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  • 型号: ERJ-P08F3003V
  • 制造商: Panasonic Corporation
  • 库位|库存: xxxx|xxxx
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ERJ-P08F3003V产品简介:

ICGOO电子元器件商城为您提供ERJ-P08F3003V由Panasonic Corporation设计生产,在icgoo商城现货销售,并且可以通过原厂、代理商等渠道进行代购。 ERJ-P08F3003V价格参考¥0.40-¥1.74。Panasonic CorporationERJ-P08F3003V封装/规格:芯片电阻 - 表面安装, 300 kOhms ±1% 0.667W,2/3W 厚膜 芯片电阻 1206(3216 公制) 汽车级 AEC-Q200,防脉冲 厚膜。您可以下载ERJ-P08F3003V参考资料、Datasheet数据手册功能说明书,资料中有ERJ-P08F3003V 详细功能的应用电路图电压和使用方法及教程。

产品参数 图文手册 常见问题
参数 数值
品牌

Panasonic

产品目录

无源元件

描述

厚膜电阻器 - SMD 1206 300Kohms 0.66W 1% Tol

产品分类

电阻器

产品手册

点击此处下载产品Datasheet

产品图片

rohs

RoHS 合规性豁免

产品系列

薄膜电阻器,厚膜电阻器 - SMD,Panasonic ERJ-P08F3003V

产品型号

ERJ-P08F3003V

产品

Thick Film Resistors SMD

产品种类

厚膜电阻器 - SMD

功率额定值

660 mW

商标

Panasonic

外壳代码-in

1206

外壳代码-mm

3216

外壳宽度

1.6 mm

外壳长度

3.2 mm

外壳高度

0.6 mm

容差

1 %

封装

Reel

封装/箱体

1206 (3216 metric)

工作温度范围

- 55 C to + 155 C

工厂包装数量

5000

温度系数

100 PPM / C

电压额定值

500 V

电阻

300 kOhms

类型

Anti-Surge Thick Film Resistors

系列

ERJ-P

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PDF Datasheet 数据手册内容提取

Anti-Surge Thick Film Chip Resistors Anti-Surge Thick Film Chip Re sis tors Type: ERJ PA2, P03, PA3, P06, P08, P14 Features ● ESD surge characteristics superior to standard metal fi lm resistors ● High reliability Metal glaze thick fi lm resistive element and three layers of electrodes ● Suitable for both refl ow and fl ow soldering ● High power … 0.20 W : 0402 inch / 1005 mm size (ERJPA2), 0603 inch / 1608 mm size (ERJP03) 0.25 W : 0603 inch / 1608 mm size (ERJPA3) 0.50 W : 0805 inch / 2012 mm size (ERJP06), 1210 inch / 3225 mm size (ERJP14) 0.66 W : 1206 inch / 3216 mm size (ERJP08) ● Reference Standards… IEC 60115-8, JIS C 5201-8, EIAJ RC-2134B ● AEC-Q200 qualifi ed ● RoHS compliant ■ As for Packaging Methods, Land Pattern, Soldering Conditions and Safety Precautions, Please see Data Files Explanation of Part Numbers 1 2 3 4 5 6 7 8 9 10 11 12 E R J P 0 6 D 1 0 0 2 V Product Code Size, Power Rating Resistance Tolerance Resistance Value Packaging Methods Thick Film CodeInch Power R. CodeTolerance The first two or three digits are significant figures Code Packaging Part No. Chip Resistors PA2 0402 0.20 W D ± 0.5 % of resistance and the third or 4th one denotes Punched Carrier Taping X ERJPA2 P03 0603 0.20 W F ± 1 % number of zeros following. 2 mm pitch, 10,000 pcs. PA3 0603 0.25 W J ± 5 % Three digit type (±5 %), ERJP03 four digit type (±1 %, ±0.5 %) Punched Carrier Taping ERJPA3 P06 0805 0.50 W Example: 222→2.2k Ω, 1002→10k Ω V 4 mm pitch, 5,000 pcs. ERJP06 P08 1206 0.66 W ERJP08 P14 1210 0.50 W Embossed Carrier Taping U ERJP14 4 mm pitch, 5,000 pcs. Construction Dimensions in mm (not to scale) L a Protective coating Electrode (Inner) W Alumina substrate t b Electrode (Between) Dimensions (mm) Mass (Weight) Part No. L W a b t [g/1000 pcs.] ERJPA2 1.00±0.05 0.50±0.05 0.20±0.15 0.25±0.05 0.35±0.05 0.8 ERJP03 1.60±0.15 0.80+0.15 0.15+0.15 0.30±0.15 0.45±0.10 2 –0.05 –0.10 ERJPA3 1.60±0.15 0.80+0.15 0.15+0.15 0.25±0.10 0.45±0.10 2 –0.05 –0.10 Thick fi lm Electrode (Outer) ERJP06 2.00±0.20 1.25±0.10 0.25±0.20 0.40±0.20 0.60±0.10 4 resistive element ERJP08 3.20+–00..2005 1.60+–00..0155 0.40±0.20 0.50±0.20 0.60±0.10 10 ERJP14 3.20±0.20 2.50±0.20 0.35±0.20 0.50±0.20 0.60±0.10 16 Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use. Should a safety concern arise regarding this product, please be sure to contact us immediately. 11 Nov. 2017

Anti-Surge Thick Film Chip Resistors Ratings Power Limiting Maximum Part No. Rating(3) Element Overload Resistance Resistance T.C.R. Category AEC-Q200 (inch size) at 70 °C Voltage(1) Voltage(2) Tole(%ra)nce Ra(Ωng)e (×10–6/°C) TReamnpgeer a(°tuCr)e Grade (W) (V) (V) ERJPA2 ±0.5, ±1 10 to 1M (E24, E96) ±100 0.20 50 100 –55 to +155 Grade 0 (0402) ±5 10 to 1M (E24) ±200 ±0.5 10 to 1M (E24, E96) ±150 ERJP03 0.20 150 200 ±1 10 to 1M (E24, E96) ±200 –55 to +155 Grade 0 (0603) R < 10 Ω : –150 to +400 ±5 1 to 1M (E24) 10 Ω ≤ R : ±200 ERJPA3 ±0.5, ±1 10 to 1M (E24, E96) ±100 0.25 150 200 –55 to +155 Grade 0 (0603) ±5 1 to 1.5M (E24) ±200 R < 33 Ω : ±300 ±0.5, ±1 10 to 1M (E24, E96) 33 Ω ≤ R : ±100 ERJP06 0.50 400 600 R < 10 Ω : –100 to +600 –55 to +155 Grade 0 (0805) ±5 1 to 3.3M (E24) 10 Ω ≤ R < 33 Ω : ±300 33 Ω ≤ R : ±200 ±0.5, ±1 10 to 1M (E24, E96) ±100 ERJP08 (1206) 0.66 500 1000 ±5 1 to 10M (E24) 10 Ω ≤ RR < 10 Ω :: –±120000 to +600 –55 to +155 Grade 0 ±0.5, ±1 10 to 1M (E24, E96) ±100 ERJP14 (1210) 0.50 200 400 ±5 1 to 1M (E24) 10 Ω ≤ RR < 10 Ω :: –±120000 to +600 –55 to +155 Grade 0 (1) Rated Continuous Working Voltage (RCWV) shall be det er mined from RCWV=√Power Rating × Re sis tance Values, or Limiting Element Voltage liste d above, whichever less. (2) Overload Test Voltage (OTV) shall be determined from OTV=Specified Magnification (refer to performance) × RCWV or Maximum Overload Voltage listed above, whichever less. (3) Use it on the condition that the case temperature is below the upper category temperature. Power Derating Curve –55 °C 70 °C 100 For resistors operated in ambient temperatures above 125 °C 70 °C, power rating shall be derated in accordance with %) 80 ERJ P06, the fi gure on the right. d ( 60 P08 ✽ When the temperature of ERJP14 is 155 °C or less, the oa derating start temperature can be changed to 125 °C. (See d L 40 ERJ PA2, P03, e the dotted line) Rat 20 PA3, P14 155 °C 0 –60 –40 –20 0 20 40 60 80 100 120 140 160 180 Ambient Temperature (°C) Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use. Should a safety concern arise regarding this product, please be sure to contact us immediately. 11 Nov. 2017

Anti-Surge Thick Film Chip Resistors ESD Characteristic R=0 Ω(≤ 1.5k Ω)/150 Ω(> 1.5k Ω) E Sample C=150p F 0402 inch size : E=±1k V Anti-Surge Thick Film Chip Resistors(ERJP Type) 0603, 0805, 1206, 1210 inch size : E=±3k V Thick Film Chip Resistors(ERJ Type) ERJPA2 (0402 inch /1005 mm size) ERJP03, PA3 (0603 inch /1608 mm size) 5% 5% ERJPA2 ERJPA3 Change Ratio ofResistance Value ---112-50500%%%%% ERJ2G Change Ratio ofResistance Value---112-50500%%%%% ERJEPR03J3G -25% -25% -30% -30% 10 Ω 100 Ω 1k Ω 10k Ω 100k Ω 1M Ω 10 Ω 100 Ω 1k Ω 10k Ω 100k Ω 1M Ω ERJP06 (0805 inch / 2012 mm size) ERJP08 (1206 inch / 3216 mm size) 5% 5% ERJP08 0% 0% hange Ratio ofesistance Value---112-5050%%%% EREJRPJ066G hange Ratio ofesistance Value---112-5050%%%% ERJ8G CR CR -25% -25% -30% -30% 10 Ω 100 Ω 1k Ω 10k Ω 100k Ω 1M Ω 10 Ω 100 Ω 1k Ω 10k Ω 100k Ω 1M Ω ERJP14 (1210 inch / 3225 mm size) 5% ERJP14 0% Ratio ofce Value-1-05%% ERJ14 ange sistan--1250%% he CR -25% -30% 10 Ω 100 Ω 1k Ω 10k Ω 100k Ω 1M Ω Performance Test Item Performance Requirements Test Conditions Resistance Within Specifi ed Tolerance 20 °C T. C. R. Within Specifi ed T. C. R. +25 °C/+155 °C (ERJPA2 : +125 °C) ERJP06 : Rated Voltag×1.77, 5 s ±2% Overload ERJPA2, ERJPA3, ERJP08 : Rated Voltag×2.0, 5 s Only when it is ERJP03 (D), P14 (D) : ±0.5% ERJP03, ERJP14 : Rated Voltag×2.5, 5 s Resistance to D : ±0.5%, F, J : ±1% 270 °C, 10 s Soldering Heat Rapid Change of ±1% –55 °C (30 min.) / +155 °C (30 min.) , 100 cycles Temperature High Temperature ±1% +155 °C, 1000 h Exposure Damp Heat, Steady State ±1% 60 °C, 90% to 95%RH, 1000 h ±3% 60 °C, 90% to 95%RH, Load Life in Humidity Only when it is ERJP03 (D), P14 (D) : ±1% Rated Voltage, 1.5 h ON / 0.5 h OFF cycle, 1000 h ±3% 70 °C, Rated Voltage, Endurance at 70 °C Only when it is ERJP03 (D), P14 (D) : ±1% 1.5 h ON / 0.5 h OFF cycle, 1000 h Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use. Should a safety concern arise regarding this product, please be sure to contact us immediately. 11 Nov. 2017

Surface Mount Resistors Safety precautions Safety Precautions (Common precautions for Surface Mount Resistors) The following are precautions for individual products. Please also refer to the common precautions for Fixed Resistors in this catalog. 1. Take measures against mechanical stress during and after mounting of Surface Mount Resistors (hereafter called the resistors) so as not to damage their electrodes and protective coatings. Be careful not to misplace the resistors on the land patterns. Otherwise, solder bridging may occur. 2. Keep the rated power and ambient temperature within the specified derating curve. Some circuit boards, wiring patterns, temperatures of heat generated by adjacent components, or amb ie nt tem per a tures can become factors in the rise of the temperature of the res is tors, regardless of the level of power applied. Therefore, check the conditions before use and op ti mize them so as not to damage the boards and peripheral components. Make sure to contact us before using the resistors under special conditions. 3. If a transient load (heavy load in a short time) like a pulse is expected to be applied, check and evaluate the operations of the resistors when installed in your products before use. Never exceed the rated power. Otherwise, the performance and/or reliability of the resistors may be impaired. 4. Before using halogen-based or other high-activity flux, check the possible effects of the flux residues on the per for mance and reliability of the resistors. 5. When soldering with a soldering iron, never touch the resistors'bodies with the tip of the soldering iron. When using a soldering iron with a high temperature tip, finish soldering as quickly as possible (within three seconds at 350 °C max.). 6. As the amount of applied solder becomes larger, the mechanical stress applied to the resistors increases, causing problems such as cracks and faulty characteristics. Avoid applying an excessive amounts of solder. 7. When the resistors' protective coatings are chipped, flawed, or removed, the characteristics of the resistors may be impaired. Take special care not to apply mechanical shock during automatic mounting or cause damage during handling of the boards with the resistors mounted. 8. Do not apply shock to the resistors or pinch them with a hard tool (e.g. pliers and tweezers). Otherwise, the resistors' protective coatings and bodies may be chipped, affecting their performance. 9. Avoid excessive bending of printed circuit boards in order to protect the resistors from abnormal stress. 10. Do not immerse the resistors in solvent for a long time. Before using solvent, carefully check the effects of imm er sion. 11. Transient voltage If there is a possibility that the transient phen om e non (significantly high voltage ap plied in a short time) may occ ur or that a high voltage pulse may be applied, make sure to evaluate and check the chara ct er is tics of Fixed Metal (Oxide) Film Resistors mounted on your product rather than only depending on the calculated pow er limit or steady-state conditions to complete the des ign or decide to use the resistors. 12. Do not apply excessive tension to the terminals. Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use. Should a safety concern arise regarding this product, please be sure to contact us immediately. 02 Sep. 2014

Safety Precautions (Common precautions for Fixed Resistors) • When using our products, no matter what sort of equipment they might be used for, be sure to make a written agreement on the specifications with us in advance. The design and specifications in this catalog are subject to change without prior notice. • Do not use the products beyond the specifications described in this catalog. • This catalog explains the quality and performance of the products as individual components. Before use, check and evaluate their operations when installed in your products. • Install the following systems for a failsafe design to ensure safety if these products are to be used in equipm ent where a defect in these products may cause the loss of human life or other significant dam age, such as damage to vehicles (automobile, train, vessel), traffic lights, medical equipment, aerospace equipment, electric heating appliances, combustion/gas equipment, rotating equipment, and disaster/crime prevention equipment. ✽ Systems equipped with a protection circuit and a protection device ✽ Systems equipped with a redundant circuit or other system to prevent an unsafe status in the event of a sing le fault (1) Precautions for use • These products are designed and manufactured for general and standard use in general elect ron ic equipment (e.g. AV equipment, home electric appliances, office equipment, information and communication equipment) • These products are not intended for use in the following special conditions. Before using the products, carefully check the effects on their quality and performance, and determine whether or not they can be used. 1. In liquid, such as water, oil, chemicals, or organic solvent 2. In direct sunlight, outdoors, or in dust 3. In salty air or air with a high concentration of corrosive gas, such as Cl, H S, NH , SO , or NO 2 2 3 2 2 4. Electric Static Discharge (ESD) Environment These components are sensitive to static electricity and can be damaged under static shock (ESD). Please take measures to avoid any of these environments. Smaller components are more sensitive to ESD environment. 5. Electromagnetic Environment Avoid any environment where strong electromagnetic waves exist. 6. In an environment where these products cause dew condensation 7. Sealing or coating of these products or a printed circuit board on which these products are mounted, with resin or other materials • These products generate Joule heat when energized. Carefully position these products so that their heat will not affect the other components. • Carefully position these products so that their temperatures will not exceed the category temperature range due to the effects of neighboring heat-generating components. Do not mount or place heat-generating components or inflammables, such as vinyl-coated wires, near these products. • Note that non-cleaning solder, halogen-based highly active flux, or water-soluble flux may deteriorate the performance or reliability of the products. • Carefully select a flux cleaning agent for use after soldering. An unsuitable agent may deteriorate the performance or reliability. In particular, when using water or a water-soluble cleaning agent, be careful not to leave water residues. Otherwise, the insulation performance may be deteriorated. (2) Precautions for storage The performance of these products, including the solderability, is guaranteed for a year from the date of arr iv al at your company, provided that they remain packed as they were when delivered and stored at a temp er a ture of 5 °C to 35 °C and a relative humidity of 45 % to 85 %. Even within the above guarantee periods, do not store these products in the following conditions. Otherwise, their electrical performance and/or solderability may be deteriorated, and the packaging materials (e.g. taping materials) may be deformed or deteriorated, resulting in mounting failures. 1. In salty air or in air with a high concentration of corrosive gas, such as Cl, H S, NH , SO , or NO 2 2 3 2 2 2. In direct sunlight <Package markings> Package markings include the product number, quantity, and country of origin. In principle, the country of origin should be indicated in English. 01 Sep. 2014

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