ESDAXLC6-1MY2 Datasheet Extra low capacitance single line transient voltage surge suppressor (TVS) Features • Extra low capacitance 0.6 pF max on a wide frequency spectrum (200 MHz - 3000 MHz) • Unidirectional device • Low clamping factor V / V CL BR • Fast response time • Very thin package: 0.55 mm max • Low leakage current SOD882 (µQFN-2L) • High ESD protection level • High integration • Suitable for high density boards • Complies with the following standards I/0 1 – IEC 61000-4-2 level 4 – MIL STD 883G-Method 3015-7: class 3B Applications I/0 2 Where transient overvoltage protection in ESD sensitive equipment is required, such as: GND • Computers • Printers • Communication systems Product status link • Cellular phone handsets and accessories ESDAXLC6-1MY2 • Video equipment Portable equipment Description The ESDAXLC6-1MY2 is a single line Transil diode designed specifically for the protection of integrated circuits in portable equipment and miniaturized electronics devices subject to ESD transient over voltages. Packaged in SOD882 (µQFN-2L), it minimizes PCB consumption. DS6650 - Rev 4 - September 2019 www.st.com For further information contact your local STMicroelectronics sales office.

ESDAXLC6-1MY2 Characteristics 1 Characteristics Table 1. Absolute maximum ratings (T = 25 °C) amb Symbol Parameter Value Unit VPP Peak pulse voltage IEC 61000-4-2, level 4 : contact discharge 8 kV PPP Peak pulse power 8/20μs(1), Tj initial = Tamb 12 W IPP Peak pulse current typical value (8/20 μs) 2.8 A Tstg Storage temperature range -55 to +150 °C Top Operating temperature range -40 to +125 1. For a surge greater than the maximum values, the diode will fail in short-circuit. Figure 1. Electrical characteristics (definitions) I Symbol Parameter V = Breakdown voltage BR IRM = Leakage current at VRM VBR VRM V V = Stand-off voltage IRM I RM = Breakdown current IR R Table 2. Electrical characteristics (values) (T = 25° C) amb Symbol Test conditions Min. Typ. Max. Unit VBR IR = 1 mA 6 - V IRM VRM = 3 V - 100 nA CLINE VR = 0 V, F = (200 MHz - 3000 MHz), VOSC = 30 mV - 0.6 pF DS6650 - Rev 4 page 2/12

ESDAXLC6-1MY2 Characteristics (curves) 1.1 Characteristics (curves) Figure 2. Junction capacitance versus reverse voltage Figure 3. Junction capacitance versus frequency (typical applied (typical values) values) Capacitance (fF) C (fF) 1000 1000 890000 VoFsTc==j23=0020m5M-VCHRzMS 890000 F=V1osMTc=jH=32z0 5mto°V C3RGMHSz 700 700 600 600 500 500 400 400 300 300 200 200 100 VR(V) 100 Fr e quenc y (MHz) 0 0 0 1 2 3 4 5 1 10 100 1000 Figure 5. Leakage current versus junction temperature Figure 4. S21 (dB) attenuation (typical values) S21 (dB) 0.00 IR(nA) -2.00 10 VR=VRM= 3V --4.00 --6.00 1 --8.00 0.1 --10.00 -12.00 T (°C) j f (Hz) 0.01 -14.00 25 35 45 55 65 75 85 95 105 115 125 10.0M 30.0M 100.0M 300.0M 1.0G 3.0G 10.0G DS6650 - Rev 4 page 3/12

ESDAXLC6-1MY2 Characteristics (curves) Figure 6. ESD response to IEC 61000-4-2 (+ 8 kV contact Figure 7. ESD response to IEC 61000-4-2 (-8 kV contact discharge discharge) 20V/div 20V/div C2 C2 20 ns/div 20 ns/div DS6650 - Rev 4 page 4/12

ESDAXLC6-1MY2 Package information 2 Package information In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK packages, depending on their level of environmental compliance. ECOPACK specifications, grade definitions and product status are available at: www.st.com. ECOPACK is an ST trademark. 2.1 SOD882 package information • Epoxy meets UL 94, V0 • Lead-free package Figure 8. SOD882 package outline D E Top view A A1 Side view b1 b2 L1 L2 Optional pin#1 e Bottom view DS6650 - Rev 4 page 5/12

ESDAXLC6-1MY2 SOD882 package information Table 3. SOD882 package mechanical data Dimensions inches (dimension in inches are given for Ref. Millimeters reference only) Min. Typ. Max. Min. Typ. Max. A 0.45 0.50 0.55 0.018 0.020 0.022 A1 0.00 0.05 0.000 0.000 0.002 b1 0.20 0.25 0.30 0.008 0.010 0.012 b2 0.20 0.25 0.30 0.008 0.010 0.012 D 0.95 1.00 1.05 0.037 0.039 0.041 E 0.55 0.60 0.65 0.022 0.024 0.026 e 0.65 0.026 L1 0.45 0.50 0.55 0.018 0.020 0.022 L2 0.45 0.50 0.55 0.018 0.020 0.022 Figure 9. SOD882 recommended footprint 0.55 0.55 0.50 0.40 Figure 10. Marking 7 Pin1 Pin 2 DS6650 - Rev 4 page 6/12

ESDAXLC6-1MY2 SOD882 package information Figure 11. Tape and reel specification Ø 1.50 +0.1/-0.0 Cathode bar 2.0 ± 0.05 4.0 ± 0.1 1 0.20 ± 0.05 ± 0. 5 7 1. 5 0.0 05 0.3 /-0.1 1.15 ± 3.5 ±- 0. 0 + 7 7 7 7 7 7 7 8. 0.59 ± 0.04 0.70 ± 0.05 2.0 ± 0.1 User direction of unreeling All dimensions in mm DS6650 - Rev 4 page 7/12

ESDAXLC6-1MY2 Recommendation on PCB assembly 3 Recommendation on PCB assembly 3.1 Stencil opening design 1. General recommendation on stencil opening design a. Stencil opening dimensions: L (Length), W (Width), T (Thickness). Figure 12. Stencil opening recommendation L T W b. General design rule ◦ Stencil thickness (T) = 75 ~ 125 μm ◦ W ◦ T ≥1.5 L × W 1. Reference design ≥0.66 2T L +W a. Stencil opening thickness: 100 µm b. Stencil opening for leads: Opening to footprint ratio is 90% Figure 13. Recommended stencil window position in mm Package footprint Leadfootprint on PCB Leadfootprint on PCB Stencil window position Stencil window position 0.39 mm 0.45 mm 0.05 mm 0.05 mm 3.2 Solder paste 1. Halide-free flux qualification ROL0 according to ANSI/J-STD-004. 2. “No clean” solder paste is recommended. 3. Offers a high tack force to resist component movement during high speed. 4. Use solder paste with fine particles: powder particle size 20-45 µm. DS6650 - Rev 4 page 8/12

ESDAXLC6-1MY2 Placement 3.3 Placement 1. Manual positioning is not recommended. 2. It is recommended to use the lead recognition capabilities of the placement system, not the outline centering 3. Standard tolerance of ±0.05 mm is recommended. 4. 3.5 N placement force is recommended. Too much placement force can lead to squeezed out solder paste and cause solder joints to short. Too low placement force can lead to insufficient contact between package and solder paste that could cause open solder joints or badly centered packages. 5. To improve the package placement accuracy, a bottom side optical control should be performed with a high resolution tool. 6. For assembly, a perfect supporting of the PCB (all the more on flexible PCB) is recommended during solder paste printing, pick and place and reflow soldering by using optimized tools. 3.4 PCB design preference 1. To control the solder paste amount, the closed via is recommended instead of open vias. 2. The position of tracks and open vias in the solder area should be well balanced. A symmetrical layout is recommended, to avoid any tilt phenomena caused by asymmetrical solder paste due to solder flow away. 3.5 Reflow profile Figure 14. ST ECOPACK® recommended soldering reflow profile for PCB mounting 240-245 °C Temperature (°C) 250 -2°C/s 2 - 3 °C/s 200 60sec (90max) -3°C/s 150 -6°C/s 100 0.9 °C/s 50 Time (s) 0 30 60 90 120 150 180 210 240 270 300 Note: Minimize air convection currents in the reflow oven to avoid component movement. DS6650 - Rev 4 page 9/12

ESDAXLC6-1MY2 Ordering information 4 Ordering information Figure 15. Ordering information scheme ESDAX LC 6 - 1MY2 ESDA array Low capacitance Breakdown voltage 6 = 6Vminimum Package 1 = 1 line MY = SOD882 (µQFN-2L), max.height:0.55 mm 2 = 2 pads Table 4. Ordering information Order code Marking Package Weight Base qty. Delivery mode ESDAXLC6-1MY2 7 SOD882 (μQFN-2L) 0.942 mg 12000 Tape and reel DS6650 - Rev 4 page 10/12

ESDAXLC6-1MY2 Revision history Table 5. Document revision history Date Revision Changes 18-Jan-2010 1 Initial release. 23-Sep-2011 2 Updated package name. Updated operating junction temperature range in Table 2. Updated Figure 3, 31-Mar-2014 3 Figure 4, and Figure 6. Updated graphic and dimension names in Table 3, Updated Figure 15. 19-Sep-2019 4 Updated Section 2.1 SOD882 package information. DS6650 - Rev 4 page 11/12

ESDAXLC6-1MY2 IMPORTANT NOTICE – PLEASE READ CAREFULLY STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, enhancements, modifications, and improvements to ST products and/or to this document at any time without notice. Purchasers should obtain the latest relevant information on ST products before placing orders. ST products are sold pursuant to ST’s terms and conditions of sale in place at the time of order acknowledgement. Purchasers are solely responsible for the choice, selection, and use of ST products and ST assumes no liability for application assistance or the design of Purchasers’ products. No license, express or implied, to any intellectual property right is granted by ST herein. Resale of ST products with provisions different from the information set forth herein shall void any warranty granted by ST for such product. ST and the ST logo are trademarks of ST. For additional information about ST trademarks, please refer to www.st.com/trademarks. All other product or service names are the property of their respective owners. Information in this document supersedes and replaces information previously supplied in any prior versions of this document. © 2019 STMicroelectronics – All rights reserved DS6650 - Rev 4 page 12/12

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