Effective June 2017 Technical Data 4338 Supersedes December 2008 FP1006 High frequency, high current power inductors Applications • Multi-phase regulators • Voltage Regulator Module (VRM) • Point-of-load modules • Desktop and server VRMs and EVRDs • Data networking and storage systems SMD Device • Graphics cards and battery power systems • DCR sensing Environmental data • Storage temperature range (component): -40 °C to +125 °C Product features • Operating temperature range: -40 °C to +125 °C • 10.2 x 8.0 x 6.0mm surface mount package (ambient plus self-temperature rise) • Ferrite core material • Solder reflow temperature: • High current carrying capacity, Low core losses J-STD-020 (latest revision) compliant • Controlled DCR tolerance for sensing circuits • Inductance range from 85nH to 220nH Pb HHALOFGEN • Current range from 38 to 100 amps FREE • Frequency range up to 2MHz

Technical Data 4338 FP1006 Effective June 2017 High frequency, high current power inductors Product Specifications Part Numbe7r OCL1± 10% (nH)FLL2Min. (nH) Irms3(Amps)Isat14@ 25°C (Amps)Isat25@ 125°C (Amps) DCR (mΩ) @ 20°C K-factor6 R1 Version FP1006R1-R08-R 85 61 100 70 454 FP1006R1-R10-R 100 72 85 64 454 FP1006R1-R12-R 120 86 53 71 53 0.27 ± 12% 454 FP1006R1-R16-R 160 115 55 40 454 FP1006R1-R22-R 220 158 38 28 454 R2 Version FP1006R2-R08-R 85 61 100 70 454 FP1006R2-R10-R 100 72 85 64 454 FP1006R2-R12-R 120 86 45 71 53 0.36 ± 8.6% 454 FP1006R2-R16-R 160 115 55 40 454 FP1006R2-R22-R 220 158 38 28 454 1 Open Circuit Inductance (OCL) Test Parameters:100kHz,0.10Vrms,0.0Adc 4 Isat1:Peak current for approximately 20% rolloff at +25°C. 2 Full Load Inductance (FLL) Test Parameters:100kHz,0.1Vrms,Isat1 5 Isat2:Peak current for approximately 20% rolloff at +125°C. 3 Irms:DC current for an approximate temperature rise of 40°C without core loss.Derating is 6 K-factor:Used to determine Bp-pfor core loss (see graph).Bp-p= K *L *ΔI *10-3,Bp-p :(Gauss), necessary for AC currents.PCB pad layout,trace thickness and width,air-flow and proximity of K:(K-factor from table),L:(inductance in nH),ΔI (peak-to-peak ripple current in amps). other heat generating components will affect the temperature rise.It is recommended the part 7 Part Number Definition:FP1006Rx-Rxx-R temperature not exceed 125°C under worst case operating conditions verified in the end (cid:129) FP1006 = Product code and size (cid:129) Rx is the DCR indicator application. (cid:129) Rxx= Inductance value in μH,R = decimal point (cid:129) “-R”suffix = RoHS compliant Dimensions- mm Top View Side View Bottom View Recommended Pad Layout Schematic 6.0 max 8.0 max 2.8 ± 0.1 3.1 1.92 b 1 1 1.52 ± 0.2 6.56 1006Rx A 6.9 ref Rxx 2 wwllyy R 1.52 ± 0.2 2 a 1.92 8.0 Part Number Amax FP1006R1-R 10.2 The nominal DCR is measured from point “a”to point”b.” FP1006R2-R 10 Part Marking: 1006Rx (Rx = DCR Indicator) Rxx = Inductance value in μH.(R = Decimal point) wwllyy = Date code R = Revision level Packaging information - mm 1.5 dia 1.5 dia 4.0 A 2.0 1.75 1 11.5 24.0 1006Rx +/-0.3 10.3 Rxx wwllyyR 2 8.1 A 6.1 12.0 User direction of feed SECTION A-A Supplied in tape-and-reel packaging,850 parts per reel,13”diameter reel. 2 www.eaton.com/electronics

FP1006 Technical Data 4338 High frequency, high current power inductor Effective June 2017 Temperature rise vs total loss 60 50 )C ° e ( 40 s Ri e ur 30 at er p m 20 e T 10 0 0 0.2 0.4 0.6 0.8 1 1.2 1.4 Total Loss (W) Core loss vs Bp-p 1MHz 10 500kHz 300kHz 200kHz 1 100kHz 0.1 W) s ( s Lo 0.01 e or C 0.001 0.0001 0.00001 100 1000 10,000 B p - p (Gauss) Inductance characteristics % of OCL vs. % of I 1 sat 100% -40°C 80% L C 60% O +25°C f o 40% % 20% +125°C 0% 0% 20% 40% 60% 80% 100% 120% % of I 1 sat www.eaton.com/electronics 3

Technical Data 4338 FP1006 Effective June 2017 High frequency, high current power inductor Solder Reflow Profile TP T -5°C TTaabbllee 11 -- SSttaannddaarrdd SSnnPPbb SSoollddeerr ((TTcc)) C Max. Ramp Up Rate = 3°C/s tP Volume Volume Max. Ramp Down Rate = 6°C/s Package mm3 mm3 T Thickness <350 >_350 L Preheat t <2.5mm 235°C 220°C A >_2.5mm 220°C 220°C T e smax atur TTaabbllee 22 -- LLeeaadd ((PPbb)) FFrreeee SSoollddeerr ((TTcc)) mper Tsmin Volume Volume Volume e t Package mm3 mm3 mm3 T s Thickness <350 350 - 2000 >2000 <1.6mm 260°C 260°C 260°C 1.6 – 2.5mm 260°C 250°C 245°C >2.5mm 250°C 245°C 245°C 25°C Time 25°C to Peak Time Reference JDEC J-STD-020 Profile Feature Standard SnPb Solder Lead (Pb) Free Solder Preheat and Soak (cid:129)Temperature min.(Tsmin) 100°C 150°C (cid:129)Temperature max.(Tsmax) 150°C 200°C (cid:129)Time (Tsminto Tsmax) (ts) 60-120 Seconds 60-120 Seconds Average ramp up rate Tsmaxto Tp 3°C/ Second Max. 3°C/ Second Max. Liquidous temperature (TL) 183°C 217°C Time at liquidous (tL) 60-150 Seconds 60-150 Seconds Peak package body temperature (TP)* Table 1 Table 2 Time (tp)** within 5 °C of the specified classification temperature (Tc) 20 Seconds** 30 Seconds** Average ramp-down rate (Tpto Tsmax) 6°C/ Second Max. 6°C/ Second Max. Time 25°C to Peak Temperature 6 Minutes Max. 8 Minutes Max. *Tolerance for peak profile temperature (Tp) is defined as a supplier minimum and a user maximum. ** Tolerance for time at peak profile temperature (tp) is defined as a supplier minimum and a user maximum. Life Support Policy: Eaton does not authorize the use of any of its products for use in life support devices or systems without the express written approval of an officer of the Company. Life support systems are devices which support or sustain life, and whose failure to perform, when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in significant injury to the user. Eaton reserves the right, without notice, to change design or construction of any products and to discontinue or limit distribution of any products. Eaton also reserves the right to change or update, without notice, any technical information contained in this bulletin. Eaton Electronics Division 1000 Eaton Boulevard Cleveland, OH 44122 United States www.eaton.com/electronics © 2017 Eaton All Rights Reserved Eaton is a registered trademark. Printed in USA Publication No. 4338 BU-SB08861 All other trademarks are property June 2017 of their respective owners.