Is Now Part of To learn more about ON Semiconductor, please visit our website at www.onsemi.com Please note: As part of the Fairchild Semiconductor integration, some of the Fairchild orderable part numbers will need to change in order to meet ON Semiconductor’s system requirements. Since the ON Semiconductor product management systems do not have the ability to manage part nomenclature that utilizes an underscore (_), the underscore (_) in the Fairchild part numbers will be changed to a dash (-). This document may contain device numbers with an underscore (_). Please check the ON Semiconductor website to verify the updated device numbers. The most current and up-to-date ordering information can be found at www.onsemi.com. Please email any questions regarding the system integration to Fairchild_questions@onsemi.com. ON Semiconductor and the ON Semiconductor logo are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries. ON Semiconductor owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of ON Semiconductor’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent-Marking.pdf. ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. Buyer is responsible for its products and applications using ON Semiconductor products, including compliance with all laws, regulations and safety requirements or standards, regardless of any support or applications information provided by ON Semiconductor. “Typical” parameters which may be provided in ON Semiconductor data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. ON Semiconductor does not convey any license under its patent rights nor the rights of others. ON Semiconductor products are not designed, intended, or authorized for use as a critical component in life support systems or any FDA Class 3 medical devices or medical devices with a same or similar classification in a foreign jurisdiction or any devices intended for implantation in the human body. Should Buyer purchase or use ON Semiconductor products for any such unintended or unauthorized application, Buyer shall indemnify and hold ON Semiconductor and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that ON Semiconductor was negligent regarding the design or manufacture of the part. ON Semiconductor is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.

F A N 2 May 2013 5 0 0 — 1 0 FAN2500 0 m A 100 mA CMOS LDO Regulator C M O S L Features Description D O • Ultra-Low Power Consumption The FAN2500 micropower low-dropout voltage regulator R • 100 mV Dropout Voltage at 100 mA utilizes CMOS technology to offer a new level of cost- e effective performance in mobile handsets, laptop and g • 25 μA Ground Current at 100 mA u notebook portable computers, and other portable l • Enable / Shutdown Control a devices. Features include extremely low power consump- t • SOT23-5 package o tion, low shutdown current, low dropout voltage, excep- r • Thermal Limiting tional loop stability able to accommodate a wide variety of • 300 mA Peak Current external capacitors, and a compact SOT23-5 surface- mount package. The FAN2500 offers significant improve- Applications ments over older BiCMOS designs and is pin-compatible • Mobile Phones and Accessories with many popular devices. The output is thermally pro- • Portable Cameras and Video Recorders tected against overload. • Laptop, Notebook, and Palmtop Computers FAN2500: pin 4 – ADJ, allows the user to adjust the output voltage over a wide range using an external volt- age divider. FAN2500-XX: pin 4 – BYP, to which a bypass capacitor may be connected for optimal noise performance. Output voltage is fixed, indicated by the suffix XX. The standard fixed output voltages available are 2.5 V, 3.0 V, and 3.3 V. Ordering Information Packing Part Number V Pin 4 Function Top Mark Package OUT Method FAN2500S25X 2.5 Bypass ACE SOT-23 5L Tape and Reel FAN2500S30X 3.0 Bypass ACW SOT-23 5L Tape and Reel FAN2500S33X 3.3 Bypass AC3 SOT-23 5L Tape and Reel FAN2500SX Adj. Adjust ACA SOT-23 5L Tape and Reel Tape and Reel Information Quantity Reel Size Width 3000 7 inches 8 mm © 2010 Fairchild Semiconductor Corporation www.fairchildsemi.com FAN2500 Rev. 1.1.0 1

F A Block Diagram N 2 5 0 0 — 1 0 0 m A C M O S L D FAN2500 O R Figure 1. Block Diagram e g u Pin Configuration l a t o r Figure 2. Pin Configuration Pin No. FAN2500 FAN2500-XX 1. V V IN IN 2. GND GND 3. EN EN 4. ADJ BYP 5. V V OUT OUT Pin Descriptions Pin Name Pin No. Type Functional Description FAN2500 Adjust ADJ 4 Input Ratio of potential divider from V to ADJ determines output voltage OUT FAN2500-XX Bypass BYP 4 Passive Connect a 470 pF capacitor for noise reduction Enable EN 3 Digital Input 0: Shutdown VOUT 1: Enable V OUT Voltage Input V 1 Power In IN Supply voltage input Voltage Output V 5 Power Out OUT Regulated output voltage GND 2 Power Ground © 2010 Fairchild Semiconductor Corporation www.fairchildsemi.com FAN2500 Rev. 1.1.0 2

F A Absolute Maximum Ratings(1) N 2 Stresses exceeding the absolute maximum ratings may damage the device. The device may not function or be opera- 5 0 ble above the recommended operating conditions and stressing the parts to these levels is not recommended. In addi- 0 tion, extended exposure to stresses above the recommended operating conditions may affect device reliability. The — absolute maximum ratings are stress ratings only. 1 0 Parameter Min. Max. Unit 0 m Power Supply Voltages A VIN (Measured to GND) 0 7 V C M Enable Input (EN) O Applied Voltage (Measured to GND)(2) 0 7 V S Power L D Dissipation(3) Internally Limited O R Temperature e g Junction -65 150 °C u l Lead Soldering (5 s) 260 °C a t o Storage -65 150 °C r Electrostatic Discharge(4) 4 kV Notes: 1. Functional operation under any of these conditions is NOT implied. Performance and reliability are guaranteed only if Recommended Operating Conditions are not exceeded. 2. Applied voltage must be current limited to specified range. 3. Based upon thermally limited junction temperature: T –T P = ----J---(-m----a---x---)-----------A-- D Θ JA 4. Human Body Model is 4 kV minimum using Mil Std. 883E, method 3015.7. Machine Model is 400 V minimum using JEDEC method A115-A. Recommended Operating Conditions The recommended Operating Conditions table defines the conditions for actual device operation. Recommended oper- ating conditions are specified to ensure optimal performance to the datasheet specifications. Fairchild does not recom- mend exceeding them or designing to Absolute Maximum Ratings. Symbol Parameter Min. Nom. Max. Unit V Input Voltage Range 2.7 6.5 V IN V Enable Input Voltage 0 V V EN IN T Junction Temperature -40 +125 °C J θ Thermal Resistance, Junction to Air 220 °C/W JA θ Thermal Resistance, Junction to Case 130 °C/W JC © 2010 Fairchild Semiconductor Corporation www.fairchildsemi.com FAN2500 Rev. 1.1.0 3

F A Electrical Characteristics(5, 6) N 2 5 Symbol Parameter Conditions Min. Typ. Max. Units 0 0 Regulator — IOUT = 100 μA 2.5 4.0 mV 1 V Drop-Out Voltage I = 50 mA 50 75 mV 0 DO OUT 0 I = 100 mA 100 140 mV m OUT ∆V Output Voltage Accuracy -2 2 % A O C ∆VREF Reference Voltage Accuracy, Adjustable Mode 1.24 1.32 1.40 V M ∆V (7) Output Voltage Accuracy, Adjustable Mode -6 6 % O O S IGND Ground Pin Current IOUT = 100 mA 50 μA L Protection D O Current Limit Thermally Protected R IGSD Shutdown Current EN = 0 V 1 μA e g TSH Thermal Protection Shutdown Temperature 150 °C u l Enable Input a t o VIL Logic Low Voltage 1.2 0.4 V r V Logic High Voltage 2.0 1.4 V IH I Input Current High 1 μA IH I Input Current Low 1 μA I Switching Characteristics(5, 6) Parameter Max. Unit Enable Input(8) Response Time 500 μsec Performance Characteristics(5, 6) Symbol Parameter Conditions Typ. Max. Unit ∆V / OUT Line Regulation V = (V + 1) to 6.5 V 0.3 % / V ∆V IN OUT IN ∆V / OUT Load Regulation I = 0.1 to 100 mA 1.0 2.0 % V OUT OUT f = 10 Hz to 1 kHz at V , IN C = 10 μF, < 7.00 OUT C = 0.01 μF eN Output Noise BYP μV / Hz f > 10 kHz at V , IN C = 10 μF, < 0.01 OUT C = 0.01 μF BYP f = 120 Hz at V , IN PSRR Power Supply Rejection C = 10 μF, 43 dB OUT C = 0.01 μF BYP Notes: 5. Unless otherwise stated; T = 25°C, V = V + 1 V, I = 100 μA, and V > 2.0 V. A IN OUT OUT IH 6. Bold values indicate -40 ≤ T ≤ 125°C. J 7. The adjustable version has a band-gap voltage range of 1.24 V to 1.40 V with a nominal value of 1.32 V. 8. When using repeated cycling. © 2010 Fairchild Semiconductor Corporation www.fairchildsemi.com FAN2500 Rev. 1.1.0 4

F A Typical Performance Characteristics N 2 5 0 0 — 1 0 0 m A C M O S L D O R e g u Figure 3. Power Supply Rejection Ratio Figure 4. Power Supply Rejection Ratio la t o r Figure 5. Power Supply Rejection Ratio Figure 6. Power Supply Rejection Ratio Figure 7. Power Supply Rejection Ratio Figure 8. Power Supply Rejection Ratio © 2010 Fairchild Semiconductor Corporation www.fairchildsemi.com FAN2500 Rev. 1.1.0 5

F A Typical Performance Characteristics (Countinued) N 2 5 0 0 — 1 0 0 m A C M O S L D O R e g u Figure 9. PSRR vs. Voltage Drop Figure 10. PSRR vs. Voltage Drop l a t o r Figure 11. Noise Performance Figure 12. Ground Pin Current Figure 13. Ground Pin Current Figure 14. Ground Pin Current © 2010 Fairchild Semiconductor Corporation www.fairchildsemi.com FAN2500 Rev. 1.1.0 6

F A Typical Performance Characteristics (Countinued) N 2 5 0 0 — 1 0 0 m A C M O S L D O R e g u Figure 15. Ground Pin Current Figure 16. Ground Pin Current l a t o r Figure 17. Dropout Voltage Figure 18. Dropout Characteristics Figure 19. Dropout Voltage Figure 20. Dropout Voltage © 2010 Fairchild Semiconductor Corporation www.fairchildsemi.com FAN2500 Rev. 1.1.0 7

F A Typical Performance Characteristics (Countinued) N 2 5 0 0 — 1 0 0 m A C M O S L D O R e g u l a t o Figure 21. Output Voltage vs. Temperature Figure 22. Enable Pin Delay r Figure 23. Shutdown Delay © 2010 Fairchild Semiconductor Corporation www.fairchildsemi.com FAN2500 Rev. 1.1.0 8

F A Functional Description In general, ceramic capacitors offer superior ESR perfor- N mance at a lower cost and a smaller case size than tan- 2 5 Designed utilizing CMOS process technology, the talum. Those with X7R or Y5V dielectric offer the best 0 FAN2500 is carefully optimized for use in compact bat- 0 temperature coefficient characteristics. The combination tery-powered devices. The FAN2500 offers a unique — of tolerance and variation over temperature in some combination of low power consumption, extremely low capacitor types can result in significant variations, result- 1 dropout voltages, high tolerance for a variety of output 0 ing in unstable performance over rated conditions. 0 capacitors, and the ability to disable the output to less m than 1 μA under user control. In the circuit, a difference Input Capacitor A amplifier controls the current through a series-pass P- An input capacitor of 2.2 μF (nominal value) or greater, C channel MOSFET, comparing the load voltage at the out- connected between the Input pin and ground, located in M put with an onboard low-drift band-gap reference. The close proximity to the device, improves transient O series resistance of the pass P-channel MOSFET is response and noise rejection. Higher values offer supe- S approximately 1 Ω, resulting in an unusually low dropout rior input ripple rejection and transient response. An L D voltage under load compared to older bipolar pass-tran- input capacitor is recommended when the input source, O sistor designs. either a battery or a regulated AC voltage, is located far R from the device. Any good-quality ceramic, tantalum, or Protection circuitry is provided onboard for overload con- e metal film capacitor gives acceptable performance; how- g ditions. If the device reaches temperatures exceeding u the specified maximums, an onboard circuit shuts down ever, tantalum capacitors with a surge current rating la the output and it remains suspended until it has cooled appropriate to the application must be selected to avoid to before re-enabling. The user can shut down the device catastrophic failure. r Output Capacitor using the Enable control pin at any time. An output capacitor is required to maintain regulator loop Careful design of the output regulator amplifier assures stability. Unlike many other LDO regulators, the loop stability over a wide range of ESR values in the FAN2500 is nearly insensitive to output capacitor ESR. external output capacitor. A wide range of values and Stable operation is achieved with a wide variety of types can be accommodated, allowing the user to select capacitors with ESR values ranging from 10 mΩ to 10 Ω a capacitor meeting space, cost, and performance or more. Tantalum, aluminum electrolytic, or multilayer requirements; and still enjoy reliable operation over tem- ceramic can be used. A nominal value of at least 1 μF is perature, load, and tolerance variations. recommended. Depending on the model selected, a number of control Bypass Capacitor (FAN2500 Only) and status functions are available to enhance the opera- tion of the LDO regulator. An Enable pin, available on all In the fixed-voltage configuration, connecting a capacitor devices, allows the user to shut down the regulator out- between the Bypass pin and ground can significantly put to conserve power, reducing supply current to less reduce noise on the output. Values ranging from 470 pF than 1 μA. The adjustable-voltage versions of the device to 10 nF can be used, depending on the sensitivity to utilize pin 4 to connect to an external voltage divider that output noise in the application. feeds back to the regulator error amplifier, thereby set- At the high-impedance Bypass pin, care must be taken in ting the voltage as desired. Two other functions are avail- the circuit layout to minimize noise pickup and capacitors able at pin 4 in the fixed-voltage versions: in noise- must be selected to minimize current loading (leakage). sensitive applications, an external bypass capacitor con- Noise pickup from external sources can be considerable. nection is provided that allows the user to achieve opti- Leakage currents into the Bypass pin directly affect regu- mal noise performance at the output, while the error lator accuracy and should be kept as low as possible; output functions as a diagnostic flag to indicate that the high-quality ceramic and film types are recommended for output voltage has dropped more than 5% below the their low leakage characteristics. Cost-sensitive applica- nominal fixed voltage. tions not concerned with noise can omit this capacitor. Applications Information Control Functions Enable Pin External Capacitors – Selection Applying a voltage of 0.4 V or less at the Enable pin dis- FAN2500 supports a wide variety of capacitors com- ables the output, reducing the quiescent output current pared to other LDO products. An innovative design to less than 1 μA; while a voltage of 2.0 V or greater approach offers significantly reduced sensitivity to ESR enables the device. If this shutdown function is not (Equivalent Series Resistance), which degrades regula- needed, the pin can be connected to the V pin. Allow- tor loop stability in older designs. While the improve- IN ing this pin to float causes erratic operation. ments greatly simplify the design task, capacitor quality still must be considered to achieve optimal circuit perfor- mance. © 2010 Fairchild Semiconductor Corporation www.fairchildsemi.com FAN2500 Rev. 1.1.0 9

F A Thermal Protection Once the limiting parameters in these two relationships N have been determined, the design can be modified to 2 FAN2500 can supply high peak output currents of up to 1 5 A for brief periods. However, this output load causes the ensure that the device remains within specified operating 0 0 device temperature to exceed maximum ratings due to conditions at all times. — power dissipation. During output overload conditions, If overload conditions are not considered, it is possible 1 when the die temperature exceeds the shutdown limit for the device to enter a thermal cycling loop, in which 0 temperature of 150°C, onboard thermal protection dis- the circuit enters a shutdown condition, cools, re- 0 m ables the output until the temperature drops below this enables, and then again overheats and shuts down A limit, at which point the output is re-enabled. During a repeatedly due to an unmanaged fault condition. thermal shutdown situation, the user may assert the C Operational of Adjustable Version M power-down function at the Enable pin, reducing power O consumption to the minimum level I · V . The adjustable version of the FAN2500 includes an input GND IN S pin, ADJ, which allows the user to select an output volt- L Thermal Characteristics age ranging from 1.8 V to near VIN, using an external D FAN2500 can supply 100 mA at the specified output volt- resistor divider. The voltage VADJ presented to the ADJ O age with an operating die (junction) temperature of up to pin is fed to the onboard error amplifier, which adjusts R 125°C. Once the power dissipation and thermal resis- the output voltage until VADJ is equal to the onboard eg tance is known, the maximum junction temperature of bandgap reference voltage of 1.32 V (typ). The equation u the device can be calculated. While the power dissipa- is: la t tion is calculated from known electrical parameters, the o r thermal resistance is a result of the thermal characteris- tics of the compact SOT23-5 surface-mount package and the surrounding PC board copper to which it is mounted. The total value of the resistor chain should not exceed The power dissipation is equal to the product of the input 250 kΩ total to keep the error amplifier biased during no- to output voltage differential and the output current, plus load conditions. Programming output voltages very near the ground current multiplied by the input voltage, or: V need to allow for the magnitude and variation of the IN dropout voltage V over load, supply, and temperature DO P = (V –V )I +V I D IN OUT OUT IN GND variations. Note that the low-leakage MOSFET input to the CMOS error amplifier induces no bias current error to The ground pin current, I can be found in the charts the calculation. GND, provided in the Electrical Characteristics section. General PCB Layout Considerations The relationship describing the thermal behavior of the To achieve the full performance of the device, careful cir- package is: cuit layout and grounding technique must be observed. Establishing a small local ground, to which the GND pin, P = ⎨⎧T----J---(-m----a---x---)---–----T----A--⎬⎫ the output, and bypass capacitors are connected; is rec- D(max) ⎩ θJA ⎭ ommended. The input capacitor should be grounded to the main ground plane. The quiet local ground is routed back to the main ground plane using feed-through vias. where TJ(max) is the maximum allowable junction temper- In general, the high-frequency compensation compo- ature of the die, which is 125°C, and TA is the ambient nents (input, bypass, and output capacitors) should be operating temperature. θJA is dependent on the sur- located as close to the device as possible. The proxim- rounding PC board layout and can be empirically ity of the output capacitor is especially important to obtained. While the θJC (junction-to-case) of the SOT23- achieve optimal noise compensation from the onboard 5 package is specified at 130°C /W, the θJA of the mini- error amplifier, especially during high load conditions. A mum PWB footprint is at least 235°C/W. This can be large copper area in the local ground provides the heat improved by providing a heat sink of surrounding copper sinking discussed above when high power dissipation ground on the PCB. significantly increases the temperature of the device. Depending on the size of the copper area, the resulting Component-side copper provides significantly better θJA can range from approximately 180°C/W for one thermal performance for this surface-mount device, com- square inch to nearly 130°C/W for four square inches. pared to that obtained when using only copper planes on The addition of backside copper with through-holes, stiff- the underside. eners, and other enhancements can reduce this value. The heat contributed by the dissipation of other devices nearby must be included in design considerations. © 2010 Fairchild Semiconductor Corporation www.fairchildsemi.com FAN2500 Rev. 1.1.0 10

F A Physical Dimensions N 2 5 0 0 — SOT-23 1 0 0 SYMM CL m 3.00 A 0.95 0.95 A 2.80 C M 5 4 B O S L 3.00 D 2.60 O 1.70 1.50 2.60 R e g u 1 2 3 l a (0.30) t 0.95 00..5300 1.00 or 0.20 C A B 1.90 0.70 TOP VIEW LAND PATTERN RECOMMENDATION SEE DETAIL A 1.30 0.90 1.45 MAX 0.15 0.05 C 0.22 0.08 0.10 C NOTES: UNLESS OTHEWISE SPECIFIED A) THIS PACKAGE CONFORMS TO JEDEC MO-178, ISSUE B, VARIATION AA, GAGE PLANE B) ALL DIMENSIONS ARE IN MILLIMETERS. C) MA05Brev5 0.25 8° 0° 0.55 0.35 SEATING PLANE 0.60 REF Figure 24. 5-LEAD, SOT-23, JEDEC MO-178, 1.6 mm Package drawings are provided as a service to customers considering Fairchild components. Drawings may change in any manner without notice. Please note the revision and/or date on the drawing and contact a Fairchild Semiconductor representative to verify or obtain the most recent revision. Package specifications do not expand the terms of Fairchild’s worldwide terms and conditions, specifically the warranty therein, which covers Fairchild products. Always visit Fairchild Semiconductor’s online packaging area for the most recent package drawings: http://www.fairchildsemi.com/packaging/. For current tape and reel specifications, visit Fairchild Semiconductor’s online packaging area: http://www.fairchildsemi.com/packaging/tr/SOT23-5L_tr.pdf. © 2010 Fairchild Semiconductor Corporation www.fairchildsemi.com FAN2500 Rev. 1.1.0 11

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A critical component in any component of a life support, device, or intended for surgical implant into the body or (b) support or sustain system whose failure to perform can be reasonably expected to life, and (c) whose failure to perform when properly used in cause the failure of the life support device or system, or to affect its accordance with instructions for use provided in the labeling, can be safety or effectiveness. reasonably expected to result in a significant injury of the user. ANTI-COUNTERFEITING POLICY Fairchild Semiconductor Corporation's Anti-Counterfeiting Policy. Fairchild's Anti-Counterfeiting Policy is also stated on our external website, www.fairchildsemi.com, under Sales Support. Counterfeiting of semiconductor parts is a growing problem in the industry. All manufacturers of semiconductor products are experiencing counterfeiting of their parts. 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Mouser Electronics Authorized Distributor Click to View Pricing, Inventory, Delivery & Lifecycle Information: O N Semiconductor: FAN2500S33X FAN2500S30X FAN2500SX FAN2500S25X