Effective December 2015 Technical Data 4343 Supersedes September 2008 FP0807 High frequency, high current power inductors Applications • Multi-phase and Vcore regulators • Voltage Regulator Module (VRM) • Desktop and server VRMs and EVRDs • Data networking and storage systems • Graphics cards and battery power systems • Point-of-load modules Environmental Data • Storage temperature range: -40°C to +125°C • Operating temperature range: -40°C to +125°C (ambient plus self-temperature rise) Product description • Solder reflow temperature: J-STD-020D compliant • High current carrying capacity • Low core losses Pb HHALOFGEN • Inductance range from 70nH to 220nH FREE • Current range from 35 to 108 amps • Frequency range up to 2MHz • 7.4 x 7.6 footprint surface mount package in a 7.0mm height • Ferrite core material • Halogen free, lead free, RoHS compliant

Technical Data 4343 FP0807 Effective December 2015 High frequency, high current power inductors Product Specifications I sat25 DCR (mΩ) Part Number7 OCL1 (nH) ±10% FLL2 (nH) min Irms3 (amps) Isat14 (amps) (amps) ±6% @ 20°C K-factor6 R1 version FP0807R1-R07-R 70 50 45 108 79 0.50 520 FP0807R1-R10-R 100 72 45 77 55 0.50 520 FP0807R1-R12-R 120 86 45 66 48 0.50 520 FP0807R1-R16-R 160 115 45 48 36 0.50 520 FP0807R1-R18-R 180 129 45 42 32 0.50 520 FP0807R1-R20-R 200 144 45 38 28 0.50 520 FP0807R1-R22-R 220 158 45 35 25 0.50 520 1. Open Circuit Inductance (OCL) Test Parameters: 100kHz, 0.10Vrms, 0.0Adc @25°C 5. Isat2: Peak current for approximately 20% rolloff at +125°C. 2. Full Load Inductance (FLL) Test Parameters: 100kHz, 0.1Vrms, Isat1 @25°C 6. K-factor: Used to determine Bp-p for core loss (see graph). Bp-p = K * L * ∆I * 10-3, Bp-p : (Gauss), K: (K-factor from 3. Irms: DC current for an approximate temperature rise of 40°C without core loss. Derating is necessary for AC table), L: (inductance in nH), ∆I (peak-to-peak ripple current in amps). currents. PCB pad layout, trace thickness and width, air-flow and proximity of other heat generating components will 7. Part Number Definition: FP0807Rx-Rxx-R affect the temperature rise. It is recommended the part temperature not exceed 125°C under worst case operating • FP0807R = Product code and size conditions verified in the end application. • x is the version indicator 4. Isat1: Peak current for approximately 20% rolloff at +25°C. • -Rxx= Inductance value in μH, R = decimal point • “-R” suffix = RoHS compliant Dimensions (mm) Recommended Pad Layout Schematic 7.4 max 7.0 2.0 max b 1 2.6 3.3 1 typ. 0807Rx 7.6 2.7 Rxx max wwllyy R 2.0 2 +/-0.2 2 2 a 1.55 2.6 +/-0.2 Part marking: 0807Rx (x= version indicator ) Rxx (xx=inductance value in uH, R= decimal point) wwllyy = date code, R = revision level DCR measured from point “a” to point “b” Do not route traces or vias underneath the inductor Packaging information (mm) Supplied in tape-and-reel packaging, 600 parts per reel, 13” diameter reel. 4.0 1.5 dia. 1.5 dia. 2.0 A 1.75 1 7.5 16.0 9.5 08R0x7xRx +/-0.3 wwllyy R 2 7.7 16.0 A 7.0 7.5 User direction of feed Section A-A 2 www.eaton.com/elx

FP0807 Technical Data 4343 High frequency, high current power inductors Effective December 2015 Temperature rise vs.total loss 50 40 C) ° e( Ris30 e ur at er20 p m e T 10 0 0 0.2 0.4 0.6 0.8 11. 2 1.4 1.6 1.8 2 Total Loss (W) Core loss Core Loss vs. Bp-p 1MHz 10 500kHz 300kHz 200kHz 1 100kHz ) 0.1 W s ( s o 0.01 L e r o C 0.001 0.0001 0.00001 100 1000 10000 Bp - p (Gauss) Inductance characteristics % of OCL vs. % of Isat1 100% 90% 80% -40°C 70% +25°C L 60% C +125°C O of 50% % 40% 30% 20% 10% 0% 0% 20% 40% 60% 80% 100% 120% 140% 160% % of Isat1 www.eaton.com/elx 3

Technical Data 4343 FP0807 Effective December 2015 High frequency, high current power inductors Solder reflow profile TP Table 1 - Standard SnPb Solder (Tc) TC -5°C Max. Ramp Up Rate = 3°C/s tP Volume Volume Package mm3 mm3 Max. Ramp Down Rate = 6°C/s Thickness <350 ≥350 TL <2.5mm) 235°C 220°C Preheat t ≥2.5mm 220°C 220°C A e Tsmax atur Table 2 - Lead (Pb) Free Solder (Tc) per Volume Volume Volume Tem Tsmin ts PThacickkangees s m<3m503 m35m03 - 2000 m>2m003 0 <1.6mm 260°C 260°C 260°C 1.6 – 2.5mm 260°C 250°C 245°C >2.5mm 250°C 245°C 245°C 25°C Time 25°C to Peak Time Reference JDEC J-STD-020D Profile Feature Standard SnPb Solder Lead (Pb) Free Solder Preheat and Soak • Temperature min. (Tsmin) 100°C 150°C • Temperature max. (Tsmax) 150°C 200°C • Time (Tsmin to Tsmax) (ts) 60-120 Seconds 60-120 Seconds Average ramp up rate Tsmax to Tp 3°C/ Second Max. 3°C/ Second Max. Liquidous temperature (Tl) 183°C 217°C Time at liquidous (tL) 60-150 Seconds 60-150 Seconds Peak package body temperature (TP)* Table 1 Table 2 Time (tp)** within 5 °C of the specified classification temperature (Tc) 20 Seconds** 30 Seconds** Average ramp-down rate (Tp to Tsmax) 6°C/ Second Max. 6°C/ Second Max. Time 25°C to Peak Temperature 6 Minutes Max. 8 Minutes Max. * Tolerance for peak profile temperature (Tp) is defined as a supplier minimum and a user maximum. ** Tolerance for time at peak profile temperature (tp) is defined as a supplier minimum and a user maximum. Life Support Policy: Eaton does not authorize the use of any of its products for use in life support devices or systems without the express written approval of an officer of the Company. Life support systems are devices which support or sustain life, and whose failure to perform, when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in significant injury to the user. Eaton reserves the right, without notice, to change design or construction of any products and to discontinue or limit distribution of any products. Eaton also reserves the right to change or update, without notice, any technical information contained in this bulletin. Eaton Electronics Division 1000 Eaton Boulevard Cleveland, OH 44122 United States www.eaton.com/elx © 2015 Eaton All Rights Reserved Eaton is a registered trademark. Printed in USA Publication No. 4343 BU-SB08620 All other trademarks are property December 2015 of their respective owners.