IntelliMAX(cid:2) Ultra-Small, Slew-Rate-Controlled Load Switch FPF1203, FPF1203L, FPF1204 www.onsemi.com Description The FPF1203 / 03L / 04 are ultra−small integrated IntelliMAX load switches with integrated P−channel switch and analog control features. Integrated slew−rate control prevents inrush current and the resulting excessive voltage drop on the power rail. The input voltage range operates from 1.2 V to 5.5 V to provide power−disconnect capability for post−regulated power rails in portable and consumer products. The low shut−off current allows power designs to meet WLCSP4 0.76x0.76x0.586 CASE 567SS standby and off−power drain specifications. The FPF120x are controlled by a logic input (ON pin) compatible with standard CMOS GPIO circuitry found on Field Programmable MARKING DIAGRAM Gate Array (FPGA) embedded processors. The FPF120x are available in 0.76 mm x 0.76 mm 4−bump WLCSP. X&K X&2 Features &. &Z • 1.2 V to 5.5 V Input Voltage Operating Range • Typical R : ON XX (QL, QP, = Specific Device Code ♦ 45 m(cid:2) at VIN = 5.5 V QM, VS) ♦ 55 m(cid:2) at VIN = 3.3 V &K = 2−Digits Lot Run Traceability Code ♦ 90 m(cid:2) at VIN = 1.8 V &2 = 2−Digit Date Code ♦ 185 m(cid:2) at VIN = 1.2 V &. = Pin One Dot • &Z = Assembly Pant Code Slew Rate Control with t : R ♦ 100 (cid:3)s • ORDERING INFORMATION Output Discharge Function on FPF1204 • Low <1.5 (cid:3)A Quiescent Current See detailed ordering and shipping information on page8 of this data sheet. • ESD Protected: Above 7 kV HBM, 2 kV CDM • GPIO / CMOS−Compatible Enable Circuitry • 4−Bump, WLCSP 0.76 mm x 0.76 mm, 0.4 mm Pitch • These are Pb−Free Devices Applications • Mobile Devices and Smart Phones • Portable Media Devices • Tablet PCs • Advanced Notebook, UMPC, MID • Portable Medical Devices • GPS and Navigation Equipment © Semiconductor Components Industries, LLC, 2011 1 Publication Order Number: July, 2020 − Rev. 4 FPF1203/D

FPF1203, FPF1203L, FPF1204 APPLICATION DIAGRAM VIN VIN VOUT VOUT FPF1203/03L/04 + − CIN ON GND COUT Figure 1. Typical Application FUNCTIONAL BLOCK DIAGRAM FPF1203/03L/04 VIN VOUT CONTROL ON LOGIC Turn−On Slew Rate Controlled Driver R ESD Protection Output Discharge (Optional) GND Figure 2. Functional Block Diagram (Output Discharge for FPF1204) www.onsemi.com 2

FPF1203, FPF1203L, FPF1204 PIN CONFIGURATIONS Figure 3. WLCSP Bumps Facing Down Figure 4. WLCSP Bumps Facing Up (Top View) (Bottom View) VOUT A1 A2 VIN VIN A2 A1 VOUT GND B1 B2 ON ON B2 B1 GND Figure 5. Pin Assignments (Top View) Figure 6. Pin Assignments (Bottom View) PIN DEFINITONS Pin No. Name Description A1 VOUT Switch output A2 VIN Supply input: input to the power switch B1 GND Ground B2 ON ON/OFF Control, active HIGH; FPF1203/04 B2 ON ON/OFF Control, active LOW; FPF1203L ABSOLUTE MAXIMUM RATINGS Symbol Parameter Min Max Unit VIN VIN, VOUT, VON to GND −0.3 6.0 V ISW Maximum Continuous Switch Current at Ambient Operating Temperature − 2.2 A PD Power Dissipation at TA = 25°C − 1.0 W TSTG Storage Temperature Range −65 +150 °C (cid:4)JA Thermal Resistance, Junction−to−Ambient 1S2P with One Thermal Via (Note 1) − 110 °C/W 1S2P without Thermal Via (Note 2) − 95 ESD Electrostatic Discharge Capability (Note 1, 2) Human Body Model, JESD22−A114 7 − kV Charged Device Model, JESD22−C101 2 − Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected. 1. Measured using 2S2P JEDEC std. PCB. 2. Measured using 2S2P JEDEC PCB COLD PLATE Method. www.onsemi.com 3

FPF1203, FPF1203L, FPF1204 RECOMMENDED OPERATING CONDITIONS Symbol Parameter Min Max Unit VIN Input Voltage 1.2 5.5 V TA Ambient Operating Temperature −40 +85 °C Functional operation above the stresses listed in the Recommended Operating Ranges is not implied. Extended exposure to stresses beyond the Recommended Operating Ranges limits may affect device reliability. ELECTRICAL CHARACTERISTICS (Unless otherwise noted, VIN = 1.2 V to 5.5 V and TA = −40 to +85°C. Typical values are at VIN = 3.3 V and TA = 25°C.) Symbol Parameter Condition Min Typ Max Unit BASIC OPERATION VIN Supply Voltage 1.2 − 5.5 V IQ(OFF) Off Supply Current FPF1203/04 VON = GND, VOUT = Open, VIN = 5.5 V − 0.1 1.0 (cid:3)A FPF1203L VON = VIN, VOUT = Open, VIN = 5.5 V − 1.0 2.0 ISD Shutdown Current FPF1203/04 VON = GND, VOUT = GND − 0.1 1.0 (cid:3)A FPF1203L VON = VIN, VOUT = GND − 1.2 3.0 IQ Quiescent Current FPF1203/04 IOUT = 0 mA, VON = VIN, = 5.5 V − 0.1 1.5 (cid:3)A FPF1203L IOUT = 0 mA, VON = GND, VIN, = 5.5 V RON On Resistance VIN = 5.5 V, IOUT = 200 mA, TA = 25°C − 45 55 m(cid:2) (Note 3) VIN = 3.3 V, IOUT = 200 mA, TA = 25°C − 55 65 (Note 3) VIN = 1.8 V, IOUT = 200 mA, TA = 25°C − 90 100 (Note 3) VIN = 1.2 V, IOUT = 200 mA, TA = 25°C − 185 220 (Note 3) VIN = 1.8 V, IOUT = 200 mA, TA = 85°C − − 105 (Note 3) RPD Output Discharge RPULL DOWN VIN = 3.3 V, VON = OFF, IFORCE = 20 mA, − 65 75 (cid:2) TA = 25°C, FPF1204 VIH On Input Logic HIGH Voltage VIN = 1.2 V to 5.5 V 1.15 − − V VIL On Input Logic LOW Voltage VIN = 1.2 V to 5.5 V − − 0.65 V RON_PD Pull−Down Resistance at ON Pin VIN = 1.2 V to 5.5 V − 8.3 − M(cid:2) ION On Input Leakage VON = VIN or GND − − 1 (cid:3)A DYNAMIC CHARACTERISTICS tDON Turn−On Delay (Note 4) VIN = 3.3 V, RL = 10 (cid:2), CL = 0.1 (cid:3)F, − 70 − (cid:3)s TA = 25°C, FPF1204 tR VOUT Rise Time (Note 4) − 100 − tON Turn−On Time (Note 6) − 170 − tDOFF Turn−Off Delay (Note 4, 5) VIN = 3.3 V, RL = 10 (cid:2), CL = 0.1 (cid:3)F, − 0.5 − (cid:3)s TA = 25°C, FPF1203L tF VOUT Fall Time (Note 4, 5) − 2.0 − tOFF Turn−Off Time (Note 5, 7) − 2.5 − tDOFF Turn−Off Delay (Note 4, 5) VIN = 3.3 V, RL = 500 (cid:2), CL = 0.1 (cid:3)F, − 6 − (cid:3)s TA = 25°C, FPF1203L tF VOUT Fall Time (Note 4, 5) − 115 − tOFF Turn−Off Time (Note 5, 7) − 121 − tDOFF Turn−Off Delay (Note 4, 5) VIN = 3.3 V, RL = 10 (cid:2), CL = 0.1 (cid:3)F, − 4.0 − (cid:3)s TA = 25°C, FPF1203 tF VOUT Fall Time (Note 4, 5) − 2.9 − tOFF Turn−Off Time (Note 5, 7) − 7.3 − www.onsemi.com 4

FPF1203, FPF1203L, FPF1204 ELECTRICAL CHARACTERISTICS (Unless otherwise noted, VIN = 1.2 V to 5.5 V and TA = −40 to +85°C. Typical values are at VIN = 3.3 V and TA = 25°C.) (continued) Symbol Parameter Condition Min Typ Max Unit DYNAMIC CHARACTERISTICS tDOFF Turn−Off Delay (Note 4, 5) VIN = 3.3 V, RL = 500 (cid:2), CL = 0.1 (cid:3)F, − 6 − (cid:3)s TA = 25°C, FPF1203 tF VOUT Fall Time (Note 4, 5) − 115 − tOFF Turn−Off Time (Note 5, 7) − 121 − tDOFF Turn−Off Delay (Note 4, 5) VIN = 3.3 V, RL = 10 (cid:2), CL = 0.1 (cid:3)F, − 4.0 − (cid:3)s TA = 25°C, FPF1204 (Note 5) tF VOUT Fall Time (Note 4, 5) − 2.5 − tOFF Turn−Off Time (Note 5, 7) − 6.5 − tDOFF Turn−Off Delay (Note 4, 5) VIN = 3.3 V, RL = 500 (cid:2), CL = 0.1 (cid:3)F, − 6 − (cid:3)s TA = 25°C, FPF1204 (Note 5) tF VOUT Fall Time (Note 4, 5) − 11 − tOFF Turn−Off Time (Note 5, 7) − 17 − Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product performance may not be indicated by the Electrical Characteristics if operated under different conditions. 3. This parameter is guaranteed by design and characterization; not production tested. 4. tDON / tDOFF / tR / tF are defined in Figure 23. 5. Output discharge enabled during off−state. 6. tON = tR + tDON 7. tOFF = tF + tDOFF TYPICAL PERFORMANCE CHARACTERISTICS Figure 7. Shutdown Current vs. Temperature Figure 8. Shutdown Current vs. Supply Voltage Figure 9. Off Supply Current vs. Temperature Figure 10. Off Supply Current vs. Supply Voltage (V Floating) (V Floating) OUT OUT www.onsemi.com 5

FPF1203, FPF1203L, FPF1204 TYPICAL PERFORMANCE CHARACTERISTICS (Continued) Figure 11. Quiescent Current vs. Temperature Figure 12. Quiescent Current vs. Supply Voltage Figure 13. R vs. Temperature Figure 14. R vs. Supply Voltage ON ON 100 100 (cid:3)s A) 10 T ( N 1ms E R R U 1 10ms C N RDS(ON)Limit 100ms RAI Single Pulse 1s I, DD0.1 RθJTAA== 1 2150ooCC/W 1D0Cs 0.01 0.1 1 10 VDS, DRAIN−SOURCE VOLTAGE (V) Figure 15. ON Pin Threshold vs. V Figure 16. Drain Current vs. Drain−Source Voltage IN Safe Operating Area www.onsemi.com 6

FPF1203, FPF1203L, FPF1204 TYPICAL PERFORMANCE CHARACTERISTICS (Continued) Figure 17. Turn−On Response – FPF1203 / 04 (VIN = 3.3 V, CIN = 1 (cid:2)F, COUT = 0.1 (cid:2)F, RL = 10 (cid:3)) Figure 18. Turn−Off Response – FPF1203 Figure 19. Turn−Off Response – FPF1203 (VIN = 3.3 V, CIN = 1 (cid:2)F, COUT = 0.1 (cid:2)F, RL = 10 (cid:3)) (VIN = 3.3 V, CIN = 1 (cid:2)F, COUT = 0.1 (cid:2)F, RL = 500 (cid:3)) Figure 20. Turn−Off Response (VIN = 3.3 V, Figure 21. Turn−Off Response (VIN = 3.3 V, CIN = 1 (cid:2)F, COUT = 0.1 (cid:2)F, RL = 10 (cid:3), FPF1204) CIN = 1 (cid:2)F, COUT = 0.1 (cid:2)F, RL = 500 (cid:3), FPF1204) www.onsemi.com 7

FPF1203, FPF1203L, FPF1204 OPERATION AND APPLICATION DESCRIPTION The FPF1203 / 03L / 04 are low−R P−channel load C greater than C can cause V to exceed V when ON OUT IN OUT IN switches with controlled turn−on. The core of each device is the system supply is removed. This could result in current a 55 m(cid:2) P−channel MOSFET and controller capable of flow through the body diode from V to V . OUT IN functioning over a wide input operating range of 1.2 to 5.5 V. The FPF1204 contain a 65 (cid:2) on−chip load resistor for 90% 90% quick output discharge when the switch is turned off. V 10% 10% OUT tR tF VIN VIN VOUT VOUT 3.3 V FPF1204 50% 50% + − CINOFFON ON GND COUT VON 90% Figure 22. Typical Application VOUT 10% t t DON DOFF Input Capacitor To limit the voltage drop on the input supply caused by Figure 23. Timing Diagram for FPF1203/4 transient inrush current when the switch turns on into a discharged load capacitor or short−circuit, a capacitor must Board Layout be placed between the V and GND pins. A 1 (cid:3)F ceramic For best performance, traces should be as short as IN capacitor, C , placed close to the pins is usually sufficient. possible. To be most effective, input and output capacitors IN Higher−value C can be used to reduce the voltage drop in should be placed close to the device to minimize the effect IN higher−current applications. of parasitic trace inductance on normal and short−circuit operation. Using wide traces or large copper planes for all Output Capacitor pins (VIN, VOUT, ON, and GND) minimizes the parasitic A 0.1 (cid:3)F capacitor, COUT, should be placed between the electrical effects and the case−ambient thermal impedance. VOUT and GND pins. This capacitor prevents parasitic However, the VOUT pin should not connect directly to the board inductance from forcing VOUT below GND when the battery source due to the discharge mechanism of the load switch is on. CIN greater than COUT is highly recommended. switch. ORDERING INFORMATION Switch Top (Typical) Output ON Pin Part Number Mark at 3.3VIN Discharge Activity tR Package Shipping† FPF1203UCX QL 55 m(cid:2) NA Active HIGH 100 (cid:3)s 4−Bump, Wafer−Level 3000 / Tape & Reel Chip−Scale Package FPF1203LUCX QP 55 m(cid:2) NA Active LOW 100 (cid:3)s (WLCSP), 0.76 mm x 3000 / Tape & Reel FPF1204UCX QM 55 m(cid:2) 65 (cid:2) Active HIGH 100 (cid:3)s 0.76 mm, 0.4 mm Pitch 3000 / Tape & Reel †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. The table below pertains to the Packaging information on the following page. PRODUCT DIMENSIONS D E X Y 760 (cid:3)m ±30 (cid:3)m 760 (cid:3)m ±30 (cid:3)m 0.180 mm ±0.018 (cid:3)m 0.180 mm ±0.018 (cid:3)m IntelliMAX is trademark of Semiconductor Components Industries, LLC (SCILLC) or its subsidiaries in the United States and/or other countries. www.onsemi.com 8

MECHANICAL CASE OUTLINE PACKAGE DIMENSIONS WLCSP4 0.76x0.76x0.586 CASE 567SS ISSUE O DATE 30 NOV 2016 Electronic versions are uncontrolled except when accessed directly from the Document Repository. DOCUMENT NUMBER: 98AON16616G Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red. DESCRIPTION: WLCSP4 0.76x0.76x0.586 PAGE 1 OF 1 ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries. ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor the rights of others. © Semiconductor Components Industries, LLC, 2019 www.onsemi.com

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