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FP0906R1-R22-R产品简介:
ICGOO电子元器件商城为您提供FP0906R1-R22-R由Bussmann/Cooper设计生产,在icgoo商城现货销售,并且可以通过原厂、代理商等渠道进行代购。 FP0906R1-R22-R价格参考。Bussmann/CooperFP0906R1-R22-R封装/规格:固定值电感器, 220nH 无屏蔽 绕线 电感器 51A 0.29 毫欧 非标准 。您可以下载FP0906R1-R22-R参考资料、Datasheet数据手册功能说明书,资料中有FP0906R1-R22-R 详细功能的应用电路图电压和使用方法及教程。
参数 | 数值 |
品牌 | Coiltronics / Eaton |
产品目录 | 无源元件 |
描述 | 固定电感器 Flat Pac,215nH 2 PADS, SMT |
产品分类 | 电感器 |
产品手册 | |
产品图片 | |
rohs | 符合RoHS |
产品系列 | 固定电感器,Coiltronics / Eaton FP0906R1-R22-R |
产品型号 | FP0906R1-R22-R |
产品 | Power Inductors |
产品种类 | 固定电感器 |
单位重量 | 453.592 mg |
商标 | Coiltronics / Eaton |
商标名 | Flat-Pac |
外壳宽度 | 6.2 mm |
外壳长度 | 9.4 mm |
外壳高度 | 8 mm |
容差 | 10 % |
封装 | Reel |
屏蔽 | Unshielded |
工作温度范围 | - 40 C to + 125 C |
工厂包装数量 | 600 |
最大直流电流 | 44 A |
最大直流电阻 | 290 uOhms |
测试频率 | 100 kHz |
电感 | 220 nH |
端接类型 | SMD/SMT |
类型 | High Frequency High Current Inductor |
系列 | FP0906 |
芯体材料 | Ferrite |
Effective June 2015 Technical Data 4407 Supersedes March 2014 FP0906 High frequency, high current power inductors Applications • Multi-phase and Vcore regulators • Voltage Regulator Modules (VRMs) • Desktop and server VRMs and EVRDs • Data networking and storage systems • Graphics cards and battery power systems • Point-of-Load modules • DCR Sensing circuits Environmental Data • Storage temperature range (Component): -40°C to +125°C • Operating temperature range: -40°C to +125°C (ambient + self-temperature rise) Product Description • Solder reflow temperature: J-STD-020D • High current carrying capacity compliant • Low core loss • Controlled DCR for sensing circuits Pb HHALOFGEN • Frequency range up to 2MHz FREE • Inductance Range from 100nH to 300nH • Current range from 32.5 to 94 amps • 9.6x6.45mm footprint surface mount package in a 8.0mm height • Ferrite core material • Halogen free, lead free, RoHS compliant
Technical Data 4407 FP0906 Effective June 2015 High frequency, high current power inductors Product specifications OCL1 FLL2 I 3 I 14 I 25 DCR (mΩ) ±5% rms sat sat Part Number7 (nH) ±10% (nH) minimum (amps) (amps) (amps) @ 20°C K-factor6 FP0906R1-R10-R 100 72 51 94 81 0.29 451 FP0906R1-R12-R 120 86 51 79 68 0.29 451 FP0906R1-R15-R 150 108 51 65 55 0.29 451 FP0906R1-R18-R 180 129 51 55 45 0.29 451 FP0906R1-R22-R 220 155 51 44 37.5 0.29 451 FP0906R1-R28-R 280 200 51 34 29 0.29 451 FP0906R1-R30-R 300 216 51 32.5 27.5 0.29 451 1 Open Circuit Inductance (OCL) Test Parameters: 100kHz, 1.0Vrms, 0.0Adc, +25°C 5. I 2: Peak current for approximately 20% rolloff @ +125°C sat 2. Full Load Inductance (FLL) Test Parameters: 100kHz, 1.0Vrms, I 1, +25°C 6. K-factor: Used to determine B for core loss (see graph). B = K * L * I * 10-3. B :(Gauss), K: (K- sat p-p p-p pp 3. I : DC current for an approximate temperature rise of 40°C without core loss. Derating is necessary factor from table), L: (Inductance in nH), I (Peak to peak ripple current in Amps). rms for AC currents. PCB layout, trace thickness and width, air-flow, and proximity of other heat 7. Part Number Definition: FP0906Rx-Rxx-R generating components will affect the temperature rise. It is recommended that the temperature FP0906 = Product code and size of the part not exceed 125°C under worst case operating conditions verified in the end application. Rx= DCR indicator 4. I 1 : Peak current for approximately 20% rolloff @ +25°C Rxx= Inductance value in uH, R= decimal point sat -R suffix = RoHS compliant Dimensions–mm Recommended Pad Layout Schematic 6.2 8.0 ±0.2 max a 2.3 2.54 ±0.2 1 1 0.3 ref 10.40 4.00 0906Rx Rxx 2 wwllyy R 2 b 2.14 ±0.2 Part marking: 0906Rx (Rx=DCR indicator), Rxx=Inductance value in uH (R=decimal point), www=date code R=revision level The nominal DCR is measured between point “a” and point “b” Soldering surfaces to be coplanar within 0.1 millimeters Do not route traces or vias underneath the inductor Packaging–mm Supplied in tape and reel packaging , 600 parts per 13” diameter reel 4.0 1.5 dia 1.75 2.0 9.7 24.00 ±0.3 11.5 12.0 1.5 dia 6.5 8.0 User direction of feed 2 www.eaton.com/elx
FP0906 Technical Data 4407 High frequency, high current power inductors Effective June 2015 Temperature rise vs. total loss 50 45 40 35 C) e (° 30 s Ri 25 e r u t 20 a r e p 15 m e T 10 5 0 0 1 2 3 4 5 6 7 8 9 0 1 2 3 4 0. 0. 0. 0. 0. 0. 0. 0. 0. 0. 1. 1. 1. 1. 1. Total Loss (W) Core loss vs Bp-p 1.0MHz 10 500kHz 300kHz 1 100kHz 0.1 W) s ( 0.01 s o L e or 0.001 C 0.0001 0.00001 0 0 0 0 0 0 1 0 0 1 0 1 B (Gauss) p-p Inductance characteristics % of OCL vs. % of I 1 sat % of OCL vs. % of I 1 FP0906R1-R10 to R18 sat FP0906R1-R22 to R30 110% 110% 100% 100% 90% 90% L OC 80% -40C L 80% of 70% OC 70% % 60% +25C of -40C % 60% 50% 50% +25C 40% +125C +85C 40% +125C +85C 30% 30% % % % % % % % % % % % % % % % % % % % % % % % % % % % % % % 0 10 20 30 40 50 60 70 80 90 100 110 120 130 140 0 10 20 30 40 50 60 70 80 90 100 110 120 130 140 % of I 1 % of I 1 sat sat www.eaton.com/elx 3
Technical Data 4407 FP0906 Effective June 2015 High frequency, high current power inductors Solder reflow profile TP Table 1 - Standard SnPb Solder (Tc) TC -5°C Max. Ramp Up Rate = 3°C/s tP Volume Volume Package mm3 mm3 Max. Ramp Down Rate = 6°C/s Thickness <350 ≥350 TL <2.5mm) 235°C 220°C Preheat t ≥2.5mm 220°C 220°C A e Tsmax atur Table 2 - Lead (Pb) Free Solder (Tc) per Volume Volume Volume Tem Tsmin ts PThacickkangees s m<3m503 m35m03 - 2000 m>2m003 0 <1.6mm 260°C 260°C 260°C 1.6 – 2.5mm 260°C 250°C 245°C >2.5mm 250°C 245°C 245°C 25°C Time 25°C to Peak Time Reference JDEC J-STD-020D Profile Feature Standard SnPb Solder Lead (Pb) Free Solder Preheat and Soak • Temperature min. (Tsmin) 100°C 150°C • Temperature max. (Tsmax) 150°C 200°C • Time (Tsmin to Tsmax) (ts) 60-120 Seconds 60-120 Seconds Average ramp up rate Tsmax to Tp 3°C/ Second Max. 3°C/ Second Max. Liquidous temperature (Tl) 183°C 217°C Time at liquidous (tL) 60-150 Seconds 60-150 Seconds Peak package body temperature (TP)* Table 1 Table 2 Time (tp)** within 5 °C of the specified classification temperature (Tc) 20 Seconds** 30 Seconds** Average ramp-down rate (Tp to Tsmax) 6°C/ Second Max. 6°C/ Second Max. Time 25°C to Peak Temperature 6 Minutes Max. 8 Minutes Max. * Tolerance for peak profile temperature (Tp) is defined as a supplier minimum and a user maximum. ** Tolerance for time at peak profile temperature (tp) is defined as a supplier minimum and a user maximum. Life Support Policy: Eaton does not authorize the use of any of its products for use in life support devices or systems without the express written approval of an officer of the Company. Life support systems are devices which support or sustain life, and whose failure to perform, when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in significant injury to the user. Eaton reserves the right, without notice, to change design or construction of any products and to discontinue or limit distribution of any products. Eaton also reserves the right to change or update, without notice, any technical information contained in this bulletin. Eaton Electronics Division 1000 Eaton Boulevard Cleveland, OH 44122 United States www.eaton.com/elx © 2015 Eaton All Rights Reserved Eaton is a registered trademark. Printed in USA Publication No. 4407 BU-SB14111 All other trademarks are property June 2015 of their respective owners.