Effective October 2015 Technical Data 4118 Supersedes April 2013 FP3 High current, low profile inductors Applications • Voltage Regulator Modules (VRMs) • Multi-phase regulators • Desktop and server VRMs and EVRDs • Notebook and laptop regulators • Battery power systems • Graphics cards • Point-of-load modules Product description Environmental data • Low profile high current inductors • Storage temperature range (component): -40°C to +155°C • Inductance range 0.1μh to 15μh • Operating temperature range: -40°C to • Design utilizes high temperature iron powder +155°C (ambient plus self temperature rise) alloy material with a non-organic binder to eliminate thermal aging • Solder reflow temperature: J-STD-020D • 7.25 x 6.7mm footprint surface mount package in a 3.0mm height Pb • Magnetically shielded, low EMI • Current rating up to 34.7Adc (Higher peak cur- rents may be attained with a greater rolloff, see rolloff curve) • Frequency range up to 2MHz

Technical Data 4118 FP3 Effective October 2015 High current, low profile inductors Product specifications OCL (uH) DCR mOhms DCR mOhms Part number6 ± 15% l 2 amps l 3 amps 10% l 4 amps 15% @ 20°C typ @ 20°C max K-factor5 rms sat sat FP3-R10-R 0.10 19.0 27 34.7 1.00 1.21 803 FP3-R20-R 0.22 15.3 16 20.8 1.54 1.88 482 FP3-R47-R 0.44 10.9 11.6 14.9 3.05 3.67 344 FP3-R68-R 0.72 9.72 9.0 11.6 3.85 4.63 268 FP3-1R0-R 1.10 6.26 7.4 9.5 9.40 11.2 219 FP3-1R5-R 1.50 5.78 6.2 8.0 10.0 13.1 185 FP3-2R0-R 2.00 5.40 5.4 6.9 11.5 15.0 161 FP3-3R3-R 3.20 3.63 4.3 5.5 24.5 30.0 127 FP3-4R7-R 4.70 3.23 3.5 4.2 34.9 40.0 105 FP3-8R2-R 8.5 2.91 2.6 3.4 61.6 74.0 78 FP3-100-R 10.9 2.30 2.3 3.0 84.2 101 69 FP3-150-R 14.9 2.22 2.0 2.5 106.0 127 59 1. OCL (Open Circuit Inductance) Test parameters: 100kHz, 0.1Vrms, 0.0Adc 5. K-factor: Used to determine Bp-p for core loss (see graph). Bp-p =K*L*ΔI. 2. I DC current for an approximate ΔT of 40°C without core loss. Derating is Bpp: (Gauss), K: (K factor from table), L: (Inductance in μH), ΔI (Peak to peak ripple rms necessary for AC currents. PCB layout, trace thickness and width, air-flow, and current in Amps). proximity of other heat generating components will affect the temperature rise. 6. Part number definition: It is recommended that the temperature of the part not exceed 155°C under FP3 = product code and size worst case operating conditions verified in the end application. xxx = inductance value in μH 3. I Amps Peak for approximately 10% rolloff @ 20°C R = decimal point (if no “R” is present, then last character equals the number of zeros) sat 4. I Amps Peak for approximately 15% rolloff @ 20°C “-R” suffix = RoHS complaint sat Dimensions–mm RECOMMENDED PAD LAYOUT SCHEMATIC 2.80 ±0.25 (2x) 1 1.0(2 mx)in. 1 FP3 3.00 Max XXX 7M.2a5x 7.50 YWWL 2.50 (2x) 2.80 ±0.25 2 (2x) 2 6.70 4.50 (2x) Max Part marking: FP3 (Product code and size), xxx=(inductance value in μH), R=decimal point (if no “R” is present, then last character equals the number of zeroes, YWW=Date code, L=Location code Packaging information (mm) Supplied in tape and reel packaging, 1700 parts per 13” diameter reel 1.5 Dia 1.5 Dia 4.0 2.0 A 1.75 1 7.5 16.0 FP3 7.5 XXX +/-0.3 YWWL 2 6.9 A 3.2 12.0 SECTION A-A Direction of Feed 2 www.eaton.com/elx

FP3 Technical Data 4118 High current, low profile inductors Effective October 2015 Inductance characteristics OCL vs. Isat 100 90 80 L C 70 O 60 of 50 % 40 30 20 10 0 0 20 40 60 80 100 120 140 160 180 200 % of Isat Core loss 1.00 Frequency (kHz) 0.90 200 0.80 W) 300 0.70 ( s 0.60 400 s o0.50 500 L 0.40 e 600 or0.30 C 700 0.20 0.10 800 0.00 900 250 500 750 1000 1250 1500 1750 2000 2250 1000 B p-p (Gauss) Temperature rise vs. total loss 140 ) 130 C 120 ° ( 110 e s 100 Ri 90 e 80 r 70 u t 60 a r 50 e 40 p m 30 20 e T 10 0 0.12 0.24 0.36 0.48 0.61 0.73 0.85 0.97 1.09 1.21 1.33 1.45 1.57 Total Loss (W) www.eaton.com/elx 3

Technical Data 4118 FP3 Effective October 2015 High current, low profile inductors Solder reflow profile TP Table 1 - Standard SnPb Solder (Tc) TC -5°C Max. Ramp Up Rate = 3°C/s tP Volume Volume Package mm3 mm3 Max. Ramp Down Rate = 6°C/s Thickness <350 ≥350 TL <2.5mm) 235°C 220°C Preheat t ≥2.5mm 220°C 220°C A e Tsmax atur Table 2 - Lead (Pb) Free Solder (Tc) per Volume Volume Volume Tem Tsmin ts PThacickkangees s m<3m503 m35m03 - 2000 m>2m003 0 <1.6mm 260°C 260°C 260°C 1.6 – 2.5mm 260°C 250°C 245°C >2.5mm 250°C 245°C 245°C 25°C Time 25°C to Peak Time Reference JDEC J-STD-020D Profile Feature Standard SnPb Solder Lead (Pb) Free Solder Preheat and Soak • Temperature min. (Tsmin) 100°C 150°C • Temperature max. (Tsmax) 150°C 200°C • Time (Tsmin to Tsmax) (ts) 60-120 Seconds 60-120 Seconds Average ramp up rate Tsmax to Tp 3°C/ Second Max. 3°C/ Second Max. Liquidous temperature (Tl) 183°C 217°C Time at liquidous (tL) 60-150 Seconds 60-150 Seconds Peak package body temperature (TP)* Table 1 Table 2 Time (tp)** within 5 °C of the specified classification temperature (Tc) 20 Seconds** 30 Seconds** Average ramp-down rate (Tp to Tsmax) 6°C/ Second Max. 6°C/ Second Max. Time 25°C to Peak Temperature 6 Minutes Max. 8 Minutes Max. * Tolerance for peak profile temperature (Tp) is defined as a supplier minimum and a user maximum. ** Tolerance for time at peak profile temperature (tp) is defined as a supplier minimum and a user maximum. Life Support Policy: Eaton does not authorize the use of any of its products for use in life support devices or systems without the express written approval of an officer of the Company. Life support systems are devices which support or sustain life, and whose failure to perform, when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in significant injury to the user. Eaton reserves the right, without notice, to change design or construction of any products and to discontinue or limit distribution of any products. Eaton also reserves the right to change or update, without notice, any technical information contained in this bulletin. Eaton Electronics Division 1000 Eaton Boulevard Cleveland, OH 44122 United States www.eaton.com/elx © 2015 Eaton All Rights Reserved Eaton is a registered trademark. Printed in USA Publication No. 4118 BU-SB13475 All other trademarks are property October 2015 of their respective owners.