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F O D M May 2010 6 1 1 — FODM611 H i g High Noise Immunity, 5V, 10Mbit/sec Logic Gate Output h N (Open Collector) Optocoupler o i s e Features Description Im m ■ High Noise Immunity characterized by common mode The FODM611 is a 5V high-speed logic gate output u transient immunity (CMTi) (open collector) optocoupler, which supports isolated n i – 20kV/µs Minimum CMTi communications allowing digital signals to communicate ty ■ High Speed between systems without conducting ground loops or , 5 hazardous voltages. It utilizes Fairchild’s proprietary V – 10Mbit/sec Date Rate (NRZ) coplanar packaging technology, Optoplanar®, and , 1 – 100ns max. Propagation Delay optimized IC design to achieve high noise immunity, 0 M – 35ns max. Pulse Width Distortion characterized by high common mode transient immunity b – 40ns max. Propagation Delay Skew specifications. it / ■ -40 to +85°C temperature range This optocoupler consists of an AlGaAS LED at the se ■ Safety and regulatory approvals input, optically coupled to a high speed integrated photo- c L – UL1577, 3750 VACRMS for 1 min. detector logic gate. The output of the detector IC is an o open collector schottky-clamped transistor. The coupled g – IEC60747-5-2 (pending approval) i parameters are guaranteed over the wide temperature c Applications range of -40°C to +85°C. A maximum input signal of G a 5mA will provide a minimum output sink current of 13mA t ■ Microprocessor system interface (fan out of 8). e – SPI, I2C O u Related Resources ■ Industrial fieldbus communications tp – DeviceNet, CAN, RS485 ■ www.fairchildsemi.com/products/opto/ u t ■ Programmable logic control ■ www.fairchildsemi.com/pf/FO/FODM8061.html (O ■ Isolated data acquisition system ■ www.fairchildsemi.com/pf/FO/FODM8071.html p e ■ Voltage level translator n ■ Isolating MOSFET/IGBT gate drivers C o l l e c t o r ) O p Functional Schematic t o c o Truth Table u p ANODE 1 6 VCC LED Output le r Off High 5 VO On Low CATHODE 3 4 GND ©2009 Fairchild Semiconductor Corporation www.fairchildsemi.com FODM611 Rev. 1.0.3

F O Pin Definitions D M Number Name Function Description 6 1 1 ANODE Anode 1 — 3 CATHODE Cathode 4 GND Output Ground H i g 5 VO Output Voltage h 6 V Output Supply Voltage N CC o i s e Safety and Insulation Ratings for Mini-Flat Package (SO5 Pin) I m As per IEC60747-5-2 (Pending Certification). This optocoupler is suitable for “safe electrical insulation” only within the m safety limit data. Compliance with the safety ratings shall be ensured by means of protective circuits. u n Symbol Parameter Min. Typ. Max. Unit it y Installation Classifications per DIN VDE 0110/1.89 Table 1 , 5 V For rated main voltage < 150Vrms I-IV , 1 For rated main voltage < 300Vrms I-III 0 M Climatic Classification 40/85/21 b i Pollution Degree (DIN VDE 0110/1.89) 2 t / s CTI Comparative Tracking Index 175 e c V Input to Output Test Voltage, Method b, 1060 PR L VIORM x 1.875 = V , 100% Production Test with o PR g t = 1 sec, Partial Discharge < 5 pC m ic VPR Input to Output Test Voltage, Method a, 848 G VIORM x 1.5 = V , Type and Sample Test with a PR t t = 60 sec, Partial Discharge < 5 pC e m O V Max Working Insulation Voltage 565 V IORM peak u VIOTM Highest Allowable Over Voltage 4000 Vpeak tp u External Creepage 5.0 mm t ( External Clearance 5.0 mm O p Insulation thickness 0.5 mm e n TCase Safety Limit Values, Maximum Values allowed in the event 150 °C C of a failure, Case Temperature o RIO Insulation Resistance at TS, VIO = 500V 109 Ω lle c t o r ) O p t o c o u p l e r ©2009 Fairchild Semiconductor Corporation www.fairchildsemi.com FODM611 Rev. 1.0.3 2

F O Absolute Maximum Ratings (T =25ºC unless otherwise specified) D A M Stresses exceeding the absolute maximum ratings may damage the device. The device may not function or be 6 operable above the recommended operating conditions and stressing the parts to these levels is not recommended. In 1 1 addition, extended exposure to stresses above the recommended operating conditions may affect device reliability. The absolute maximum ratings are stress ratings only. — H Symbol Parameter Value Units i g h TSTG Storage Temperature -40 to +125 ºC N T Operating Temperature -40 to +85 ºC o OPR i s TJ Junction Temperature -40 to +125 ºC e I T Lead Solder Temperature 260 for 10sec ºC m SOL (Refer to Reflow Temperature Profile) m u IF Forward Current 50 mA n i VR Reverse Voltage 5.0 V ty , V Supply Voltage 0 to 7.0 V 5 CC V V Output Voltage -0.5 to V +0.5 V , O CC 1 0 IO Average Output Current 50 mA M PD Input Power Dissipation(1)(2) 100 mW b I i t PD Output Power Dissipation(1)(2) 85 mW /s O e c Recommended Operating Conditions L o The Recommended Operating Conditions table defines the conditions for actual device operation. Recommended g i operating conditions are specified to ensure optimal performance to the datasheet specifications. Fairchild does not c recommend exceeding them or designing to Absolute Maximum Ratings. G a t Symbol Parameter Min. Max. Unit e O T Ambient Operating Temperature -40 +85 ºC A u V Supply Voltages(3) 4.5 5.5 V tp CC u V Logic Low Input Voltage 0 0.8 V t FL ( O I Logic High Input Current 6.3 15 mA FH p I Logic Low Input Current 250 µA e FL n N Fan Out (at R = 1kΩ) 5 TTL Loads C L o RL Output Pull-up Resistor 330 4k Ω ll e c t Isolation Characteristics (T =25ºC) o A r ) Symbol Parameter Test Conditions Min. Typ. Max. Units O p t V Input-Output Isolation Voltage freq= 60Hz, t = 1.0min, 3750 Vac o ISO RMS I ≤ 10µA(4)(5) c I-O o RISO Isolation Resistance VI-O = 500V(4) 1012 Ω up C Isolation Capacitance V = 0V, freq=1.0MHz(4) 0.6 pF le ISO I-O r Notes: 1. No derate required to 85ºC. 2. Functional operation under these conditions is not implied. Permanent damage may occur if the device is subjected to conditions outside these ratings. 3. 0.1µF bypass capacitor must be connected between pins 4 and 6. 4. Device is considered a two terminal device: Pins 1 and 3 are shorted, and Pins 4, 5, and 6 are shorted together. 5. 3,750 VAC for 1 minute duration is equivalent to 4,500 VAC for 1 second duration. RMS RMS ©2009 Fairchild Semiconductor Corporation www.fairchildsemi.com FODM611 Rev. 1.0.3 3

F O Electrical Characteristics (Apply over all recommended conditions) D (T = -40ºC to +85ºC, 4.5V ≤ V ≤ 5.5V), unless otherwise specified. M A CC 6 Typical value is measured at TA = 25ºC and VCC = 5.0V. 1 1 Symbol Parameter Test Conditions Min. Typ. Max. Units — INPUT CHARACTERISTICS H i g VF Forward Voltage IF = 10mA, Fig. 1 1.05 1.45 1.8 V h BV Input Reverse Breakdown Voltage I = 10µA 5.0 V N R R o IFHL Threshold Input Current VO = 0.6V, IOL(sinking) = 13mA, 3.4 5.0 mA is e T < 85ºC, Fig. 2 A I m OUTPUT CHARACTERISTICS m VOL Logic LOW Output Voltage IF = rated IFHL, 0.4 0.6 V u I (sinking) = 13mA, Fig. 3 n OL i t y IOH Logic HIGH Output Current IF = 250µA, VO = 5.0V, Fig. 4 2.1 30.0 µA , 5 I Logic LOW Output Supply Current I = 10mA, V = 5.0V, Fig. 5, 7 7.5 10.0 mA V CCL F CC , 1 I Logic HIGH Output Supply Current I = 0mA, V = 5.0V, Fig. 6, 7 6.0 9.0 mA 0 CCH F CC M b i t / s e Switching Characteristics (Apply over all recommended conditions) c (T = -40ºC to +85ºC, 4.5V ≤ V ≤ 5.5V, I = 7.5mA), unless otherwise specified. L A CC F o Typical value is measured at TA = 25ºC and VCC = 5.0V g i c Symbol Parameter Test Conditions Min. Typ. Max. Units G Date Rate R = 350Ω 10 Mbps a L t e t Propagation Delay Time to Logic R = 350Ω, C = 15pF, 43 100 ns PHL L L O Low Output Fig. 8 and 11 u t t Propagation Delay Time to Logic R = 350Ω, C = 15pF, 50 100 ns p PLH L L u High Output Fig. 8 and 11 t ( PWD Pulse Width Distortion, R = 350Ω, C = 15pF, 7 35 ns O L L p | t – t | Fig. 9 PHL PLH e tPSK Propagation Delay Skew RL = 350Ω, CL = 15pF(6) 40 ns n C o tR Output Rise Time, (10% to 90%) RL = 350Ω, CL = 15pF, 20 ns lle Fig. 10 and 11 c t t Output Fall Time, (90% to 10%) R = 350Ω, C = 15pF, 10 ns o F L L r Fig. 10 and 11 ) O |CM | Common Mode Transient V = 5.0V, V > 0.8 x V , 20 40 kV/µs p H I O CC Immunity at Output High V = 1000V(7), Fig. 12 to CM c |CM | Common Mode Transient V = 0V, V < 0.8V, 20 40 kV/µs o L Immunity at Output Low VICM = 100O0V(7), Fig. 12 up l e Notes r 6. t is equal to the magnitude of the worst case difference in t and/or t that will be seen between any two units PSK PHL PLH from the same manufacturing date code that are operated at same case temperature (±5°C), at same operating conditions, with equal loads (R = 350Ω and C = 15pF), and with an input rise time less than 5ns. L L 7. Common mode transient immunity at output high is the maximum tolerable positive dVcm/dt on the leading edge of the common mode impulse signal, Vcm, to assure that the output will remain high. Common mode transient immunity at output low is the maximum tolerable negative dVcm/dt on the trailing edge of the common pulse signal, Vcm, to assure that the output will remain low. ©2009 Fairchild Semiconductor Corporation www.fairchildsemi.com FODM611 Rev. 1.0.3 4

F O Typical Performance Curves D M 6 Fig. 1 Input LED Current vs Forward Voltage Fig. 2 Threshold Input Current vs Ambient Temperature 1 100 6 1 mA) IVOCL C= =1 35m.0AV — A) 10 ENT ( 5 H T (m URR ig I – INPUT LED CURRENF00.0.111 TA = 25°CTA = 85°C TA = -40°C – THRESHOLD INPUT CHL 234 h Noise Immu IF n i t 0.0010.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0 1-40 -20 0 20 40 60 80 y, 5 VF – FORWARD VOLTAGE (V) TA – AMBIENT TEMPERATURE (°C) V , 1 0 M b Fig. 3 Low Level Output Voltage vs. Ambient Temperature Fig. 4 Logic High Output Current vs Ambient Temperature i t 0.60 2.0 /s GE (V) 0.55 VIIOFCL C= = =5 1m53.A0mVA NT (µA) 1.8 IVVFOC =C = 2= 35 5.03.µ0VAV ec L LTA RRE og VO CU 1.6 ic UT 0.50 UT G P P UT UT 1.4 a O O t L H e V – LOW LEVEOL 00..4450 I – LOGIC HIGOH 11..20 Output ( O 0.35 0.8 p -40 -20 0 20 40 60 80 -40 -20 0 20 40 60 80 e TA – AMBIENT TEMPERATURE (°C) TA – AMBIENT TEMPERATURE (°C) n C o C LOW OUTPUT SUPPLY CURRENT (mA) 109876 VIFC F=Ci g1=0. 5 m5.0 ATVypicvasl .L Aomgibc iLenotw T Oemutppeurta Stuurpeply Current C HIGH OUTPUT SUPPLY CURRENT (mA) 10864 IVFCF =Ci g 0=.m 56A. 0TVypicavls L. Aogmicb iHenigth T Oemutppeurta Stuurpeply Current llector) Optocoupler GI GI O O CAL L 5 CAL L 2 PI PI Y Y – TCCL 4-40 -20 0 20 40 60 80 – TCCH 0-40 -20 0 20 40 60 80 I TA – AMBIENT TEMPERATURE (°C) I TA – AMBIENT TEMPERATURE (°C) ©2009 Fairchild Semiconductor Corporation www.fairchildsemi.com FODM611 Rev. 1.0.3 5

F O Typical Performance Curves (Continued) D M 6 Fig. 7 Typical Logic Output Supply Current 1 A) vs. Output Supply Voltage Fig. 8 Typical Propagation Delay vs. Ambient Temperature 1 T (m 10 IF = 0mA (for ICCH), 10mA (for ICCL) 55 Frequency = 5MHz — Y CURREN 8 TA = 25°C Y (ns) 50 RDIVFCuL = tC=y 7 =C3. 555ym0c.0ΩlAeV = 50% High PPL ELA N UT SU 6 ICCL ON D 45 ois TP ATI e C OU 4 ICCH PAG 40 Im AL LOGI 2 – PROP 35 tPHL mun TYPIC t tPLH ity I – CC 03.0 3.5 4.0 4.5 5.0 5.5 30-40 -20 0 20 40 60 80 , 5V VCC – OUTPUT SUPPLY VOLTAGE (V) TA – AMBIENT TEMPERATURE (°C) , 1 0 M b i t Fig. 9 Pulse Width Distortion vs. Ambient Temperature Fig. 10 Rise and Fall Time vs. Ambient Temperature /s 8 40 e DISTORTION (ns) 6 FDIVRFrCuL e= tC=qy 7u =C3.e 555ynm0cVcΩlAye == 55M0%Hz ME (ns) 3350 RFDIVFrCuL e= tC=qy 7u =C3.e 555ynm0cVcΩlAye == 55M0%Hz tR c Logic G DTH LL TI 25 at ULSE WI 4 RISE, FA 2105 e Ou – t| ) – PPLH 2 t, t – RF 105 tF tput (O HL p P ( |t 0-40 -20 0 20 40 60 80 0-40 -20 0 20 40 60 80 en TA – AMBIENT TEMPERATURE (°C) TA – AMBIENT TEMPERATURE (°C) C o l l e c t o r ) O p t o c o u p l e r ©2009 Fairchild Semiconductor Corporation www.fairchildsemi.com FODM611 Rev. 1.0.3 6

F O Schematics D M 6 Pulse Gen. IF 11 5MHz tf = tr = 5ns — DC = 50% 0.1µF 350Ω Bypass H VO Monitoring ig Node h Input CL N Monitoring o Mode i s RM e I m m u n (IF = 7.5mA) i t y Input 50% , 5 V tf tr , 1 0 90% M Output 1.5V b 10% it VOL /s e tPHL tPLH c L o Figure 11. Test Circuit for Propagation Delay Time, Rise Time and Fall Time g i c G a t IF e O VCC u 0B.y1pµaFss 350Ω tp u VO Monitoring t SW CL Node (O p e RM n C o VCM lle c Pulse Gen to r ) O p t VCM90% 1kV o c o u 10% 0V p l e tr tf r VOH VO (IF = 0mA) 0.8 VCC 0.8V VO (IF = 7.5mA) VOL Figure 12. Test Circuit for Instantaneous Common Mode Rejection Voltage ©2009 Fairchild Semiconductor Corporation www.fairchildsemi.com FODM611 Rev. 1.0.3 7

F O Package Dimensions D M 6 1 1 — H i g h N o i s e I m m u n i t y , 5 V , 1 0 M b i t / s e LAND PATTERN RECOMMENDATION c L o g i c G a t e O u t p u t ( O p e n C Notes: o l 1. No standard applies to this package. le 2. All dimensions are in millimeters. c t 3. Dimensions are exclusive of burrs, mold flash, and tie bar extrusion. o r 4. Drawings filesname and revision: MKT-MFP05A. ) O p t o Package drawings are provided as a service to customers considering Fairchild components. Drawings may change in any manner c without notice. Please note the revision and/or date on the drawing and contact a Fairchild Semiconductor representative to verify or o u obtain the most recent revision. Package specifications do not expand the terms of Fairchild’s worldwide terms and conditions, p specifically the warranty therein, which covers Fairchild products. l e r Always visit Fairchild Semiconductor’s online packaging area for the most recent package drawings: http://www.fairchildsemi.com/packaging/ ©2009 Fairchild Semiconductor Corporation www.fairchildsemi.com FODM611 Rev. 1.0.3 8

F O Ordering Information D M Order Entry Identifier 6 1 Option (Example) Description 1 No Suffix FODM611 Mini-Flat 5-pin, shipped in tubes (100 units per tube) — R2 FODM611R2 Mini-Flat 5-pin, tape and reel (2,500 units per reel) H i g h All packages are lead free per JEDEC: J-STD-020B standard. N o i s e Marking Information I m m u n i t y , 1 5 V , 1 M611 2 0 M b VV X YY M 6 it/ s e c L o 3 4 5 g i c G a t e Definitions O 1 Fairchild logo u t p 2 Device number u t 3 IEC60747-5-2 (VDE marking) ( O 4 One digit year code, e.g., ‘9’ p e 5 Two digit work week ranging from ‘01’ to ‘53’ n C 6 Assembly package code o l l e c t o r ) O p t o c o u p l e r ©2009 Fairchild Semiconductor Corporation www.fairchildsemi.com FODM611 Rev. 1.0.3 9

F O Tape and Reel Dimensions D M 6 P D 1 2 0 1 K0 t P0 E — H i g h A0 W N W B o 1 0 F i s e I m m d P D 1 u n i t y 2.54 Pitch , 5 V Description Symbol Dimensions (mm) , 1 Tape Width W 12.00 +0.30/-0.10 0 M Tape Thickness t 0.30 ±0.05 b i Sprocket Hole Pitch P0 4.00 ±0.10 t/s Sprocket Hole Diameter D0 1.50 +0.10 / -0.0 ec Sprocket Hole Location E 1.75 ±0.10 L o Pocket Location F 5.50 ±0.10 g i c P2 2.00 ±0.10 G Pocket Pitch P 8.00 ±0.10 a t Pocket Dimension A0 4.40 ±0.10 e O B0 7.30 ±0.10 u t K 2.30 ±0.10 p 0 u Pocket Hole Diameter D1 1.50 Min. t ( O Cover Tape Width W 9.20 1 p Cover Tape Thickness d 0.065 ±0.010 e n Max. Component Rotation or Tilt 10° Max. C o Devices Per Reel 2500 ll e c Reel Diameter 330mm (13") t o r ) O p t o c o u p l e r ©2009 Fairchild Semiconductor Corporation www.fairchildsemi.com FODM611 Rev. 1.0.3 10

F O Reflow Profile D M 6 Max. Ramp-up Rate = 3°C/S 1 TP Max. Ramp-down Rate = 6°C/S 1 260 240 tP — 220 TL H i 200 Tsmax g h C) 180 Preheat Area tL N °e ( 160 Tsmin ois r 140 e u ts at 120 Im er 100 m p u m 80 n Te 60 it y 40 , 5 V 20 , 1 0 0 120 240 360 M b Time 25°C to Peak it / s Time (seconds) e c L o g Profile Feature Pb-Free Assembly Profile ic G Temperature Min. (Tsmin) 150°C a Temperature Max. (Tsmax) 200°C te O Time (t ) from (Tsmin to Tsmax) 60–120 seconds S u Ramp-up Rate (tL to tP) 3°C/second max. tp u Liquidous Temperature (TL) 217°C t ( Time (t ) Maintained Above (T ) 60–150 seconds O L L p Peak Body Package Temperature 260°C +0°C / –5°C e n Time (tP) within 5°C of 260°C 30 seconds C o Ramp-down Rate (TP to TL) 6°C/second max. ll e Time 25°C to Peak Temperature 8 minutes max. c t o r ) O p t o c o u p l e r ©2009 Fairchild Semiconductor Corporation www.fairchildsemi.com FODM611 Rev. 1.0.3 11

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Products customers buy either from Fairchild directly or from Authorized Fairchild Distributors are genuine parts, have full traceability, meet Fairchild's quality standards for handling and storage and provide access to Fairchild's full range of up-to-date technical and product information. Fairchild and our Authorized Distributors will stand behind all warranties and will appropriately address any warranty issues that may arise. Fairchild will not provide any warranty coverage or other assistance for parts bought from Unauthorized Sources. Fairchild is committed to combat this global problem and encourage our customers to do their part in stopping this practice by buying direct or from authorized distributors. PRODUCT STATUS DEFINITIONS Definition of Terms Datasheet Identification Product Status Definition Datasheet contains the design specifications for product development. Specifications may change Advance Information Formative / In Design in any manner without notice. Datasheet contains preliminary data; supplementary data will be published at a later date. Fairchild Preliminary First Production Semiconductor reserves the right to make changes at any time without notice to improve design. Datasheet contains final specifications. Fairchild Semiconductor reserves the right to make No Identification Needed Full Production changes at any time without notice to improve the design. Datasheet contains specifications on a product that is discontinued by Fairchild Semiconductor. Obsolete Not In Production The datasheet is for reference information only. Rev. I76 ©2009 Fairchild Semiconductor Corporation www.fairchildsemi.com FODM611 Rev. 1.0.3

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