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FDMQ8403产品简介:
ICGOO电子元器件商城为您提供FDMQ8403由Fairchild Semiconductor设计生产,在icgoo商城现货销售,并且可以通过原厂、代理商等渠道进行代购。 FDMQ8403价格参考。Fairchild SemiconductorFDMQ8403封装/规格:晶体管 - FET,MOSFET - 阵列, 4 个 N 通道(H 桥) Mosfet 阵列 100V 3.1A 1.9W 表面贴装 12-MLP(5x4.5)。您可以下载FDMQ8403参考资料、Datasheet数据手册功能说明书,资料中有FDMQ8403 详细功能的应用电路图电压和使用方法及教程。
参数 | 数值 |
产品目录 | |
描述 | MOSFET 4N-CH 100V 3.1A 12-MLPMOSFET SER BOOST LED DRVR |
产品分类 | FET - 阵列分离式半导体 |
FET功能 | 标准 |
FET类型 | 4 个 N 通道(H 桥) |
Id-ContinuousDrainCurrent | 3 A |
Id-连续漏极电流 | 3 A |
品牌 | Fairchild Semiconductor |
产品手册 | |
产品图片 | |
rohs | 符合RoHS无铅 / 符合限制有害物质指令(RoHS)规范要求 |
产品系列 | 晶体管,MOSFET,Fairchild Semiconductor FDMQ8403GreenBridge™ PowerTrench® |
数据手册 | |
产品型号 | FDMQ8403 |
Pd-PowerDissipation | 1.9 W |
Pd-功率耗散 | 1.9 W |
RdsOn-Drain-SourceResistance | 110 mOhms |
RdsOn-漏源导通电阻 | 110 mOhms |
Vds-Drain-SourceBreakdownVoltage | 100 V |
Vds-漏源极击穿电压 | 100 V |
Vgs-Gate-SourceBreakdownVoltage | +/- 20 V |
Vgs-栅源极击穿电压 | 20 V |
不同Id时的Vgs(th)(最大值) | 4V @ 250µA |
不同Vds时的输入电容(Ciss) | 215pF @ 15V |
不同Vgs时的栅极电荷(Qg) | 5nC @ 10V |
不同 Id、Vgs时的 RdsOn(最大值) | 110 毫欧 @ 3A,10V |
产品种类 | MOSFET |
供应商器件封装 | 12-MLP(5x4.5) |
其它名称 | FDMQ8403CT |
功率-最大值 | 1.9W |
包装 | 剪切带 (CT) |
单位重量 | 242.300 mg |
商标 | Fairchild Semiconductor |
安装类型 | 表面贴装 |
安装风格 | SMD/SMT |
导通电阻 | 110 mOhms |
封装 | Reel |
封装/外壳 | 12-WDFN 裸露焊盘 |
封装/箱体 | MLP-12 4.5x5 |
工厂包装数量 | 3000 |
晶体管极性 | N-Channel |
最大工作温度 | + 150 C |
最小工作温度 | - 55 C |
标准包装 | 1 |
汲极/源极击穿电压 | 100 V |
漏极连续电流 | 3 A |
漏源极电压(Vdss) | 100V |
电流-连续漏极(Id)(25°C时) | 3.1A |
系列 | FDMQ8403 |
配置 | Quad |
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F D M Q 8 July 2012 4 FDMQ8403 0 3 N GreenBridgeTM Series of High-Efficiency Bridge Rectifiers -C h ® N-Channel PowerTrench MOSFET a n 100 V, 6 A, 110 mΩ n e l Features General Description P o (cid:132) Max r = 110 mΩ at V = 10 V, I = 3 A This quad MOSFET solution provides ten-fold improvement in w DS(on) GS D power dissipation over diode bridge. e (cid:132) Max r = 175 mΩ at V = 6 V, I = 2.4 A r DS(on) GS D T r (cid:132) Substantial efficiency benefit in PD solutions e n (cid:132) RoHS Compliant Application c h ® (cid:132) High-Efficiency Bridge Rectifiers M O S F E T Top Bottom Pin 1 S3 7 6 S2 Q3 Q2 G4 G1 S3 8 5 S2 D1/D4 D1/D4 D1/D4 D3/S4 S1/D2 G3 9 4 G2 G3 G2 D3/ S1/ D3/S4 10 Q4 Q1 3 S1/D2 S3 S4 D2 S2 S3 S2 D1/D4 11 2 D1/D4 G4 12 1 G1 MLP 4.5x5 MOSFET Maximum Ratings TA = 25 °C unless otherwise noted Symbol Parameter Ratings Units V Drain to Source Voltage 100 V DS V Gate to Source Voltage ±20 V GS Drain Current -Continuous (Package limited) T = 25 °C 6 C -Continuous (Silicon limited) T = 25 °C 9 I C A D -Continuous T = 25 °C (Note 1a) 3.1 A -Pulsed 12 Power Dissipation T = 25 °C 17 P C W D Power Dissipation T = 25 °C (Note 1a) 1.9 A T , T Operating and Storage Junction Temperature Range -55 to +150 °C J STG Thermal Characteristics R Thermal Resistance, Junction to Ambient (Note 1a) 65 θJA °C/W R Thermal Resistance, Junction to Ambient (Note 1b) 135 θJA Package Marking and Ordering Information Device Marking Device Package Reel Size Tape Width Quantity FDMQ8403 FDMQ8403 MLP 4.5x5 13 ’’ 12 mm 3000 units ©2012 Fairchild Semiconductor Corporation 1 www.fairchildsemi.com FDMQ8403 Rev.C2
F D Electrical Characteristics M T = 25 °C unless otherwise noted J Q Symbol Parameter Test Conditions Min Typ Max Units 8 4 0 Off Characteristics 3 BV Drain to Source Breakdown Voltage I = 250 μA, V = 0 V 100 V N DSS D GS - ΔBV Breakdown Voltage Temperature C ΔTDSS Coefficient ID = 250 μA, referenced to 25 °C 72 mV/°C h J a I Zero Gate Voltage Drain Current V = 80 V, V = 0 V 1 μA n DSS DS GS n IGSS Gate to Source Leakage Current VGS = ±20 V, VDS = 0 V ±100 nA e l P On Characteristics o w V Gate to Source Threshold Voltage V = V , I = 250 μA 2 2.8 4 V GS(th) GS DS D e Δ ΔVTGJS(th) GTeamtep teor aStuoruer cCeo Tehffriceisehnotld Voltage ID = 250 μA, referenced to 25 °C -8 mV/°C rTr e VGS = 10 V, ID = 3 A 85 110 n r Static Drain to Source On Resistance V = 6 V, I = 2.4 A 115 175 mΩ c DS(on) GS D h V = 10 V, I = 3 A, T = 125 °C 147 191 ® GS D J g Forward Transconductance V = 10 V, I = 3 A 6 S M FS DS D O Dynamic Characteristics S F Ciss Input Capacitance 162 215 pF E C Output Capacitance VDS = 50 V, VGS = 0 V, 43 60 pF T oss f = 1 MHz C Reverse Transfer Capacitance 2.6 5 pF rss Switching Characteristics t Turn-On Delay Time 4.1 10 ns d(on) tr Rise Time VDD = 50 V, ID = 3 A, 1.2 10 ns td(off) Turn-Off Delay Time VGS = 10 V, RGEN = 6 Ω 7.2 15 ns t Fall Time 1.8 10 ns f Q Total Gate Charge V = 0 V to 10 V 3 5 nC g GS Qg Total Gate Charge VGS = 0 V to 5 V VDD = 50 V, 1.7 3 nC Qgs Gate to Source Charge ID = 3 A 0.9 nC Q Gate to Drain “Miller” Charge 0.8 nC gd Drain-Source Diode Characteristics V Source to Drain Diode Forward Voltage V = 0 V, I = 3 A (Note 2) 0.86 1.3 V SD GS S t Reverse Recovery Time 33 53 ns rr I = 3 A, di/dt = 100 A/μs Q Reverse Recovery Charge F 23 37 nC rr Notes: 1. RθJA is determined with the device mounted on a 1in2 pad 2 oz copper pad on a 1.5 x 1.5 in. board of FR-4 material. RθJC is guaranteed by design while RθCA is determined by the user's board design. a. 65 °C/W when mounted on a 1 in2 b. 135 °C/W when mounted on a pad of 2 oz copper. the board minimum pad of 2 oz copper. designed Q1+Q3 or Q2+Q4. the board designed Q1+Q3 or Q2+Q4. 2. Pulse Test: Pulse Width < 300 μs, Duty cycle < 2.0%. ©2012 Fairchild Semiconductor Corporation 2 www.fairchildsemi.com FDMQ8403 Rev.C2
F D Typical Characteristics M T = 25 °C unless otherwise noted J Q 8 4 12 5 0 VGVS G=S 8= V 10 V VGS = 6 V NCE VGS = 5 V PDUULTSYE C DYUCRLEA T=I O0.N5 %= 8M0A μXs 3 N A) 9 VGS = 7 V STA 4 -C URRENT ( 6 ALIZEDE ON-RESI 3 VGS = 6 V hann C MC e AIN VGS = 5 V NOROUR 2 VGS = 7 V l P DR 3 O S o I, D PULSE DURATION = 80 μs N T 1 we DUTY CYCLE = 0.5% MAX RAI VGS = 8 V VGS = 10 V rT 0 D 0 r 0 1 2 3 4 5 0 3 6 9 12 e n VDS, DRAIN TO SOURCE VOLTAGE (V) ID, DRAIN CURR ENT (A) c h Figure 1. On Region Characteristics Figure 2. Normalized On-Resistance ® vs Drain Current and Gate Voltage M O S 2.0 400 F ANCE 1.8 VIDG =S 3= A10 V )mΩ ID = 3 A PDUULTSYE C DYUCRLEA T=I O0.N5 %= 8M0A μXs ET NORMALIZED O SOURCE ON-RESIST 1111....0246 rDRAIN TO ,DS(on)(CE ON-RESISTANCE 123000000 TJ = 125 oC AIN T 0.8 SOUR TJ = 25 oC R D 0.6 0 -75 -50 -25 0 25 50 75 100 125 150 4 5 6 7 8 9 10 TJ, JUNCTION TEM PERATURE (oC) VGS, GATE TO SOURCE VOLTAGE (V) Figure 3. Normalized On Resistance Figure 4. On-Resistance vs Gate to vs Junction Temperature Source Voltage 12 20 PULSE DURATION = 80 μs A) 10 VGS = 0 V DUTY CYCLE = 0.5% MAX T ( N T (A) 9 VDS = 5 V URRE 1 TJ = 150 oC RREN 6 TJ = 150 oC AIN C TJ = 25 oC U R 0.1 C D AIN TJ = 25 oC RSE R E , DD 3 REV 0.01 TJ = -55 oC I TJ = -55 oC I, S 0 0.001 2 3 4 5 6 7 0.2 0.4 0.6 0.8 1.0 1.2 VGS, GATE TO SOU RCE VOLTAGE (V) VSD, BODY DIODE FOR WARD VOLTAGE (V) Figure 5. Transfer Characteristics Figure 6. Source to Drain Diode Forward Voltage vs Source Current ©2012 Fairchild Semiconductor Corporation 3 www.fairchildsemi.com FDMQ8403 Rev.C2
F D Typical Characteristics M T = 25 °C unless otherwise noted J Q 8 10 1000 4 0 E (V) ID = 3 A VDD = 50 V 3 N G 8 A - O SOURCE VOLT 46 VDD = 25 V VDD = 75 V PACITANCE (pF) 10100 CCiossss Channel P T A E C o AT 2 w G f = 1 MHz e V, GS 0 1 VGS = 0 V Crss rT r 0 0.5 1.0 1.5 2.0 2.5 3.0 0.1 1 10 100 e Qg, GATE CH ARGE (nC) VDS, DRAIN TO SOU RCE VOLTAGE (V) nc h Figure 7. Gate Charge Characteristics Figure 8. Capacitance vs Drain ® to Source Voltage M O S 20 500 F E 10 W) T R ( A) 100 us WE 100 T ( O REN 1 1 ms NT P R E I, DRAIN CUD0.000.00.115 TLIHMISIT AERDTSTRE JABIθNA J =Y=AG I M2Sr=LD5 AE1S Xo 3(PCo5 nRU ) AoLCST/EEWD 1111D000 C0s m smss , PPEAK TRANSI ()PK 01.015 SRTAIθNJ =AG 2=L5 E1 o 3PC5U oLCS/WE 0.1 1 10 100 300 10-4 10-3 10-2 10-1 1 10 100 1000 VDS, DRAIN to SOU RCE VOLTAGE (V) t, PULSE WI DTH (sec) Figure 9. Forward Bias Safe Operating Area Figure 10. Single Pulse Maximum Power Dissipation 2 DUTY CYCLE-DESCENDING ORDER D = 0.5 AL 0.2 ERMZJAθ 0.1 00..105 ALIZED TH PEDANCE, 00..0021 PDM t1 RMIM0.01 t2 NO SINGLE PULSE NOTES: RθJA = 135 oC/W DPEUATYK FTAJ C= TPODRM: xD Z =θ JtA1 /xt2 RθJA + TA 0.001 10-4 10-3 10-2 10-1 1 10 100 1000 t, RECTANGULAR PULSE DURATION (sec) Figure 11. Junction-to-Ambient Transient Thermal Response Curve ©2012 Fairchild Semiconductor Corporation 4 www.fairchildsemi.com FDMQ8403 Rev.C2
F D Dimensional Outline and Pad Layout M Q 8 4 0 3 N - C h a n n e l P o w e r T r e n c h ® M O S F E T ©2012 Fairchild Semiconductor Corporation 5 www.fairchildsemi.com FDMQ8403 Rev.C2
F D M Q 8 4 0 TRADEMARKS 3 The following includes registered and unregistered trademarks and service marks, owned by Fairchild Semiconductor and/or its global subsidiaries, and is not N intended to be an exhaustive list of all such trademarks. - C 2Cool™ F-PFS™ PowerTrench® The Power Franchise® h AccuPower™ FRFET® PowerXS™ ® a AX-CAP™* Global Power ResourceSM Programmable Active Droop™ n BitSiC® Green Bridge™ QFET® TinyBoost™tm n Build it Now™ Green FPS™ QS™ e CorePLUS™ Green FPS™ e-Series™ Quiet Series™ TTiinnyyCBuaclck™™ l P CorePOWER™ Gmax™ RapidConfigure™ TinyLogic® o CROSSVOLT™ GTO™ ™ TINYOPTO™ w CTL™ IntelliMAX™ Current Transfer Logic™ ISOPLANAR™ Saving our world, 1mW/W/kW at a time™ TinyPower™ e DEUXPEED® Marking Small Speakers Sound Louder SignalWise™ TinyPWM™ rT TinyWire™ DEcuoaSl CPAooRl™K® aMnedg BaBeuttcekr™™ SSMmAarRtMT aSxT™ART™ TranSiC® re TriFault Detect™ n EESffiBceCn™tMax™ MMiIcCrRoFOECTO™UPLER™ SSoPlMut®ions for Your Success™ TμSReUrEDCesU™RRENT®* ch ® MicroPak™ STEALTH™ ® MicroPak2™ SuperFET® M FFaaiirrcchhiilldd® Semiconductor® MMiollteiorDnMrivaex™™ SSuuppeerrSSOOTT™™--36 UHC® O FACT Quiet Series™ Motion-SPM™ SuperSOT™-8 Ultra FRFET™ S FACT® mWSaver™ SupreMOS® UniFET™ F FAST® OptoHiT™ SyncFET™ VCX™ E FastvCore™ OPTOLOGIC® Sync-Lock™ VisualMax™ T FETBench™ OPTOPLANAR® ®* VoltagePlus™ FlashWriter® * XS™ ® FPS™ tm *Trademarks of System General Corporation, used under license by Fairchild Semiconductor. DISCLAIMER FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY PRODUCTS HEREIN TO IMPROVE RELIABILITY, FUNCTION, OR DESIGN. FAIRCHILD DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS. THESE SPECIFICATIONS DO NOT EXPAND THE TERMS OF FAIRCHILD’S WORLDWIDE TERMS AND CONDITIONS, SPECIFICALLY THE WARRANTY THEREIN, WHICH COVERS THESE PRODUCTS. LIFE SUPPORT POLICY FAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF FAIRCHILD SEMICONDUCTOR CORPORATION. As used here in: 1. Life support devices or systems are devices or systems which, (a) are 2. A critical component in any component of a life support, device, or intended for surgical implant into the body or (b) support or sustain life, system whose failure to perform can be reasonably expected to cause and (c) whose failure to perform when properly used in accordance with the failure of the life support device or system, or to affect its safety or instructions for use provided in the labeling, can be reasonably effectiveness. expected to result in a significant injury of the user. ANTI-COUNTERFEITING POLICY Fairchild Semiconductor Corporation’s Anti-Counterfeiting Policy. Fairchild’s Anti-Counterfeiting Policy is also stated on our external website, www.Fairchildsemi.com, under Sales Support. Counterfeiting of semiconductor parts is a growing problem in the industry. All manufactures of semiconductor products are experiencing counterfeiting of their parts. Customers who inadvertently purchase counterfeit parts experience many problems such as loss of brand reputation, substandard performance, failed application, and increased cost of production and manufacturing delays. Fairchild is taking strong measures to protect ourselves and our customers from the proliferation of counterfeit parts. Fairchild strongly encourages customers to purchase Fairchild parts either directly from Fairchild or from Authorized Fairchild Distributors who are listed by country on our web page cited above. Products customers buy either from Fairchild directly or from Authorized Fairchild Distributors are genuine parts, have full traceability, meet Fairchild’s quality standards for handing and storage and provide access to Fairchild’s full range of up-to-date technical and product information. Fairchild and our Authorized Distributors will stand behind all warranties and will appropriately address and warranty issues that may arise. Fairchild will not provide any warranty coverage or other assistance for parts bought from Unauthorized Sources. Fairchild is committed to combat this global problem and encourage our customers to do their part in stopping this practice by buying direct or from authorized distributors. PRODUCT STATUS DEFINITIONS Definition of Terms Datasheet Identification Product Status Definition Datasheet contains the design specifications for product development. Specifications Advance Information Formative / In Design may change in any manner without notice. Datasheet contains preliminary data; supplementary data will be published at a later Preliminary First Production date. Fairchild Semiconductor reserves the right to make changes at any time without notice to improve design. Datasheet contains final specifications. Fairchild Semiconductor reserves the right to No Identification Needed Full Production make changes at any time without notice to improve the design. Datasheet contains specifications on a product that is discontinued by Fairchild Obsolete Not In Production Semiconductor. The datasheet is for reference information only. Rev. I61 ©2012 Fairchild Semiconductor Corporation 6 www.fairchildsemi.com FDMQ8403 Rev.C2
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