Chip Bead Cores Chip Bead Cores EXCCL Type: EXCML EXC3B ■ ■ Features Recommended Applications ● Effective noise suppression for power lines and high ● Digital equipment such as PCs, word processors, speed signal lines print ers, HDD, PCC, CD-ROMs, DVD-ROMs. ● Easy pattern layout on PC Board ● Digital audio and video equipment such as VCRs, ● RoHS compliant DVC, CD Players, DVD Players. ● AC adapters, and switching power supplies. Type: EXCCL, EXCML ● Electronic musical instruments, and other digital ● Low DC Resistance 3 to 8 mΩ typical: Rated equipment. current (3 and 4 Amperes) (type: EXCML) ● Low impedance Type: EXC3B ● High impedance for high speed signal line noise ● Increased attenuation ● 60 Ω-1 A, 120 Ω-0.5 A are achieved by using 1608 size (type: EXC3BP) ■ Type: EXCCL ● Explanation of Part Numbers 1 2 3 4 5 6 7 8 9 10 11 12 (cid:38) (cid:57) (cid:36) (cid:36) (cid:45) (cid:20) (cid:19) (cid:18) (cid:23) (cid:54) (cid:18) Product Code Type Part kind Size Form Suffix Noise Filter Chip type Bead core Code Dimensions (mm) Code Packing 4532 4.5(cid:76)3.2(cid:76)1.8 U Embossed Carrier Taping 3225 3.2(cid:76)2.5(cid:76)1.6 3216 3.2(cid:76)1.6(cid:76)1.6 Design and specifi cations are each subject to change without notice. Ask factory for the current technical specifi cations before purchase and/or use. Should a safety concern arise regarding this product, please be sure to contact us immediately. 02 Nov. 2012

Chip Bead Cores ■ Construction ■ Dimensions in mm (not to scale) H A A L W Type Dimensions (mm) Mass Ferrite core (Weight) Electrode (inch size) L W H A [mg/pc.] EXCCL4532 4.5±0.4 3.2±0.3 1.8±0.2 0.5±0.2 125.8 (1812) EXCCL3225 3.2±0.3 2.5±0.3 1.6±0.3 0.5±0.3 60.5 (1210) EXCCL3216 3.2±0.3 1.6±0.3 1.6±0.3 0.5±0.3 37 (1206) ■ Type: EXCML ● Explanation of Part Numbers 1 2 3 4 5 6 7 8 9 10 11 12 (cid:38) (cid:57) (cid:36) (cid:46) (cid:45) (cid:19) (cid:17) (cid:34) (cid:20) (cid:26) (cid:17) (cid:54) Product Code Type Part kind Size Material Nominal Impedance Form Molded The first two digits are Noise Filter Bead core Code Dimensions (mm) Code Packing Chip type significant figure of 45 4.5(cid:76)1.6 (cid:76)1.1 impedance value and the Embossed Carrier Taping U 32 3.2(cid:76)1.6 (cid:76)0.9 third one denotes the (EXCML16 to 32) 20 2.0(cid:76)1.25(cid:76)0.9 number of zeros following H Embossed Carrier Taping 16 1.6(cid:76)0.8 (cid:76)0.8 (EXCML45) ■ ■ Construction Dimensions in mm (not to scale) e T W L Ferrite core Type Dimensions (mm) Mass (Weight) (inch size) L W T e [mg/pc.] Conductor Electrode EXCML16 1.6±0.2 0.8±0.2 0.8±0.2 (0.4) 4.5 (0603) EXCML20 2.0±0.2 1.25±0.20 0.9±0.2 (0.5) 10.5 (0805) EXCML32 3.2±0.3 1.6±0.3 0.9±0.2 (0.6) 21.5 (1206) EXCML45 4.5±0.3 1.6±0.3 1.1±0.2 (0.6) 36.0 (1806) Design and specifi cations are each subject to change without notice. Ask factory for the current technical specifi cations before purchase and/or use. Should a safety concern arise regarding this product, please be sure to contact us immediately. 02 Nov. 2012

Chip Bead Cores ■ Type: EXC3B ● Explanation of Part Numbers 1 2 3 4 5 6 7 8 9 10 11 12 (cid:38) (cid:57) (cid:36) (cid:20) (cid:35) (cid:35) (cid:19) (cid:19) (cid:18) (cid:41) Product Code Size Type Characteristics Nominal Impedance Form Suffix Noise Filter Code Dimensions (mm) Multilayer High frequency The first two digits are Code Packing Chip type B High attenuation significant figure of 3 1.6(cid:76)0.8(cid:76)0.8 Bead Core for signal Lines impedance value and the H Embossed Carrier Taping High frequency third one denotes the P High attenuation number of zeros following for Power Lines ■ ■ Construction Dimensions in mm (not to scale) Ferrite core e T W L Inner Conductor Electrode Type Dimensions (mm) Mass (Weight) (inch size) L W T e [mg/pc.] EXC3BB 1.6±0.2 0.8±0.2 0.8±0.2 0.3±0.2 4.5 (0603) EXC3BP 1.6±0.2 0.8±0.2 0.8±0.2 0.3±0.2 4.5 (0603) ■ Ratings Impedance Rated Current DC Resistance Type Part Number (Ω) at 100 MHz tol.(%) (mA DC) (Ω) max. 4532 EXCCL4532U1 115 2000 0.1 3225 EXCCL3225U1 45 2000 0.05 3216 EXCCL3216U1 25 2000 0.05 4516 EXCML45A910H 91 3000 0.016 3216 EXCML32A680U 68 3000 0.012 2012 EXCML20A390U 39 4000 0.008 ±25 1608 EXCML16A270U 27 4000 0.006 EXC3BP600H 60 1000 0.07 EXC3BP121H 120 500 0.1 1608 EXC3BB221H 220 200 0.3 EXC3BB601H 600 100 0.8 EXC3BB102H 1000 50 1 ● Category Temperature Range –25 °C to +85 °C Design and specifi cations are each subject to change without notice. Ask factory for the current technical specifi cations before purchase and/or use. Should a safety concern arise regarding this product, please be sure to contact us immediately. 02 Nov. 2012

Chip Bead Cores ■ Impedance Characteristics (Reference Data) Measured by HP4291A ∣Z∣ : Impedance R : Resistance X : Reactance (cid:76)EXCCL4532U1 (4532) (cid:76)EXCML16A270U (1608) 140 140 120 120 , R, X()(cid:49)(cid:63) 1086000 Z R Z, R, X()(cid:49)(cid:63) 1086000 Z(cid:49) 40 X (cid:49) 40 Z R 20 20 X 0 0 1 10 100 1000 10000 1 10 100 1000 10000 Frequency(MHz) Frequency(MHz) (cid:76)EXCCL3225U1 (3225) (cid:76)EXCML20A390U (2012) 140 140 120 120 Z, R, X()(cid:49)(cid:63) 1086000 Z Z, R, X()(cid:49)(cid:49)(cid:63)1086000 Z (cid:49) 40 40 R R 20 20 X X 0 0 1 10 100 1000 10000 1 10 100 1000 10000 Frequency(MHz) Frequency(MHz) (cid:76)EXCCL3216U1 (3216) (cid:76)EXCML32A680U (3216) 140 140 120 120 )(cid:63) 100 )(cid:63) 100 R, X( 80 R, X( 80 Z R , (cid:49) 60 , (cid:49) 60 Z(cid:49) 40 Z Z(cid:49) 40 X 20 R 20 0 X 0 1 10 100 1000 10000 1 10 100 1000 10000 Frequency(MHz) Frequency(MHz) (cid:76)EXCML45A910H (4516) 180 160 140 )(cid:63) 120 X( Z R, 100 , (cid:49) 80 R Z (cid:49) 60 X 40 20 0 1 10 100 1000 10000 Frequency(MHz) Design and specifi cations are each subject to change without notice. Ask factory for the current technical specifi cations before purchase and/or use. Should a safety concern arise regarding this product, please be sure to contact us immediately. 02 Nov. 2012

Chip Bead Cores ■ Impedance Characteristics (Reference Data) Measured by HP4291A ∣Z∣ : Impedance R : Resistance X : Reactance (cid:76)EXC3BB221H (1608) (cid:76)EXC3BP121H (1608) 1400 200 1200 Z )(cid:63) 1000 )(cid:63) 150 X( 800 X( R R, R, 100 , (cid:49) 600 , (cid:49) Z(cid:49) 400 Z Z(cid:49) 50 X 200 0 X R 0 1 10 100 1000 10000 1 10 100 1000 10000 Frequency(MHz) Frequency(MHz) (cid:76)EXC3BB601H (1608) (cid:76)EXC3BP600H (1608) 1400 200 1200 )(cid:63) 1000 )(cid:63) 150 X( X( R, 800 R, 100 Z Z, (cid:49) 600 R Z Z, (cid:49) R (cid:49) 400 (cid:49) 50 200 X X 0 0 1 10 100 1000 10000 1 10 100 1000 10000 Frequency(MHz) Frequency(MHz) (cid:76)EXC3BB102H (1608) 1400 1200 )(cid:63) 1000 Z X( R R, 800 , (cid:49) 600 X Z (cid:49) 400 200 0 1 10 100 1000 10000 Frequency(MHz) Design and specifi cations are each subject to change without notice. Ask factory for the current technical specifi cations before purchase and/or use. Should a safety concern arise regarding this product, please be sure to contact us immediately. 02 Nov. 2012

Chip Bead Cores ■ Packaging Methods (Taping) ● Standard Quantity Part Number Kind of Taping Pitch (P) Quantity 1 EXCCL4532U1 8 mm 1000 pcs./reel EXCCL3225U1 2000 pcs./reel EXCCL3216U1 EXCML45A910H Embossed Carrier Taping 3000 pcs./reel EXCML32A680U 4 mm EXCML20A390U EXCML16A270U 4000 pcs./reel EXC3B□□□□H ● Embossed Carrier Taping ● Taping Reel T Sprocket hole Compartment fD0 fC A B F W f D f B t2 P1 P2 P0 E Chip component Tape running direction f A W Embossed Carrier Dimensions (mm) Part Number A B W F P P P 0D t 1 2 0 0 2 EXCCL4532U1 3.6±0.2 4.9±0.2 12.0±0.2 5.5±0.1 8.0±0.1 2.4 max. EXCCL3225U1 2.9±0.2 3.6±0.2 8.0±0.2 3.5±0.1 2.1 max. EXCCL3216U1 2.0±0.2 3.6±0.2 EXCML45A910H 1.9±0.2 4.8±0.2 12.0±0.2 5.5±0.1 4.0±0.1 2.0±0.1 4.0±0.1 1.5±0.1 1.8 max. EXCML32A680U 1.9±0.2 3.5±0.2 EXCML20A390U 1.5±0.2 2.3±0.2 8.0±0.2 3.5±0.1 1.6 max. EXCML16A270U 1.0±0.2 1.8±0.2 EXC3B□□□□H 1.0±0.1 1.8±0.1 Standard Reel Dimensions (mm) Part Number 0A 0B 0C 0D E W T EXCCL4532U1 13.0±0.3 16.5 max. EXCCL3225U1 09.0±0.3 13 max. EXCCL3216U1 EXCML45A910H 180.0 0 60.0±1.0 13.0±0.5 21.0±0.8 2.0±0.5 13.0±0.3 16.5 max. –3.0 EXCML32A680U EXCML20A390U 09.0±0.3 13 max. EXCML16A270U EXC3B□□□□H Design and specifi cations are each subject to change without notice. Ask factory for the current technical specifi cations before purchase and/or use. Should a safety concern arise regarding this product, please be sure to contact us immediately. 02 Nov. 2012

Chip Bead Cores ■ Recommended Land Pattern Dimensions in mm (not to scale) (mm) Part Number A B C EXCCL4532U1 3 5.4 2.8 EXCCL3225U1 1.7 4.1 2.1 EXCCL3216U1 1.7 4.1 1.2 A B EXCML45A910H 2.6 to 3 5.5 to 6.5 1.2 to 1.6 EXCML32A680U 1.6 to 2 4 to 5 1.2 to 1.6 EXCML20A390U 0.8 to 1.2 3 to 4 1 to 1.2 EXCML16A270U 0.6 to 1 2 to 3 0.8 to 1 C EXC3B□□□□H 0.8 to 1 2 to 2.6 0.8 to 1 ■ Recommended Soldering Conditions Recommendations and precautions are described below. ● Recommended soldering conditions for refl ow · Refl ow soldering shall be performed a maximum of two times. · Please contact us for additional information when For soldering (Example : Sn-37Pb) used in conditions other than those specifi ed. · Please measure the temperature of the terminals Temperature Time and study every kind of solder and printed circuit Preheating 140 °C to 160 °C 60 s to 120 s board for solderability bef ore ac tu al use. Main heating Above 200 °C 30 s to 40 s Peak 235 ± 10 °C max. 10 s Peak ure Preheating For lead-free soldering (Example : Sn/3Ag/0.5Cu) erat Temperature Time mp Heating Preheating 150 °C to 170 °C 60 s to 120 s e T Main heating Above 230 °C 30 s to 40 s Peak max. 260 °C max. 10 s Time ● Flow soldering · Flow soldering may cause this product to come off because the adhesiveness of the product element is low. Please consult our sales representative in advance about fl ow soldering. <Repair with hand soldering> ● Preheat with a blast of hot air or similar method. Use a soldering iron with a tip temperature of 350 °C or less. Solder each electrode for 3 seconds or less. ● Never touch this product with the tip of a soldering iron. Safety Precautions The following are precautions for individual products. Please also refer to the common precautions for Noise Suppression Device shown on this catalog. 1. Use rosin-based fl ux or halogen-free fl ux. 2. For cleaning, use an alcohol-based cleaning agent. Before using any other type, consult with our sales pers on in advance. 3. Do not apply shock to Chip Bead Cores (hereafter called the bead cores) or pinch them with a hard tool (e.g. pliers and tweezers). Otherwise, their bodies may be chipped, affecting their perf or mance. Excessive mechanical stress may damage the bead cores. Handle with care. 4. Store the bead cores in a location with a temperature ranging from -5 °C to +40 °C and a rel a tive humidity of 40 % to 60 %, where there are no rapid changes in temperature or humidity. 5. Use the bead cores within a year (EXC3B Type: within half a year) after the date of the outg o ing in spec tion indicated on the packages. Design and specifi cations are each subject to change without notice. Ask factory for the current technical specifi cations before purchase and/or use. Should a safety concern arise regarding this product, please be sure to contact us immediately. 02 Nov. 2012