device power management d ESD Protected: systems. Switch control is managed by a logic input S (active LOW) capable of interfacing directly with low- w - Human Body Model: >5.0 kV voltage control signal / General-Purpose Input / it c - Charged Device Model: >2.5 kV Output (GPIO) without an external pull-down resistor. h w - IEC 61000-4-2 Air Discharge: >15 kV The device is packaged in advanced, fully “green” i - IEC 61000-4-2 Contact Discharge: >8 kV compliant, 1.21 mm x 1.21 mm, Wafer-Level Chip- th Scale Package (WLCSP). A d Applications j u s Smart Phones, Tablet PCs ta b Storage, DSLR, and Portable Devices l e C u r r e n Ordering Information t - L Operating im Part Number Package Top Mark Temperature Range i t C 1.21 mm x 1.21 mm, Wafer-Level Chip-Scale o FPF2496UCX -40 to 85°C TJ Package (WLCSP) n t ro l © 2014 Semiconductor Components Industries, LLC. www.fairchildsemi.com FPF2496 • Rev. 1.11 www.onsemi.com
F P F Application Diagram 2 4 9 VIO 6 — I n t R e PU l l i M 3.5 V ~ 5.5 V VIN VOUT A X CIN COUT ™ FPF2496 2 OC FLAGB 8 V O OFF ON ONB ISET v GND e RSET r- V o l t a g e Figure 1. Typical Application , O Note: v e 1. CIN and COUT capacitors are recommended for improved device stability. r- C u r r e n t Block Diagram P r o HV Power Device te c TRCB t i VI N V OUT on L o Charge a UVLO OVP Pump Current d Limit S w i t c ONB ISET h w CONTROL LOGIC i t h A d Thermal ju Shutdwn s t a b l e FPF2 496 C OC_FLAGB u r r e n t - L im i Figure 2. Functional Block Diagram t C o n t r o l © 2014 Semiconductor Components Industries, LLC. www.fairchildsemi.com FPF2496 • Rev. 1.11 2 www.onsemi.com
F P F Pin Configurations 2 4 9 6 1 2 3 3 2 1 — I n t e A V GND V V GND V l OUT IN IN OUT li M A X ™ V GND V V GND V B OUT IN IN OUT 2 8 V O C OCFLAGB ISET ONB ONB ISET OCFLAGB ve r - V o l t Figure 3. Pin Assignments (Top View) Figure 4. Pin Assignments (Bottom View) a g e , O v e r Pin Description - C u Pin # Name Description rr e n A1, B1 VOUT Switch Output t P A3, B3 VIN Supply Input: Input to the power switch r o A2 t GND Ground (Device Ground) e c B2 t i o Logic HIGH Switch Disable n C3 ONB ON/OFF Control Input: Active LOW; GPIO compatible Logic LOW Switch Enable L o Fault Output: Active LOW, open-drain output that indicates an input over current. External a C1 OCFLAGB pull-up resistor to VCC is required. d S C2 ISET Current Limit Set Input: A resistor from ISET to ground sets the current limit for the switch. w i tc h w i t h A d j u s t a b l e C u r r e n t - L i m i t C o n t r o l © 2014 Semiconductor Components Industries, LLC. www.fairchildsemi.com FPF2496 • Rev. 1.11 3 www.onsemi.com
F P Absolute Maximum Ratings F 2 4 Stresses exceeding the absolute maximum ratings may damage the device. The device may not function or be 9 operable above the recommended operating conditions and stressing the parts to these levels is not recommended. 6 In addition, extended exposure to stresses above the recommended operating conditions may affect device reliability. — The absolute maximum ratings are stress ratings only. I n t Symbol Parameters Min. Max. Unit e l l i VIN to GND, VIN to VOUT -0.3 28.0 M VPIN V A ONB, VOUT, FLAGB, ISET to GND -0.3 6.0 X ™ ISW Maximum Continuous Switch Current 2.75 A 2 tPD Total Power Dissipation at TA=25°C 1.0 W 8 V TJ Operating Junction Temperature -40 +150 °C O TSTG Storage Junction Temperature -65 +150 °C v e JA T(1h-einrcmha Sl Rqueasriset aPnacde ,o Jf u2n oczti.o Cno-tpop-Aemr) bient 19150(2(3) ) °C/W r-Vo l Human Body Model, ta Electrostatic Discharge ANSI/ESDA/JEDEC JS-001-2012 5.0 g Capability e , ESD Charged Device Model, JESD22-C101 2.5 kV O IEC61000-4-2 System Air Discharge (VIN, VON, VOUT to GND) 15 ve Level Contact Discharge (VIN, VON, VOUT to GND) 8 r-C Notes: u r 2. Measured using 2S2P JEDEC std. PCB. r e 3. Measured using 2S2P JEDEC PCB cold plate method. n t P r o t e c Recommended Operating Conditions t i o The Recommended Operating Conditions table defines the conditions for actual device operation. Recommended n operating conditions are specified to ensure optimal performance to the datasheet specifications. ON Semiconductor L o does not recommend exceeding them or designing to Absolute Maximum Ratings. a d Symbol Parameters Min. Max. Unit S w VIN Supply Voltage 3.5 5.5 V it c TA Ambient Operating Temperature -40 85 °C h w i t h A d j u s t a b l e C u r r e n t - L i m i t C o n t r o l © 2014 Semiconductor Components Industries, LLC. www.fairchildsemi.com FPF2496 • Rev. 1.11 4 www.onsemi.com
F P Electrical Characteristics F 2 4 Unless otherwise noted; VIN=3.5 to 5.5 V, TA=-40 to +85°C; typical values are at VIN=5 V and TA=25°C. 9 6 Symbol Parameters Condition Min. Typ. Max. Unit — I Basic Operation n t e VIN Input Voltage 3.5 5.5 V ll i M IQ(OFF) Off Supply Current VONB=HIGH, VOUT=Open 1 2 μA A X ISD(OFF) Shutdown Current VIN=5.5 V, VOUT=0 V, VONB=HIGH 0.1 4.0 μA ™ IQ Quiescent Current IOUT=0 mA 65 100 μA 2 8 VIN=5.0 V, IOUT=1 A 70 100 V RON On Resistance mΩ O VIN=3.7 V, IOUT=1 A 75 105 v e ONB Input Logic HIGH r VIH Voltage VIN=3.5 V to 5.5 V 1.15 V -V o ONB Input Logic LOW lt VIL Voltage VIN=3.5 V to 5.5 V 0.65 V ag e FLAGB Output Logic VIN=5 V, ISINK=10 mA 0.1 0.2 , O VIL_FLAG LOW Voltage VIN=3.5 V, ISINK=10 mA 0.15 0.30 V ve r FLAGB Output HIGH - IFLAGB_LK Leakage Current VIN=5 V, Switch On 1 μA Cu r r ION ONB Input Leakage 0 V to VIN 1.0 μA e n RON_PD Patu Oll-NDBo wPnin R esistance VTAIN==-34.05 ~to5 .855 V°C, VON=HIGH, 14 MΩ t Pr o RPD Output Discharge VIN=3.5 V, VONB=HIGH, IFORCE=20 mA, 100 Ω te RPULL_DOWN TA=-40 to 85°C ct i o Over-Voltage Protection n L VIN Rising Threshold 5.60 5.80 6.00 o VOVP_TRIP Input OVP Lockout V a VIN Falling Threshold 5.50 d S VOVP_HYS Input OVP Hysteresis 0.3 V w i tOVP Response Time IVOIUNT==50.5.5 V A t,o C 6L.=01 V µ F, TA=25°C, 1 μs tch w Over-Current Protection i t h VIN=5 V, RSET = 2100 Ω, 450 500 550 A VOUT >1.68V with with 10% Accuracy d ILIM Current Limit mA ju VIN=5 V, RSET = 1070 Ω, 900 1000 1100 s VOUT >1.68 V with 10% Accuracy ta b VIN Increasing 3.2 le VUVLO Under-Voltage Lockout V C VIN Decreasing 3.0 u r VUVLO_HYS UVLO Hysteresis 200 mV re n VT_RCB RPoCiBnt Protection Trip VOUT - VIN 50 mV t-L i m RCB Protection VR_RCB Release Trip Point VIN - VOUT 50 mV it C o Continued on the following page… n t r o l © 2014 Semiconductor Components Industries, LLC. www.fairchildsemi.com FPF2496 • Rev. 1.11 5 www.onsemi.com
F P F Electrical Characteristics (Continued) 2 4 9 Unless otherwise noted; VIN=3.5 to 5.5 V, TA=-40 to +85°C; typical values are at VIN=5 V and TA=25°C. 6 — Symbol Parameters Conditions Min. Typ. Max. Unit I n VRCB_HYS RCB Hysteresis 100 mV te l Default RCB li tRCB Response Time VIN=5 V, VONB=HIGH/LOW 2 µs M A X IRCB RCB Current VONB=HIGH, VOUT=5.5 V 14 μA ™ Hard Over-Current Moderate Over-Current Condition, 2 tHOCP Response Time IOUT ≥ ILIM, VOUT ≤ 0 V 6 µs 8 V tOCP ORevespr-oCnusrere Tnitm e MIOUoTd ≥e rIaLItMe VOOvUeTr ≤-C VuIrNr ent Condition, 7 µs Ov e tOC_FLAG ORevespr-oCnusrere Tnitm Fela g WPuhlleinng O LvOeWr-C urrent Occurs to Flag 8 ms r-V o l Shutdown Threshold 150 ta g TSD Thermal Shutdown Return from Shutdown 130 °C e , O Hysteresis 20 v e Dynamic Characteristics r - C tDON Turn-On Delay(4,5) 4.39 ms u r tR VOUT Rise Time(4,5) 7.26 ms re n tON Turn-On Time(4,7) 11.65 ms t tDOFF Turn-Off Delay(5) VIN=5 V, RL=100 Ω, CL=1 µF, TA=25°C 1.85 ms Pro t tF VOUT Fall Time(5) 37.60 ms ec t tOFF Turn-Off Time(7) 39.45 ms io n Notes: L 4. This parameter is guaranteed by design and characterization; not production tested. o a 5. tDON/tDOFF/tR/tF are defined in Figure 5 below. d 6. tON=tR + tDON. S 7. tOFF=tF + tDOFF. w it c h Timing Diagram w i t h A where: 90% d j VON tDON = Delay On Time us 10% tR = VOUT Rise Time ta b t = Turn-On Time ON l e tDOFF = Delay Off Time C tF = VOUT Fall Time u 90% 90% tOFF = Turn Off Time rre n V OUT t - L 10% 10% i m i t tdON tR tdOFF tF C tON tOFF on t Figure 5. Timing Diagram r o l © 2014 Semiconductor Components Industries, LLC. www.fairchildsemi.com FPF2496 • Rev. 1.11 6 www.onsemi.com
F P F Operation and Application Description 2 4 Input Capacitor Setting Current Limit 96 To limit the voltage drop on the input supply caused by The current limit is set with an external resistor — transient inrush current when the switch turns on into connected between the ISET and GND pins. The resistor I n discharge load capacitor; a capacitor must be placed in is selected using Table 1. Resistor tolerance of 1% or t between the VIN and GND pins. A high-value CIN less is recommended ell capacitor can be used to reduce the voltage drop in Table 1. Current Limit Settings by RSET(8) iM high-current applications. A Min. Typ. Max. X Output Capacitor ™ R Ω Current Current Current An output capacitor should be placed between the VOUT SET Limit (mA) Limit (mA) Limit (mA) 28 and GND pins. This capacitor prevents parasitic board inductance from forcing VOUT below GND when the 420 2250 2500 2750 V O switch is on. This capacitor also prevents reverse inrush 469 2020 2250 2407 v current from creating a voltage spike that could damage e the device in the case of a VOUT short. 528 1800 2000 2200 r- V 604 1570 1750 1920 Fault Reporting o l 680 1350 1500 1650 t Upon the detection of an over-current, OC_FLAGB a g signals the fault by activating LOW. 866 1125 1250 1375 e , Current Limiting 1070 900 1000 1100 O v The current limit ensures that the current through the 1200 810 900 990 e r switch does not exceed the maximum set value, while 1330 720 800 880 -C not limiting the minimum value. The current limit is u 1500 630 700 770 adjustable through the selection of an external resistor r r connected to ISET. Information for selecting the resistor 1740 540 600 660 e n is found in the sections below. The device acts as a 2100 450 500 550 t constant-current source when the load draws more than P the maximum value set by the device until thermal 2320 405 450 495 ro shutdown occurs. The device recovers if the die 2550 360 400 440 te temperature drops below the threshold temperature. c 2940 315 350 385 ti o Under-Voltage Lockout (UVLO) 3400 370 300 330 n The under-voltage lockout turns the switch off if the input L 4020 225 250 275 o voltage drops below the lockout threshold. With the ONB a pin active, the input voltage rising above the UVLO 4990 180 200 220 d threshold releases the lockout and enables the switch. S 6490 135 150 165 w True Reverse-Current Blocking 9530 90 100 110 it c The true reverse-current blocking feature protects the Note: h input source against current flow from output to input, 8. Table values based on 1% tolerance resistor. w whether the load switch is on or off. it h Thermal Shutdown Board Layout A d The thermal shutdown protects the die from internally or For best performance, all traces should be as short as ju externally generated excessive temperature. During an s possible. The input and output capacitors should be t over-temperature condition, the switch is turned off. The a placed close to the device to minimize the effect that b switch automatically turns on again if the temperature of parasitic trace inductance may have on normal and l e the die drops below the threshold temperature. short-circuit operation. Using wide traces for VIN, VOUT, C GND helps minimize parasitic electrical effects along u with minimizing the case-to-ambient thermal impedance. r r e n t - L i m i t C o n t r o l © 2014 Semiconductor Components Industries, LLC. www.fairchildsemi.com FPF2496 • Rev. 1.11 7 www.onsemi.com
F P F Physical Dimensions 2 4 9 6 — F 0.03 C I n 2X E A te B 0.40 ll i M A1 Ø0.20 A Cu Pad 0.40 X PIN A1 D ™ INDEX AREA 2 Ø0.30 8 0.03 C Solder Mask V 2X O v TOP VIEW LAND PATTERN RECOMMENDATION e r (NSMD PAD TYPE) - V o l t a g 0.06 C e 0.378±0.018 , 0.625 O 0.05 C E 0.547 0.208±0.021 v e r - C u C SEATING PLANE rr e D SIDE VIEWS nt P r o t e NOTES: c t i o A. NO JEDEC REGISTRATION APPLIES. n Ø0.260±0.020 L B. DIMENSIONS ARE IN MILLIMETERS. 0.40 9X o a C. DIMENSIONS AND TOLERANCE d C PER ASMEY14.5M, 1994. S w B (Y)±0.018 D. DATUM C IS DEFINED BY THE SPHERICAL i 0.40 A CROWNS OF THE BALLS. tc h 1 2 3 F E. PACKAGE NOMINAL HEIGHT IS 586 MICRONS w ±39 MICRONS (547-625 MICRONS). i t (X)±0.018 h F. FOR DIMENSIONS D, E, X, AND Y SEE A PRODUCT DATASHEET. d BOTTOM VIEW j G. DRAWING FILNAME: MKT-UC009ABrev2 u s t a Product-Specific Dimensions b l e Product D E X Y C u FPF2496 1210 µm ±30 µm 1210 µm ±30 µm 205 µm 205 µm r r e n t L i m it C o n t r o l © 2012 Semiconductor Components Industries, LLC. www.fairchildsemi.com FPF2496 • Rev. 1.11 8 www.onsemi.com
F P F 2 4 9 6 — I n t e l li M A X ™ 2 8 V O v e r - V o l t a g e , O v e r - C u r r e n t P r o t e c t i o n L o a d S ON Semiconductor and the ON Semiconductor logo are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries. ON Semiconductor owns the rights to a number of patents, trademarks, copyrights, trade secrets, w and other intellectual property. A listing of ON Semiconductor’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent-Marking.pdf. it ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation c or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application h or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. Buyer w is responsible for its products and applications using ON Semiconductor products, including compliance with all laws, regulations and safety requirements or i standards, regardless of any support or applications information provided by th ON Semiconductor. “Typical” parameters which may be provided in ON Semiconductor data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by A customer’s technical experts. ON Semiconductor does not convey any license under its patent rights nor the rights of others. ON Semiconductor products d are not designed, intended, or authorized for use as a critical component in life support systems or any FDA Class 3 medical devices or medical devices with ju a same or similar classification in a foreign jurisdiction or any devices intended for implantation in the human body. Should Buyer purchase or use ON s Semiconductor products for any such unintended or unauthorized application, Buyer shall indemnify and hold ON Semiconductor and its officers, employees, t subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or a indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that ON Semiconductor was b negligent regarding the design or manufacture of the part. ON Semiconductor is an Equal Opportunity/Affirmative Action Employer. This literature is subject le to all applicable copyright laws and is not for resale in any manner. C u PUBLICATION ORDERING INFORMATION r r LITERATURE FULFILLMENT: e n Literature Distribution Center for ON Semiconductor N. American Technical Support: 800-282-9855 Toll Free ON Semiconductor Website: www.onsemi.comt 19521 E. 32nd Pkwy, Aurora, Colorado 80011 USA USA/Canada. L Phone: 303-675-2175 or 800-344-3860 Toll Free USA/Canada Europe, Middle East and Africa Technical Support: Order Literature: http://www.onsemi.com/orderlitim Fax: 303-675-2176 or 800-344-3867 Toll Free USA/Canada Phone: 421 33 790 2910 i t Email: orderlit@onsemi.com Japan Customer Focus Center For additional information, please contact your loc al C Phone: 81-3-5817-1050 Sales Representative o n t r o l © 2012 Semiconductor Components Industries, LLC. www.fairchildsemi.com FPF2496 • Rev. 1.11 9 www.onsemi.com
ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries. ON Semiconductor owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of ON Semiconductor’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent−Marking.pdf. ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. Buyer is responsible for its products and applications using ON Semiconductor products, including compliance with all laws, regulations and safety requirements or standards, regardless of any support or applications information provided by ON Semiconductor. “Typical” parameters which may be provided in ON Semiconductor data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. ON Semiconductor does not convey any license under its patent rights nor the rights of others. ON Semiconductor products are not designed, intended, or authorized for use as a critical component in life support systems or any FDA Class 3 medical devices or medical devices with a same or similar classification in a foreign jurisdiction or any devices intended for implantation in the human body. Should Buyer purchase or use ON Semiconductor products for any such unintended or unauthorized application, Buyer shall indemnify and hold ON Semiconductor and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that ON Semiconductor was negligent regarding the design or manufacture of the part. ON Semiconductor is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. PUBLICATION ORDERING INFORMATION LITERATURE FULFILLMENT: N. American Technical Support: 800−282−9855 Toll Free ON Semiconductor Website: www.onsemi.com Literature Distribution Center for ON Semiconductor USA/Canada 19521 E. 32nd Pkwy, Aurora, Colorado 80011 USA Europe, Middle East and Africa Technical Support: Order Literature: http://www.onsemi.com/orderlit Phone: 303−675−2175 or 800−344−3860 Toll Free USA/Canada Phone: 421 33 790 2910 Fax: 303−675−2176 or 800−344−3867 Toll Free USA/Canada Japan Customer Focus Center For additional information, please contact your local Email: orderlit@onsemi.com Phone: 81−3−5817−1050 Sales Representative © Semiconductor Components Industries, LLC www.onsemi.com www.onsemi.com 1
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