Effective June 2017 Technical Data 10007 Supersedes September 2012 FP1007R6 High frequency, high current power inductors Applications • Multi-phase regulators • Voltage Regulator Modules (VRMs) • Desktop and server VRMs and EVRDs • Data networking and storage systems • Graphics cards and battery power systems • Point-of-Load modules • DCR Sensing Environmental data SMD Device • Storage temperature range (component): -40 °C to +125 °C Product features • Operating temperature range: -40 °C to +125 °C • 10.5 x 8.0 x 7.0mm Maximum surface mount (ambient plus self-temperature rise) package • Solder reflow temperature: • Ferrite core material J-STD-020 (latest revision) compliant • Controlled DCR tolerance for sensing circuits • Inductance Range from 150nH to 470nH Pb HHALOFGEN • Current range from 23.5 to 75 Amps FREE • Frequency range up to 2MHz • Halogen free, lead free, RoHS compliant

Technical Data 10007 FP1007R6 Effective June 2017 High frequency, high current power inductors Product Specifications Part OCL1 ±10% FLL2Min. Irms3 Isat14 @25°C Isat25 @100°C DCR @20°C Number7 (nH) (nH) (Amps) (Amps) (Amps) (mΩ) K-Factor 6 FP1007R6-R15-R 150 108 75.0 60.0 FP1007R6-R18-R 180 129 60.0 50.0 FP1007R6-R22-R 220 158 50.0 40.0 FP1007R6-R27-R 270 194 61 41.0 33.0 0.29 ± 5% 348.8 FP1007R6-R33-R 330 237 33.0 26.5 FP1007R6-R39-R 390 280 28.0 22.5 FP1007R6-R47-R 470 338 23.5 19.0 1.Open Circuit Inductance (OCL) Test Parameters: 100kHz, 0.10Vrms, 0.0Adc 5.Isat2: Peak current for approximately 20% rolloff at +100°C. 2.Full Load Inductance (FLL) Test Parameters: 100kHz, 0.1Vrms, Isat1 6.K-factor: Used to determine Bp-p for core loss (see graph). Bp-p = K * L 3.Irms: DC current for an approximate temperature rise of 40°C without core loss. Derating is * ∆I * 10-3. Bp-p:(Gauss), K: (K-factor from table), L: (Inductance in nH), necessary for AC currents. PCB layout, trace thickness and width, air-flow, and proximity of ∆I (peak-to-peak ripple current in Amps). other heat generating components will affect the temperature rise. It is recommended that 7.Part Number Definition: FP1007R6-Rxx-R the temperature of the part not exceed 125°C under worst case operating conditions FP1007R6 = Product code and size verified in the end application. Rxx= Inductance value in uH, R = decimal point 4.Isat1: Peak current for approximately 20% rolloff at +25°C. -R suffix = RoHS compliant Dimensions- mm The nominal DCR is measured from point "A" to point "B" Part Marking: 1007R6, Rxx = Inductance value in µH. (R = Decimal point) wwllyy = Date code R = Revision level Tolerance are ±0.15mm unless otherwise specified. Soldering surfaces to be coplanar within 0.1016mm. PCB tolerance ±0.1mm unless otherwise specified. Packaging information - mm 1.5 dia 2.0 1.75 1.5 dia 4.0 A 11.5 1 24.0 ±0.30 10.60 2 8.1 Supplied in Tape-and-Reel packaging, 700 parts per 13 inch diameter reel. 12.0 A 7.1 SECTION A-A 2 www.eaton.com/electronics

FP1007R6 Technical Data 10007 High frequency, high current power inductor Effective June 2017 Temperature rise vs total loss 60 50 C) e (° 40 s Ri ure 30 at er p m 20 e T 10 0 0.0 0.4 0.8 1.2 1.6 2.0 Total Loss (W) Core loss vs Bp-p 1MHz 500kHz 10 300kHz 200kHz 1 100kHz W) 0.1 s ( s o L e 0.01 or C 0.001 0.0001 0.00001 100 1000 10000 Bp-p (Gauss) Inductance characteristics % of OCL vs. I 1 sat 100% 80% 60% L C O of % 40% -40°C +100°C +25°C 20% 0% 0% 20% 40% 60% 80% 100% 120% 140% 160% % of Isat1 www.eaton.com/electronics 3

Technical Data 10007 FP1007R6 Effective June 2017 High frequency, high current power inductor Solder Reflow Profile TP TTaabbllee 11 -- SSttaannddaarrdd SSnnPPbb SSoollddeerr ((TTcc)) TC -5°C Max. Ramp Up Rate = 3°C/s tP Volume Volume Max. Ramp Down Rate = 6°C/s Package mm3 mm3 Thickness <350 >_350 TL <2.5mm 235°C 220°C Preheat t A >_2.5mm 220°C 220°C e Tsmax atur TTaabbllee 22 -- LLeeaadd ((PPbb)) FFrreeee SSoollddeerr ((TTcc)) per Volume Volume Volume Tem Tsmin ts Package mm3 mm3 mm3 Thickness <350 350 - 2000 >2000 <1.6mm 260°C 260°C 260°C 1.6 – 2.5mm 260°C 250°C 245°C >2.5mm 250°C 245°C 245°C 25°C Time 25°C to Peak Time Reference JDEC J-STD-020 Profile Feature Standard SnPb Solder Lead (Pb) Free Solder Preheat and Soak (cid:129)Temperature min.(Tsmin) 100°C 150°C (cid:129)Temperature max.(Tsmax) 150°C 200°C (cid:129)Time (Tsminto Tsmax) (ts) 60-120 Seconds 60-120 Seconds Average ramp up rate Tsmaxto Tp 3°C/ Second Max. 3°C/ Second Max. Liquidous temperature (TL) 183°C 217°C Time at liquidous (tL) 60-150 Seconds 60-150 Seconds Peak package body temperature (TP)* Table 1 Table 2 Time (tp)** within 5 °C of the specified classification temperature (Tc) 20 Seconds** 30 Seconds** Average ramp-down rate (Tpto Tsmax) 6°C/ Second Max. 6°C/ Second Max. Time 25°C to Peak Temperature 6 Minutes Max. 8 Minutes Max. *Tolerance for peak profile temperature (Tp) is defined as a supplier minimum and a user maximum. ** Tolerance for time at peak profile temperature (tp) is defined as a supplier minimum and a user maximum. Life Support Policy: Eaton does not authorize the use of any of its products for use in life support devices or systems without the express written approval of an officer of the Company. Life support systems are devices which support or sustain life, and whose failure to perform, when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in significant injury to the user. Eaton reserves the right, without notice, to change design or construction of any products and to discontinue or limit distribution of any products. Eaton also reserves the right to change or update, without notice, any technical information contained in this bulletin. Eaton Electronics Division 1000 Eaton Boulevard Cleveland, OH 44122 United States www.eaton.com/electronics © 2017 Eaton All Rights Reserved Eaton is a registered trademark. Printed in USA Publication No. 10007 BU-SB12795 All other trademarks are property June 2017 of their respective owners.