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FGH40N60SFTU产品简介:
ICGOO电子元器件商城为您提供FGH40N60SFTU由Fairchild Semiconductor设计生产,在icgoo商城现货销售,并且可以通过原厂、代理商等渠道进行代购。 FGH40N60SFTU价格参考¥13.93-¥14.56。Fairchild SemiconductorFGH40N60SFTU封装/规格:晶体管 - UGBT,MOSFET - 单, IGBT Field Stop 600V 80A 290W Through Hole TO-247。您可以下载FGH40N60SFTU参考资料、Datasheet数据手册功能说明书,资料中有FGH40N60SFTU 详细功能的应用电路图电压和使用方法及教程。
参数 | 数值 |
25°C时Td(开/关)值 | 25ns/115ns |
产品目录 | |
Current-CollectorPulsed(Icm) | 120A |
描述 | IGBT 600V 80A 290W TO247IGBT 晶体管 N-CH / 40A 600V FS Planar |
产品分类 | IGBT - 单路分离式半导体 |
GateCharge | 120nC |
IGBT类型 | 场截止 |
品牌 | Fairchild Semiconductor |
产品手册 | |
产品图片 | |
rohs | 符合RoHS无铅 / 符合限制有害物质指令(RoHS)规范要求 |
产品系列 | 晶体管,IGBT 晶体管,Fairchild Semiconductor FGH40N60SFTU- |
数据手册 | |
产品型号 | FGH40N60SFTU |
PCN组件/产地 | |
SwitchingEnergy | 1.13mJ (开), 310µJ (关) |
TestCondition | 400V, 40A, 10 欧姆, 15V |
不同 Vge、Ic时的 Vce(on) | 2.9V @ 15V,40A |
产品目录页面 | |
产品种类 | IGBT 晶体管 |
供应商器件封装 | TO-247 |
其它名称 | FGH40N60SFTU-ND |
功率-最大值 | 290W |
功率耗散 | 290 W |
包装 | 管件 |
单位重量 | 6.390 g |
反向恢复时间(trr) | - |
商标 | Fairchild Semiconductor |
在25C的连续集电极电流 | 80 A |
安装类型 | 通孔 |
安装风格 | Through Hole |
封装 | Tube |
封装/外壳 | TO-247-3 |
封装/箱体 | TO-247 |
工厂包装数量 | 30 |
最大工作温度 | + 150 C |
最小工作温度 | - 55 C |
栅极/发射极最大电压 | 20 V |
栅极—射极漏泄电流 | 400 nA |
标准包装 | 30 |
电压-集射极击穿(最大值) | 600V |
电流-集电极(Ic)(最大值) | 80A |
系列 | FGH40N60 |
输入类型 | 标准 |
配置 | Single |
集电极—发射极最大电压VCEO | 600 V |
集电极—射极饱和电压 | 2.3 V |
Is Now Part of To learn more about ON Semiconductor, please visit our website at www.onsemi.com Please note: As part of the Fairchild Semiconductor integration, some of the Fairchild orderable part numbers will need to change in order to meet ON Semiconductor’s system requirements. Since the ON Semiconductor product management systems do not have the ability to manage part nomenclature that utilizes an underscore (_), the underscore (_) in the Fairchild part numbers will be changed to a dash (-). This document may contain device numbers with an underscore (_). Please check the ON Semiconductor website to verify the updated device numbers. The most current and up-to-date ordering information can be found at www.onsemi.com. Please email any questions regarding the system integration to Fairchild_questions@onsemi.com. ON Semiconductor and the ON Semiconductor logo are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries. ON Semiconductor owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of ON Semiconductor’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent-Marking.pdf. ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. Buyer is responsible for its products and applications using ON Semiconductor products, including compliance with all laws, regulations and safety requirements or standards, regardless of any support or applications information provided by ON Semiconductor. “Typical” parameters which may be provided in ON Semiconductor data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. ON Semiconductor does not convey any license under its patent rights nor the rights of others. ON Semiconductor products are not designed, intended, or authorized for use as a critical component in life support systems or any FDA Class 3 medical devices or medical devices with a same or similar classification in a foreign jurisdiction or any devices intended for implantation in the human body. Should Buyer purchase or use ON Semiconductor products for any such unintended or unauthorized application, Buyer shall indemnify and hold ON Semiconductor and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that ON Semiconductor was negligent regarding the design or manufacture of the part. ON Semiconductor is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
F G H March 2015 4 0 N 6 FGH40N60SF 0 S F 600 V, 40 A Field Stop IGBT — 6 Features General Description 0 0 • High Current Capability Using novel field stop IGBT technology, Fairchild’s field stop V , • Low Saturation Voltage: VCE(sat) = 2.3 V @ IC = 40 A IGBTs offer the optimum performance for solar inverter, UPS, 4 welder and PFC applications where low conduction and switch- 0 • High Input Impedance ing losses are essential. A • Fast Switching: EOFF = 8 uJ/A F • RoHS Compliant i e l Applications d S • Solar Inverter, UPS, Welder, PFC to p I G B T C E C G G COLLECTOR (FLANGE) E Absolute Maximum Ratings Symbol Description Ratings Unit V Collector to Emitter Voltage 600 V CES Gate to Emitter Voltage ±20 V V GES Transient Gate-to-Emitter Voltage ±30 Collector Current @ T = 25oC 80 A I C C Collector Current @ T = 100oC 40 A C ICM (1) Pulsed Collector Current @ TC = 25oC 120 A Maximum Power Dissipation @ T = 25oC 290 W P C D Maximum Power Dissipation @ T = 100oC 116 W C T Operating Junction Temperature -55 to +150 oC J T Storage Temperature Range -55 to +150 oC stg Maximum Lead Temp. for soldering TL Purposes, 1/8” from case for 5 seconds 300 oC Notes: 1: Repetitive rating: Pulse width limited by max. junction temperature Thermal Characteristics Symbol Parameter Typ. Max. Unit RθJC(IGBT) Thermal Resistance, Junction to Case - 0.43 oC/W RθJA Thermal Resistance, Junction to Ambient - 40 oC/W ©2009 Fairchild Semiconductor Corporation 1 www.fairchildsemi.com FGH40N60SF Rev.1.5
F G Package Marking and Ordering Information H 4 0 Part Number Top Mark Package Packing Method Reel Size Tape Width Quantity N 6 FGH40N60SFTU FGH40N60SF TO-247 Tube N/A N/A 30 0 S F Electrical Characteristics of the IGBT TC = 25°C unless otherwise noted — 6 Symbol Parameter Test Conditions Min. Typ. Max. Unit 0 0 V Off Characteristics , 4 BV Collector to Emitter Breakdown Voltage V = 0 V, I = 250 μA 600 - - V 0 CES GE C ΔBV / Temperature Coefficient of Breakdown A ΔT CES Voltage VGE = 0 V, IC = 250 μA - 0.6 - V/oC F J i e ICES Collector Cut-Off Current VCE = VCES, VGE = 0 V - - 250 μA ld IGES G-E Leakage Current VGE = VGES, VCE = 0 V - - ±400 nA S t o p On Characteristics I V G-E Threshold Voltage I = 250 μA, V = V 4.0 5.0 6.5 V G GE(th) C CE GE B IC = 40 A, VGE = 15 V - 2.3 2.9 V T V Collector to Emitter Saturation Voltage CE(sat) ITC = = 4 102 A5,o VCGE = 15 V, - 2.5 - V C Dynamic Characteristics C Input Capacitance - 2110 - pF ies V = 30 VV = 0 V, C Output Capacitance CE , GE - 200 - pF oes f = 1 MHz C Reverse Transfer Capacitance - 60 - pF res Switching Characteristics t Turn-On Delay Time - 25 - ns d(on) t Rise Time - 42 - ns r td(off) Turn-Off Delay Time VCC = 400 V, IC = 40 A, - 115 - ns tEf FTuarlln T-Oimne Switching Loss RInGd u=c t1iv0e Ω L,o VaGdE, T=C 1 =5 2V5,oC -- 12.173 5-4 mnsJ on E Turn-Off Switching Loss - 0.31 - mJ off E Total Switching Loss - 1.44 - mJ ts t Turn-On Delay Time - 24 - ns d(on) t Rise Time - 43 - ns r td(off) Turn-Off Delay Time VCC = 400 V, IC = 40 A, - 120 - ns tEf FTuarlln T-Oimne Switching Loss RInGd u=c t1iv0e Ω L,o VaGdE, T=C 1 =5 1V2,5oC -- 13.104 -- mnsJ on E Turn-Off Switching Loss - 0.48 - mJ off E Total Switching Loss - 1.62 - mJ ts Q Total Gate Charge - 120 - nC g V = 400 V, I = 40 A, Q Gate to Emitter Charge CE C - 14 - nC ge VGE = 15 V Q Gate to Collector Charge - 58 - nC gc ©2009 Fairchild Semiconductor Corporation 2 www.fairchildsemi.com FGH40N60SF Rev.1.5
F G Typical Performance Characteristics H 4 0 N Figure 1. Typical Output C haracteristics Figure 2. Typical Outpu t Characteristics 60 120 120 S TC = 25oC 20V TC = 125oC 20V 15V F — 100 15V 100 12V or Current, I [A]C 6800 12V or Current, I [A]C 6800 600 V, 40 A Collect 40 10V Collect 40 10V Fie l 20 20 d VGE = 8V VGE = 8V St 0 0 o 0.0 1.5 3.0 4.5 6.0 0.0 1.5 3.0 4.5 6.0 p Collector-Emitter Voltage, VCE [V] Collector-Emitter Voltage, VCE [V] IG B Figure 3. Typical Saturation Voltage Figure 4. Transfer Characteristics T Characteristics 80 120 Common Emitter Common Emitter VGE = 15V VCE = 20V nt, I [A]C 60 TTCC == 2152o5CoC ent, I [A]C 80 TTCC == 2152o5CoC urre 40 Curr ollector C 20 Collector 40 C 0 0 0 1 2 3 4 6 8 10 12 13 Collector-Emitter Voltage, VCE [V] Gate-Emitter Voltage,VGE [V] Figure 5. Saturation Voltage vs. Case Figure 6. Saturation Voltage vs. V GE Temperature at Variant Current Level 4.0 20 Common Emitter Common Emitter mitter Voltage, V [V]CE 233...505 VGE = 15V 8400AA mitter VoltageV [V], CE11268 TC = -40oC Collector-E 12..50 IC = 20A Collector-E 4 IC = 20A 40A 80A 1.0 0 25 50 75 100 125 4 8 12 16 20 Case Temperature, TC [oC] Gate-Emitter Voltage, VGE [V] ©2009 Fairchild Semiconductor Corporation 3 www.fairchildsemi.com FGH40N60SF Rev.1.5
F G Typical Performance Characteristics H 4 0 N Figure 7. Saturation Voltage vs. VGE Figure 8. Saturation Voltage vs. VGE 6 0 20 20 S Common Emitter Common Emitter F Emitter VoltageV [V], CE11268 TC = 25oC []mitter Voltage, V VCE11268 TC = 125oC — 600 V, 40 A ctor- 40A 80A or-E 40A 80A Fie Colle 4 IC = 20A Collect 4 IC = 20A ld St o 0 0 p 4 8 12 16 20 4 8 12 16 20 Gate-Emitter Voltage, VGE [V] Gate-Emitter Voltage, VGE [V] IG B Figure 9. Capacitance Characteristics Figure 10. Gate charge Characteristics T 5000 15 Common Emitter Common Emitter VGE = 0V, f = 1MHz TC = 25oC 4000 Ciss TC = 25oC [V]E12 G 200V pF] e, V Vcc = 100V 300V e [3000 ag 9 nc olt a V apacit2000 Coss mitter 6 C E e- 1000 at 3 G C rss 0 0 0.1 1 10 30 0 50 100 150 Collector-Emitter Voltage, VCE [V] Gate Charge, Qg [nC] Figure 11. SOA Characteristics Figure 12. Turn-on Characteristics vs. Gate Resistance 400 200 100 10μs A] 100 Collector Current, I [c 01.011 SPiunlgsele T NCo =n r2e5poeCtitive 11100m 0DmsμCss Switching Time [ns] trtd(on) CVICCo =Cm 4=m0 4oA0n0 EVm, VitGteE r= 15V Curves must be derated linearly with increase TC = 25oC in temperature TC = 125oC 0.01 10 1 10 100 1000 0 10 20 30 40 50 Collector-Emitter Voltage, VCE [V] Gate Resistance, RG [Ω] ©2009 Fairchild Semiconductor Corporation 4 www.fairchildsemi.com FGH40N60SF Rev.1.5
F G Typical Performance Characteristics H 4 0 N Figure 13. Turn-off Characteristics vs. Figure 14. Turn-on Characteristics vs. 6 Gate Resistance Collector Current 0 S 5500 500 F Common Emitter Common Emitter — VCC = 400V, VGE = 15V VGE = 15V, RG = 10Ω IC = 40A TC = 25oC 60 1000 TC = 25oC T = 125oC 0 me [ns] TC = 125oC td(off) me [ns] 100 C tr V, 4 g Ti g Ti 0 A hin 100 hin F Switc tf Switc td(on) ield S t o 10 10 p 0 10 20 30 40 50 20 40 60 80 I G Gate Resistance, RG [Ω] Collector Current, IC [A] B T Figure 15. Turn-off Characteristics vs. Figure 16. Switching Loss vs. Gate Resistance Collector Current 500 10 Common Emitter Common Emitter VGE = 15V, RG = 10Ω VCC = 400V, VGE = 15V TC = 25oC IC = 40A me [ns] 100 TC = 125oC td(off) ss [mJ] TTCC == 2152o5CoC Eon Ti Lo ng tf ng 1 hi hi c c Swit Swit Eoff 10 00..32 20 40 60 80 0 10 20 30 40 50 Collector Current, IC [A] Gate Resistance, RG [Ω] Figure 17. Switching Loss vs. Collector Current Figure 18. Load Current vs. Frequency 30 Common Emitter V = 15V, R = 10Ω GE G 10 T = 25oC C E J] TC = 125oC on m s [ s o E g L 1 off n hi c wit S 0.1 20 30 40 50 60 70 80 Collector Current, IC [A] ©2009 Fairchild Semiconductor Corporation 5 www.fairchildsemi.com FGH40N60SF Rev.1.5
F G Typical Performance Characteristics H 4 0 N Figure 19. Turn off Switching 6 SOA Characteristics 0 S F 200 — 100 6 0 0 A] V nt, I [C , 40 or Curre 10 A Fi ct e Colle ld S Safe Operating Area t o V = 15V, T = 125oC p GE C 1 I 1 10 100 1000 G B Collector-Emitter Voltage, VCE [V] T Figure 20. Transient Thermal Impedance of IGBT 1 c] hj 0.5 Zt e [ 0.1 0.2 s on 0.1 p s 0.05 e R 0.02 al 0.01 0.01 m er single pulse h T Duty Factor, D = t1/t2 Peak Tj = Pdm x Zthjc + TC 1E-3 1E-5 1E-4 1E-3 0.01 0.1 1 Rectangular Pulse Duration [sec] ©2009 Fairchild Semiconductor Corporation 6 www.fairchildsemi.com FGH40N60SF Rev.1.5
4.82 15.87 E B E 4.58 15.37 A 4.13 12.81 E 3.53 6.85 3.65 E 6.61 3.51 0.254 M B AM 5.58 5.34 E 1.35 5.20 0.51 4.96 20.82 20.32 E 13.08 MIN 1 2 3 3 1 1.87 33..9639 E 1.53 (2X) 16.25 E 15.75 1.60 2.77 2.43 0.71 5.56 0.51 1.35 2.66 1.17 2.29 0.254 M B AM 11.12 NOTES: UNLESS OTHERWISE SPECIFIED. A. PACKAGE REFERENCE: JEDEC TO-247, ISSUE E, VARIATION AB, DATED JUNE, 2004. B. DIMENSIONS ARE EXCLUSIVE OF BURRS, MOLD FLASH, AND TIE BAR EXTRUSIONS. C. ALL DIMENSIONS ARE IN MILLIMETERS. D. DRAWING CONFORMS TO ASME Y14.5 - 1994 E DOES NOT COMPLY JEDEC STANDARD VALUE F. DRAWING FILENAME: MKT-TO247A03_REV04
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