Is Now Part of To learn more about ON Semiconductor, please visit our website at www.onsemi.com Please note: As part of the Fairchild Semiconductor integration, some of the Fairchild orderable part numbers will need to change in order to meet ON Semiconductor’s system requirements. Since the ON Semiconductor product management systems do not have the ability to manage part nomenclature that utilizes an underscore (_), the underscore (_) in the Fairchild part numbers will be changed to a dash (-). This document may contain device numbers with an underscore (_). Please check the ON Semiconductor website to verify the updated device numbers. The most current and up-to-date ordering information can be found at www.onsemi.com. Please email any questions regarding the system integration to Fairchild_questions@onsemi.com. ON Semiconductor and the ON Semiconductor logo are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries. ON Semiconductor owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of ON Semiconductor’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent-Marking.pdf. ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. Buyer is responsible for its products and applications using ON Semiconductor products, including compliance with all laws, regulations and safety requirements or standards, regardless of any support or applications information provided by ON Semiconductor. “Typical” parameters which may be provided in ON Semiconductor data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. ON Semiconductor does not convey any license under its patent rights nor the rights of others. ON Semiconductor products are not designed, intended, or authorized for use as a critical component in life support systems or any FDA Class 3 medical devices or medical devices with a same or similar classification in a foreign jurisdiction or any devices intended for implantation in the human body. Should Buyer purchase or use ON Semiconductor products for any such unintended or unauthorized application, Buyer shall indemnify and hold ON Semiconductor and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that ON Semiconductor was negligent regarding the design or manufacture of the part. ON Semiconductor is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.

F A N 5 6 July 2013 2 2 / F A N 5 6 FAN5622 / FAN5624 / FAN5626 2 4 Linear LED Drivers with Single-Wire Digital Interface / F A N 5 Features Description 62 6  Family of Three Linear Current-Sink LED Drivers that The FAN5622, FAN5624, and FAN5626 are two-, four-, and — Support 2, 4, or 6 LED Outputs six-channel current-sink linear LED drivers used to backlight L  Current Sink Driver for Each LED Output: the main LCD displays or keypads in mobile electronics, such in as cellular phone handsets. e – 30 mA Maximum Output Current a – 50 mV Drop-out at 15 mA IOUT Ain dvuecrtyo rlos wo rd rsowpoitcuht ocf a5p0a cmitVor sa.l loTwhse dbrirviginhgtn LeEssD sle wveitlhso uotf athney r L – Better than 3% Matching between Channels E LED outputs are programmed through single-wire digital D – External RSET control interface. The user can program 32 linear dimming D  Single-Wire Digital Control Interface for Easy steps and turn on and off the LEDs through this interface by r i Programming applying digital pulses. v e – 32 Linear Steps of Dimming Control The FAN562x family of linear LED drivers provides high rs  Less than 1 µA Shutdown Current efficiency due to the low drop-out voltage of the LED driver. w Good matching between different channels of LED output is it  Short-Circuit, Under-Voltage, and Thermal Protection provided across the entire 32 dimming steps. These LED h S  Wide Input Voltage Range: 2.7 to 5.5 V drivers also integrate short circuit, under-voltage, and thermal i protection to ensure for a more robust solution. n  Small Form-Factor Packages: gl The FAN5622, FAN5624, and FAN5626 are available in very e – FAN5622: 6-Pin Super SOT23 - small form-factor packages: 6-pin Super SOT23, 10-lead W – FAN5624: 10-Lead 1.4x1.8x0.55 mm UMLP UMLP, and 10-lead MicroPak™ MLP, respectively. i r – FAN5626: 10-Lead 1.6x2.1x0.55 mm MicroPak™ e D MLP i g Applications it a l  Mobile Handsets In t  Mobile Internet Devices e r f  PMP and MP3 Players ac e  LCD Modules Figure 1. Typical Application of FAN5622 Ordering Information # of Temperature Part Number Package Packing Channels Range FAN5622SX 2 -40 to 85°C 6-Lead, SUPERSOT6, JEDEC MO-193, 1.6 mm Wide Tape and Reel FAN5624UMPX 4 -40 to 85°C 10-Lead, Ultrathin Molded Leadless Package (UMLP) Tape and Reel FAN5626LX 6 -40 to 85°C 10-Lead ,Micropak ,JEDEC MO255, 1.6 X 2.1 mm Tape and Reel © 2010 Fairchild Semiconductor Corporation www.fairchildsemi.com FAN5622 / FAN5624 / FAN5626 • Rev. 1.0.3

F A N Applications Diagrams 5 6 2 2 / F A N 5 6 2 4 / F A N 5 6 2 6 — L Figure 2. FAN5624 Typical Application for 4 LEDs in e a r L E D D r i v e r s w i t h S i n g l e - W i r e D Figure 3. FAN5626 Typical Application for 6 LEDs i g i Block Diagram t a l I n t e r f a c e Figure 4. Block Diagram © 2010 Fairchild Semiconductor Corporation www.fairchildsemi.com FAN5622 / FAN5624 / FAN5626 • Rev. 1.0.3 2

F A N Pin Configuration 5 6 2 2 / F A CTRL 1 6 LED1 N 5 6 GND 2 5 ISET 2 4 / F VIN 3 4 LED2 A N 5 6 2 6 — Figure 5. FAN5622: 6-Pin SSOT23, Top View Figure 6. FAN5624: 10-Lead UMLP, Top View L i n LED6 LED5 LED4 LED3 e a r L 9 8 7 6 E D D r i v ISET 10 5 LED2 e r s w i t 1 2 3 4 h S i n VIN GND CTRL LED1 g l e Figure 7. FAN5626: 10-Lead MicroPak™ MLP, Top View -W i r e Pin Definitions D i g Pin # i t a l FAN5622 FAN5624 FAN5626 Name Description In MicroPak t SSOT23-6 UMLP10 e MLP10 r f a 3 5 1 VIN Input Voltage. Connect to 2.7-5.5 V input power source. c DC e 2 6 2 GND Ground LED Current Setting. Full-scale LED current is set by tying this pin 5 3 10 ISET through a resistor (R ) to GND. SET Control pin. Program dimming levels by driving pin with digital pulses. 1 7 3 CTRL This pin cannot be left floating. 6 8 4 LED1 LED Cathode #1. LED current sink output. 4 10 5 LED2 LED Cathode #2. LED current sink output. 1 6 LED3 LED Cathode #3. LED current sink output. 2 7 LED4 LED Cathode #4. LED current sink output. 8 LED5 LED Cathode #5. LED current sink output. 9 LED6 LED Cathode #6. LED current sink output. 4, 9 N/C No Connect © 2010 Fairchild Semiconductor Corporation www.fairchildsemi.com FAN5622 / FAN5624 / FAN5626 • Rev. 1.0.3 3

F A N 5 Absolute Maximum Ratings 6 2 2 Stresses exceeding the absolute maximum ratings may damage the device. The device may not function or be operable above / the recommended operating conditions and stressing the parts to these levels is not recommended. In addition, extended F A exposure to stresses above the recommended operating conditions may affect device reliability. The absolute maximum ratings N are stress ratings only. 5 6 2 Symbol Parameter Min. Max. Unit 4 / VIN Pin -0.3 6.0 V F A VCC Other Pins(1) -0.3 VIN + V N 0.3 5 6 Human Body Model per JESD22-A114 3.0 kV 2 ESD Electrostatic Discharge Protection Level 6 Charged Device Model per JESD22-C101 1.5 kV — TJ Junction Temperature –40 +150 °C L i T Storage Temperature –65 +150 °C n STG e a T Lead Soldering Temperature, 10 Seconds +260 °C L r L Note: E 1. Lesser of 6.0 V or V +0.3 V. D IN D r i v e r s Recommended Operating Conditions w i t h The Recommended Operating Conditions table defines the conditions for actual device operation. Recommended operating S conditions are specified to ensure optimal performance to the datasheet specifications. Fairchild does not recommend exceeding i them or designing to absolute maximum ratings. n g l e Symbol Parameter Min. Max. Unit - W V Power Supply Voltage Range 2.7 5.5 V i IN r e T Operating Ambient Temperature Range -40 +85 °C A D TJ Operating Junction Temperature Range -40 +125 °C ig i t I Full-Scale LED Current 5 30 mA a LED(FS) l I n te r f a c Thermal Properties e Junction-to-ambient thermal resistance is a function of application and board layout. This data is measured with boards in accordance to JEDEC standard JESD51. Special attention must be paid not to exceed junction temperature T at a given J(max) ambient temperature T . A Symbol Parameter Typical Unit Junction-to-Ambient Thermal Resistance, SSOT23-6 Package 235 °C/W  Junction-to-Ambient Thermal Resistance, UMLP10 Package(2) 287 °C/W JA Junction-to-Ambient Thermal Resistance, MicroPak™ MLP10 package(3) 220 °C/W Notes: 2. Recommended not to exceed 132 mW of maximum power dissipation. 3. Recommended not to exceed 198 mW of maximum power dissipation. © 2010 Fairchild Semiconductor Corporation www.fairchildsemi.com FAN5622 / FAN5624 / FAN5626 • Rev. 1.0.3 4

F A N 5 Electrical Specifications 6 2 2 VIN = 2.7 V to 5.5 V, RSET = 19.10 kΩ, TA = -40°C to +85°C, Vf = 2.5 V to [3.5 V or VIN – 0.1 V], whichever is smaller. Typical / values are at T = 25°C, V = 3.6 V, and V = 3.2 V. F A IN f A N Symbol Parameter Condition Min. Typ. Max. Unit 5 6 Power Supplies 2 4 ISD Shutdown Supply Current VIN = 3.6 V, CTRL = 0 0.3 1.0 µA / F FAN5622: VIN = 3.6 V, ILED = 0 mA 0.4 0.8 mA A N IIN Operating Supply Current FAN5624: VIN = 3.6 V, ILED = 0 mA 0.6 1.0 mA 5 6 FAN5626: VIN = 3.6 V, ILED = 0 mA 0.8 1.2 mA 2 6 IIH Control Pin Input Current CTRL = 1.8 V 1 250 nA — Under-Voltage Lockout VIN Rising 2.50 2.70 V L V UVLO Threshold V Falling 2.10 2.30 2.50 V in IN e Regulation a r IFS_LEDx (MAX) Full-Scale LED Output Current ILEDx = 30 mA; x = 1 to 6 5 30 mA LE VIN=2.85 V – 4.5 V; VCATH =0.15 to D I Absolute Current Accuracy (1.2 V or VIN=2.55 V, Whichever is -10 +10 % D LED Smaller); Full-Scale Current 5- r i v 30 mA, TA = 25°C e r I LED Current Matching(4) ILEDx = 15 mA; V_LEDx=0.4 V, -3 +3 % s LED MATCH T = 25°C w A i t V I Drive Voltage 9.53 kΩ ≤ R ≤ 56.2 kΩ 1.20 V h ISET SET SET S Current Mirror Ratio from ISET IRATIO Pin 9.53 kΩ ≤ RSET ≤ 56.2 kΩ 240 in g l V = 3.6 V, I = 15 mA, e ∆IOUT_LOAD IOUT Load Regulation LEIND V = 2.7L EtoD x3.5 V, -3 +3 % -W F i V = 2.7 to 4.8 V, I = 15 mA, r ∆I I Line Regulation IN LEDx -4 +4 % e OUT_LINE OUT VCATH = 0.5 V D VIN=3.6 V; ILED = 15 mA, -10% 50 ig V Dropout Voltage ILED Drop mV ita DROPOUT VI IN= D3.r6o pV ; ILED = 30 mA, -10% 60 l In LED t e Rising Temperature at Junction 150 r TSD Thermal Shutdown °C fa Hysteresis 20 c e Logic Input (CTRL) V HIGH-Level Input Voltage 1.2 V IH V LOW-Level Input Voltage 0.4 V IL T CTRL LOW Time for Dimming V = 3.6 V; See Figure 17 0.5 300 µs LO IN T Time Delay between Steps V = 3.6 V; See Figure 17 0.5 µs HI IN T CTRL HIGH to Turn-On Delay V = 3.6 V; See Figure 17 250 µs ON IN CTRL LOW, Shutdown Pulse V = 3.6 V; from Falling Edge of T IN 1 ms SD Width CTRL Note: 4. For the two, four, and six LED current sinks of FAN5622, FAN5624, and FAN5626 respectively; the following are determined: the maximum sink current of the two, four, and six LED outputs (MAX); the minimum sink current of the two, four, and six outputs (MIN); and the average sink current (AVG). For all of the LED outputs, two matching numbers are calculated: (MAX-AVG)/ AVG and (AVG-MIN)/AVG. The largest number of the two (worst case) is considered the matching figure for the part. The matching figure for a given part is considered to be the highest matching figure of all LED outputs. The typical specification provided is the most likely norm of the matching figure for all parts. © 2010 Fairchild Semiconductor Corporation www.fairchildsemi.com FAN5622 / FAN5624 / FAN5626 • Rev. 1.0.3 5

F A N Typical Performance Characteristics 5 6 2 2 / F A N 5 6 2 4 / F A N 5 6 2 6 — L i n e a r L Figure 8. Efficiency vs. Input Voltage where LED V =3.2 V Figure 9. Dropout Voltage vs. Input Voltage E F D D r i v e r s w i t h S i n g l e - W i r e D i g i t a l I n Figure 10. Current Match of Channels vs. Input Voltage Figure 11. Load Regulation at 15 mA/Output te r f a c e Figure 12. Shutdown Current vs. Input Voltage Figure 13. Quiescent Current vs. Input Voltage © 2010 Fairchild Semiconductor Corporation www.fairchildsemi.com FAN5622 / FAN5624 / FAN5626 • Rev. 1.0.3 6

F A N 5 Typical Performance Characteristics 6 2 2 / F A N 5 6 2 4 / F A N 5 6 2 6 — L i n e a r L E Figure 14. Startup Waveform for FAN5626 Figure 15. Shutdown Waveform for FAN5626 D D r i v e r s w i t h S i n g l e - W i r e D i g i t a l I n t e Figure 16. Dimming Operation r f a c e © 2010 Fairchild Semiconductor Corporation www.fairchildsemi.com FAN5622 / FAN5624 / FAN5626 • Rev. 1.0.3 7

F A N 5 Circuit Description 6 2 2 The FAN5622, FAN5624, and FAN5626 are a family of Table 2 outlines the dimming levels while Figure 17 shows / current-sink linear LED driver ICs able to drive two, four, and how to change the dimming levels. F A six LEDs respectively. These three devices are powered Table 2. Brightness Control Levels (R = 19.10 kΩ) N directly from 2.7 V to 5.5 V supply and all the channels are SET 5 controlled via the integrated current sinks from the external 6 Dimming Level Current Level I (mA) 2 power source. Designed with a very low drop-out voltage, the LED 4 FAN562x products can operate close to the input supply 1 1.67% 0.25 / voltage without the need for additional inductive boost or F 2 3.33% 0.50 A capacitive switching circuitry. N 3 5.00% 0.75 5 All three devices require only two additional discrete passive 6 components: a single 1 µF input ceramic capacitor and a 4 6.67% 1.00 2 6 resistor (RSET) to set the maximum current for the LEDs. Each 5 10.00% 1.50 — current-sink output provides constant current and can drive 6 13.33% 2.00 the LEDs up to 30 mA. Fairchild Semiconductor’s TinyWire™ L i single-wire digital interface enables these LED drivers to 7 16.67% 2.50 n e program the brightness level of the LEDs in 32 linear steps. 8 20.00% 3.00 a r Setting Maximum Current 9 23.33% 3.50 L E The maximum LED current of the FAN5622, FAN5624, and 10 26.67% 4.00 D FAN5626 is programmed by an external resistor called RSET. D 11 30.00% 4.50 The maximum full-scale LED current for all three LED drivers r i is 30 mA and it can go as low as 5 mA. The FAN562x 12 33.33% 5.00 v e products also operate below 5 mA full-scale LED current by r 13 36.67% 5.50 s using a larger RSET value. However, the LED channel w accuracy and matching specifications are guaranteed. Table 1 14 40.00% 6.00 i shows the RSET resistor values for several full-scale current 15 43.33% 6.50 th levels. S 16 46.67% 7.00 i Table 1. Maximum LED Current Settings by Resistor n 17 50.00% 7.50 g l e ILED (mA) RSET (kΩ) 18 53.33% 8.00 -W 5 56.20 19 56.67% 8.50 i r e 10 28.70 20 60.00% 9.00 D 15 19.10 21 63.33% 9.50 ig i 20 14.30 22 66.67% 10.00 ta l 25 11.50 23 70.00% 10.50 In t 30 9.53 24 73.33% 11.00 e r f 25 76.67% 11.50 a Digital Interface & Dimming Control c 26 80.00% 12.00 e The FAN5622, FAN5624, and FAN5626 implement a simple single-wire digital interface to program the LED brightness to 27 83.33% 12.50 one of thirty two (32) levels spaced in linear steps. To maintain 28 86.67% 13.00 the brightness of the LEDs at a specific dimming level, the digital pulse signal to the CTRL pin should be held HIGH for 29 90.00% 13.50 that last pulse. It is held HIGH for as long as desired to keep 30 93.33% 14.00 the LEDs illuminated at that specific brightness level. 31 96.67% 14.50 32 100.00% 15.00 © 2010 Fairchild Semiconductor Corporation www.fairchildsemi.com FAN5622 / FAN5624 / FAN5626 • Rev. 1.0.3 8

F A N Digital Dimming Control 5 6 2 2 / F A N 5 6 2 4 / F A N 5 6 2 6 — L i n e a r L Figure 17. Digital Pulse Dimming Control Diagram E D D r i v e r s w i t h S i n g l e - W i r e D i g i t a l I n t e r f a c e © 2010 Fairchild Semiconductor Corporation www.fairchildsemi.com FAN5622 / FAN5624 / FAN5626 • Rev. 1.0.3 9

F A N 5 Physical Dimensions 6 2 2 / F A N 5 6 2 4 / F A N 5 6 2 6 — L i n e a r L E D D r i v e r s w i t h S i n g l e - W i r e D i g i t a l I n t e r f a c e Figure 18. 6-Lead SSOT23 Package drawings are provided as a service to customers considering Fairchild components. Drawings may change in any manner without notice. Please note the revision and/or date on the drawing and contact a Fairchild Semiconductor representative to verify or obtain the most recent revision. Package specifications do not expand the terms of Fairchild’s worldwide terms and conditions, specifically the warranty therein, which covers Fairchild products. Always visit Fairchild Semiconductor’s online packaging area for the most recent package drawings: http://www.fairchildsemi.com/packaging/. © 2010 Fairchild Semiconductor Corporation www.fairchildsemi.com FAN5622 / FAN5624 / FAN5626 • Rev. 1.0.3 10

F A N 5 Physical Dimensions (Continued) 6 2 2 0.10 C 1.40 A / B F 2X 1.70 (9X) A N 0.663 0.563 5 6 2 1.80 4 1 / F PIN#1 IDENT 2.10 A N 0.10 C 0.40 5 TOP VIEW 6 2X 2 6 (10X)0.225 — 0.10 C 0.55 MAX. (0.15) RECOMMENDED Li LAND PATTERN n e a 9X r 0.08 C 1.45 L 0.45 0.05 SEATING C 0.55 E D 0.00 PLANE D SIDE VIEW r i 0.40 v e 1.85 rs 0.35 (9X) w 0.45 i 3 (10X)0.225 th S 0.40 OPTIONAL MINIMIAL i n DETAIL A 6 TOE LAND PATTERN g l e 1 - NOTES: W PIN#1 IDENT i r A. PACKAGE DOES NOT CONFORM TO e 10 0.15(10X) ANY JEDEC STANDARD. D 0.25 B. DIMENSIONS ARE IN MILLIMETERS. ig BOTTOM VIEW 0.10 C A B C. DIMENSIONS AND TOLERANCES PER ita 0.05 C ASME Y14.5M, 1994. l I n D. LAND PATTERN RECOMMENDATION IS t e 0.55 BASED ON FSC DESIGN ONLY. r f 0.45 PACKAGE E. DRAWING FILENAME: MKT-UMLP10Arev5. ac EDGE e F. FAIRCHILD SEMICONDUCTOR. 45° LEAD LEAD 0.25 OPTION 1 OPTION 2 0.15 DETAIL A SCALE : 2X SCALE : 2X SCALE : 2X Figure 19. 10-Lead, Ultrathin Molded Leadless Package (UMLP) Package drawings are provided as a service to customers considering Fairchild components. Drawings may change in any manner without notice. Please note the revision and/or date on the drawing and contact a Fairchild Semiconductor representative to verify or obtain the most recent revision. Package specifications do not expand the terms of Fairchild’s worldwide terms and conditions, specifically the warranty therein, which covers Fairchild products. Always visit Fairchild Semiconductor’s online packaging area for the most recent package drawings: http://www.fairchildsemi.com/packaging/. © 2010 Fairchild Semiconductor Corporation www.fairchildsemi.com FAN5622 / FAN5624 / FAN5626 • Rev. 1.0.3 11

F A N Physical Dimensions (Continued) 5 6 2 2 / F A N 0.10 C 5 2.10 A 6 2X 2 1.62 4 B KEEPOUT ZONE, NO TRACES / (0.11) OR VIAS ALLOWED F A N 0.56 5 1.60 1.12 6 2 6 PIN1 IDENT IS — 2X LONGER THAN 0.10 C (0.35)10X L OTHER LINES TOP VIEW 2X 0.50 (0.25)10X in e a RECOMMENDED LAND PATTERN r L E 0.55 MAX D 0.05 C D r 0.05 C iv e 0.05 (0.20) r 0.00 s C SIDE VIEW 0.35 w 0.25 it h S D (0.15) in DETAIL A (0.36) g 0.65 0.35 l 0.55 0.25 e - 0.35 DETAIL A 2X SCALE W 0.25 1 4 0.56 ir e NOTES: D 10 5 i A. PACKAGE CONFORMS TO JEDEC g (0.29) REGISTRATION MO-255, VARIATION UABD . ita 0.50 9 60.25 00..32559X BC.. DDIIMMEENNSSIIOONNSS AARNED ITNO MLEILRLAIMNECTEESR PSE.R l In 9X ASME Y14.5M, 1994. t 0.15 e 1.62 0.10 C A B D. PRESSUEPNPCLIEE RO FD ECPEENNTDEERN PTA. D I FIS P PRAECSKEANGT EIT rfa 0.05 C IS NOT INTENDED TO BE SOLDERED AND c e ALL FEATURES HAS A BLACK OXIDE FINISH. BOTTOM VIEW E. DRAWING FILENAME: MKT-MAC10Arev5. Figure 20. 10-Lead MicroPak™ MLP Package drawings are provided as a service to customers considering Fairchild components. Drawings may change in any manner without notice. Please note the revision and/or date on the drawing and contact a Fairchild Semiconductor representative to verify or obtain the most recent revision. Package specifications do not expand the terms of Fairchild’s worldwide terms and conditions, specifically the warranty therein, which covers Fairchild products. Always visit Fairchild Semiconductor’s online packaging area for the most recent package drawings: http://www.fairchildsemi.com/packaging/. © 2010 Fairchild Semiconductor Corporation www.fairchildsemi.com FAN5622 / FAN5624 / FAN5626 • Rev. 1.0.3 12

F A N 5 6 2 2 / F A N 5 6 2 4 / F A N 5 6 2 6 — L i n e a r L E D D r i v e r s w i t h S i n g l e - W i r e D i g i t a l I n t e r f a c e © 2010 Fairchild Semiconductor Corporation www.fairchildsemi.com FAN5622 / FAN5624 / FAN5626 • Rev. 1.0.3 13

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